CN110831355B - Preparation method of printed circuit board of 5G base station coupler - Google Patents
Preparation method of printed circuit board of 5G base station coupler Download PDFInfo
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- CN110831355B CN110831355B CN202010029329.6A CN202010029329A CN110831355B CN 110831355 B CN110831355 B CN 110831355B CN 202010029329 A CN202010029329 A CN 202010029329A CN 110831355 B CN110831355 B CN 110831355B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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Abstract
The invention relates to a preparation method of a 5G base station coupler printed circuit board, which is used for preparing an N-layer high-frequency HDI board of a millimeter wave power amplifier for a 5G base station, wherein N is an even number greater than 6, and the preparation method comprises the following steps: preparation of L1 and L2 layers: selecting a TG170 core board for manufacturing, only manufacturing an L2-th layer of circuit, and reserving a copper surface on an L1 layer; the second step is that: production of L3 to L (N-2) layers: selecting a ROGERS material core board for manufacturing, wherein the method comprises the steps of pretreatment, first lamination treatment and edge milling treatment; the third step: l (N-1) and LN layer production: selecting a TG170 core board for manufacturing, only manufacturing an L (N-1) layer circuit, and reserving a copper surface on an LN layer; the fourth step: and (3) combined lamination treatment: stacking the laminates manufactured in the first step to the third step in sequence, and performing second lamination treatment by using a laminator to integrally laminate the L1 to the LN layers; the fifth step: post-process treatment: comprises edge milling, plate baking, drilling, metal edge wrapping treatment and post-process treatment. The invention has the advantages of strong lamination bonding force, less signal transmission loss, fine circuit and the like.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a method for preparing a printed circuit board of a 5G base station coupler.
Background
With the advent of the 5G high-speed communication age, various types of high-frequency circuits, including high-frequency high-speed power amplifiers, have been developed. Appropriate printed circuit board materials are required as a foundation, and thus the demand for new high-speed printed circuit boards is increasing in the 5G era. Under 5G application of various frequencies, the material manufacturing process and the product yield of the circuit board face new challenges. Such as 6G products, and millimeter wave frequencies. At present, a multilayer high-frequency HDI board for a millimeter wave power amplifier of a 5G base station is not available for a while, and therefore, a preparation method of a 5G base station coupler printed circuit board is needed to be developed.
Disclosure of Invention
The invention provides a preparation method of a printed circuit board of a 5G base station coupler, wherein the circuit board prepared by the preparation method is a multilayer high-frequency HDI board suitable for a millimeter wave power amplifier of a 5G base station, and has the advantages of strong lamination bonding force and less signal transmission loss.
In order to achieve the above purpose, the following technical solutions are provided.
A manufacturing method of a 5G base station coupler printed circuit board for manufacturing an N-layer high frequency HDI board for a millimeter wave power amplifier of a 5G base station, wherein N is an even number greater than 6, the manufacturing method comprising the steps of,
the first step is as follows: preparation of L1 and L2 layers: selecting a TG170 core board for manufacturing, only manufacturing an L2-th layer of circuit, and reserving a copper surface on an L1 layer;
the second step is that: production of L3 to L (N-2) layers: selecting a ROGERS material core board for manufacturing, wherein the method comprises the steps of pretreatment, first lamination treatment and edge milling treatment;
the third step: l (N-1) and LN layer production: selecting a TG170 core board for manufacturing, only manufacturing an L (N-1) layer circuit, and reserving a copper surface on an LN layer;
the fourth step: and (3) combined lamination treatment: stacking the laminates manufactured in the first step to the third step in sequence, and performing second lamination treatment by using a laminating machine to integrally press the L1 to the LN layers together, wherein the second lamination treatment is mixed lamination treatment, namely pressing the TG170 core plates in the first step and the third step and the ROGERS core plates in the second step together;
the fifth step: post-process treatment: comprises edge milling, plate baking, drilling, metal edge wrapping treatment and post-process treatment.
The invention relates to a method for preparing a 5G base station coupler printed circuit board, which comprises the steps of preparing L1, L2 layers, L (N-1), LN layers and L3 to L (N-2) layers, carrying out first lamination pressing treatment among the layers in the preparation process of the L3 to L (N-2) layers, then respectively stacking L1 and L2 layers and the L (N-1) and LN layers on two sides, carrying out second lamination pressing treatment, wherein the first lamination pressing treatment is the pressing treatment among the same ROGERS core boards, copper foils and PP, and the second lamination pressing treatment is the core board mixed pressing treatment of the ROGERS core boards, the TG170 core boards on the top and the TG170 core boards on the bottom, wherein the copper foils used by the ROGERS high-frequency materials need radio-frequency lines on the high-frequency boards and also need to consider the binding force between the high-frequency boards and PP, therefore, an L2 layer circuit is prepared on one side of a substrate, and the rough surface of the side surface of a circuit, the glue flowing gap between the glue flowing channel and the circuit can improve the bonding force between the glue flowing channel and the L3-L (N-2) layer, and the bonding force between the glue flowing channel and the circuit and other layers is ensured by combining and pressing, so that the thickness of the dielectric layer is uniform, and the signal transmission loss is reduced.
Further, according to the method for manufacturing a 5G base station coupler printed circuit board of claim 1, the core boards of the L1 and L2 layers and the L (N-1) and LN layers are manufactured by using thin boards as core boards, and the core boards of the L1 and L2 layers and the L (N-1) and LN layers are designed with blind holes.
Furthermore, the core boards of the L1 and L2 layers and the manufacturing processes of the L (N-1) and LN layers are as follows: cutting material → drilling blind holes → plating copper plate electric → resin plug hole → polishing and leveling → making inner layer circuit → outer layer dry film → acid etching → film removing → outer layer AOI.
Furthermore, mechanical blind hole electroplating is adopted in the copper plate electroplating process in the manufacturing process of the core plates of the L1 and L2 layers and the L (N-1) and LN layers, and the mechanical blind hole electroplating is electroplating in a thin plate frame and VCP electroplating mode.
Further, the pre-process treatment: cutting → baking plate → inner layer wet film → inner layer etching → inner inspection.
Further, the metal edge covering treatment in the fifth step comprises a metal edge covering process, wherein the metal edge covering position is a metal edge covering design except for the product, the process edge connecting part and the stamp hole area. As is well known, a printed circuit board includes a plurality of unit circuit boards for shipment to a user, and in the process of manufacturing the printed circuit board, a technical edge joint is provided between the unit circuit boards for connecting adjacent unit circuit boards and facilitating cutting and removal of a finished unit circuit board, which is used for shipment to the user, and thus, the unit circuit board is called a product. The metal edge covering positions are except for the product, the technical edge connecting position and the stamp hole area, namely except for the technical edge connecting position and the stamp area between the unit circuit board and the adjacent unit circuit board.
Further, after the metal edge covering process is completed, the inner groove before copper plating → the copper plating plate electric → the outer dry film → the pattern electric → the half groove → the film removing → the etching process is sequentially performed.
Further, the metal-covered edge treatment in the fifth step may further include a secondary drilling step of cutting a position where the metal-covered edge position meets the non-metal-covered edge position, before the etching step.
Furthermore, the etching process enables the copper sheet generated in the secondary drilling and cutting process to disappear after etching, and the metal edge wrapping is ensured to be complete without copper sheet tilting.
Further, during the etching process, the radio frequency line width is controlled, and the compensation size of the radio frequency line is determined according to the etching capacity.
Compared with the prior art, the preparation method of the printed circuit board of the 5G base station coupler has the following beneficial effects:
the invention relates to a method for preparing a 5G base station coupler printed circuit board, which comprises the steps of preparing L1, L2 layers, L (N-1), LN layers and L3 to L (N-2) layers, carrying out first lamination pressing treatment among the layers in the preparation process of the L3 to L (N-2) layers, then respectively stacking L1 and L2 layers and the L (N-1) and LN layers on two sides, carrying out second lamination pressing treatment, wherein the first lamination pressing treatment is the pressing treatment among the same ROGERS core boards, copper foils and PP, and the second lamination pressing treatment is the core board mixed pressing treatment of the ROGERS core boards, the TG170 core boards on the top and the TG170 core boards on the bottom, wherein the copper foils used by the ROGERS high-frequency materials need radio-frequency lines on the high-frequency boards and also need to consider the binding force between the high-frequency boards and PP, therefore, an L2 layer circuit is prepared on one side of a substrate, and the rough surface of the side surface of a circuit, the glue flowing gap between the glue flowing channel and the circuit can improve the bonding force between the glue flowing channel and the L3-L (N-2) layer, and the bonding force between the glue flowing channel and the circuit and other layers is ensured by combining and pressing, so that the thickness of the dielectric layer is uniform, and the signal transmission loss is reduced.
Detailed Description
The method for manufacturing the printed circuit board of the 5G base station coupler according to the present invention will be described in further detail with reference to the following embodiments.
Example 1
A preparation method of a printed circuit board of a 5G base station coupler is used for preparing a 12-layer high-frequency HDI board of a millimeter wave power amplifier of a 5G base station, and comprises the following steps,
the first step is as follows: preparation of L1 and L2 layers: selecting a TG170 core board for manufacturing, only manufacturing an L2-th layer of circuit, and reserving a copper surface on an L1 layer;
the second step is that: production of L3-L10 layers: selecting a ROGERS material core board for manufacturing, wherein the method comprises the steps of pretreatment, first lamination treatment and edge milling treatment;
the third step: preparation of L11 and L12 layers: selecting a TG170 core board for manufacturing, only manufacturing L (N-1) layers of circuits, and reserving copper surfaces on L12 layers;
the fourth step: and (3) combined lamination treatment: stacking the laminates manufactured in the first step to the third step in sequence, and performing second lamination treatment by using a laminating machine to integrally press the L1-L12 layers together, wherein the second lamination treatment is mixed lamination treatment, namely pressing the TG170 core plates in the first step and the third step and the ROGERS core plates in the second step together;
the fifth step: post-process treatment: comprises edge milling, plate baking, drilling, metal edge wrapping treatment and post-process treatment.
The invention relates to a method for preparing a 5G base station coupler printed circuit board, which comprises the steps of preparing L1, L2 layers, L11, L12 layers and L3 to L10 layers, carrying out first lamination pressing treatment among the layers in the preparation process of the L3 to L10 layers, then respectively stacking L1 layers, L2 layers, L11 layers and L12 layers on two sides, carrying out second lamination pressing treatment, wherein the first lamination pressing treatment is the pressing treatment among the same ROGERS core boards, copper foils and PP, and the second lamination pressing treatment is the mixed lamination pressing treatment of the ROGERS core boards, the top TG170 core boards and the bottom TG170 core boards, wherein the ROGERS high-frequency material uses the high-frequency boards which need radio-frequency lines and also need to consider the binding force between the high-frequency boards and PP, therefore, the L2 layer circuit is prepared by adopting a single surface of the substrate, the rough surface of the side surface of the copper layer and the front surface of the circuit can improve the binding force between the line and the L3-L10 layer, the mode of combining and pressing with other layers ensures the lamination binding force, enables the thickness of the dielectric layer to be uniform and reduces the signal transmission loss. The mixing and pressing formula of the L3-L10 layer, the L1 layer, the L2 layer, the L11 layer and the L12 layer is shown in Table 1.
Table 1: mixed pressure program meter
| Number of stages | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| Initial temperature (F) | 284 | 284 | 356 | 410 | 410 | 410 | 410 | 410 | 356 | 284 |
| Final temperature (F) | 284 | 356 | 410 | 410 | 410 | 410 | 410 | 356 | 284 | 237 |
| Initial Pressure (PSI) | 100 | 100 | 300 | 450 | 550 | 550 | 550 | 250 | 100 | 100 |
| Final Pressure (PSI) | 100 | 250 | 400 | 450 | 550 | 550 | 400 | 100 | 100 | 100 |
| Time (min) | 8 | 10 | 26 | 5 | 50 | 30 | 20 | 30 | 30 | 1 |
In a non-limiting embodiment of the present invention, the core plates of the L1 and L2 layers and the L11 and L12 layers are all prepared by using thin plates with a thickness of 0.185mm (without copper foil thickness) as the core plates, and the core plates of the L1 and L2 layers and the L11 and L12 layers are all designed with blind holes, and the aperture of the blind holes is 0.25 mm.
In a non-limiting embodiment of the present invention, the core boards of the L1 and L2 layers and the L11 and L12 layers are all manufactured as follows: cutting material → drilling blind holes → plating copper plate electric → resin plug hole → polishing and leveling → making inner layer circuit → outer layer dry film → acid etching → film removing → outer layer AOI. After the manufacture is finished, the blind holes are formed by pressing the laminated plates together with the L3-L10.
In a non-limiting embodiment of the present invention, in the core board of the L1 and L2 layers and the copper plate deposition process in the manufacturing process of the L11 and L12 layers, mechanical blind via electroplating is adopted, and the mechanical blind via electroplating is electroplating by adopting a thin plate rack + VCP electroplating manner.
In one non-limiting embodiment of the present invention, the pre-process treatment comprises: cutting → baking plate → inner layer wet film → inner layer etching → inner inspection.
In a non-limiting embodiment of the present invention, the metal covering process in the fifth step includes a metal covering process, where the metal covering position is a metal edge design except for a product, a technical edge joint and a stamp hole area. As is well known, a printed circuit board includes a plurality of unit circuit boards for shipment to a user, and in the process of manufacturing the printed circuit board, a technical edge joint is provided between the unit circuit boards for connecting adjacent unit circuit boards and facilitating cutting and removal of a finished unit circuit board, which is used for shipment to the user, and thus, the unit circuit board is called a product. The metal edge covering positions are except for the product, the technical edge connecting position and the stamp hole area, namely except for the technical edge connecting position and the stamp area between the unit circuit board and the adjacent unit circuit board.
In a non-limiting embodiment of the present invention, after the metal edge covering process is completed, the inner groove → the copper plate → the outer dry film → the pattern electric → the half groove → the film removal → the etching process is performed in sequence. The inner groove is milled before drilling and copper deposition, the roughness of the edge of the plate is larger due to milling of the groove, and the smoothness of the substrate wall of the metal edge is ensured by adopting a method of removing glue twice. Then, the inside of the tank is metalized through copper deposition and electroplating, and an outer layer dry film and a pattern are performed.
In a non-limiting embodiment of the present invention, the metal covering process in the fifth step further includes a secondary drilling step, which is performed before the etching step, for cutting a position where the metal covering position meets the non-metal covering position.
In a non-limiting embodiment of the present invention, the etching process causes the copper sheet generated in the secondary drilling and cutting process to disappear after etching, so as to ensure that the metal covering edge is complete without copper sheet tilting, and thus, the metal covering edge is formed.
In a non-limiting embodiment of the present invention, the rf linewidth control is performed during the etching process, and the rf linecompensation size is determined according to the etching capability. According to the etching capacity, the radio frequency line compensates 1.2mil, the LDI exposure machine and the vacuum etching machine are adopted for production, etching is controlled according to the standard of line width +/-5%, and 9 areas of pnl plates which are measured respectively can be etched in batches within the required range. The required ranges are specified in Table 2.
TABLE 2
| Radio frequency linewidth requirement | Compensation | Measured in fact | Determination |
| 5mil±0.3mil | 1.2mil | 4.95-5.06mil | OK |
Example 2
A preparation method of a printed circuit board of a 5G base station coupler is used for preparing an 8-layer high-frequency HDI board of a millimeter wave power amplifier of a 5G base station, and comprises the following steps,
the first step is as follows: preparation of L1 and L2 layers: selecting a TG170 core board for manufacturing, only manufacturing an L2-th layer of circuit, and reserving a copper surface on an L1 layer;
the second step is that: production of L3-L6 layers: selecting a ROGERS material core board for manufacturing, wherein the method comprises the steps of pretreatment, first lamination treatment and edge milling treatment;
the third step: preparation of L7 and L8 layers: selecting a TG170 core board for manufacturing, only manufacturing L (N-1) layers of circuits, and reserving copper surfaces on L8 layers;
the fourth step: and (3) combined lamination treatment: stacking the laminates manufactured in the first step to the third step in sequence, and performing second lamination treatment by using a laminating machine to integrally press the L1-L8 layers together, wherein the second lamination treatment is mixed lamination treatment, namely pressing the TG170 core plates in the first step and the third step and the ROGERS core plates in the second step together;
the fifth step: post-process treatment: comprises edge milling, plate baking, drilling, metal edge wrapping treatment and post-process treatment.
The invention relates to a method for preparing a 5G base station coupler printed circuit board, which comprises the steps of preparing L1, L2 layers, L7, L8 layers and L3 to L6 layers, carrying out first lamination pressing treatment among the layers in the preparation process of the L3 to L6 layers, then respectively stacking L1 layers, L2 layers, L7 layers and L8 layers on two sides, carrying out second lamination pressing treatment, wherein the first lamination pressing treatment is the pressing treatment among the same ROGERS core boards, copper foils and PP, and the second lamination pressing treatment is the mixed lamination pressing treatment of the ROGERS core boards, the top TG170 core boards and the bottom TG170 core boards, wherein the ROGERS high-frequency material uses the high-frequency boards which need radio-frequency lines and also need to consider the binding force between the high-frequency boards and PP, therefore, the L2 layer circuit is prepared by adopting a single surface of the substrate, the rough surface of the side surface of the copper layer and the front surface of the circuit can improve the binding force between the line and the L3-L6 layer, the mode of combining and pressing with other layers ensures the lamination binding force, enables the thickness of the dielectric layer to be uniform and reduces the signal transmission loss.
In a non-limiting embodiment of the present invention, the core plates of the L1 and L2 layers and the L7 and L8 layers are all prepared by using thin plates with a thickness of 0.185mm (without copper foil thickness) as the core plates, and the core plates of the L1 and L2 layers and the L7 and L8 layers are all designed with blind holes, and the aperture of the blind holes is 0.25 mm.
In a non-limiting embodiment of the present invention, the core boards of the L1 and L2 layers and the L7 and L8 layers are all manufactured as follows: cutting material → drilling blind holes → plating copper plate electric → resin plug hole → polishing and leveling → making inner layer circuit → outer layer dry film → acid etching → film removing → outer layer AOI. After the manufacture is finished, the blind holes are formed by pressing the laminated plates together with the L3-L6.
In a non-limiting embodiment of the present invention, in the core board of the L1 and L2 layers and the copper plate deposition process in the manufacturing process of the L7 and L8 layers, mechanical blind via electroplating is adopted, and the mechanical blind via electroplating is electroplating by adopting a thin plate rack + VCP electroplating manner.
In one non-limiting embodiment of the present invention, the pre-process treatment comprises: cutting → baking plate → inner layer wet film → inner layer etching → inner inspection.
In a non-limiting embodiment of the present invention, the metal covering process in the fifth step includes a metal covering process, where the metal covering position is a metal edge design except for a product, a technical edge joint and a stamp hole area.
In a non-limiting embodiment of the present invention, after the metal edge covering process is completed, the inner groove → the copper plate → the outer dry film → the pattern electric → the half groove → the film removal → the etching process is performed in sequence. And (3) routing an inner groove before copper deposition in the drilled hole, wherein the roughness of the edge of the plate is larger due to the routing of the groove, and the smoothness of the substrate wall of the metal edge is ensured by adopting a method of removing glue twice. Then, the inside of the tank is metalized through copper deposition and electroplating, and an outer layer dry film and a pattern are performed.
In a non-limiting embodiment of the present invention, the metal covering process in the fifth step further includes a secondary drilling step, which is performed before the etching step, for cutting a position where the metal covering position meets the non-metal covering position.
In a non-limiting embodiment of the present invention, the etching process causes the copper sheet generated in the secondary drilling and cutting process to disappear after etching, so as to ensure that the metal covering edge is complete without copper sheet tilting, and thus, the metal covering edge is formed.
In a non-limiting embodiment of the present invention, the rf linewidth control is performed during the etching process, and the rf linecompensation size is determined according to the etching capability. According to the etching capacity, the radio frequency line compensates 1.2mil, the LDI exposure machine and the vacuum etching machine are adopted for production, etching is controlled according to the standard of line width +/-5%, and 9 areas of pnl plates which are measured respectively can be etched in batches within the required range.
Example 3
A preparation method of a printed circuit board of a 5G base station coupler is used for preparing a 16-layer high-frequency HDI board of a millimeter wave power amplifier of a 5G base station, and comprises the following steps,
the first step is as follows: preparation of L1 and L2 layers: selecting a TG1150 core board for manufacturing, only manufacturing an L2 layer of circuit, and reserving a copper surface on an L1 layer;
the second step is that: production of L3-L14 layers: selecting a ROGERS material core board for manufacturing, wherein the method comprises the steps of pretreatment, first lamination treatment and edge milling treatment;
the third step: preparation of L15 and L16 layers: selecting a TG1150 core board for manufacturing, only making L (N-1) layers of circuits, and reserving copper surfaces on the L16 layers;
the fourth step: and (3) combined lamination treatment: stacking the laminates manufactured in the first step to the third step in sequence, and performing second lamination treatment by using a laminating machine to integrally press the L1-L16 layers together, wherein the second lamination treatment is mixed lamination treatment, namely pressing the TG170 core plates in the first step and the third step and the ROGERS core plates in the second step together;
the fifth step: post-process treatment: comprises edge milling, plate baking, drilling, metal edge wrapping treatment and post-process treatment.
The invention relates to a method for preparing a 5G base station coupler printed circuit board, which comprises the steps of preparing L1, L2 layers, L15, L16 layers and L3 to L14 layers, carrying out first lamination pressing treatment among the layers in the preparation process of the L3 to the L14 layers, then respectively stacking L1, L2 layers and L15 and L16 layers on two sides, carrying out second lamination pressing treatment, wherein the first lamination pressing treatment is the pressing treatment among the same ROGERS core boards, copper foils and PP, and the second lamination pressing treatment is the mixed lamination pressing treatment of the ROGERS core boards, the top TG1150 core board and the bottom TG1150 core board respectively, wherein the ROGERS high-frequency material uses a radio-frequency line on the high-frequency board, and the binding force between the high-frequency board and the PP is also considered, therefore, an L2 layer circuit is prepared by adopting a single surface of a substrate, the rough surface of the side surface of a copper layer of the circuit and the gap between the circuit and the flow glue can improve the L3-L14 layer, the mode of combining and pressing with other layers ensures the lamination binding force, enables the thickness of the dielectric layer to be uniform and reduces the signal transmission loss.
In a non-limiting embodiment of the present invention, the core plates of the L1 and L2 layers and the L15 and L16 layers are all prepared by using thin plates with a thickness of 0.185mm (without copper foil thickness) as the core plates, and the core plates of the L1 and L2 layers and the L15 and L16 layers are all designed with blind holes, and the aperture of the blind holes is 0.25 mm.
In a non-limiting embodiment of the present invention, the core boards of the L1 and L2 layers and the L15 and L16 layers are all manufactured as follows: cutting material → drilling blind holes → plating copper plate electric → resin plug hole → polishing and leveling → making inner layer circuit → outer layer dry film → acid etching → film removing → outer layer AOI. After the manufacture is finished, the blind holes are formed by pressing the laminated plates together with the L3-L14.
In a non-limiting embodiment of the present invention, in the core board of the L1 and L2 layers and the copper plate deposition process in the manufacturing process of the L15 and L16 layers, mechanical blind via electroplating is adopted, and the mechanical blind via electroplating is electroplating by adopting a thin plate rack + VCP electroplating manner.
In one non-limiting embodiment of the present invention, the pre-process treatment comprises: cutting → baking plate → inner layer wet film → inner layer etching → inner inspection.
In a non-limiting embodiment of the present invention, the metal covering process in the fifth step includes a metal covering process, where the metal covering position is a metal edge design except for a product, a technical edge joint and a stamp hole area.
In a non-limiting embodiment of the present invention, after the metal edge covering process is completed, the inner groove → the copper plate → the outer dry film → the pattern electric → the half groove → the film removal → the etching process is performed in sequence. And (3) routing an inner groove before copper deposition in the drilled hole, wherein the roughness of the edge of the plate is larger due to the routing of the groove, and the smoothness of the substrate wall of the metal edge is ensured by adopting a method of removing glue twice. Then, the inside of the tank is metalized through copper deposition and electroplating, and an outer layer dry film and a pattern are performed.
In a non-limiting embodiment of the present invention, the metal covering process in the fifth step further includes a secondary drilling step, which is performed before the etching step, for cutting a position where the metal covering position meets the non-metal covering position.
In a non-limiting embodiment of the present invention, the etching process causes the copper sheet generated in the secondary drilling and cutting process to disappear after etching, so as to ensure that the metal covering edge is complete without copper sheet tilting, and thus, the metal covering edge is formed.
In a non-limiting embodiment of the present invention, the rf linewidth control is performed during the etching process, and the rf linecompensation size is determined according to the etching capability. According to the etching capacity, the radio frequency line compensates 1.2mil, the LDI exposure machine and the vacuum etching machine are adopted for production, etching is controlled according to the standard of line width +/-5%, and 9 areas of pnl plates which are measured respectively can be etched in batches within the required range.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (10)
1. A preparation method of a printed circuit board of a 5G base station coupler is characterized by comprising the following steps: the preparation method is used for preparing an N-layer high-frequency HDI board of a millimeter wave power amplifier for a 5G base station, wherein N is an even number greater than 6, and comprises the following steps,
the first step is as follows: preparation of L1 and L2 layers: selecting a TG170 core board for manufacturing, only manufacturing an L2-th layer of circuit, and reserving a copper surface on an L1 layer;
the second step is that: production of L3 to L (N-2) layers: selecting a ROGERS material core board for manufacturing, wherein the method comprises the steps of pretreatment, first lamination treatment and edge milling treatment;
the third step: l (N-1) and LN layer production: selecting a TG170 core board for manufacturing, only manufacturing an L (N-1) layer circuit, and reserving a copper surface on an LN layer;
the fourth step: and (3) combined lamination treatment: stacking the laminates manufactured in the first step to the third step in sequence, and performing second lamination treatment by using a laminator to integrally laminate the L1 to the LN layers;
the fifth step: post-process treatment: comprises edge milling, plate baking, drilling, metal edge wrapping treatment and post-process treatment.
2. The method for manufacturing a printed circuit board of a 5G base station coupler as claimed in claim 1, wherein the core boards of the L1 and L2 layers and the L (N-1) and LN layers are manufactured by using thin boards as core boards, and the core boards of the L1 and L2 layers and the L (N-1) and LN layers are designed with blind holes.
3. The method for preparing a printed circuit board of a 5G base station coupler as claimed in claim 2, wherein the core boards of the L1 and L2 layers and the L (N-1) and LN layers are prepared by the following steps: cutting material → drilling blind holes → plating copper plate electric → resin plug hole → polishing and leveling → making inner layer circuit → outer layer dry film → acid etching → film removing → outer layer AOI.
4. The method for preparing a printed circuit board of a 5G base station coupler as claimed in claim 3, wherein the core board of the L1 and L2 layers and the copper plate deposition process in the manufacturing process of the L (N-1) and LN layers are carried out by mechanical blind hole electroplating, and the mechanical blind hole electroplating is carried out by adopting a thin plate frame and VCP electroplating mode.
5. The method of manufacturing a 5G base station coupler printed circuit board of claim 1, wherein the pre-process treatment: cutting → baking plate → inner layer wet film → inner layer etching → inner inspection.
6. The method of claim 1, wherein the metal edge covering process in the fifth step comprises a metal edge covering process, and the metal edge covering position is a metal edge covering design except for a product, a process edge joint and a stamp hole area.
7. The method for manufacturing a 5G base station coupler printed circuit board according to claim 6, wherein after the metal edge covering process is completed, the copper pre-plating routing inner groove → copper plating board electric → outer dry film → graphic electric → routing half groove → film stripping → etching process is performed in sequence.
8. The method of claim 7, wherein the metal cladding process in the fifth step further comprises a secondary drilling step, which is performed before the etching step, for cutting off a portion where the metal cladding portion meets the non-metal cladding portion.
9. The method of claim 8, wherein the etching step is performed to remove copper flakes generated during the second drilling and cutting process, thereby ensuring that the metal edge is completely covered without copper flakes.
10. The method as claimed in claim 8, wherein the etching process is performed with a radio frequency line width control, and the compensation of the radio frequency line is determined according to the etching capability.
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| CN111491466A (en) * | 2020-03-27 | 2020-08-04 | 广东科翔电子科技股份有限公司 | Method for manufacturing 77GHz millimeter wave radar circuit board |
| CN114615828A (en) * | 2020-12-08 | 2022-06-10 | 深南电路股份有限公司 | HDI circuit board, manufacturing method thereof and millimeter wave radar sensor |
| CN114286544B (en) * | 2022-01-04 | 2024-01-30 | 江西中络电子有限公司 | Processing method of anti-interference 5G base station signal amplifier printed circuit board |
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