CN217088243U

CN217088243U - Multilayer blind hole microwave board formed by mixed pressing of nickel-phosphorus sheet resistance materials

Info

Publication number: CN217088243U
Application number: CN202220693072.9U
Authority: CN
Inventors: 顾凯旋; 王德瑜; 吉祥书
Original assignee: Zhejiang Jiutong Electronic Technology Co ltd
Current assignee: Zhejiang Jiutong Electronic Technology Co ltd
Priority date: 2022-03-25
Filing date: 2022-03-25
Publication date: 2022-07-29
Anticipated expiration: 2032-03-25

Abstract

A multilayer blind hole microwave board mixed and pressed by nickel-phosphorus sheet resistance materials. The multilayer blind hole microwave board mixed and pressed by the nickel-phosphorus sheet resistance material comprises a first board, a dielectric layer and a second board. The first sheet material includes a substrate, a resistive layer, and a copper layer. A first square hole and a square resistor are etched in the resistance layer and the copper layer. The high-temperature-resistant adhesive tape is attached to the square resistor, the edge of the high-temperature-resistant adhesive tape is located in the middle position between the square resistor and the inner side wall of the first square hole, the thickness of the high-temperature-resistant adhesive tape is the same as that of the dielectric layer, and the square resistor can be protected during pressing. The method comprises the steps of pre-placing patterns before the first plate and the second plate are pressed, pre-placing the first plate and the second plate to a certain extent before the first plate and the second plate are pressed, so that the sizes of the first plate and the second plate after pressing are matched with each other to reach 1:1, the phenomenon of asymmetry caused by different materials is avoided, and the pressing quality is improved.

Description

Multilayer blind hole microwave board formed by mixed pressing of nickel-phosphorus sheet resistance materials

Technical Field

The utility model relates to a circuit board technical field, in particular to multilayer blind hole microwave board that nickel phosphorus sheet resistance material thoughtlessly pressed.

Background

The buried resistor, also called buried resistor or thin film resistor, is a technology of pressing a resistor made of special material on an insulating substrate, then forming an outer layer material with a designed required resistance value through processes of printing, etching and the like, and then pressing the outer layer material on a printed board to form a planar resistance layer.

With the development trend of miniaturization and multi-functionalization of electronic products, the number of passive elements and the size of a printed circuit board are required to be reduced as much as possible, and the embedded passive elements are embedded into the printed circuit board through the application of a planar embedded resistor manufacturing process technology, so that the line length among the elements can be shortened, and a large number of welding points on the surface of the printed circuit board are reduced. However, when a planar resistive layer is formed by etching, the edge of the line width after etching is affected by etching, and the resistive layer has residues, if the line is thin due to continuous etching, the sheet resistance changes with the line width, so that the etching has a great influence on the accuracy, and it is difficult to accurately control the etching accuracy.

On the other hand, with the rapid advance of the 5G communication technology, designers have higher and higher requirements on product performance and product integration, and the multilayer circuit board mixed with various high-frequency and high-speed materials is also increased explosively. In the prior art, various materials are mostly directly laminated, such as a buried resistor printed board disclosed in patent No. CN201310392722.1 and a manufacturing method thereof. However, when the two plates are pressed, under the influence of different material structures, the warp, weft, size and plate thickness can influence the expansion and contraction values, so that the phenomenon of asymmetry or layer deviation can be caused after pressing.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides a multilayer blind hole microwave board made of mixed-pressed nickel-phosphorus sheet resistance material, so as to solve the above technical problems.

A multi-layer blind hole microwave board formed by co-pressing nickel-phosphorus square resistor materials comprises a first board, at least one medium layer arranged on the first board, and a second board arranged on the medium layer, wherein the first board comprises a substrate, a resistor layer arranged on the substrate, and a copper layer arranged on the resistor layer, at least one first square hole and at least one square resistor arranged in the first square hole are etched on the resistor layer and the copper layer, the square resistor is positioned in the center of the first square hole and arranged at intervals with the inner side wall of the first square hole, a high-temperature-resistant adhesive tape is pasted on the square resistor, the edge of the high-temperature-resistant adhesive tape is positioned in the middle position between the square resistor and the inner side wall of the first square hole, the thickness of the high-temperature-resistant adhesive tape is the same as that of the medium layer, and the second board is connected with the first board through the medium layer in a press-pressing manner, the method comprises the following steps of pre-placing patterns before the first plate and the second plate are pressed, wherein at least one second square hole penetrating through the second plate and the medium layer is formed in the second plate, and the second square hole is coaxially arranged with the first square hole and communicated with the first square hole to form a blind groove.

Furthermore, the first plate is a polytetrafluoroethylene copper-clad plate and is single-sided or double-sided.

Further, the resistance layer is made of a nickel-phosphorus alloy which is a resistance material.

Further, the second plate material is made of FR-4 grade material.

Further, when a plurality of blind grooves are formed, when the distance between each blind groove and the corresponding blind groove is larger than or equal to 5mm, the circuit of the electroplating area is placed a certain distance into the corresponding blind groove, and when the distance between each blind groove and the corresponding blind groove is smaller than 5mm, the copper area is reduced.

Compared with the prior art, the utility model provides a pair of multilayer blind hole microwave board that nickel phosphorus side hinders material and thoughtlessly presses passes through the side hinders and posts high temperature resistant adhesive tape, the border of high temperature resistant adhesive tape is located the side hinder with intermediate position between the inside wall of first square hole, the thickness of high temperature resistant adhesive tape with the thickness of dielectric layer is the same, can protect when the pressfitting the side hinders. Before lamination, the first plate is pre-placed by eight ten thousandths, and the second plate is pre-placed by four thousandths, so that the first plate and the second plate are pre-placed to a certain degree before lamination, the sizes of the first plate and the second plate are matched to reach 1:1 after lamination, the phenomenon of asymmetry caused by different materials is avoided, and the lamination quality is improved.

Drawings

FIG. 1 is a cross-sectional view of the multi-layer blind hole microwave board mixed with nickel-phosphorus sheet resistance material provided by the present invention.

Detailed Description

Specific examples of the present invention will be described in further detail below. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.

As shown in fig. 1, it is a schematic structural diagram of a multilayer blind hole microwave board mixed and pressed by nickel-phosphorus sheet resistance material provided by the present invention. The multilayer blind hole microwave board mixed and pressed by the nickel-phosphorus sheet resistance material comprises a first board 10, at least one dielectric layer 20 arranged on the first board 10, and a second board 30 arranged on the dielectric layer 20. It is understood that the multi-layer blind hole microwave board with ni-p sheet resist mixed compression further includes other functional modules, such as circuit elements, through holes, circuit patterns, etc., which are well known to those skilled in the art and will not be described herein again.

The first sheet 10 is a teflon copper clad laminate and may be a single-sided or double-sided sheet, and in this embodiment, the first sheet 10 is a single-sided sheet. The first sheet material 10 includes a substrate 11, a resistive layer 12 disposed on the substrate 11, and a copper layer 13 disposed on the resistive layer 12.

The substrate 11 is used for carrying the above-mentioned functional modules, so that the substrate 11 is provided with a plurality of functional structures, such as through holes and the like, which are positioned with the second plate 30, and which can be arranged according to actual needs, and will not be described in detail herein.

The resistance layer 12 is made of a resistance material nickel-phosphorus alloy, and at least one first square hole 14 and at least one square resistor 141 located in the first square hole 14 are etched on the resistance layer 12 and the copper layer 13. The square resistor 141 is located at the center of the first square hole 14 and is spaced apart from the inner side wall of the first square hole 14. The square resistor 141 and the first resistorThe square hole 14 is formed by etching the resistor layer 12 and the copper layer 13, and specifically, a dry film is attached to the copper layer 13, then exposure and development are performed to transfer images corresponding to the square resistor 141 and other circuits to the dry film, and then the dry film is put into an etching solution to be etched, so that the first square hole 14, the square resistor 141 and other circuit patterns are etched. The concentration of chloride ions in the etching solution is 140-180 g/l, the acid equivalent is 2-2.2N, S.G is 1.28-1.32, the temperature is 45-55 ℃, and the spraying pressure is 1.5-2.5 kg/cm ² . Adding CuSO with the concentration of 240-260 g/L ₄ And H with the concentration of 10-14 ml/L ₂ SO ₄ And carrying out secondary etching in the mixed solution for 1-3 minutes, wherein the temperature of the mixed solution is 85-95 ℃, and stripping and cleaning after the secondary etching is finished. Because the resistance layer is remained after the etching of the line width edge, if the line is thin due to the continuous etching, the square resistor changes along with the line width, the way of soaking copper sulfate is adopted for etching to eliminate the resistance layer at the line width edge, so that the side wall of the square resistor 141 is smooth, the resistance value of the square resistor 141 can be accurately ensured, and the line width is prevented from being thin due to the continuous etching.

The high-temperature-resistant adhesive tape 142 is attached to the square resistor 141, the edge of the high-temperature-resistant adhesive tape 142 is located in the middle between the square resistor 141 and the inner side wall of the first square hole 14, and the thickness of the high-temperature-resistant adhesive tape 142 is the same as that of the dielectric layer 20, so that the square resistor 141 can be protected during pressing.

The dielectric layer 20 is used to connect the first board 10 and the second board 30 during lamination and plays a role of interlayer insulation, which should be prior art and will not be described herein again. The number of layers of the dielectric layer 20 can be set according to actual needs.

The second sheet material 30 is made of an FR-4 grade material. The second plate 30 and the first plate 10 are connected through the dielectric layer 20 in a pressing manner. Because the materials, sizes and thicknesses of the second plate 30 and the first plate 10 are different, the expansion and contraction values are affected, and the Z-axis expansion and contraction coefficients of the PTFE (polytetrafluoroethylene) material and the FR-4 (epoxy resin) material are also not matched, the second plate 30 and the first plate 10 can expand and contract to different degrees after being pressed, so that the phenomenon of layer deviation occurs after pressing. And calculating the pre-magnification by collecting a large amount of data of different harmomegathus after the PTFE and the FR-4 are pressed and establishing an harmomegathus database. Before lamination, the first plate 10 is pre-placed by eight ten thousandths, and the second plate 30 is pre-placed by four thousandths, so that the first plate 10 and the second plate 30 are pre-placed to a certain degree before lamination, the sizes of the first plate and the second plate are matched with each other to reach 1:1 after lamination, the phenomenon of asymmetry caused by different materials is avoided, and the lamination quality is improved. Meanwhile, after the pressing, the high temperature resistant adhesive tape 142 needs to be torn off, and the square resistor 141 is subjected to subsequent processing. The second plate 30 is provided with at least one second square hole 31 penetrating through the second plate 30 and the medium layer 20, and the second square hole 31 and the first square hole 14 are coaxially arranged and are communicated with each other, so that a blind groove is formed. When a plurality of blind grooves are arranged, when the distance between the blind grooves is more than or equal to 5mm, the circuit of the electroplating area is placed a certain distance into the blind grooves. When the distance between the blind grooves is less than 5mm, the copper area is properly reduced, and the delamination after lamination is avoided.

Compared with the prior art, the utility model provides a pair of multilayer blind hole microwave board that nickel phosphorus side hinders material and thoughtlessly presses passes through the side hinders 141 and goes up to paste high temperature resistant adhesive tape 142, the border of high temperature resistant adhesive tape 142 is located the side hinder 141 with intermediate position between the inside wall of first square hole 14, the thickness of high temperature resistant adhesive tape 142 with dielectric layer 20's thickness is the same, can protect when the pressfitting the side hinders 141. Before lamination, the first plate 10 is pre-placed by eight ten thousandths, and the second plate 30 is pre-placed by four thousandths, so that the first plate 10 and the second plate 30 are pre-placed to a certain degree before lamination, the sizes of the first plate and the second plate are matched with each other to reach 1:1 after lamination, the phenomenon of asymmetry caused by different materials is avoided, and the lamination quality is improved.

The above description is only for the preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention, and any modification, equivalent replacement or improvement within the spirit of the present invention is encompassed by the claims of the present invention.

Claims

1. The utility model provides a multilayer blind hole microwave board that nickel phosphorus sheet resistance material thoughtlessly pressed which characterized in that: the microwave board with the multilayer blind holes comprises a first board, at least one dielectric layer arranged on the first board, and a second board arranged on the dielectric layer, wherein the first board comprises a substrate, a resistance layer arranged on the substrate, and a copper layer arranged on the resistance layer, at least one first square hole and at least one square resistor arranged in the first square hole are etched on the resistance layer and the copper layer, the square resistor is positioned in the center of the first square hole and arranged at intervals with the inner side wall of the first square hole, a high-temperature-resistant adhesive tape is pasted on the square resistor, the edge of the high-temperature-resistant adhesive tape is positioned in the middle position between the square resistor and the inner side wall of the first square hole, the thickness of the high-temperature-resistant adhesive tape is the same as that of the dielectric layer, and the second board is connected with the first board through the dielectric layer in a pressing manner, the method comprises the following steps of pre-placing patterns before the first plate and the second plate are pressed, wherein at least one second square hole penetrating through the second plate and the medium layer is formed in the second plate, and the second square hole is coaxially arranged with the first square hole and communicated with the first square hole to form a blind groove.

2. The microwave board with multi-layer blind holes made of mixed-pressed nickel-phosphorus sheet resistance material as claimed in claim 1, wherein: the first plate is a polytetrafluoroethylene copper-clad plate and is single-sided or double-sided.

3. The microwave board with multi-layer blind holes made of mixed-pressed nickel-phosphorus sheet resistance material as claimed in claim 1, wherein: the resistance layer is made of resistance material nickel-phosphorus alloy.

4. The microwave board with multi-layer blind holes made of mixed-pressed nickel-phosphorus sheet resistance material as claimed in claim 1, wherein: the second plate is made of FR-4 grade material.

5. The microwave board with multi-layer blind holes made of mixed-pressed nickel-phosphorus sheet resistance material as claimed in claim 1, wherein: when a plurality of blind grooves are arranged, when the distance between the blind grooves and the blind grooves is more than or equal to 5mm, the circuit of the electroplating area is placed a certain distance into the blind grooves, and when the distance between the blind grooves and the blind grooves is less than 5mm, the copper area is reduced.