JP2022020865A - Multilayer ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer ceramic electronic component to which damage is hardly applied to a ridge par of a lamination body.

SOLUTION: A manufacturing method of a multilayer ceramic electronic component, includes: a plurality of ceramic layers laminated in one axial direction; a plurality of inner electrodes arranged between the plurality of ceramic layers; first and second main surfaces directed to the one axial direction; first and second side surfaces connecting the first and second main surfaces, and from which the plurality of inner electrodes is exposed; and a ridge part connecting the first and second main surfaces at an obtuse angle, and manufactures the lamination body of which the first main surface is held by a holding member. By rotating and moving the lamination body on the holding member while using the ridge part as a support axis, a holding surface held by the holding member on the lamination body is changed to the first side surface from the first main surface. A side margin part is formed on the second side surface of the lamination body of which the first side surface is held by the holding member.

SELECTED DRAWING: Figure 11

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to a method for manufacturing a laminated ceramic electronic component to which a side margin portion is retrofitted.

Patent Document 1 discloses a technique for manufacturing a monolithic ceramic capacitor. In this technique, a laminated sheet in which ceramic sheets are laminated is cut to produce a plurality of laminated bodies having a cut surface on which an internal electrode is exposed as a side surface. Then, a side margin portion for ensuring the insulating property around the internal electrode is formed on the side surface of the laminated body.

In the technique described in Patent Document 1, it is difficult to form a side margin portion on the side surface of the laminated body because the side surface of the laminated body faces in the lateral direction immediately after the laminated sheet is cut. Therefore, in this technique, the side surface of the laminated body is turned upward by rolling the laminated body 90 degrees before forming the side margin portion.

Japanese Unexamined Patent Publication No. 2012-209039

In the technique described in Patent Document 1, when the laminated body rolls, the ridge portion of the laminated body functions as a support axis that becomes the center of rotation of the rolling structure, so that stress tends to concentrate on the ridge portion of the laminated body. .. Therefore, in the technique of rolling the laminated body, damage such as chipping is likely to be added to the ridge portion of the laminated body. As a result, the manufacturing yield of the monolithic ceramic capacitor is lowered.

In view of the above circumstances, an object of the present invention is to provide a method for manufacturing a laminated ceramic electronic component in which the ridge portion of the laminated body is not easily damaged.

In order to achieve the above object, in the method for manufacturing a laminated ceramic electronic component according to an embodiment of the present invention, a plurality of ceramic layers laminated in the uniaxial direction and a plurality of internal electrodes arranged between the plurality of ceramic layers are used. , The first and second main surfaces facing the uniaxial direction, the first and second side surfaces connecting the first and second main surfaces, and the plurality of internal electrodes exposed, and the first main surface. A laminated body having a ridge portion connecting the first side surface at an obtuse angle and having the first main surface held by a holding member is produced.
By rolling the laminated body on the holding member with the ridge portion as a support axis, the holding surface held by the holding member in the laminated body is changed from the first main surface to the first side surface. ..
A side margin portion is formed on the second side surface of the laminated body in which the first side surface is held by the holding member.

In the laminated body having this configuration, the connection angle at the ridge portion connecting the first main surface and the first side surface, which functions as a support shaft that is the center of rotation of rolling, is obtuse. Therefore, the concentration of stress on the ridge when the laminated body rolls is suppressed. Therefore, in the method for manufacturing the laminated ceramic electronic component, the ridge portion of the laminated body is less likely to be damaged.

The first and second sides may be parallel to each other.
The side margin portion may be formed by punching the ceramic sheet on the second side surface.
In this configuration, the second side surfaces of the plurality of laminated bodies after rolling can be arranged on the same plane. This makes it possible to collectively form side margin portions on the second side surface of the plurality of laminated bodies. Therefore, the manufacturing efficiency of the laminated ceramic electronic component is improved.

The obtuse angle may be smaller than 93 °.
In this configuration, it is possible to keep the change in the dimensions of the laminated body small by making the connection angle at the ridge portion obtuse. As a result, the mounting area of the laminated ceramic electronic component can be kept small.

As described above, according to the present invention, it is possible to provide a method for manufacturing a laminated ceramic electronic component in which the ridge portion of the laminated body is not easily damaged.

It is a perspective view of the multilayer ceramic capacitor which concerns on one Embodiment of this invention. It is sectional drawing along the AA'line of FIG. 1 of the said monolithic ceramic capacitor. It is sectional drawing along the BB'line of FIG. 1 of the said monolithic ceramic capacitor. It is a flowchart which shows the manufacturing method of the said monolithic ceramic capacitor. It is a top view which shows the manufacturing process of the said monolithic ceramic capacitor. It is a perspective view which shows the manufacturing process of the said monolithic ceramic capacitor. It is a top view which shows the manufacturing process of the said monolithic ceramic capacitor. It is a schematic diagram which shows the manufacturing process of the said monolithic ceramic capacitor. It is a perspective view which shows the manufacturing process of the said monolithic ceramic capacitor. It is a schematic diagram which shows the manufacturing process of the said monolithic ceramic capacitor. It is a schematic diagram which shows the manufacturing process of the said monolithic ceramic capacitor. It is a schematic diagram which shows the manufacturing process of the said monolithic ceramic capacitor. It is a perspective view which shows the manufacturing process of the said monolithic ceramic capacitor.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The drawings show X-axis, Y-axis, and Z-axis that are orthogonal to each other as appropriate. The X-axis, Y-axis, and Z-axis are common to all drawings.

[Structure of Multilayer Ceramic Capacitor 10]
1 to 3 are views showing a multilayer ceramic capacitor 10 according to an embodiment of the present invention. FIG. 1 is a perspective view of the monolithic ceramic capacitor 10. FIG. 2 is a cross-sectional view of the monolithic ceramic capacitor 10 along the AA'line of FIG. FIG. 3 is a cross-sectional view of the monolithic ceramic capacitor 10 along the line BB'of FIG.

The multilayer ceramic capacitor 10 includes a ceramic prime field 11, a first external electrode 14, and a second external electrode 15. The outer surfaces of the ceramic prime field 11 include first and second end faces facing the X-axis direction, first and second side surfaces facing the Y-axis direction, and first and second main faces facing the Z-axis direction. , Have.

The external electrodes 14 and 15 cover the first and second end faces of the ceramic element 11 and face each other in the X-axis direction with the ceramic element 11 interposed therebetween. The external electrodes 14 and 15 extend from each end surface of the ceramic prime field 11 to the main surface and the side surface. As a result, in the external electrodes 14 and 15, the cross section parallel to the XY plane and the cross section parallel to the XY plane are both U-shaped.

The shapes of the external electrodes 14 and 15 are not limited to those shown in FIG. For example, the external electrodes 14 and 15 may extend from the end surface of the ceramic prime field 11 to only one main surface, and may have an L-shaped cross section parallel to the XX plane. Further, the external electrodes 14 and 15 do not have to extend to any of the main surfaces and side surfaces.

The external electrodes 14 and 15 are formed of good electric conductors. Examples of good electrical conductors forming the external electrodes 14 and 15 include copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), and gold (Au). Examples thereof include metals or alloys whose main components are such as.

The ceramic prime field 11 is made of dielectric ceramics and has a laminated body 16 and a side margin portion 17. The laminated body 16 has first and second side surfaces S1 and S2 facing the Y-axis direction, and first and second main surfaces M1 and M2 facing the Z-axis direction. The first and second main surfaces M1 and M2 extend along the XY plane.

The laminated body 16 further has first and second ridges R1 and R2. The first ridge portion R1 connects the first main surface M1 and the first side surface S1 at an obtuse angle θ1 slightly larger than 90 °. The second ridge portion R2 connects the first main surface M1 and the second side surface S2 at an acute angle θ2 slightly smaller than 90 °. That is, the side surfaces S1 and S2 are slightly inclined with respect to the XZ plane.

It is preferable that the side surfaces S1 and S2 of the laminated body 16 are parallel to each other. As a result, the side margin portions 17 can be efficiently formed on the side surfaces S1 and S2 of the laminated body 16. The method of forming the side margin portion 17 will be described in the method of manufacturing the multilayer ceramic capacitor 10 described later.

Further, the connection angle θ1 at the first ridge portion R1 of the laminated body 16 is preferably smaller than 93 °. The connection angle θ2 at the second ridge portion R2 of the laminated body 16 is preferably larger than 87 °. As a result, the dimension of the laminated body 16 in the Y-axis direction can be kept small, so that the mounting area of the laminated ceramic capacitor 10 can be kept small.

In the laminated body 16, the ridges R1 and R2 may be ridges that directly connect the first main surface M1 and the side surfaces S1 and S2, but the first main surface M1 and the side surfaces S1 and S2 are loosely connected. It is preferably a rounded surface that connects to. As a result, in the laminated body 16, stress is less likely to be concentrated on the ridges R1 and R2, so that damage is less likely to be applied to the ridges R1 and R2.

The laminated body 16 has a structure in which a plurality of flat plate-shaped ceramic layers extending along an XY plane are laminated in the Z-axis direction. The laminated body 16 has a capacity forming portion 18 and a cover portion 19. The cover portion 19 covers the capacitance forming portion 18 from above and below in the Z-axis direction, and constitutes the main surfaces M1 and M2 of the laminated body 16.

The capacitance forming portion 18 is arranged between the plurality of ceramic layers and has a plurality of sheet-shaped first and second internal electrodes 13 extending along an XY plane. The internal electrodes 12 and 13 are alternately arranged along the Z-axis direction. That is, the internal electrodes 12 and 13 face each other in the Z-axis direction with the ceramic layer interposed therebetween.

The first internal electrode 12 is drawn out only to the first end surface of the ceramic element 11, and the second internal electrode 13 is drawn out only to the second end surface of the ceramic element 11. As a result, the first internal electrode 12 is connected only to the first external electrode 14, and the second internal electrode 13 is connected only to the second external electrode 15.

The internal electrodes 12 and 13 are formed over the entire width of the capacitance forming portion 18 in the Y-axis direction, and are exposed on both side surfaces S1 and S2 of the laminated body 16. The side margin portion 17 covers both side surfaces S1 and S2 of the laminated body 16. Thereby, the insulating property between the internal electrodes 12 and 13 on both side surfaces S1 and S2 of the laminated body 16 can be ensured.

With such a configuration, in the multilayer ceramic capacitor 10, when a voltage is applied between the first external electrode 14 and the second external electrode 15, a plurality of layers between the first internal electrode 12 and the second internal electrode 13 are applied. A voltage is applied to the ceramic layer of. As a result, in the multilayer ceramic capacitor 10, electric charges corresponding to the voltage between the first external electrode 14 and the second external electrode 15 are stored.

In the ceramic prime field 11, dielectric ceramics having a high dielectric constant are used in order to increase the capacity of each ceramic layer between the internal electrodes 12 and 13. Examples of the dielectric ceramics having a high dielectric constant include materials having a perovskite structure containing barium (Ba) and titanium (Ti) represented by barium titanate (BaTIO ₃ ).

The ceramic layer is strontium titanate (SrTiO ₃ ) -based, calcium titanate (CaTIO ₃ ) -based, magnesium titanate (MgTIO ₃ ) -based, calcium zirconate (CaZrO ₃ ) -based, calcium titanate (Ca (Ca (Ca)). It may be composed of Zr, Ti) O ₃ ) system, barium zirconate (BaZrO ₃ ) system, titanium oxide (TiO ₂ ) system and the like.

The internal electrodes 12 and 13 are formed of good electric conductors. Nickel (Ni) is typically mentioned as a good electric conductor forming the internal electrodes 12 and 13, and in addition to this, copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), and the like. Examples thereof include metals or alloys containing gold (Au) or the like as a main component.

The laminated ceramic capacitor 10 according to the present embodiment may be provided with the laminated body 16 and the side margin portion 17, and other configurations can be appropriately changed. For example, the number of the first and second internal electrodes 12 and 13 can be appropriately determined according to the size and performance required for the multilayer ceramic capacitor 10.

[Manufacturing method of multilayer ceramic capacitor 10]
FIG. 4 is a flowchart showing a method of manufacturing the monolithic ceramic capacitor 10. FIGS. 5 to 13 are views showing a manufacturing process of the monolithic ceramic capacitor 10. Hereinafter, a method for manufacturing the monolithic ceramic capacitor 10 will be described with reference to FIGS. 5 to 13 with reference to FIGS. 4.

(Step S01: Ceramic sheet preparation)
In step S01, a first ceramic sheet 101 and a second ceramic sheet 102 for forming the capacitance forming portion 18 and a third ceramic sheet 103 for forming the cover portion 19 are prepared. The ceramic sheets 101, 102, 103 are configured as an unfired dielectric green sheet containing dielectric ceramics as a main component.

The ceramic sheets 101, 102, 103 are formed into a sheet shape using, for example, a roll coater or a doctor blade. The thickness of the ceramic sheets 101 and 102 is adjusted according to the thickness of the ceramic layer in the capacitance forming portion 18 after firing. The thickness of the third ceramic sheet 103 can be adjusted as appropriate.

FIG. 5 is a plan view of the ceramic sheets 101, 102, 103. At this stage, the ceramic sheets 101, 102, and 103 are configured as large-sized sheets that are not individualized. FIG. 5 shows the cutting lines Lx and Ly for individualizing each multilayer ceramic capacitor 10. The cutting line Lx is parallel to the X axis, and the cutting line Ly is parallel to the Y axis.

As shown in FIG. 5, the first ceramic sheet 101 is formed with an unfired first internal electrode 112 corresponding to the first internal electrode 12, and the second ceramic sheet 102 is not corresponding to the second internal electrode 13. The second internal electrode 113 for firing is formed. An internal electrode is not formed on the third ceramic sheet 103 corresponding to the cover portion 19.

The internal electrodes 112 and 113 can be formed by applying an arbitrary conductive paste to the ceramic sheets 101 and 102. The method for applying the conductive paste can be arbitrarily selected from known techniques. For example, a screen printing method or a gravure printing method can be used for applying the conductive paste.

In the internal electrodes 112 and 113, gaps in the X-axis direction along the cutting line Ly are formed every other cutting line Ly. The gap between the first internal electrode 112 and the gap between the second internal electrodes 113 are arranged alternately in the X-axis direction. That is, the cutting line Ly passing through the gap of the first internal electrode 112 and the cutting line Ly passing through the gap of the second internal electrode 113 are alternately arranged.

(Step S02: Lamination)
In step S02, the laminated sheet 104 is produced by laminating the ceramic sheets 101, 102, 103 prepared in step S01 as shown in FIG. In the laminated sheet 104, the first ceramic sheet 101 and the second ceramic sheet 102 corresponding to the capacitance forming portion 18 are alternately laminated in the Z-axis direction.

Further, in the laminated sheet 104, the third ceramic sheet 103 corresponding to the cover portion 19 is laminated on the upper and lower surfaces of the alternately laminated ceramic sheets 101 and 102 in the Z-axis direction. In the example shown in FIG. 6, three third ceramic sheets 103 are laminated, but the number of third ceramic sheets 103 can be changed as appropriate.

The laminated sheet 104 is integrated by crimping the ceramic sheets 101, 102, 103. For crimping of the ceramic sheets 101, 102, 103, for example, hydrostatic pressure pressurization or uniaxial pressurization is preferably used. This makes it possible to increase the density of the laminated sheet 104.

(Step S03: Disconnection)
In step S03, the laminated sheet 104 obtained in step S02 is cut along the cutting lines Lx and Ly to produce an unfired laminated body 116. The laminated body 116 corresponds to the laminated body 16 after firing. For example, a push-cutting blade, a rotary blade, or the like can be used for cutting the laminated sheet 104.

7 and 8 are schematic views for explaining an example of step S03. FIG. 7 is a plan view of the laminated sheet 104. FIG. 8 is an end view of the laminated sheet 104 as viewed from the X-axis direction. The laminated sheet 104 is cut by the push-cutting blade F along the cutting lines Lx and Ly while being held by the adhesive tape-shaped holding member T.

As shown in FIG. 8, when the laminated sheet 104 is cut along the cutting line Lx, the push-cutting blade F is inserted into the laminated sheet 104 with a slight inclination about the X axis with respect to the XZ plane. As a result, as shown in FIG. 9, an unfired laminated body 116 in which the side surfaces S1 and S2 are parallel to each other and is inclined with respect to the XZ plane is obtained.

In the laminated body 116, the connection angle θ1 between the first main surface M1 and the first side surface S1 in the first ridge portion R1 and the connection angle θ2 between the first main surface M1 and the second side surface S2 in the second ridge portion R2 are set. It can be controlled by the inclination of the push cutting blade F with respect to the XX plane. However, the control method of the connection angles θ1 and θ2 is not limited to this.

(Step S04: Forming a side margin portion)
In step S04, the unfired ceramic prime 111 is produced by providing the unfired side margin portions 117 on the side surfaces S1 and S2 where the internal electrodes 112 and 113 of the laminated body 116 obtained in step S03 are exposed. 10 to 13 are diagrams showing the process of step S04.

FIG. 10A shows the state immediately after step S03. In this state, since the laminated bodies 116 arranged in the X-axis and Y-axis directions are close to each other on the holding member T, it is difficult to handle each of the laminated bodies 116. Therefore, the distance between the X-axis and Y-axis directions of the laminated body 116 arranged on the holding member T is widened.

Specifically, the holding member T shown in FIG. 10A is stretched in the X-axis and Y-axis directions. As a result, as shown in FIG. 10B, the spacing between the laminated bodies 116 on the holding member T is widened. In addition, for example, when the holding member T used in step S03 does not have elasticity, the laminated body 116 is replaced with another holding member T having elasticity in advance, if necessary.

Even in the state shown in FIG. 10B, since the side surfaces S1 and S2 of each laminated body 116 are oriented in the Y-axis direction, which is the in-plane direction of the surface of the holding member T, the side surfaces S1 and S2 of the laminated body 116 are still oriented. It is difficult to provide the side margin portion 117 in the. Therefore, the orientation of the laminated body 116 is changed on the holding member T.

Specifically, as shown in FIG. 11A, a flat plate-shaped working plate B extending along the XY plane is arranged on the second main surface M2 of the laminated body 116. It is preferable that the working plate B collectively covers the second main surface M2 of all the laminated bodies 116 on the holding member T. The working plate B is preferably made of a non-slip elastic material such as silicon rubber.

Then, as shown in FIG. 11B, the action plate B is moved in the Y-axis direction. At this time, a moment is generated in the laminated body 116 due to the force applied from the working plate B in the Y-axis direction. As a result, the laminated body 116 rolls on the holding member T with the first ridge portion R1 connecting the first main surface M1 and the first side surface S1 as the rotation center.

After the first main surface M1 is peeled off from the holding member T by the rolling of the laminated body 116, the first side surface S1 is adhered to the holding member T. As a result, as shown in FIG. 11C, the holding surface held by the holding member T in the laminated body 116 is changed from the first main surface M1 to the first side surface S1, and the second side surface S2 of the laminated body 116 is changed. It faces upward in the Z-axis direction.

In the laminated body 116, since the first ridge portion R1 that functions as a support shaft that is the center of rotation of rolling has an obtuse angle, the stress applied to the first ridge portion R1 during rolling is dispersed. That is, stress is unlikely to be concentrated on the first ridge portion R1 of the laminated body 116 at the time of rolling. Therefore, in step S04, when the laminated body 116 is rolled, damage such as chipping is unlikely to be applied to the laminated body.

In the state shown in FIG. 11C, since the second side surface S2 of all the laminated bodies 116 on the holding member T faces the upper side in the Z-axis direction opposite to the holding member T side, the first layer of the laminated body 116 is It is easy to form the side margin portion 117 on the two side surfaces S2. An example of the method of forming the side margin portion 117 will be described with reference to FIG.

First, as shown in FIG. 12A, the ceramic sheets 117s are arranged so as to cover the laminated body 116 arranged on the holding member T. At this time, since the second side surface S2 of all the laminated bodies 116 is on the same plane along the XY plane, the ceramic sheet 117s can be brought into close contact with the second side surface S2 of all the laminated bodies 116.

The ceramic sheet 117s is configured as an unfired dielectric green sheet, similarly to the ceramic sheets 101, 102, 103 prepared in step S01. The ceramic sheet 117s is formed into a sheet shape using, for example, a roll coater or a doctor blade.

Then, from the state shown in FIG. 12A, the ceramic sheet 117s is cut along the contour of the second side surface S2 of each laminated body 116. As the cutting method of the ceramic sheet 117s, a known method can be arbitrarily selected. For example, a punching method of punching the ceramic sheet 117s with the second side surface S2 of each laminated body 116 can be adopted.

In the punching method, the ceramic sheet 117s is pressed by an elastic member from the upper side in the Z-axis direction. As a result, a shearing force is applied to the ceramic sheet 117s sandwiched between the elastic member and the second side surface S2 of the laminated body 116 along the contour of the second side surface S2 of each laminated body 116. As a result, the ceramic sheet 117s can be punched out.

Subsequently, by replacing the laminated body 116 shown in FIG. 12B with another holding member T, the orientation of the laminated body 116 in the Y-axis direction is reversed. Then, the side margin portion 117 is formed on the first side surface S1 on the side opposite to the second side surface S of the laminated body 116 on which the side margin portion 117 is not formed in the same manner as described above.

As a result, as shown in FIG. 13, an unfired ceramic prime field 111 having side margin portions 117 formed on both side surfaces S1 and S2 of the laminated body 116 is obtained. In the unfired ceramic prime 111, both side surfaces S1 and S2 of the laminated body 116 with the internal electrodes 112 and 113 exposed are covered with the side margin portions 117.

The method of forming the side margin portion 117 on the second side surface S2 of the laminated body 116 in the state shown in FIG. 11C is not limited to the above. For example, the pre-cut ceramic sheet 117s may be attached to the second side surface S2 of the laminated body 116. Further, the ceramic slurry may be applied to the second side surface S2 of the laminated body 116 by, for example, a dip method.

(Step S05: Baking)
In step S05, the unfired ceramic prime field 111 obtained in step S04 is fired to produce the ceramic prime field 11 of the laminated ceramic capacitor 10 shown in FIGS. 1 to 3. That is, in step S05, the laminated body 116 becomes the laminated body 16, and the side margin portion 117 becomes the side margin portion 17.

The firing temperature in step S05 can be determined based on the sintering temperature of the ceramic prime field 111. For example, when a barium titanate (BaTIO ₃ ) -based material is used, the firing temperature can be about 1000 to 1300 ° C. Further, the calcination can be performed, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.

(Step S06: External electrode formation)
In step S06, the laminated ceramic capacitors 10 shown in FIGS. 1 to 3 are manufactured by forming the external electrodes 14 and 15 at both ends of the ceramic prime field 11 obtained in step S05 in the X-axis direction. The method for forming the external electrodes 14 and 15 in step S06 can be arbitrarily selected from known methods.

From the above, the monolithic ceramic capacitor 10 is completed. In this manufacturing method, since the side margin portions 17 are retrofitted to the side surfaces S1 and S2 of the laminated body 16 in which the internal electrodes 12 and 13 are exposed, the ends of the plurality of internal electrodes 12 and 13 in the ceramic prime field 11 in the Y-axis direction. The positions of the parts are aligned within a range of 0.5 μm.

[Other embodiments]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made.

For example, in the laminated bodies 16 and 116, if the connection angle θ1 at the first ridge portion R1 is an obtuse angle, it is possible to realize a configuration in which damage is less likely to occur during rolling. Therefore, in the laminated bodies 16 and 116, the connection angle θ2 at the second ridge portion R2 does not necessarily have to be an acute angle, and may be a right angle or an obtuse angle.

Further, in the above embodiment, the laminated ceramic capacitor 10 has been described as an example of the laminated ceramic electronic component, but the present invention can be applied to all the laminated ceramic electronic components. Examples of such laminated ceramic electronic components include chip varistor, chip thermistor, and laminated inductor.

10 ... Multilayer ceramic capacitor 11,111 ... Ceramic prime field 12,112 ... First internal electrode 13,113 ... Second internal electrode 14,114 ... First external electrode 15, 115 ... Second external electrode 104 ... Laminated sheet 16, 116 ... Laminated bodies 17, 117 ... Side margin portions M1, M2 ... Main surfaces S1, S2 ... Side surfaces R1, R2 ... Ridges θ1, θ2 ... Connection angles T ... Holding member F ... Push-cutting blade B ... Action plate

Claims (3)

A plurality of ceramic layers laminated in the uniaxial direction, a plurality of internal electrodes arranged between the plurality of ceramic layers, the first and second main surfaces facing the uniaxial direction, and the first and second main surfaces. The first and second side surfaces that connect the surfaces and expose the plurality of internal electrodes, the first ridge portion that connects the first main surface and the first side surface at an obtuse angle, and the first main surface and the above. A laminated body having a second ridge portion connecting the second side surface at an acute angle, and
The side margin portions formed on the first and second side surfaces of the laminated body, respectively,
A laminated ceramic electronic component. The laminated ceramic electronic component according to claim 1.
A laminated ceramic electronic component whose first and second sides are parallel to each other. The laminated ceramic electronic component according to claim 1 or 2.
The obtuse angle is less than 93 °,
The acute angle is greater than 87 °,
Multilayer ceramic electronic components.

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