CN111465221A - Manufacturing method of packaging substrate based on radio frequency filter - Google Patents
Manufacturing method of packaging substrate based on radio frequency filter Download PDFInfo
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- CN111465221A CN111465221A CN202010294133.XA CN202010294133A CN111465221A CN 111465221 A CN111465221 A CN 111465221A CN 202010294133 A CN202010294133 A CN 202010294133A CN 111465221 A CN111465221 A CN 111465221A
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- substrate
- copper foil
- copper
- prepreg
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Abstract
The invention discloses a manufacturing method of a packaging substrate based on a radio frequency filter, which comprises the following steps: preparing a double-sided copper-clad substrate, wherein an ultrathin carrier copper foil on the double-sided copper-clad substrate is provided with a carrier copper foil and an ultrathin copper foil which is detachably arranged on the carrier copper foil; laminating the first semi-cured sheet and the first copper foil to obtain a first substrate; performing one-time target shooting and edge milling operation, and then manufacturing a first layer of circuit graph to obtain a second substrate; laminating a second prepreg and a second copper foil to obtain a third substrate; performing secondary target shooting and edge milling operation to obtain a fourth substrate; carrying out three times of edge milling operation after copper reduction to obtain a fifth substrate; dividing the fifth substrate to obtain a processing plate containing three layers of copper foils; and carrying out conventional subsequent processing on the processing plate to finish the manufacture of the packaging substrate based on the radio frequency filter. The manufacturing method is reasonable and easy to operate, and the radio frequency filter packaging substrate manufactured by the manufacturing method has the advantages of strong function, good quality, good design flexibility, low manufacturing cost and the like, and can well replace a ceramic substrate.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, and particularly provides a manufacturing method of a packaging substrate based on a radio frequency filter.
Background
At present, the most common radio frequency filter substrate at home and abroad is a ceramic substrate, but the substrate is expensive and has high research and development cost, and the ceramic substrate has no obvious advantage in price for the filter with greatly increased demand. Therefore, a new product and a new process capable of replacing the ceramic substrate are needed.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
In order to overcome the defects, the invention provides the manufacturing method of the packaging substrate based on the radio frequency filter, which is reasonable in design and easy to operate, and the manufactured packaging substrate of the radio frequency filter has the advantages of strong function, good quality, good design flexibility, easiness in manufacturing, low manufacturing cost and the like, well meets the performance requirement and the batch production requirement of products, and can well replace a ceramic substrate.
The technical scheme adopted by the invention for solving the technical problem is as follows: a manufacturing method of a packaging substrate based on a radio frequency filter comprises the following steps:
step 1), preparing a double-sided copper-clad substrate, wherein the double-sided copper-clad substrate is formed by laminating two ultrathin carrier copper foils and an auxiliary substrate positioned in the middle, each ultrathin carrier copper foil is provided with a layer of carrier copper foil and an ultrathin copper foil detachably arranged on the carrier copper foil, and the carrier copper foil faces the auxiliary substrate; in addition, a positioning hole is drilled on the double-sided copper-clad substrate;
step 2), sequentially superposing a first semi-cured sheet and a first copper foil on the ultrathin copper foils on the two sides of the double-sided copper-clad substrate respectively, wherein the lengths and the widths of the first semi-cured sheet and the first copper foil are required to be respectively and correspondingly larger than those of the double-sided copper-clad substrate;
laminating and laminating for the first time after stacking and typesetting, wherein in the laminating process, the resin of the first semi-cured sheet flows, is filled and is used for sealing the edges of the double-sided copper-clad substrate; obtaining a first substrate with four layers after lamination;
step 3), firstly, carrying out first target shooting operation and first edge milling operation on the first substrate; then simultaneously manufacturing a first layer of circuit pattern on the surfaces of the first copper foils on the two sides of the first substrate to obtain a second substrate;
step 4), sequentially superposing a second prepreg and a second copper foil on the first layer of circuit patterns on the two sides of the second substrate, wherein the specifications of the glass fiber cloth of the second prepreg and the first prepreg are consistent, and the gel content of the second prepreg is larger than that of the first prepreg; performing second laminating and pressing after stacking and typesetting, wherein in the laminating process, the resin of the second prepreg flows, and filling and edge sealing are performed; and laminating to obtain a sixth layer of third substrate;
step 5), performing second target shooting operation and second edge milling operation on the third substrate to obtain a fourth substrate;
step 6), carrying out copper reduction operation on the two second copper foils on the fourth substrate, and then milling off all the edge seals of the gummosis on the periphery of the double-sided copper-clad substrate by third edge milling operation to obtain a fifth substrate;
step 7), separating the fifth substrate along the joint of the two ultrathin copper foils and the two carrier copper foils respectively to obtain two processing plates containing three layers of copper foils;
and 8) sequentially carrying out conventional processes of target shooting, drilling, conducting and circuit manufacturing on the processed board, and finishing the subsequent required manufacturing of the packaging substrate based on the radio frequency filter.
As a further improvement of the invention, the thickness of the ultra-thin carrier copper foil is 3 μm or 5 μm.
As a further improvement of the present invention, in the step 3), when the first target practice is performed on the first substrate, the drill size for target practice is smaller than the hole diameter of the alignment hole.
As a further improvement of the present invention, the processing method adopted by the three-time edge milling operation is as follows: mechanical milling, laser milling or die punching.
As a further improvement of the invention, the thickness of the processing plate is less than 0.2 mm.
The manufacturing method of the radio frequency filter packaging substrate has the advantages that 1) the manufacturing method of the radio frequency filter packaging substrate is improved, the manufactured radio frequency filter packaging substrate has the advantages of being strong in function, good in quality, good in design flexibility, easy to manufacture, low in manufacturing cost and the like, the performance requirements and the batch production requirements of products are well met, and ceramic substrates can be well replaced, 2) compared with the prior art, the manufacturing method of the radio frequency filter packaging substrate is mainly technically improved in the way that ① adopts a double-sided copper-clad substrate containing double-sided ultrathin carrier copper foils, on one hand, the risk of plate folding damage in the laminating process is reduced, the warping problem is solved, the warping degree is not more than 1.5%, on the other hand, alignment holes are drilled in the double-sided copper-clad substrate, the positioning problem of the subsequent process is well solved, in addition, when one-time laminating is matched, glue flowing of a first prepreg can carry out hole sealing on the alignment holes, the subsequent wet liquid medicine can be effectively prevented from permeating, the product quality is well ensured, the second wet liquid medicine containing quantity of a second prepreg is kept consistent with the second cured glue, and the second cured film containing quantity of the second prepreg is also kept consistent with the second cured glue filling quantity after the second prepreg is kept.
Drawings
FIG. 1 is a schematic cross-sectional view of a double-sided copper-clad substrate with alignment holes according to the present invention;
FIG. 2 is a schematic cross-sectional view of a first substrate according to the present invention;
FIG. 3 is a schematic cross-sectional view of a second substrate according to the present invention;
FIG. 4 is a schematic cross-sectional view of a third substrate according to the present invention;
FIG. 5 is a schematic cross-sectional view of a fifth substrate according to the present invention;
FIG. 6 is a schematic cross-sectional view of a machined plate according to the present invention;
fig. 7 is a schematic partial cross-sectional view of a package substrate of the rf filter according to the present invention.
The following description is made with reference to the accompanying drawings:
b0-double-sided copper-clad substrate; b1 — first substrate; b2 — a second substrate; b3 — a third substrate; b4 — a fifth substrate; b5 — processing plate; b6 — package substrate; 10-ultra-thin carrier copper foil; 100-carrier copper foil; 101-ultra-thin copper foil; 11 — an auxiliary substrate; 12-alignment holes; 20 — a first semi-cured sheet; 21-first copper foil; 22-first layer wiring pattern; 30 — a second prepreg; 31-second copper foil.
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions of the present invention, so that the present invention has no technical significance. The terms "first", "second", and the like in the present specification are used for convenience of description only, and are not intended to limit the scope of the present invention.
Example (b):
the invention provides a manufacturing method of a packaging substrate based on a radio frequency filter, which comprises the following steps:
step 1), preparing a double-sided copper-clad substrate B0, specifically referring to fig. 1, where the double-sided copper-clad substrate B0 is formed by laminating two ultra-thin carrier copper foils 10 and an auxiliary substrate 11 located in the middle, where each ultra-thin carrier copper foil 10 has a carrier copper foil 100 and an ultra-thin copper foil 101 detachably disposed on the carrier copper foil 100, and the ultra-thin copper foil can be deposited on the carrier copper foil in an electro-deposition processing manner, but before the electro-deposition operation, the carrier copper foil is treated correspondingly to ensure that the carrier copper foil and the ultra-thin copper foil can be well separated, and the carrier copper foil 100 faces the auxiliary substrate 11; in addition, a positioning hole 12 is drilled on the double-sided copper-clad substrate B0 for subsequent positioning, such as: after the first pressing, the alignment holes are used as a reference for target shooting and edge milling positioning, so that accurate positioning is realized, if the alignment holes are not formed, the positioning reference is not formed after the first pressing, the edge milling risk is caused during edge milling, the edge sealing area is milled off, and liquid medicine can penetrate deeply in the subsequent wet process, so that the product is scrapped;
step 2) sequentially superposing a first semi-cured sheet 20 and a first copper foil 21 on the ultrathin copper foil 101 on two sides of the double-sided copper-clad substrate B0, wherein the specification of the first copper foil 21 can be that the conventional thicknesses of Toz, H oz, M oz, 1oz and the like are selected according to actual requirements, and the lengths and the widths of the first semi-cured sheet 20 and the first copper foil 21 are required to be respectively and correspondingly larger than those of the double-sided copper-clad substrate, so that when the subsequent pressing is carried out, the first semi-cured sheet is used for carrying out edge sealing to prevent the subsequent wet process liquid medicine from permeating until the subsequent wet process liquid medicine is completely milled before board separation, or the other scheme can be adopted, namely, the double-sided copper-clad substrate is subjected to etching treatment, a substrate area is etched around the work PN L of the double-sided copper-clad substrate, and when the first semi-cured sheet is combined with the substrate area during the one-pressing, the ultra-thin carrier copper foil is subjected to edge sealing until the ultra-thin carrier copper foil is completely milled before the board separation, and in the scheme, the length and the width of the first semi-cured sheet 20;
laminating and laminating for the first time after stacking and typesetting, wherein in the laminating process, the resin of the first semi-cured sheet flows, is filled and seals the edges of the double-sided copper-clad substrate B0; the four-layer first substrate B1 is obtained after lamination, as shown in fig. 2;
step 3), firstly, performing first target shooting operation and first edge milling operation on the first substrate B1, wherein the processing boundary of the first edge milling operation is positioned between the periphery of the first semi-cured sheet and the periphery of the double-sided copper-clad substrate, namely the first edge milling operation mainly comprises the steps of milling off part of the first semi-cured sheet and the first copper foil; then, simultaneously manufacturing a first layer of circuit patterns 22 on the surfaces of the first copper foils 21 on the two sides of the first substrate B1 to obtain a second substrate B2, which can be specifically referred to as shown in fig. 3;
step 4), sequentially stacking a second prepreg 30 and a second copper foil 31 on the first layer of circuit patterns 22 on two sides of the second substrate B2, wherein the specifications of the glass fiber cloth of the second prepreg 30 and the first prepreg 20 are consistent, which is favorable for improving the warping problem, and the glue content of the second prepreg 30 is also greater than that of the first prepreg 20, that is, the thickness of the second prepreg is greater than that of the first prepreg, so that the thickness of the second prepreg after lamination is consistent with that of the first prepreg while enough glue is filled in the first layer of circuit patterns, which is favorable for improving the warping problem;
performing second laminating and pressing after stacking and typesetting, wherein in the laminating process, the resin of the second prepreg flows, and filling and edge sealing are performed; and six layers of the third substrate B3 are obtained after lamination, as shown in fig. 4;
step 5), performing second shooting operation and second edge milling operation on the third substrate B3, wherein the processing boundary of the second edge milling operation is located on the base material area around working PN L of the double-sided copper-clad substrate, so as to obtain a fourth substrate;
step 6), performing copper reduction operation on the two second copper foils 31 on the fourth substrate according to production requirements, and then milling off all the edge seals of the gummosis on the periphery of the double-sided copper-clad substrate by third edge milling operation to obtain a fifth substrate B4, which can be specifically shown in the attached figure 5;
step 7), tearing and separating the fifth substrate B4 along the joint of the two ultrathin copper foils 101 and the two carrier copper foils 100 respectively to obtain two processing plates B5 containing three layers of copper foils, which can be specifically shown in the attached figure 6;
and 8) sequentially carrying out conventional processes of target shooting, drilling, conducting and circuit manufacturing on the processed board B5 to finish the subsequent required manufacturing of the packaging substrate based on the radio frequency filter, and specifically referring to the attached drawing 7.
In this embodiment, the thickness of the ultra-thin carrier copper foil 10 is preferably 3 μm or 5 μm.
Preferably, in step 3), when the first substrate B1 is subjected to the first targeting operation, the size of the drill used for targeting is smaller than the aperture of the alignment hole 12, because the alignment hole is filled with the glue of the first prepreg after the first pressing, when the drill with the size smaller than the aperture of the alignment hole is used for targeting, a certain prepreg can be retained in the alignment hole for sealing the hole, so as to prevent the liquid medicine from permeating in the subsequent wet process.
Preferably, the processing method adopted by the three-time edge milling operation is as follows: mechanical milling, laser milling or die punching.
Preferably, the thickness of the processing board B5 is less than 0.2 mm.
Preferably, the specific processing method in the step 8) is as follows: firstly, carrying out third shooting operation on the processing board B5; then, laser via hole machining is simultaneously carried out on the second copper foil 31, the second prepreg 30, the first prepreg 20 and the ultra-thin copper foil 101 of the processing plate B5, and copper deposition and hole filling electroplating machining are carried out, so that the second copper foil 31 and the ultra-thin copper foil 101 are respectively communicated with the first copper foil 21; subsequently, the processing board B5 after the conducting operation is ground to remove excess copper and the like; then, the ground processing board B5 is subjected to pattern transfer, exposure, development and etching treatment, so as to produce a second layer of circuit pattern on the surface of the second copper foil 31 and a third layer of circuit pattern on the surface of the ultra-thin copper foil 101; then, normal flow operations such as conventional solder resist coating, surface treatment, shape treatment, product testing and the like are performed on the processing board B5 on which the circuit fabrication is completed, so as to complete the fabrication of the radio frequency filter-based package substrate B6, which is specifically shown in fig. 7.
In addition, compared with the prior art, the manufacturing method of the radio frequency filter packaging substrate is mainly technically improved in that a double-sided copper-clad substrate containing a double-sided ultrathin carrier copper foil is adopted for ①, so that the risk of damage to a plate and a buckling problem can be reduced in the laminating process, the warping degree is not more than 1.5%, an aligning hole can be drilled in the double-sided copper-clad substrate, the aligning hole can be well solved, in addition, when the double-sided copper-clad substrate is matched with one-time laminating, the glue flow of the first prepreg can seal the aligning hole, the permeation of a subsequent process can be effectively prevented, the product quality is well ensured, the problem that the prepreg has consistent thickness with a second prepreg containing moisture content after the double-sided copper-clad substrate is laminated due to the action of external force in the production process is avoided, the second prepreg containing moisture content of a second prepreg is also ensured, and the second prepreg containing moisture content of a second prepreg is also ensured to be consistent with the second prepreg containing moisture content of the prepreg after the prepreg is laminated, so that the prepreg has the second prepreg filled with the second prepreg containing moisture content of the prepreg and the prepreg when the prepreg is kept consistent with the prepreg after the first prepreg is matched with the first prepreg.
The above embodiments are merely illustrative of the efficacy of the present invention and not intended to limit the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be construed as being within the scope of the present invention.
Claims (5)
1. A manufacturing method of a packaging substrate based on a radio frequency filter is characterized in that: the method comprises the following steps:
step 1), preparing a double-sided copper-clad substrate (B0), wherein the double-sided copper-clad substrate (B0) is formed by laminating two ultra-thin carrier copper foils (10) and an auxiliary substrate (11) positioned in the middle, each ultra-thin carrier copper foil (10) is provided with a layer of carrier copper foil (100) and an ultra-thin copper foil (101) which is detachably arranged on the carrier copper foil (100), and the carrier copper foil (100) faces the auxiliary substrate (11); in addition, a positioning hole (12) is drilled in the double-sided copper-clad substrate (B0);
step 2), sequentially stacking a first semi-cured sheet (20) and a first copper foil (21) on the ultrathin copper foils (101) on the two sides of the double-sided copper-clad substrate (B0), and requiring that the lengths and the widths of the first semi-cured sheet (20) and the first copper foil (21) are respectively and correspondingly greater than those of the double-sided copper-clad substrate;
laminating and laminating for the first time after stacking and typesetting, wherein in the laminating process, the resin of the first semi-cured sheet flows, is filled and seals edges of the double-sided copper-clad substrate (B0); laminating to obtain a first substrate (B1) with four layers;
step 3), firstly, carrying out first target shooting operation and first edge milling operation on the first substrate (B1); then, simultaneously manufacturing a first layer of circuit patterns (22) on the surfaces of the first copper foils (21) on the two sides of the first substrate (B1) to obtain a second substrate (B2);
step 4), sequentially stacking a second prepreg (30) and a second copper foil (31) on the first layer of circuit patterns (22) on two sides of the second substrate (B2), wherein the specifications of the glass fiber cloth of the second prepreg (30) and the first prepreg (20) are consistent, and the gel content of the second prepreg (30) is larger than that of the first prepreg (20);
performing second laminating and pressing after stacking and typesetting, wherein in the laminating process, the resin of the second prepreg flows, and filling and edge sealing are performed; and a sixth-layer third substrate (B3) is obtained after lamination;
step 5), carrying out second target shooting operation and second edge milling operation on the third substrate (B3) to obtain a fourth substrate;
step 6), carrying out copper reduction operation on the two second copper foils (31) on the fourth substrate, and then milling off all the edge seals of the gummosis on the periphery of the double-sided copper-clad substrate by third edge milling operation to obtain a fifth substrate (B4);
step 7), separating the fifth substrate (B4) along the joint of the two ultrathin copper foils (101) and the two carrier copper foils (100) respectively to obtain two processing plates (B5) containing three layers of copper foils;
and 8) sequentially carrying out conventional processes of target shooting, drilling, conducting and circuit manufacturing on the obtained processing board (B5) to finish the subsequent manufacturing of the required packaging substrate based on the radio frequency filter.
2. The method of claim 1, wherein the method further comprises: the thickness of the ultra-thin carrier copper foil (10) is 3 μm or 5 μm.
3. The method of claim 1, wherein the method further comprises: in the step 3), when the first target practice is performed on the first substrate (B1), the drill size for target practice is smaller than the diameter of the alignment hole (12).
4. The method of claim 1, wherein the method further comprises: the processing method adopted by the three-time edge milling operation comprises the following steps: mechanical milling, laser milling or die punching.
5. The method of claim 1, wherein the method further comprises: the thickness of the processing board (B5) is less than 0.2 mm.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112492747A (en) * | 2021-01-04 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate with three-layer plate structure and manufacturing method thereof |
| CN116744585A (en) * | 2023-08-15 | 2023-09-12 | 江苏普诺威电子股份有限公司 | Ultrathin medium-thickness substrate, manufacturing method thereof and voice coil motor |
| CN114302561B (en) * | 2021-12-08 | 2024-02-02 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board with ultralow copper residue and semi-through holes |
| CN117881096A (en) * | 2024-03-13 | 2024-04-12 | 江苏普诺威电子股份有限公司 | Heat dissipation packaging substrate and processing method thereof |
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| CN117881096A (en) * | 2024-03-13 | 2024-04-12 | 江苏普诺威电子股份有限公司 | Heat dissipation packaging substrate and processing method thereof |
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