JP2015026721A - Method for manufacturing capacitor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a capacitor element in which a small-sized and high-capacity capacitor element having high reliability can be manufactured with high yield.SOLUTION: The method for manufacturing the capacitor element includes the following steps: pressing a green chip 22 toward a covering ceramic green sheet 25 to punch the covering ceramic green sheet 25 and attaching a punched part 25b of the covering ceramic green sheet 25 to a side surface 22c of the green chip 22; and peeling off a remaining part 25c of the covering ceramic green sheet 25, in which when punching, the side surface 22c of the green chip 22 is pressed so as to be inclined with respect to a principal surface 25a of the covering ceramic green sheet 25, and when peering, the remaining part 25c is peeled off so as to be turned over from a side of an end part P1, of the side surface 22c of the green chip 22, which has been previously contacted with the principal surface 25a of the covering ceramic green sheet 25 toward a side of an end part P2 which has been contacted with the principal surface 25a later.

Description

  The present invention relates to a method of manufacturing a capacitor element as an electronic component, and more specifically, a substantially rectangular parallelepiped capacitor including a laminate composed of dielectric layers and internal electrode layers alternately laminated along a predetermined direction. The present invention relates to a method for manufacturing an element.

  In recent years, multilayer ceramic capacitors as capacitor elements have been dramatically reduced in size and capacity. On the other hand, with the improvement in performance of electronic devices, there is still a strong demand for higher capacity for multilayer ceramic capacitors. In order to meet this requirement, it is effective to increase the area (that is, the effective area) of the mutually facing portions of the stacked internal electrode layers.

  As one method for meeting the above requirements, Japanese Patent Application Laid-Open No. 6-349669 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2012-209539 (Patent Document 2) describe an internal method in a direction orthogonal to a direction connecting a pair of external electrodes. A portion of the dielectric layer located adjacent to the electrode layer (that is, the side surface where the dielectric layer of the four outer surfaces of the multilayer ceramic capacitor extending substantially parallel to the lamination direction of the internal electrode layer is exposed) A technique for narrowing a dielectric layer) to be formed is disclosed.

  This technology is used to manufacture a mother block by laminating a plurality of ceramic green sheets printed with a conductive pattern serving as an internal electrode layer, and cutting the chip into individual green chips of a predetermined size. The cutting including the conductive pattern exposed by cutting the conductive pattern on the cut surface corresponding to the side surface of the green chip so that the conductive pattern is exposed and attaching the ceramic green sheet for coating sufficiently thin on the cut surface. By covering the surface, the dielectric layer in the portion forming the side surface of the multilayer ceramic capacitor described above can be narrowed.

  Here, when the ceramic green sheet for coating is prepared on the cut surface corresponding to the side surface of the green chip, a ceramic green sheet for coating larger than the cut surface is prepared and attached to the elastic body. By punching out the green chip by pressing it against the ceramic green sheet for coating placed on the elastic body, and by peeling the remaining part from the punched part of the ceramic green sheet for coating, It is disclosed that a ceramic green sheet for coating can be easily attached to the cut surface of the green chip.

JP-A-6-349669 JP 2012-209539 A

  However, when the sticking method disclosed in Patent Document 2 is adopted, when the green chip is pressed against the ceramic green sheet for coating, when the punching is partially insufficient, the coating ceramic green sheet After peeling off the remaining portion, the remaining portion of the ceramic green sheet for coating located adjacent to the portion where the punching was insufficient remains attached to the green chip, and this portion is the green chip. May remain on the green chip without detaching from the surface.

  As described above, when a part of the remaining part of the ceramic green sheet for coating remains on the green chip, it causes a problem in various processes performed thereafter, and the yield is greatly deteriorated. Will be invited. In addition, if the above residue remains on the green chip and becomes a product, moisture will enter the inside of the multilayer ceramic capacitor from that part, resulting in poor moisture resistance and reliability. There is also a concern of adversely affecting sex.

  Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method of manufacturing a capacitor element that can manufacture a small, large-capacity, and highly reliable capacitor element with a high yield. And

  A method for manufacturing a capacitor element according to the present invention is a method for manufacturing a capacitor element including a multilayer body composed of dielectric layers and internal electrode layers alternately stacked along a predetermined direction. A step of preparing a green structure formed by laminating a plurality of first dielectric green sheets to be layers and having a conductive pattern to be the internal electrode layer formed therein; and the green structure The other of the pair of outer surfaces of the green structure is held in a state where the green structure is held using a holding tool on one outer surface side of the pair of outer surfaces positioned opposite to each other. By pressing the outer surface toward the second dielectric green sheet placed on the elastic body, the second dielectric green sheet is punched out by the green structure. Attaching the punched portion of the second dielectric green sheet to the other outer surface of the green structure, and removing the elastic body from the punched portion of the second dielectric green sheet and the remaining portion after punching. And a step of separating the remaining portion of the second dielectric green sheet from the punched portion of the second dielectric green sheet. In the method for manufacturing a capacitor element according to the present invention, in the step of attaching the second dielectric green sheet to the other outer surface of the green structure, the other outer surface of the green structure is The other outer surface of the green structure is inclined and pressed against the main surface of the second dielectric green sheet so as to contact the main surface of the second dielectric green sheet with a time difference. , In the step of peeling off the remaining portion of the second dielectric green sheet, the end side that has previously contacted the main surface of the second dielectric green sheet of the other outer surface of the green structure Then, the remaining part of the second dielectric green sheet is peeled off toward the end side that comes into contact later.

  In the method of manufacturing a capacitor element according to the present invention, in the step of attaching the second dielectric green sheet to the other outer surface of the green structure, before attaching the second dielectric green sheet. The conductive pattern may be exposed on the other outer surface of the green structure.

  The method for manufacturing a capacitor element according to the present invention includes the step of attaching the second dielectric green sheet to the one outer surface of the green structure prior to the step of attaching the second dielectric green sheet to the other outer surface of the green structure. You may further provide the process of affixing 3 dielectric green sheets.

  In the method of manufacturing a capacitor element according to the present invention, the step of attaching the third dielectric green sheet to the one outer surface of the green structure includes the other outer surface side of the green structure. In the state where the green structure is held using a holder, the one outer surface of the green structure is pressed against the third dielectric green sheet placed on an elastic body to Punching out the third dielectric green sheet by a body, thereby attaching the punched portion of the third dielectric green sheet to the one outer surface of the green structure, and the above-mentioned of the third dielectric green sheet Removing the elastic body from the punched portion and the remaining portion after punching, and punching the third dielectric green sheet From the portion may include the step of peeling the remaining portion of the third dielectric green sheet.

  In the method of manufacturing a capacitor element according to the present invention, as the holder, the third dielectric attached to the other outer surface of the green structure and the one outer surface of the green structure. It is preferable to use an adhesive holder having an adhesive surface for holding the green structure by contacting the exposed surface of the body green sheet.

  In the method of manufacturing a capacitor element according to the present invention, in the step of attaching the third dielectric green sheet to the one outer surface of the green structure, the other outer surface of the green structure is attached. The green structure is held using the adhesive holder by contacting the adhesive surface of the adhesive holder, and then the third dielectric green sheet is pasted on the adhesive holder By rolling the green structure, the adhesive structure is brought into contact with the exposed surface of the third dielectric green sheet attached to the one outer surface of the green structure, thereby bringing the green structure into contact with the green structure. It is preferable to hold using an adhesive holder.

  In the method of manufacturing a capacitor element according to the present invention, in the step of attaching the third dielectric green sheet to the one outer surface of the green structure, before attaching the third dielectric green sheet. The conductive pattern may be exposed on the one outer surface of the green structure.

  In the method of manufacturing a capacitor element according to the present invention, in the step of attaching the second dielectric green sheet to the other outer surface of the green structure, a plurality of the green structures are arranged in rows or rows. The second dielectric green sheet may be affixed to each of the plurality of green structures by holding the holder in a state where the second dielectric green sheet is placed.

  In the method for manufacturing a capacitor element according to the present invention, the green structure may be a green chip including only one portion to be the laminated body.

  In the method for manufacturing a capacitor element according to the present invention, the green structure may be a green block including a plurality of portions to be the laminate.

  According to the present invention, it is possible to manufacture a small, large-capacity and highly reliable capacitor element with a high yield.

1 is a schematic perspective view of a multilayer ceramic capacitor manufactured according to a method for manufacturing a capacitor element in an embodiment of the present invention. It is a schematic cross section along the II-II line shown in FIG. 1 of the multilayer ceramic capacitor shown in FIG. FIG. 3 is a schematic cross-sectional view taken along line III-III shown in FIG. 1 of the multilayer ceramic capacitor shown in FIG. 1. FIG. 2 is a schematic perspective view of only the element body of the multilayer ceramic capacitor shown in FIG. 1. FIG. 5 is a schematic perspective view of a green chip that is a precursor of a laminated body that constitutes a part of the element body shown in FIG. 4. It is a flowchart which shows schematically the manufacturing method of the capacitor | condenser element in embodiment of this invention. It is the schematic which shows the process of affixing a mother block on the 1st holding | maintenance adhesive sheet. It is the schematic which shows the process of cut | disconnecting a mother block. It is the schematic which shows the process in which the distance between the green chips which will be located adjacently after the cutting | disconnection of a mother block is expanded. It is the schematic which shows the 1st rolling process which changes direction of a green chip. It is the schematic which shows the 1st rolling process which changes direction of a green chip. It is the schematic which shows the 1st rolling process which changes direction of a green chip. It is the schematic which shows the 1st affixing process which affixes the ceramic green sheet for a coating | cover to one side surface of a green chip. It is the schematic which shows the 1st affixing process which affixes the ceramic green sheet for a coating | cover to one side surface of a green chip. It is the schematic which shows the 1st affixing process which affixes the ceramic green sheet for a coating | cover to one side surface of a green chip. It is the schematic which shows the 1st peeling process which peels off the remainder part of the ceramic green sheet for coating stuck to the green chip in the 1st sticking process. It is the schematic which shows the state of the green chip after a 1st peeling process. It is the schematic which shows the 2nd rolling process which changes direction of a green chip again. It is the schematic which shows the 2nd rolling process which changes direction of a green chip again. It is the schematic which shows the 2nd rolling process which changes direction of a green chip again. It is the schematic which shows the 2nd affixing process which affixes the ceramic green sheet for a coating | cover on the other side surface of a green chip. It is the schematic which shows the 2nd affixing process which affixes the ceramic green sheet for a coating | cover on the other side surface of a green chip. It is the schematic which shows the 2nd affixing process which affixes the ceramic green sheet for a coating | cover on the other side surface of a green chip. It is the schematic which shows the 2nd peeling process which peels off the remainder part of the ceramic green sheet for coating stuck on the green chip in the 2nd sticking process. It is the schematic which shows the state of the green chip after a 2nd peeling process.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following embodiments, the same or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated.

  Examples of the capacitor element manufactured by applying the present invention include a multilayer ceramic capacitor in which a ceramic material is used as a dielectric material, and a multilayer metallized film capacitor in which a resin film is used as a dielectric material. In the following embodiments, a case where the present invention is applied to a multilayer ceramic capacitor will be described as an example.

  FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor manufactured according to the method of manufacturing a capacitor element in the embodiment of the present invention. 2 and 3 are schematic cross-sectional views of the multilayer ceramic capacitor shown in FIG. 1 taken along lines II-II and III-III shown in FIG. 1, respectively. 4 is a schematic perspective view of only the element body of the multilayer ceramic capacitor shown in FIG. 1, and FIG. 5 is a diagram of a green chip that is a precursor of the multilayer body constituting a part of the element body shown in FIG. It is a schematic perspective view. In the following, prior to describing the method for manufacturing a capacitor element in the present embodiment, a multilayer ceramic capacitor manufactured according to the method for manufacturing a capacitor element will be described with reference to FIGS. 1 to 5.

  As shown in FIGS. 1 to 3, the multilayer ceramic capacitor 10 is an electronic component having a substantially rectangular parallelepiped shape as a whole, and includes an element body 11 and a pair of external electrodes 16.

  As shown in FIGS. 1 and 2, the pair of external electrodes 16 are provided so as to be separated from each other so as to cover the outer surfaces of both end portions in a predetermined direction of the element body 11. The pair of external electrodes 16 are each composed of a conductive film.

  More specifically, the pair of external electrodes 16 is configured by a laminated film of a sintered metal layer and a plating layer, for example. A sintered metal layer is formed by baking pastes, such as Cu, Ni, Ag, Pd, an Ag-Pd alloy, Au, for example. A plating layer is comprised by the Ni plating layer and the Sn plating layer which covers this, for example. Instead of this, the plated layer may be a Cu plated layer or an Au plated layer. Further, the pair of external electrodes 16 may be constituted only by a plating layer.

  Further, a conductive resin paste can be used as the pair of external electrodes 16. When a conductive resin paste is used as the pair of external electrodes 16, the resin component contained in the conductive resin paste exhibits an effect of absorbing vibration generated in the element body 11, so that it propagates from the element body 11 to the outside. It is possible to effectively attenuate the vibrations that occur, which is advantageous in reducing noise.

  As shown in FIGS. 1 to 4, the element body 11 includes a laminated body 12 composed of dielectric layers 13 and internal electrode layers 14 that are alternately laminated along a predetermined direction, and a predetermined portion of the laminated body 12. And a pair of additional dielectric layers 15 to be covered.

  Dielectric layer 13 and additional dielectric layer 15 are formed of a ceramic material mainly composed of barium titanate, for example. The dielectric layer 13 and the additional dielectric layer 15 include a Mn compound, a Mg compound, a Si compound, a Co compound, a Ni compound, a rare earth compound, and the like as subcomponents of ceramic powder that is a raw material of the ceramic green sheet described later. You may go out. On the other hand, the internal electrode layer 14 is formed of a metal material typified by Ni, Cu, Ag, Pd, an Ag—Pd alloy, Au, or the like.

  As shown in FIG. 2, one of the pair of internal electrode layers 14 adjacent to each other with the dielectric layer 13 sandwiched in the stacking direction is connected to one of the pair of external electrodes 16 inside the multilayer ceramic capacitor 10. The other of the pair of internal electrode layers 14 that are electrically connected and are adjacent to each other with the dielectric layer 13 in the stacking direction is the other of the pair of external electrodes 16 inside the multilayer ceramic capacitor 10. Is electrically connected. Thus, a plurality of capacitor elements are electrically connected in parallel between the pair of external electrodes 16.

The material of the dielectric layer 13 and the additional dielectric layer 15 is not limited to the above-described ceramic material mainly composed of barium titanate, and other high dielectric constant ceramic materials (for example, CaTiO ₃ , SrTiO ₃ , CaZrO). ₃ as a main component) may be selected as the material of the dielectric layer 13 and the additional dielectric layer 15. Further, it is not always necessary to match the material of the dielectric layer 13 and the material of the additional dielectric layer 15, and the use of ceramic materials having different main components as the material of the dielectric layer 13 and the additional dielectric layer 15. Also good. On the other hand, the material of the internal electrode layer 14 is not limited to the metal material described above, and another conductive material may be selected as the material of the internal electrode layer 14.

  Here, referring to FIGS. 1 to 3, as a term indicating the direction of the multilayer ceramic capacitor 10, the direction in which the pair of external electrodes 16 are arranged is defined as the length direction L of the multilayer ceramic capacitor 10, and the dielectric layer 13 And the internal electrode layer 14 are defined as the thickness direction T, and the direction perpendicular to both the length direction L and the thickness direction T is defined as the width direction W. In the following description, these terms are defined as use.

  Of the six outer surfaces of the substantially rectangular parallelepiped multilayer ceramic capacitor 10, a pair of outer surfaces positioned relative to each other in the length direction L is defined as an end surface 10a, and a pair of positions positioned relative to each other in the thickness direction T. The outer surface is defined as a main surface 10b, and a pair of outer surfaces positioned relative to each other in the width direction W are defined as side surfaces 10c, and these terms are used in the following description.

  In addition, referring to FIG. 4 and FIG. 5, the pair of outer surfaces of the element body 11 and the pair of outer surfaces of the green chip 22 corresponding to the pair of end surfaces 10 a of the multilayer ceramic capacitor 10 are respectively connected to the end surfaces 11 a and 11. The end surface 22a is defined as a pair of outer surfaces of the element body 11 and a pair of outer surfaces of the green chip 22 corresponding to the pair of main surfaces 10b of the multilayer ceramic capacitor 10, and these are defined as the main surface 11b and the main surface 22b, respectively. The pair of outer surfaces of the body 11 and the pair of outer surfaces of the green chip 22 corresponding to the pair of side surfaces 10c of the multilayer ceramic capacitor 10 are defined as the side surface 11c and the side surface 22c, respectively. These terms are used.

  As shown in FIGS. 1 to 3, the multilayer ceramic capacitor 10 according to the present embodiment has an elongated, substantially rectangular parallelepiped shape configured such that the outer dimension along the length direction L is the longest. Yes. As representative values of the outer dimension in the length direction L and the outer dimension in the width direction W of the multilayer ceramic capacitor 10 (usually, the outer dimension in the thickness direction T is equivalent to the outer dimension in the width direction W), for example, 3.2 [mm] × 1.6 [mm], 2.0 [mm] × 1.25 [mm], 1.6 [mm] × 0.8 [mm], 1.0 [mm] × 0 0.5 [mm], 0.8 [mm] × 0.4 [mm], 0.6 [mm] × 0.3 [mm], 0.4 [mm] × 0.2 [mm], etc. It is done.

  As shown in FIG. 4, the pair of additional dielectric layers 15 cover the pair of outer surfaces of the stacked body 12 positioned in the width direction W so as to constitute the pair of side surfaces 11 c of the element body 11. Yes. On the other hand, the pair of end surfaces 11a of the element body 11 is mainly constituted by a pair of outer surfaces of the laminated body 12 that are positioned opposite to each other in the length direction L, and the pair of main surfaces 11b of the element body 11 are mainly thick. It is comprised by a pair of outer surface of the laminated body 12 located in the direction T facing.

  As shown in FIG. 5, the green chip 22 as a green structure which is a precursor of the laminated body 12 has an internal electrode on the surface of a ceramic green sheet for lamination 23 as a first dielectric green sheet to be a dielectric layer 13. A plurality of material sheets on which the conductive pattern 24 to be the layer 14 is printed are stacked and cut so as to have a substantially rectangular parallelepiped shape as illustrated.

  On the pair of end faces 22a of the green chip 22, a part of the conductive patterns 24 arranged in a stacked manner is selectively exposed. More specifically, in the pair of end surfaces 22a of the green chip 22, the end portions on one side in the length direction L of the conductive pattern 24 to be connected to the external electrodes 16 formed so as to cover the end surfaces 22a are respectively provided. Exposed. On the other hand, at the pair of side surfaces 22c of the green chip 22, all end portions in the width direction W of the conductive patterns 24 arranged in a stacked manner are exposed.

  A pair of side surfaces 22c of the green chip 22 is covered with a ceramic green sheet for coating as a second and third dielectric green sheet so as to cover it (corresponding to portions indicated by reference numerals 25b and 26b in FIG. 25 and the like) ) Are pasted in association with each other. As a result, the ends in the width direction W of the conductive pattern 24 exposed on the pair of side surfaces 22c of the green chip 22 described above are covered with the covering ceramic green sheet, and further, the covering ceramic green sheet The green chip 22 in a state of being attached is thermocompression bonded and fired, whereby the element body 11 as shown in FIG. 4 is manufactured.

  In the multilayer ceramic capacitor 10 described above, portions of the dielectric layers located at both ends in the width direction W of the element body 11 cover a pair of outer surfaces positioned opposite to each other in the width direction W of the multilayer body 12. Since the ceramic green sheet for coating that becomes the additional dielectric layer 15 after firing is formed by firing, the thickness of the ceramic green sheet for coating to be laminated is sufficiently reduced. The thickness of the dielectric layer in the portion forming the side surface 10c of the ceramic capacitor 10 can be reduced. Therefore, by adopting the structure, it is possible to increase the effective area by increasing the size of the internal electrode layer 14 along the width direction W with respect to the physique, which is smaller and larger than the conventional one. A multilayer ceramic capacitor having a capacity can be obtained.

  FIG. 6 is a flowchart schematically showing a method for manufacturing a capacitor element in the present embodiment, and FIGS. 7 to 25 are schematic views showing specific steps among the steps shown in FIG. Next, with reference to these FIG. 6 thru | or FIG. 25, the manufacturing method of the capacitor | condenser element in this Embodiment is demonstrated.

  The capacitor element manufacturing method according to the present embodiment is a batch processing until the middle of the manufacturing process, and the component material (mother block) that is the core of the multilayer ceramic capacitor is manufactured as one lump, and then The present invention is applied to a production method in which a plurality of multi-layer ceramic capacitors are simultaneously produced in large quantities by cutting them into pieces and further processing the separated parts material (that is, the above-mentioned green chip). This is an example.

  As shown in FIG. 6, the capacitor element manufacturing method according to the present embodiment includes, in order, a step of manufacturing a mother block (step S1), a step of cutting the mother block (step S2), and a coating ceramic. A step of attaching a green sheet (step S3), a step of performing thermocompression bonding (step S4), a step of performing barrel polishing (step S5), and a step of performing baking (step S6); And a step of forming external electrodes (step S7).

  In the step of manufacturing the mother block (step S1), first, a ceramic slurry containing ceramic powder, a binder and a solvent is prepared, and this ceramic slurry is formed into a sheet shape on a carrier film using a die coater or a gravure coater. As a result, a ceramic green sheet is produced. Next, the ceramic green sheet is printed by screen printing or gravure printing so that the conductive paste has a predetermined pattern.

  As a result, as described above, a material sheet in which the conductive pattern 24 to be the internal electrode layer 14 is printed on the surface of the multilayer ceramic green sheet 23 to be the dielectric layer 13 is prepared. A mother block 20 (see FIG. 7) is manufactured by laminating a plurality of sheets according to a predetermined rule and thermocompression bonding.

  The step of cutting the mother block (step S2) includes, in order, the step of attaching the mother block to the first holding adhesive sheet and the step of dividing the mother block into pieces into green chips. Yes.

  FIG. 7 is a schematic diagram illustrating a process in which the mother block is attached to the first holding pressure-sensitive adhesive sheet, and FIG. 8 is a schematic diagram illustrating a process in which the mother block is divided and separated into green chips. .

  As shown in FIG. 7, in the step of attaching the mother block to the first holding adhesive sheet, the first holding adhesive sheet 31 is attached to one of the pair of main surfaces of the prepared mother block 20. .

  As a result, the mother block 20 is held by the first holding pressure-sensitive adhesive sheet 31. Here, as the first holding pressure-sensitive adhesive sheet 31, various types can be used as long as they have adhesiveness. For example, a foamed release sheet whose adhesiveness is lowered by heating can be suitably used.

  As shown in FIG. 8, in the process of dividing the mother block into pieces into green chips, these are placed on the table 32 while the mother block 20 is held by the first holding adhesive sheet 31. Then, cutting is performed using the cutting blade 33 so as to divide the mother block 20 into a matrix.

  Thereby, the mother block 20 is divided and separated into a plurality of green chips 22. For cutting the mother block 20, it is possible to use pressing using a cutting blade (blade) as the cutting blade 33 or dicing using a cutting blade (dicer) as the cutting blade 33.

  The plurality of green chips 22 obtained in this way have the structure shown in FIG. 5, and a pair of end faces 22a and a pair of side faces 22c as a cut surface from which the conductive pattern 24 is exposed (in the drawings after FIG. 8). In order to distinguish each of the pair of side surfaces 22c, one side surface is denoted by reference numeral 22c1 and the other side surface is denoted by reference numeral 22c2 as necessary.

  Since the first holding adhesive sheet 31 is affixed to the mother block 20 prior to the cutting of the mother block 20, even after the mother block 20 is divided into a plurality of green chips 22, the individual green chips 22. Is maintained by the first holding pressure-sensitive adhesive sheet 31. Therefore, the plurality of green chips 22 are held in a state of being arranged in a matrix by the first holding adhesive sheet 31.

  Here, each of the plurality of separated green chips 22 has a substantially rectangular parallelepiped shape, but due to the cutting blade 33 having a tapered shape as shown in FIG. In the cutting process, the pair of end surfaces 22a and the pair of side surfaces 22c1 and 22c2 as the cutting surfaces are inclined in accordance with the fact that the mother block 20 has a substantially V-shaped cutting groove in cross section. Will have a shape. The degree of inclination of the pair of end surfaces 22a and the pair of side surfaces 22c1 and 22c2 becomes more prominent when a cutting blade is used than when a pressing blade is used as the cutting blade 33.

  Accordingly, as shown in FIG. 8, each of the plurality of separated green chips 22 is, in a strict sense, a corner portion of the pair of end surfaces 22a and the pair of side surfaces 22c1 and 22c2 as cut surfaces. The inside angle of the lens is substantially a truncated pyramid which is slightly less than 90 °, or a distorted cube.

  More specifically, when the green chip 22 has a quadrangular truncated pyramid shape, the main surface of the pair of main surfaces 22b of the green chip 22 that is not held by the first holding adhesive sheet 31. The width dimension is about several μm to several tens of μm smaller than the width dimension of the main surface held by the first holding pressure-sensitive adhesive sheet 31. In FIG. 8, in order to facilitate understanding, the degree of inclination of the pair of side surfaces 22c1 and 22c2 is drawn more emphasized than in actuality (the same applies to FIGS. 9 to 25 referred to hereinafter). Is).

  In the step of attaching the covering ceramic green sheet (step S3), the distance between the green chips that are positioned adjacent to each other after cutting the mother block is increased, and the direction of the green chip is changed. A first rolling step, a first attaching step in which a covering ceramic green sheet is attached to one side surface of the green chip, and a remaining portion of the covering ceramic green sheet attached to the green chip in the first attaching step A first peeling step in which the part is peeled off, a second rolling step in which the orientation of the green chip is changed again, a second attaching step in which a ceramic green sheet for coating is attached to the other side surface of the green chip, Ceramic grease for coating applied to the green chip in the second application process Remainder of Nshito contains a second peeling process is peeled off.

  FIG. 9 is a schematic diagram showing a process of increasing the distance between green chips that are positioned adjacent to each other after cutting the mother block.

  As shown in FIG. 9, in the step of increasing the distance between adjacent green chips, first, the plurality of green chips 22 that are arranged and held in a matrix by the first holding adhesive sheet 31 are second The holding adhesive sheet 41 is transferred while maintaining the state of being aligned in the matrix. Here, as the second holding pressure-sensitive adhesive sheet 41, an expanded sheet having adhesiveness and extending by heating can be used.

  This transfer is performed, for example, in a state where the plurality of green chips 22 are stuck on the first holding pressure-sensitive adhesive sheet 31 and are located on the side opposite to the main surface stuck on the first holding pressure-sensitive adhesive sheet 31. This can be realized by attaching the second holding pressure-sensitive adhesive sheet 41 to the surface, and then peeling the first holding pressure-sensitive adhesive sheet 31 from the plurality of green chips 22. In addition, if the adhesive sheet 41 with a stronger adhesive force than the 1st holding | maintenance adhesive sheet 31 is used as the 2nd holding | maintenance adhesive sheet 41, the transfer operation can be implemented more smoothly.

  Next, the second holding pressure-sensitive adhesive sheet 41 is expanded by an expanding device (not shown) in the direction of the arrow shown in the drawing, so that the second holding pressure-sensitive adhesive sheet 41 is expanded and arranged in a matrix. The plurality of green chips 22 move away from each other, and the distances G1 and G2 between the adjacent green chips 22 are increased. At this time, the distance G1 in the direction in which the side surfaces 22c of the adjacent green chips 22 face each other is increased to such an extent that the adjacent green chips 22 do not contact each other in the first and second rolling steps described later. It is done.

  As the second holding pressure-sensitive adhesive sheet 41, it is preferable to use an expanded sheet having plasticity that does not return to its original state after expansion. By using an expanded sheet having the characteristics, handling in the subsequent steps Can be done easily.

  10 to 12 are schematic views illustrating a first rolling process in which the direction of the green chip is changed.

  In the first rolling step in which the orientation of the green chip is changed, first, as shown in FIG. 10, the second holding adhesive remains in a state where the plurality of green chips 22 are held by the second holding adhesive sheet 41. The sheet 41 is affixed to the support plate 42, and the action plate 43 is arranged so as to contact each of the main surfaces not held by the second holding adhesive sheets 41 of the plurality of green chips 22. Here, as the support plate 42 and the action plate 43, those made of silicone rubber can be suitably used.

  Next, as shown in FIG. 10, the action plate 43 is fixed, and the support plate 42 is moved in the direction of the arrow A1 shown in the drawing. As a result, the green chip 22 rotates in the direction of the arrow B1 shown in the drawing against the adhesive force of the second holding adhesive sheet 41 due to the friction between the action plate 43 and the green chip 22. The main surface of the green chip 22 held by the second holding pressure-sensitive adhesive sheet 41 is lifted.

  Thereafter, as shown in FIG. 11, the support plate 42 is further moved in the direction of the arrow A <b> 1 shown in the drawing, so that the side surface 22 c 1 of the green chip 22 contacts the second holding adhesive sheet 41.

  Thus, as shown in FIG. 12, the plurality of green chips 22 are collectively rotated by approximately 90 ° from the state shown in FIG. 10, and the side surfaces 22c2 of the plurality of green chips 22 are respectively the second holding adhesive sheets. A plurality of green chips 22 are held by the second holding adhesive sheet 41 as an adhesive holder on the side surface 22c1 side so as to be exposed toward the normal direction of the main surface of 41. It will be.

  13 to 15 are schematic views showing a first attaching process in which a covering ceramic green sheet is attached to one side surface of the green chip.

  In the first attaching step in which the covering ceramic green sheet is attached to one side surface of the green chip, first, as shown in FIG. 13, the plurality of green chips 22 held by the second holding adhesive sheet 41. The support plate 42 is disposed so that the side surface 22c2 faces downward, and the covering ceramic green sheet 25 as the third dielectric green sheet faces the plurality of green chips 22 below the plurality of green chips 22. Be placed.

  Here, the covering ceramic green sheet 25 is arranged in a state of being developed on the elastic body 51, and the elastic body 51 is placed on the table 52. Further, as the ceramic green sheet for covering 25, as in the case of the ceramic green sheet for laminating 23 described above, a ceramic slurry containing ceramic powder, a binder and a solvent and formed into a sheet shape is used.

  Next, by lowering the support plate 42 in the direction of the arrow C1 shown in FIG. 13, the plurality of green chips 22 are pressed toward the covering ceramic green sheet 25 as shown in FIG. At that time, each of the plurality of green chips 22 is for covering with a pressing force to such an extent that the elastic body 51 of the portion contacting the plurality of green chips 22 via the covering ceramic green sheet 25 is elastically deformed in the vicinity thereof. It is pressed toward the ceramic green sheet 25.

  Thereby, the covering ceramic green sheets 25 sandwiched between the plurality of green chips 22 and the elastic bodies 51 are respectively crimped to the side surfaces 22c2 of the plurality of green chips 22, and The covering ceramic green sheet 25 is punched by applying a shearing force to the covering ceramic green sheet 25 at the end of the side surface 22c2.

  As described above, the covering ceramic green sheet 25 is divided into the punched portion 25b punched by each of the plurality of green chips 22 and the remaining portion 25c after punching, and the plurality of green chips 22 are cut by the punched portion 25b. Each of the side surfaces 22c2 is covered.

  Note that when the covering ceramic green sheets 25 are attached to the plurality of green chips 22, adhesion to the side surfaces 22 c 2 of the plurality of green chips 22 and / or the main surface 25 a of the covering ceramic green sheets 25 is performed as necessary. An agent may be applied in advance. Here, examples of usable adhesives include those containing various resin components as main components, those obtained by dissolving the resin components in a solvent, and pastes in which ceramic particles are dispersed. . Also, the method for applying the adhesive is not particularly limited, and various methods can be used.

  Here, as described above, each of the plurality of green chips 22 has a substantially square frustum shape in which the pair of side surfaces 22c1 and 22c2 is inclined. One side 22c1 is attached to the second holding adhesive sheet 41 and the green chip 22 is held, so that the other side 22c2 of the plurality of green chips 22 is the main of the covering ceramic green sheet 25. The surface is inclined with respect to the surface 25a.

  Therefore, when the support plate 42 is lowered, each of the side surfaces 22c2 of the plurality of green chips 22 comes into contact with the main surface 25a of the covering ceramic green sheet 25 with a time difference. More specifically, as shown in FIG. 14, among the side surfaces 22c2 of the green chip 22, the end portion P1 positioned below is first in contact with the main surface 25a of the covering ceramic green sheet 25, The end P <b> 2 located further upward will come into contact with the main surface 25 a of the covering ceramic green sheet 25 later.

  Next, as shown in FIG. 15, the plurality of green chips 22 are moved away from the elastic body 51 by raising the support plate 42 in the direction of the arrow D <b> 1. At that time, not only the punched portion 25b of the covering ceramic green sheet 25 but also the remaining portion 25c rises together with the plurality of green chips 22 in a state where it adheres to the plurality of green chips 22. As a result, the entire covering ceramic green sheet 25 is detached from the elastic body 51.

  FIG. 16 is a schematic diagram showing a first peeling process in which the remaining portion of the covering ceramic green sheet attached to the green chip in the first attaching process is peeled off. FIG. 17 is a schematic view showing the state of the green chip after the first peeling process.

  As shown in FIG. 16, in the first peeling process in which the remaining portion of the covering ceramic green sheet is peeled off, among the remaining portions 25 c of the covering ceramic green sheet 25 attached to the plurality of green chips 22, The end portion 25d of the side surface 22c2 of the green chip 22 where the end portion P1 is located is held by the peeling roll 60 of the peeling device, and the remaining portion 25c of the covering ceramic green sheet 25 is wound by the peeling roll 60. As a result, the remaining portion 25 c of the covering ceramic green sheet 25 is peeled off from the plurality of green chips 22.

  At this time, the remaining portion 25c of the covering ceramic green sheet 25 is pulled in the direction of the arrow E1 shown in the drawing, and the main portion of the covering ceramic green sheet 25 among the side surfaces 22c2 of the individual green chips 22 is pulled. The surface 25a is peeled off from the end P1 side that contacts the surface 25a first toward the end P2 side that contacts the surface 25a.

  As a result, the remaining portions 25c of the covering ceramic green sheet 25 are all removed from the plurality of green chips 22, and as shown in FIG. 17, the portions pasted on the side surfaces 22c2 of the plurality of green chips 22 are removed. Only the covering ceramic green sheet (that is, the punched portion 25 b described above) remains on the plurality of green chips 22. The details will be described later.

  18 to 20 are schematic views showing a second rolling process in which the direction of the green chip is changed.

  In the second rolling step in which the orientation of the green chip is changed, first, as shown in FIG. 18, a coating adhered to the main surface that is not held by the second holding adhesive sheet 41 of the plurality of green chips 22 The action plate 43 is disposed so as to contact each exposed surface of the punched portion 25b of the ceramic green sheet 25 for use.

  Next, the action plate 43 is fixed, and the support plate 42 is moved in the direction of arrow A2 shown in the drawing. As a result, the green chip 22 moves in the direction of the arrow B2 shown in the figure against the adhesive force of the second holding adhesive sheet 41 due to the friction between the action plate 43 and the punched portion 25b of the covering ceramic green sheet 25. Accordingly, as shown in FIG. 19, the plurality of green chips 22 collectively rotate by approximately 90 °.

  Thereafter, as shown in FIG. 19, the support plate 42 is further moved in the direction of the arrow A2 shown in the drawing. This resists the adhesive force of the second holding adhesive sheet 41 by the friction between the action plate 43 and the punched portion 25b of the covering ceramic green sheet 25 and the friction between the action plate 43 and the green chip 22. Thus, the green chip 22 is further rotated in the direction of the arrow B2 shown in the drawing, and as shown in FIG. The exposed surface of the 25 punched portions 25 b contacts the second holding adhesive sheet 41.

  Accordingly, the plurality of green chips 22 are collectively rotated by approximately 180 ° from the state shown in FIG. 18, and the side surfaces 22c1 of the plurality of green chips 22 are respectively normal to the main surface of the second holding adhesive sheet 41. In addition to being exposed in the direction, the plurality of green chips 22 are held by the second holding adhesive sheet 41 as an adhesive holder on the side surface 22c2 side in order to maintain the state.

  21 to 23 are schematic views showing a second attaching step in which a covering ceramic green sheet is attached to the other side surface of the green chip.

  In the second attaching step in which the covering ceramic green sheet is attached to the other side surface of the green chip, as in the case of the first attaching step described above, first, as shown in FIG. A support plate 42 is disposed so that the side surfaces 22c1 of the plurality of green chips 22 held by the adhesive sheet 41 face downward, and a coating ceramic as a second dielectric green sheet is provided below the plurality of green chips 22. The green sheet 26 is disposed so as to face the plurality of green chips 22.

  Here, the covering ceramic green sheet 26 is arranged in a state of being developed on the elastic body 51, and the elastic body 51 is placed on the table 52. Further, as the ceramic green sheet for coating 26, as in the case of the ceramic green sheet for lamination 23, a ceramic slurry containing ceramic powder, a binder and a solvent as a raw material is used.

  Next, the support plate 42 is lowered in the direction of the arrow C2 shown in FIG. 21, whereby the plurality of green chips 22 are pressed toward the covering ceramic green sheet 26, respectively, as shown in FIG. At that time, each of the plurality of green chips 22 is coated with a pressing force such that each of the elastic bodies 51 in contact with the plurality of green chips 22 via the coating ceramic green sheet 26 is elastically deformed in the vicinity thereof. It is pressed toward the ceramic green sheet 26.

  Thereby, the covering ceramic green sheets 26 sandwiched between the plurality of green chips 22 and the elastic body 51 are respectively pressed against the side surfaces 22c1 of the plurality of green chips 22, and The covering ceramic green sheet 26 is punched by applying a shearing force to the covering ceramic green sheet 26 at the end of the side surface 22c1.

  As described above, the covering ceramic green sheet 26 is divided into the punched portion 26b punched by each of the plurality of green chips 22 and the remaining portion 26c after punching. The plurality of green chips 22 are cut by the punched portion 26b. Each of the side surfaces 22c1 is covered.

  When the covering ceramic green sheets 26 are affixed to the plurality of green chips 22, adhesion to the side surfaces 22 c 1 of the plurality of green chips 22 and / or the main surface 26 a of the covering ceramic green sheets 26 is performed as necessary. An agent may be applied in advance. Here, examples of usable adhesives include those containing various resin components as main components, those obtained by dissolving the resin components in a solvent, and pastes in which ceramic particles are dispersed. . Also, the method for applying the adhesive is not particularly limited, and various methods can be used.

  Here, as described above, each of the plurality of green chips 22 has a substantially square frustum shape in which the pair of side surfaces 22c1 and 22c2 is inclined. The exposed surface of the punched portion 25b of the covering ceramic green sheet 25 affixed to the other side surface 22c2 is affixed to the second holding adhesive sheet 41 to hold the green chip 22, whereby a plurality of green chips One side surface 22 c 1 of 22 is inclined with respect to the main surface 26 a of the ceramic green sheet 26 for coating.

  Therefore, when the support plate 42 is lowered, each of the side surfaces 22c1 of the plurality of green chips 22 comes into contact with the main surface 26a of the covering ceramic green sheet 26 with a time difference. More specifically, as shown in FIG. 22, among the side surfaces 22 c 1 of the green chip 22, the lower end portion P 3 comes into contact with the main surface 26 a of the covering ceramic green sheet 26 first. The end portion P4 located at a higher position later comes into contact with the main surface 26a of the covering ceramic green sheet 26.

  Next, as shown in FIG. 23, the plurality of green chips 22 are moved away from the elastic body 51 by raising the support plate 42 in the direction of the arrow D2. At that time, not only the punched portion 26 b of the covering ceramic green sheet 26 but also the remaining portion 26 c rises together with the plurality of green chips 22 in a state where it adheres to the plurality of green chips 22. As a result, the entire covering ceramic green sheet 26 is detached from the elastic body 51.

  FIG. 24 is a schematic view showing a second peeling process in which the remaining portion of the covering ceramic green sheet attached to the green chip in the second attaching process is peeled off. FIG. 25 is a schematic view showing the state of the green chip after the second peeling process.

  As shown in FIG. 24, in the second peeling process in which the remaining part of the ceramic green sheet for coating is peeled off, as in the first peeling process described above, the coating material attached to the plurality of green chips 22 is removed. Of the remaining portion 26c of the ceramic green sheet 26, the terminal portion 26d on the side where the end portion P3 of the side surface 22c1 of the green chip 22 is located is held by the peeling roll 60 of the peeling device, and covered by the peeling roll 60. The remaining portion 26 c of the ceramic ceramic sheet 26 for winding is wound up so that the remaining portion 26 c of the ceramic green sheet 26 for coating is peeled off from the plurality of green chips 22.

  At this time, the remaining portion 26c of the covering ceramic green sheet 26 is pulled in the direction of the arrow E2 shown in the drawing, and the main portion of the covering ceramic green sheet 26 among the side surfaces 22c1 of the individual green chips 22 is pulled. The surface 26a is peeled away from the end P3 side that comes into contact with the surface 26a first toward the end P4 side that comes into contact later.

  As a result, the remaining portions 26c of the covering ceramic green sheet 26 are all removed from the plurality of green chips 22, and as shown in FIG. 25, the portions pasted on the side surfaces 22c1 of the plurality of green chips 22 are removed. Only the coating ceramic green sheet (that is, the punched portion 26 b described above) remains on the plurality of green chips 22. The details will be described later.

  Through the above steps, the ceramic green sheets 25 and 26 for covering are attached to the pair of side surfaces 22c1 and 22c2 of the green chip 22 in association with the shape and size corresponding to the pair of side surfaces 22c1 and 22c2, respectively. Will be.

  In the step (step S4) in which the thermocompression bonding is performed, the green chip 22 after the above-described ceramic green sheets for covering 25 and 26 are attached is brought to a state heated to a predetermined temperature, and in this state, the green chip 22 is elastic. The exposed surfaces of the covering ceramic green sheets 25 and 26 are pressed against each other toward the green chip 22 using a body or the like, so that a thermocompression treatment is performed. Thereby, the adhesiveness with respect to the green chip 22 of the punching parts 25b and 26b of the ceramic green sheets 25 and 26 for coating | cover is improved.

  In the step (step S5) in which barrel polishing is performed, the green chip 22 after being subjected to the above-described thermocompression bonding (the punched portions 25b of the coating ceramic green sheets 25 and 26 attached to the green chip 22) 26b) is enclosed together with a media ball having a hardness higher than that of the ceramic material in a small box called a barrel, and polishing is performed by rotating the barrel. As a result, the outer surfaces (particularly corners and corners) of the green chip 22 and the covering ceramic green sheets 25 and 26 are rounded.

  In the step where the firing is performed (step S6), the green chip 22 after barrel polishing (including the punched portions 25b and 26b of the covering ceramic green sheets 25 and 26 attached to the green chip 22) is included. ) Is heated to a predetermined temperature, whereby the ceramic material is sintered. By this processing, the green chip 22 becomes the element body 11 shown in FIG.

  In the step of forming the external electrode (step S7), a metal layer is formed by applying a conductive paste to the pair of end faces 11a of the element body 11, and the formed metal layer is baked. Thereafter, Ni plating and Sn plating are sequentially performed on the baked metal layer to form a pair of external electrodes 16.

  Through the series of steps described above, the manufacture of the multilayer ceramic capacitor 10 having the structure shown in FIGS. 1 to 3 is completed.

  As described above, in the method for manufacturing a capacitor according to the present embodiment, the first attachment in which the covering ceramic green sheets 25 and 26 to be the additional dielectric layer 15 are attached to the green chip 22 as the green structure. In the attaching step and the second attaching step, it is possible to remove all the remaining portions 25c, 26c of the covering ceramic green sheets 25, 26 from the plurality of green chips 22.

  That is, as described above, when the green chip 22 is pressed against the covering ceramic green sheets 25 and 26, if the punching of the covering ceramic green sheets 25 and 26 is partially insufficient, the covering is performed. Even after the remaining portions 25c, 26c of the ceramic green sheets 25, 26 are peeled off, the ceramic green sheets 25, 26 for covering the portions located adjacent to the ends P2, P4 where the punching is insufficient. The remaining portions 25c and 26c remain attached to the outer surface of the portion continuously located on the side surfaces 22c1 and 22c2, and the portions may remain on the green chip 22 without being detached from the green chip 22. There is.

  However, as described above, in the capacitor manufacturing method according to the present embodiment, as shown in FIGS. 14 and 22, the side surfaces 22c1 and 22c2 of the green chip 22 are the main parts of the ceramic green sheets 25 and 26 for coating. Since the side surfaces 22c1 and 22c2 of the green chip 22 are pressed against the main surfaces 25a and 26a of the covering ceramic green sheets 25 and 26 so as to contact the surfaces 25a and 26a with a time difference, respectively. Of the side surfaces 22c1 and 22c2 of the green chip 22, the coating ceramic green sheet 25 reliably applies a shearing force to the end portions P1 and P3 that contact the main surfaces 25a and 26a of the coating ceramic green sheets 25 and 26 first. , 26 and can be acted on Thereby as punched in the portion it is reliably performed. For this reason, the portion of the side surface 22c1 or 22c2 of the green chip 22 where the punching may be insufficient is the end P2 or P4 side that comes into contact with the main surfaces 25a or 26a of the covering ceramic green sheets 25 or 26 later. It is possible to aggregate.

  On the other hand, as described above, in the method of manufacturing a capacitor according to the present embodiment, as shown in FIGS. 16 and 24, the ceramic green sheets 25 for coating among the side surfaces 22c1 and 22c2 of the green chip 22 are provided. 26 so that the remaining portions 25c and 26c of the covering ceramic green sheets 25 and 26 are turned from the end portion P1 and P3 side that contacted the main surfaces 25a and 26a to the end portion P2 and P4 side that contacted later. Even if the punching is insufficient on the end portions P2 and P4 that come into contact with the main surfaces 25a and 26a of the covering ceramic green sheets 25 and 26 later, the side surfaces 22c1 and 22c2 are continuous. The coating sera of the part located adjacent to the part where the punching was insufficient, attached to the outer surface of the part located It is possible to reliably apply a pulling force for peeling to the remaining portions 25c, 26c of the green sheets 25, 26, and thereby the main surfaces 25a of the ceramic green sheets 25, 26 for coating. 26a, the remaining portions 25c and 26c of the covering ceramic green sheets 25 and 26 can be peeled off at the end portions P2 and P4 side which contacted later.

  Therefore, by adopting the capacitor manufacturing method according to the present embodiment, it is possible to remove all of the remaining portions 25c, 26c of the covering ceramic green sheets 25, 26 from the plurality of green chips 22. Therefore, by adopting the method for manufacturing a capacitor according to the present embodiment, various defects caused by the remaining portions 25c, 26c of the covering ceramic green sheets 25, 26 remaining on the green chip 22. As a result, it becomes possible to manufacture a small, large-capacity and highly reliable capacitor element with a high yield.

  Here, when comparing the above-described first attaching step and the second attaching step, the green chip 22 is directly held by the second holding adhesive sheet 41 in the first attaching step. The second sticking step is different in that the green chip 22 is held by the second holding pressure-sensitive adhesive sheet 41 through the covering ceramic green sheet 25 that is previously stuck to the green chip 22 in the second sticking step. Therefore, particularly in the second attaching step described above, the covering ceramic green sheet 25 attached in advance functions as a cushion, so that the green chip 22 is formed more than in the first attaching step. There is an increased risk that punching will be insufficient on the side of the end P4 that comes into contact with the main surface 26a of the covering ceramic green sheet 26 in the side surface 22c2. Therefore, the effect obtained by employing the method for manufacturing a capacitor element in the present embodiment becomes more meaningful in the second attaching step.

  Therefore, in order to confirm the above-described effect, the present inventor sets the peeling direction of the covering ceramic green sheet 26 in the above-described second attaching step so that the covering ceramic green sheet of the side surface 22c2 of the green chip 22 is peeled off. In contrast to the case where the main surface 26a of the green chip 22 is peeled from the end portion P3 side that contacts the main surface 26a toward the end portion P4 side that contacts the main surface 26a, the side surface 22c2 of the green chip 22 is covered. The ceramic green sheet for coating 26 is actually applied to the case where the main surface 26a of the ceramic green sheet 26 is peeled from the end P4 side that comes into contact with the main surface 26a toward the end P3 that comes into contact with the main surface 26a. In this case, a part of the remaining portion 26c of the covering ceramic green sheet 26 is removed. An experiment was conducted to compare whether would remain on the extent green chip 22.

  As a result, in the case where the covering ceramic green sheet 26 is peeled from the end portion P3 side toward the end portion P4 side (that is, when the capacitor element manufacturing method in the present embodiment is applied), The sample in which the remaining portion 26c of the ceramic green sheet for coating 26 remained on the green chip 22 was 0 samples out of 100 samples, whereas the ceramic green for coating from the end P4 side toward the end P3 side. When the sheet 26 is peeled off (that is, when the capacitor element manufacturing method according to the present embodiment is not applied), the remaining portion 26c of the covering ceramic green sheet 26 remains on the green chip 22. Confirmed that 50 samples out of 100 samples It was.

  From the above results, it can be said that it has been experimentally confirmed that the effects as described above can be obtained by employing the method of manufacturing a capacitor element according to the present embodiment.

  In the present embodiment described above, the present invention is applied to both the case where the covering ceramic green sheet is attached to each of the pair of side surfaces of the green chip as the green structure, and the covering ceramic green sheet is attached. However, it is not necessarily required to be configured as such, and the effect described above is achieved by applying the present invention to at least one of the pair of side surfaces and attaching the covering ceramic green sheet. You can get at least part of.

  Further, in the above-described embodiment, the mother blocks are cut in a matrix in the cutting step, so that the green chip as a green structure including only one portion that becomes a laminated body included in the product in advance is obtained. 2 illustrates an example in which the present invention is applied to a method of manufacturing a capacitor element having a procedure for obtaining a precursor of an element body shown in FIG. In the cutting process, the mother block is cut only in rows, so that it is once separated into rod-like green blocks as green structures including a plurality of portions to be laminated bodies included in the product. A ceramic green sheet for coating is attached to each of the plurality of rod-shaped green blocks after singulation, and then It is also possible to apply the present invention to a method of manufacturing a capacitor element in a procedure in which each of a plurality of rod-shaped green blocks to which a covering ceramic green sheet is attached is cut again to obtain a precursor of an element body shown in FIG. It is.

  In the above-described embodiment, the case where the ceramic green sheets for coating are collectively pasted to a plurality of green chips as the green structure has been described as an example. Of course, the present invention can also be applied to the case where the ceramic green sheet for coating is individually attached to the structure.

  In the above-described embodiment, the shape of the cutting blade used in the cutting process is a specific method for pressing the side surface of the green chip in a state where the side surface of the green chip is inclined with respect to the main surface of the coating ceramic green sheet. The case where the green chip has a substantially quadrangular pyramid shape due to the above has been described as an example, but it is naturally possible to realize this by using other methods.

  Further, in the above-described embodiment, the second adhesive holding as an adhesive holding tool for sticking and holding the green chip is used as a holding tool used when the coating ceramic green sheet is attached to the green chip as the green structure. Although the case where the sheet is used has been illustrated, it is naturally possible to attach the coating ceramic green sheet to the green structure in a state where the green structure is held using a holder of another mechanism.

  Thus, the above-described embodiment disclosed herein is illustrative in all respects and is not restrictive. The technical scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 10 Multilayer ceramic capacitor, 10a end surface, 10b main surface, 10c side surface, 11 element body, 11a end surface, 11b main surface, 11c side surface, 12 laminated body, 13 dielectric layer, 14 internal electrode layer, 15 additional dielectric layer, 16 External electrode, 20 Mother block, 22 Green chip, 22a End surface, 22b Main surface, 22c, 22c1, 22c2 Side surface, 23 Ceramic green sheet for lamination, 24 Conductive pattern, 25, 26 Ceramic green sheet for coating, 25a, 26a Main surface 25b, 26b Punched portion, 25c, 26c Residual portion, 25d, 26d End portion, 31 First holding adhesive sheet, 32 Table, 33 Cutting blade, 41 Second holding adhesive sheet, 42 Support plate, 43 Working plate, 51 elastic body, 52 table, 60 peeling roll, P ~P4 end.

Claims (10)

A method of manufacturing a capacitor element for manufacturing a capacitor element including a laminate composed of dielectric layers and internal electrode layers alternately laminated along a predetermined direction,
A step of preparing a green structure formed by laminating a plurality of first dielectric green sheets serving as the dielectric layers and having a conductive pattern serving as the internal electrode layer formed therein;
Among the pair of outer surfaces of the green structure, in a state where the green structure is held using a holding tool on one outer surface side of the pair of outer surfaces positioned relative to the green structure. The second dielectric green sheet is punched out by the green structure by pressing the other outer surface of the second dielectric green sheet against the second dielectric green sheet placed on the elastic body. A step of attaching a punched portion to the other outer surface of the green structure;
Detaching the elastic body from the punched portion and the remaining portion after punching of the second dielectric green sheet;
Peeling the remaining part of the second dielectric green sheet from the punched part of the second dielectric green sheet,
In the step of attaching the second dielectric green sheet to the other outer surface of the green structure, the other outer surface of the green structure has a time difference with respect to the main surface of the second dielectric green sheet. Inclining and pressing the other outer surface of the green structure against the main surface of the second dielectric green sheet so as to contact,
In the step of peeling off the remaining portion of the second dielectric green sheet, the end of the other outer surface of the green structure that has previously contacted the main surface of the second dielectric green sheet A method of manufacturing a capacitor element, wherein the remaining portion of the second dielectric green sheet is peeled away toward an end side that comes into contact later.   In the step of attaching the second dielectric green sheet to the other outer surface of the green structure, the conductive pattern on the other outer surface of the green structure before the second dielectric green sheet is attached. The method for manufacturing a capacitor element according to claim 1, wherein is exposed.   Prior to the step of attaching the second dielectric green sheet to the other outer surface of the green structure, the method further comprises the step of attaching a third dielectric green sheet to the one outer surface of the green structure. A method for manufacturing a capacitor element according to claim 1.   The step of affixing the third dielectric green sheet to the one outer surface of the green structure in a state where the green structure is held using a holder on the other outer surface side of the green structure. The one outer surface of the green structure is pressed against the third dielectric green sheet placed on an elastic body to punch out the third dielectric green sheet by the green structure, thereby Attaching the punched portion of the third dielectric green sheet to the one outer surface of the green structure, and removing the elastic body from the punched portion of the third dielectric green sheet and the remaining portion after punching; And the remaining portion of the third dielectric green sheet from the punched portion of the third dielectric green sheet. And a step of peeling can, method of manufacturing the capacitor element according to claim 3.   The green structure by contacting the other outer surface of the green structure and the exposed surface of the third dielectric green sheet affixed to the one outer surface of the green structure as the holder The manufacturing method of the capacitor | condenser element of Claim 4 using the adhesion holder which has the adhesion surface which hold | maintains. In the step of attaching the third dielectric green sheet to the one outer surface of the green structure, the green surface is obtained by bringing the adhesive surface of the adhesive holder into contact with the other outer surface of the green structure. Hold the structure using the adhesive holder,
Then, the third structure attached to the one outer surface of the green structure by rolling the green structure to which the third dielectric green sheet is attached on the adhesive holder. 6. The method of manufacturing a capacitor element according to claim 5, wherein the adhesive surface is brought into contact with the exposed surface of a dielectric green sheet and the green structure is held using the adhesive holder.   In the step of attaching the third dielectric green sheet to the one outer surface of the green structure, the conductive pattern is formed on the one outer surface of the green structure before the third dielectric green sheet is attached. The method for manufacturing a capacitor element according to claim 3, wherein is exposed.   In the step of attaching the second dielectric green sheet to the other outer surface of the green structure, a plurality of the green structures are held using the holding tool in a state of being arranged in a row or a matrix. 8. The method of manufacturing a capacitor element according to claim 1, wherein the second dielectric green sheet is attached to each of the plurality of green structures at once.   The method for manufacturing a capacitor element according to claim 1, wherein the green structure is a green chip including only one portion to be the laminated body.   The method for manufacturing a capacitor element according to claim 1, wherein the green structure is a green block including a plurality of portions to be the laminated body.

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