JP7213644B2 - Manufacturing method for multilayer ceramic electronic component - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method of manufacturing a laminated ceramic electronic component to which a side margin portion is retrofitted.

There is known a technique of retrofitting side margin portions in the manufacturing process of a multilayer ceramic capacitor (see, for example, Patent Document 1). This technique is advantageous in reducing the size and increasing the capacity of the multilayer ceramic capacitor, since the thin side margins can reliably protect the side surfaces of the multilayer body where the internal electrodes are exposed.

As an example, in the method for manufacturing a multilayer ceramic capacitor described in Patent Document 1, a multilayer sheet obtained by laminating ceramic sheets having internal electrodes printed thereon is cut to form a plurality of multilayer bodies having the cut surfaces on which the internal electrodes are exposed as side surfaces. make. A side margin portion is formed on the side surface of the laminate by punching the ceramic sheet on the side surface of the laminate.

JP 2012-209539 A

However, it has been found that the technique of punching a ceramic sheet on the side surface of the laminate results in insufficient adhesion of the side margin to the side surface of the laminate, and the side margin tends to separate from the side surface of the laminate. As a result, it becomes difficult to obtain high reliability and yield in the multilayer ceramic capacitor.

SUMMARY OF THE INVENTION In view of the circumstances as described above, an object of the present invention is to provide a method of manufacturing a multilayer ceramic electronic component, which can provide high adhesion of the side margins to the side surfaces of the multilayer body.

In order to achieve the above object, in a method for manufacturing a multilayer ceramic electronic component according to one aspect of the present invention, a plurality of ceramic layers laminated in a first axial direction and a plurality of inner layers positioned between the plurality of ceramic layers electrodes, and first and second side surfaces facing each other in a second axial direction perpendicular to the first axis, and exposing the plurality of internal electrodes, arranged on an adhesive sheet holding the first side surfaces A plurality of laminated bodies are prepared.
A series of ceramic sheets are positioned on the second side of the plurality of laminations.
The pressing surface that is elastically deformable and that has been subjected to release treatment is brought into contact with the ceramic sheet, and the ceramic sheet is thermocompression bonded to the second side surfaces of the plurality of laminates.
The thermocompression-bonded ceramic sheet is punched at the second side surfaces of the plurality of laminates.

In this configuration, after the ceramic sheet is thermocompression bonded to the second side surfaces of the plurality of laminates, the ceramic sheets are punched out from the second side surfaces of the plurality of laminates. As a result, the punched ceramic sheet becomes the side margin portion having high adhesiveness to the second side surface of the plurality of laminates.
In addition, the pressing surface that is brought into contact with the ceramic sheet during thermocompression bonding is elastically deformable. As a result, even when the second side surfaces of the plurality of laminates have uneven heights or when the pair of side surfaces of the plurality of laminates are not planes parallel to each other, the ceramic sheets can be excellently thermocompressed. .
Further, the pressing surface, which is brought into contact with the ceramic sheet during thermocompression bonding, is subjected to release treatment. As a result, the pressing surface can be smoothly separated from the ceramic sheet after thermocompression bonding without the ceramic sheet sticking to the pressing surface. As a result, it is possible to prevent the ceramic sheet after being punched from being peeled off from the second side surfaces of the plurality of laminates.

The ceramic sheet may be thermocompression bonded to the second side surfaces of the plurality of laminates by pressing the ceramic sheet with an elastic member having the pressing surface.
Further, the ceramic sheet may be thermocompression bonded to the second side surfaces of the plurality of laminates by pressing the ceramic sheet through a release film having the pressing surface with an elastic member. The film may be a PET film.
In these cases, the rubber hardness according to JIS K 6253 of the elastic member may be A60 to A80. Further, the elastic member may be made of fluororubber or silicone rubber.
With these configurations, the ceramic sheets can be thermocompression bonded to the second side surfaces of the plurality of laminates even better.

The punched ceramic sheet may be further thermocompression bonded to the second side surfaces of the plurality of laminates.
With this configuration, it is possible to more reliably obtain high adhesion of the side margin portion to the second side surface of the laminate.

As described above, according to the present invention, it is possible to provide a method of manufacturing a multilayer ceramic electronic component that provides high adhesion of the side margins to the side surfaces of the multilayer body.

1 is a perspective view of a laminated ceramic capacitor according to one embodiment of the present invention; FIG. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line AA' in FIG. 1; 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line BB' of FIG. 1; FIG. 4 is a flow chart showing a method for manufacturing the laminated ceramic capacitor. FIG. 4 is a plan view of a ceramic sheet prepared in a ceramic sheet preparation step of the manufacturing method; It is a perspective view which shows the lamination process of the said manufacturing method. It is a top view which shows the cutting process of the said manufacturing method. It is a partial cross-sectional view showing the cutting step. FIG. 4 is a perspective view of an unfired ceramic body obtained in the side margin forming step of the manufacturing method; 4 is a flow chart showing a method of forming a side margin portion in the manufacturing method; FIG. 4 is a partial cross-sectional view showing a ceramic sheet arranging step in the forming method; It is a fragmentary sectional view which shows the thermo-compression-bonding process of the said formation method. It is a fragmentary sectional view which illustrates the process of the said thermo-compression-bonding process. It is a fragmentary sectional view showing a comparative example of the above-mentioned thermocompression-bonding process. It is a fragmentary sectional view showing other embodiments of the above-mentioned thermocompression-bonding process. It is a partial cross-sectional view showing a punching step of the forming method. It is a fragmentary sectional view which shows the re-thermocompression-bonding process of the said formation method.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The drawings show mutually orthogonal X, Y and Z axes where appropriate. The Z-axis is an axis oriented vertically. The X-axis and Y-axis are horizontally oriented axes orthogonal to the Z-axis. The X-axis, Y-axis, and Z-axis are common in all drawings.

[Structure of Multilayer Ceramic Capacitor 10]
1 to 3 are diagrams showing a multilayer ceramic capacitor 10 according to one embodiment of the present invention in a common posture. FIG. 1 is a perspective view of a laminated ceramic capacitor 10. FIG. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line AA' in FIG. FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line BB' of FIG.

A laminated ceramic capacitor 10 includes a ceramic element body 11 , a first external electrode 14 and a second external electrode 15 . The ceramic body 11 is a hexahedron having first and second end surfaces orthogonal to the X axis, first and second side surfaces orthogonal to the Y axis, and first and second main surfaces orthogonal to the Z axis. configured as

The external electrodes 14 and 15 cover both end surfaces of the ceramic body 11 and face each other in the X-axis direction with the ceramic body 11 interposed therebetween. The external electrodes 14 and 15 extend from each end surface of the ceramic body 11 to the main surface and side surfaces. As a result, the external electrodes 14 and 15 have a U-shaped cross section parallel to the XZ plane and a cross section parallel to the XY plane.

The shape of the external electrodes 14 and 15 is not limited to that shown in FIG. For example, the external electrodes 14 and 15 may extend from both end surfaces of the ceramic body 11 to only one main surface and have an L-shaped cross section parallel to the XZ plane. Also, the external electrodes 14 and 15 do not have to extend to any of the main surfaces and side surfaces.

The external electrodes 14 and 15 are made of a good electrical conductor. Good electrical conductors forming the external electrodes 14 and 15 include, for example, copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), and gold (Au). and the like as a main component.

The ceramic body 11 is made of dielectric ceramics and has a laminate 16 and side margin portions 17 . The laminate 16 has a pair of side surfaces S that are orthogonal to the Y-axis and face each other in the Y-axis direction. Moreover, the laminate 16 has a pair of end faces perpendicular to the X-axis and facing in the X-axis direction, and a pair of main faces perpendicular to the Z-axis and facing in the Z-axis direction.

The laminate 16 has a structure in which a plurality of flat ceramic layers extending along the XY plane are laminated in the Z-axis direction. The laminate 16 has a capacitance forming portion 18 and a cover portion 19 . The cover portion 19 covers the capacitance forming portion 18 from above and below in the Z-axis direction, and constitutes a pair of main surfaces of the laminate 16 .

The capacitance forming portion 18 has a plurality of sheet-like first and second internal electrodes 12 and 13 arranged between a plurality of ceramic layers and extending along the XY plane. The internal electrodes 12 and 13 are alternately arranged along the Z-axis direction. That is, the internal electrodes 12 and 13 face each other in the Z-axis direction with the ceramic layer interposed therebetween.

The first internal electrode 12 is drawn out to the end face covered with the first external electrode 14 . On the other hand, the second internal electrode 13 is drawn out to the end surface covered with the second external electrode 15 . Thereby, the first internal electrode 12 is connected only to the first external electrode 14 and the second internal electrode 13 is connected only to the second external electrode 15 .

The internal electrodes 12 and 13 are formed over the entire width of the capacitance forming portion 18 in the Y-axis direction, and are exposed to the pair of side surfaces S of the laminate 16, respectively. The side margin portions 17 respectively cover the pair of side surfaces S of the laminate 16 . Thereby, insulation between the internal electrodes 12 and 13 on both side surfaces S of the laminate 16 can be ensured.

With such a configuration, in the multilayer ceramic capacitor 10, when a voltage is applied between the first external electrode 14 and the second external electrode 15, the plurality of voltages between the first internal electrode 12 and the second internal electrode 13 A voltage is applied to the ceramic layer of As a result, in the multilayer ceramic capacitor 10 , electric charges corresponding to the voltage between the first external electrode 14 and the second external electrode 15 are stored.

In the ceramic body 11, dielectric ceramics with a high dielectric constant are used in order to increase the capacitance of each ceramic layer between the internal electrodes 12,13. Dielectric ceramics with a high dielectric constant include, for example, perovskite structure materials containing barium (Ba) and titanium (Ti), represented by barium titanate (BaTiO ₃ ).

The ceramic layer includes strontium titanate (SrTiO ₃ ), calcium titanate (CaTiO ₃ ), magnesium titanate (MgTiO ₃ ), calcium zirconate (CaZrO ₃ ), calcium zirconate titanate (Ca(Zr,Ti) O ₃ ), barium zirconate (BaZrO ₃ ), and titanium oxide (TiO ₂ ).

The internal electrodes 12 and 13 are made of a good electrical conductor. Nickel (Ni) is typically used as a good electrical conductor forming the internal electrodes 12 and 13. In addition, copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), A metal or alloy containing gold (Au) or the like as a main component can be used.

[Manufacturing Method of Multilayer Ceramic Capacitor 10]
FIG. 4 is a flow chart showing the manufacturing method of the multilayer ceramic capacitor 10 according to this embodiment. 5 to 9 are diagrams showing the manufacturing process of the multilayer ceramic capacitor 10. FIG. Hereinafter, a method for manufacturing the laminated ceramic capacitor 10 will be described along FIG. 4 with reference to FIGS. 5 to 9 as appropriate.

(Step S01: Ceramic sheet preparation)
In step S01, the first ceramic sheet 101 and the second ceramic sheet 102 for forming the capacitance forming portion 18, and the third ceramic sheet 103 for forming the cover portion 19 are prepared. The ceramic sheets 101, 102, 103 are configured as unfired dielectric green sheets containing dielectric ceramics as a main component.

The ceramic sheets 101, 102, 103 are formed into sheets using, for example, a roll coater or a doctor blade. The thicknesses of the ceramic sheets 101 and 102 are adjusted according to the thickness of the ceramic layers in the capacitor forming portion 18 after firing. The thickness of the third ceramic sheet 103 can be adjusted appropriately.

FIG. 5 is a plan view of the ceramic sheets 101, 102, 103. FIG. At this stage, the ceramic sheets 101, 102, 103 are constructed as large sheets that are not singulated. FIG. 5 shows cutting lines Lx and Ly used when singulating each laminated ceramic capacitor 10 . The cutting line Lx is parallel to the X-axis, and the cutting line Ly is parallel to the Y-axis.

As shown in FIG. 5, unfired first internal electrodes 112 corresponding to the first internal electrodes 12 are formed on the first ceramic sheet 101 , and unfired first internal electrodes 112 corresponding to the second internal electrodes 13 are formed on the second ceramic sheet 102 . A sintered second internal electrode 113 is formed. No internal electrodes are formed on the third ceramic sheet 103 corresponding to the cover portion 19 .

The internal electrodes 112, 113 can be formed by applying any conductive paste to the ceramic sheets 101, 102. FIG. A method for applying the conductive paste can be arbitrarily selected from known techniques. For example, a screen printing method or a gravure printing method can be used to apply the conductive paste.

In the internal electrodes 112 and 113, gaps in the X-axis direction along the cutting line Ly are formed every other cutting line Ly. The gaps between the first internal electrodes 112 and the gaps between the second internal electrodes 113 are alternately arranged in the X-axis direction. That is, the cutting lines Ly passing through the gaps between the first internal electrodes 112 and the cutting lines Ly passing through the gaps between the second internal electrodes 113 are arranged alternately.

(Step S02: Lamination)
In step S02, ceramic sheets 101, 102, and 103 prepared in step S01 are laminated as shown in FIG. In the laminated sheet 104, the first ceramic sheets 101 and the second ceramic sheets 102 corresponding to the capacitance forming portion 18 are alternately laminated in the Z-axis direction.

In the laminated sheet 104, the third ceramic sheet 103 corresponding to the cover portion 19 is laminated on the upper and lower surfaces of the alternately laminated ceramic sheets 101 and 102 in the Z-axis direction. Although three third ceramic sheets 103 are laminated in the example shown in FIG. 6, the number of third ceramic sheets 103 can be changed as appropriate.

The laminated sheet 104 is integrated by pressing the ceramic sheets 101, 102, 103 together. For pressure bonding of the ceramic sheets 101, 102, 103, it is preferable to use, for example, hydrostatic pressurization or uniaxial pressurization. Thereby, it is possible to increase the density of the laminated sheet 104 .

(Step S03: Disconnect)
In step S03, the laminate sheet 104 obtained in step S02 is cut along cutting lines Lx and Ly to produce an unfired laminate 116. FIG. Laminate 116 corresponds to laminate 16 after firing. For cutting the laminated sheet 104, for example, a press cutting blade or a rotating blade can be used.

7 and 8 are schematic diagrams for explaining an example of step S03. FIG. 7 is a plan view of the laminated sheet 104. FIG. FIG. 8 is a cross-sectional view of the laminated sheet 104 along the YZ plane. The laminated sheet 104 is cut by the press cutting blade BL along the cutting lines Lx and Ly while being held by an adhesive sheet F1 such as a foam release sheet.

First, as shown in FIG. 8A, the press-cutting blade BL is arranged above the laminated sheet 104 in the Z-axis direction, and the tip thereof faces the laminated sheet 104 below in the Z-axis direction. Next, as shown in FIG. 8B, the press-cutting blade BL is moved downward in the Z-axis direction until it reaches the adhesive sheet F1, thereby penetrating the laminated sheet 104. Then, as shown in FIG.

Then, as shown in FIG. 8C, the press cutting blade BL is moved upward in the Z-axis direction to pull out from the laminated sheet 104 . As a result, the laminate sheet 104 is cut in the X-axis and Y-axis directions to form a laminate 116 having a side surface S in which the internal electrodes 112 and 113 are exposed in the Y-axis direction.

(Step S04: Side Margin Formation)
In step S04, unfired side margin portions 117 are provided on both side surfaces S of the laminate 116 obtained in step S03. As a result, as shown in FIG. 9, the unfired ceramic body 111 is obtained in which the side surfaces S where the internal electrodes 112 and 113 are exposed are covered with the side margin portions 117 .

In the method of forming the side margin portions 117 according to the present embodiment, high adhesiveness of the side margin portions 117 to the side surfaces S of the laminate 116 can be obtained. Thereby, high reliability and yield of the multilayer ceramic capacitor 10 can be realized. The details of the method of forming the side margin portions 117 in step S04 will be described later.

(Step S05: Firing)
In step S05, the ceramic body 111 obtained in step S04 and shown in FIG. 9 is fired to produce the ceramic body 11 of the multilayer ceramic capacitor 10 shown in FIGS. In other words, the layered body 116 becomes the layered body 16 and the side margin portion 117 becomes the side margin portion 17 by step S<b>05 .

The sintering temperature in step S<b>05 can be determined based on the sintering temperature of the ceramic body 111 . For example, when a barium titanate (BaTiO ₃ )-based material is used, the firing temperature can be about 1000 to 1300°C. Also, the firing can be performed, for example, in a reducing atmosphere or in a low oxygen partial pressure atmosphere.

(Step S06: External electrode formation)
In step S06, external electrodes 14 and 15 are formed on both ends of the ceramic body 11 obtained in step S05 in the X-axis direction to fabricate the multilayer ceramic capacitor 10 shown in FIGS. A method for forming the external electrodes 14 and 15 in step S06 can be arbitrarily selected from known methods.

By the above, the multilayer ceramic capacitor 10 is completed. In this manufacturing method, since the side margins 117 are formed on the side surfaces S of the laminate 116 where the internal electrodes 112 and 113 are exposed, the Y-axis direction end portions of the plurality of internal electrodes 12 and 13 in the ceramic element body 11 are formed. The positions are aligned within a range of 0.5 μm.

[Method for Forming Side Margin Part 117]
FIG. 10 is a flow chart showing the method of forming the side margin portions 117 according to the present embodiment, which is performed in step S04 described above. 11 to 17 are diagrams for explaining the method of forming the side margin portion 117. FIG. A method for forming the side margin portion 117 will be described below along FIG. 10 with reference to FIGS. 11 to 17 as appropriate.

(Step S41: Change orientation of laminate)
In step S41, the direction of the side surface S of the laminate 116 is changed from the Y-axis direction to the Z-axis direction. This is because, in the state immediately after step S03 shown in FIG. This is because it is difficult to form

A method for changing the direction of the side surface S of the laminate 116 from the Y-axis direction to the Z-axis direction is not limited to a specific configuration, but for example, a plurality of laminates 116 can be collectively rolled in the Y-axis direction. can. As a result, the layered body 116 is rotated by 90°, and the pair of side surfaces S of the layered body 116 face upward and downward in the Z-axis direction, respectively.

In this case, before the laminate 116 is rolled, for example, the laminate 116 is changed from the adhesive sheet F1 to an extensible adhesive sheet F2, and the adhesive sheet F2 is stretched, thereby increasing the thickness of the laminate 116 in the Y-axis direction. It is preferable to widen the interval between This makes it easier to roll the laminate 116 on the adhesive sheet F2.

(Step S42: Ceramic sheet arrangement)
In step S42, the ceramic sheet 117s is arranged on the side surface S of the laminate 116. As shown in FIG. The ceramic sheet 117s is an unfired dielectric green sheet, like the ceramic sheets 101, 102 and 103 prepared in step S01. The ceramic sheet 117s can be formed similarly to the ceramic sheets 101, 102, 103.

FIG. 11 is a diagram showing the process of step S42. In the state immediately after step S41 shown in FIG. The laminated body 116 is held by the adhesive sheet F2 on the first side surface S facing downward in the Z-axis direction.

In step S42, as shown in FIG. 11B, a series of ceramic sheets 117s capable of collectively covering the plurality of laminates 116 are placed on the second side surfaces S of the plurality of laminates 116 facing upward in the Z-axis direction. placed above. That is, the ceramic sheet 117s is arranged so as to face the adhesive sheet F2 with the plurality of laminates 116 interposed therebetween.

(Step S43: thermocompression bonding)
In step S43, the ceramic sheet 117s arranged in step S42 is thermocompression bonded to the side surface S of the laminate . FIG. 12 is a diagram showing the process of step S43. At step S43, the heating and pressurizing member E is used. The heating and pressurizing member E has a plate-like elastic member E1 and a heating plate E2 extending along the X-axis direction.

The elastic member E1 is made of an elastic material. A lower surface in the Z-axis direction of the elastic member E1 is formed as a pressing surface p that has undergone mold release treatment. Examples of the release treatment applied to the pressing surface p include coating treatment of a fluorine-based release agent and a silicon-based release agent. The heating plate E2 is provided on the upper surface of the elastic member E1 in the Z-axis direction, and is configured as a heat-generating component capable of heating the elastic member E1.

In step S43, first, as shown in FIG. 12A, the heating and pressing member E is arranged above the ceramic sheet 117s in the Z-axis direction, and the pressing surface p faces the ceramic sheet 117s. Next, as shown in FIG. 12B, the heating and pressing member E is moved downward in the Z-axis direction so that the pressing surface p contacts the ceramic sheet 117s.

Then, while the heating plate E2 heats the elastic member E1, the pressing surface p of the elastic member E1 presses the ceramic sheet 117s downward in the Z-axis direction. Thereby, the ceramic sheet 117s can be pressed against the side surface S of the laminate 116 while applying heat to the ceramic sheet 117s from the pressing surface p of the elastic member E1.

Therefore, the ceramic sheet 117s, which is softened by the heat applied from the pressing surface p, adheres closely along the side surface S of the laminate 116 without gaps. For example, as shown in FIG. 13A, even if the side surface S of the laminate 116 is a plane inclined with respect to the XY plane or a curved surface with unevenness, the ceramic sheets 117s can be brought into close contact with each other. can be done.

The temperature of the ceramic sheet 117s when pressed by the pressing surface p can be controlled by, for example, the output of the heating plate E2, and is preferably 50° C. or higher and 150° C. or lower. Also, the pressing time of the ceramic sheet 117s by the pressing surface p can be set, for example, within a range of 1 second or more and 10 seconds or less.

Moreover, since the pressing surface p is elastically deformable, the ceramic sheet 117s can be pressed against the side surfaces S of all the laminates 116 more reliably. For example, as shown in FIG. 13B, the ceramic sheet 117s is brought into close contact with the side surfaces S of the multiple laminates 116 even when the heights in the Z-axis direction of the side surfaces S of the multiple laminates 116 vary. be able to.

The elastic member E1 forming the pressing surface p preferably has appropriate hardness and elastic modulus. Specifically, the elastic member E1 preferably has a rubber hardness of A60 to A80 according to JIS K 6253. Such an elastic member E1 can be made of, for example, fluorine-based rubber or silicon-based rubber.

After the thermocompression bonding is completed, as shown in FIG. 12C, the pressing surface p is separated from the ceramic sheet 117s by moving the heating and pressing member E upward in the Z-axis direction. At this time, since the pressing surface p is subjected to the release treatment, it is possible to prevent the ceramic sheet 117s from sticking to the pressing surface p side.

FIG. 14 shows an example in which the ceramic sheet 117s is thermocompression-bonded to the side surface S of the laminate 116 using a heating and pressurizing member Ea having an elastic member E1a instead of the heating and pressurizing member E having the elastic member E1. . In the elastic member E1a of the heating and pressurizing member Ea, the Z-axis direction lower surface q is not subjected to mold release treatment, that is, the pressing surface p to which mold release treatment is applied is not provided.

When the lower surface q of the elastic member E1a is brought into contact with the ceramic sheet 117s and thermocompression bonding is performed, the ceramic sheet 117s is likely to stick to the elastic member E1a. Therefore, when the heating and pressurizing member Ea is moved upward in the Z-axis direction, the ceramic sheet 117s sticks to the lower surface q of the elastic member E1a and separates from the side surface S of the laminate 116 as shown in FIG. be.

For this reason, it is preferable to use a heating and pressing member E having an elastic member E1 provided with a pressing surface p that has undergone a release treatment for thermocompression bonding of the ceramic sheet 117s. By using the release film P that has undergone a release treatment, the ceramic sheet 117s can also be thermocompression bonded with the heating and pressing member E having the elastic member E1a that is not provided with the pressing surface p.

That is, as shown in FIG. 15, a release film P is placed between the lower surface q of the elastic member E1a and the ceramic sheet 117s to prevent direct contact between the lower surface q of the elastic member E1a and the ceramic sheet 117s. In this case, the lower surface in the Z-axis direction of the release film P that has undergone the release treatment serves as the pressing surface p.

15, it is possible to prevent the ceramic sheet 117s from peeling off from the side surface S of the laminate 116 after thermocompression bonding, similarly to the configuration shown in FIG. The release film P can be formed of, for example, a PET film configured to be flexibly deformable together with the lower surface q of the elastic member E1a.

(Step S44: Punching)
In step S44, the side surface S of the laminate 116 is punched out of the ceramic sheet 117s that has been thermocompressed in step S43. FIG. 16 is a diagram showing the process of step S44. In step S44, a plate-like elastic member D that extends along the XY plane is used. The elastic member D preferably has low elasticity, and can be made of, for example, low-elasticity rubber.

In step S44, first, as shown in FIG. 16A, the elastic member D is opposed to the upper side of the ceramic sheet 117s in the Z-axis direction. Next, as shown in FIG. 16B, the elastic member D is moved downward in the Z-axis direction until it contacts the ceramic sheet 117s, and the elastic member D further pushes the ceramic sheet 117s downward in the Z-axis direction.

At this time, the elastic member D bites into the space between the multiple laminates 116, thereby pushing down the area of the ceramic sheet 117s that is not held by the side surfaces S of the laminates 116 in the Z-axis direction. Thereby, the ceramic sheet 117s is cut along the contour of the side surface S of each laminate 116 by the shearing force applied in the Z-axis direction.

Then, as shown in FIG. 16C, by moving the elastic member D upward in the Z-axis direction, the elastic member D is separated from the ceramic sheet 117s. At this time, the ceramic sheets 117 s remaining on the side surfaces S of the laminates 116 become the side margin portions 117 . The ceramic sheets 117s remaining in the spaces between the multiple laminates 116 are removed.

(Step S45: Re-thermal compression bonding)
In step S45, the side margin portion 117 formed on the side surface S of the laminate 116 in step S44 is further thermocompression bonded. FIG. 17 is a diagram showing the process of step S45. In step S45, the same heating and pressurizing member E as in step S43 is used, but a heating and pressurizing member having a different configuration from that in step S43 may be used.

In step S45, first, as shown in FIG. 17A, the heating and pressing member E is arranged above the side margin portion 117 in the Z-axis direction, and the pressing surface p faces the side margin portion 117. As shown in FIG. Next, as shown in FIG. 17B, the heating and pressing member E is moved downward in the Z-axis direction so that the pressing surface p contacts the side margin portion 117 .

Then, while the heating plate E2 heats the elastic member E1, the pressing surface p of the elastic member E1 presses the side margin portion 117 downward in the Z-axis direction. As a result, the side margin portion 117 can be pressed against the side surface S of the laminate 116 while applying heat to the side margin portion 117 from the pressing surface p of the elastic member E1.

The temperature of the side margin portion 117 when pressed by the pressing surface p can be controlled by, for example, the output of the heating plate E2, and is preferably 50° C. or higher and 150° C. or lower. Also, the pressing time of the side margin portion 117 by the pressing surface p can be set, for example, within a range of 1 second or more and 10 seconds or less.

Finally, as shown in FIG. 17C, the pressing surface p of the elastic member E1 is separated from the side margin portion 117 by moving the heating and pressing member E upward in the Z-axis direction. In this way, by thermocompression bonding the cut side margin portions 117 to the side surfaces S of the laminate 116 again, high adhesiveness of the side margin portions 117 can be ensured more reliably.

[Other embodiments]
Although the embodiments of the present invention have been described above, it is needless to say that the present invention is not limited to the above-described embodiments and can be modified in various ways.

For example, in the above embodiment, the manufacturing method of the multilayer ceramic capacitor 10 was described as an example of multilayer ceramic electronic components, but the manufacturing method of the present invention can be applied to multilayer ceramic electronic components in general. Examples of such multilayer ceramic electronic components include chip varistors, chip thermistors, and multilayer inductors.

DESCRIPTION OF SYMBOLS 10... Laminated ceramic capacitor 11... Ceramic element body 12, 13... Internal electrodes 14, 15... External electrode 16... Laminated body 17... Side margin part 18... Capacitance formation part 19... Cover part 101, 102, 103... Ceramic sheet 104... Laminated sheet 111 Ceramic element body 112, 113 Internal electrode 116 Laminated body 117 Side margin portion 117s Ceramic sheet S Side faces F1, F2 Adhesive sheets E, Ea Heating and pressing members E1, E1a Elastic member E2 ...heating plate p...pressing surface P...releasing film D...elastic member

Claims (6)

a plurality of ceramic layers stacked in a first axial direction; a plurality of internal electrodes positioned between the plurality of ceramic layers; and a plurality of internal electrodes facing in a second axial direction orthogonal to the first axis. Prepare a plurality of unfired laminates arranged on an adhesive sheet holding the first side and having first and second sides exposed,
placing a series of ceramic sheets on the second side of the plurality of laminations;
Bringing the elastically deformable first pressing surface that has been subjected to a release treatment into contact with the ceramic sheet,
thermocompression bonding the ceramic sheet to the second side surface of the plurality of laminates by pressing the ceramic sheet with an elastic member having the first pressing surface ;
contacting the thermocompression-bonded ceramic sheet with a second pressing surface different from the first pressing surface, punching the ceramic sheet at the second side surfaces of the plurality of laminates;
The rubber hardness of the elastic member conforming to JIS K 6253 is A60 to A80.
A method for manufacturing a multilayer ceramic electronic component. a plurality of ceramic layers stacked in a first axial direction; a plurality of internal electrodes positioned between the plurality of ceramic layers; and a plurality of internal electrodes facing in a second axial direction orthogonal to the first axis. Prepare a plurality of unfired laminates arranged on an adhesive sheet holding the first side and having first and second sides exposed,
placing a series of ceramic sheets on the second side of the plurality of laminations;
The first pressure surface that is elastically deformable and has been subjected to a release treatment is brought into contact with the ceramic sheet, and the ceramic sheet is pressed through the release film having the first pressure surface with an elastic member. thermocompression bonding a ceramic sheet to the second side surfaces of the plurality of laminates;
contacting the thermocompression-bonded ceramic sheet with a second pressing surface different from the first pressing surface, punching the ceramic sheet at the second side surfaces of the plurality of laminates;
The rubber hardness of the elastic member conforming to JIS K 6253 is A60 to A80.
A method for manufacturing a multilayer ceramic electronic component. A method for manufacturing a multilayer ceramic electronic component according to claim 2 ,
The method for producing a laminated ceramic electronic component, wherein the release film is a PET film. A method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 3 ,
The method for manufacturing a laminated ceramic electronic component, wherein the elastic member is made of fluorine-based rubber or silicon-based rubber. The multilayer ceramic electronic component according to any one of claims 1 to 4 ,
A method of manufacturing a laminated ceramic electronic component, further comprising: thermocompression bonding the punched ceramic sheet to the second side surfaces of the plurality of laminates. The multilayer ceramic electronic component according to any one of claims 1 to 5,
The temperature of the ceramic sheet when pressed by the first pressing surface is 50° C. or higher and 150° C. or lower.
A method for manufacturing a multilayer ceramic electronic component.

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