JP2023000001A - Manufacturing method of multilayer ceramic electronic component - Google Patents

Abstract

To provide a technique for improving adhesiveness of a side margin part to a side face of a laminate.SOLUTION: A manufacturing method of a multilayer ceramic electronic component includes preparing: a laminate comprising a plurality of ceramic layers laminated in a uniaxial direction, a plurality of internal electrodes positioned between the plurality of ceramic layers, and a side face where the plurality of internal electrodes is exposed; and a side margin sheet. A hydrophilic face is formed by applying hydrophilicity to at least one of the side face and the side margin sheet through discharge processing. The side face and the side margin sheet are adhered using the hydrophilic face as an adhesive face. In such a configuration, the hydrophilic face is provided as the adhesive face between the side face of the laminate and the side margin sheet, thereby obtaining high adhesiveness between the side face of the laminate and the side margin sheet.SELECTED DRAWING: Figure 12

Description

TECHNICAL FIELD The present invention relates to a method of manufacturing a laminated ceramic electronic component to which a side margin portion is retrofitted.

There is known a technique of retrofitting side margin portions in the manufacturing process of a multilayer ceramic capacitor (see, for example, Patent Document 1). This technique is advantageous in reducing the size and increasing the capacity of the multilayer ceramic capacitor, since the thin side margins can reliably protect the side surfaces of the multilayer body where the internal electrodes are exposed.

As an example, in the method for manufacturing a multilayer ceramic capacitor described in Patent Document 1, a multilayer sheet obtained by laminating ceramic sheets having internal electrodes printed thereon is cut to form a plurality of multilayer bodies having the cut surfaces on which the internal electrodes are exposed as side surfaces. make. Then, side margin portions are formed on both side surfaces of the laminate by punching the ceramic sheets on the side surfaces of the laminate.

JP 2012-209539 A

In the method described in Patent Document 1, the ceramic sheet is punched while being heated on the side surface of the laminate in order to enhance the adhesion of the side margins to the side surface of the laminate. However, even with such a method, the adhesiveness of the side margins is still insufficient, and the side margins may peel off from the side surfaces of the laminate in subsequent steps.

In view of the circumstances as described above, an object of the present invention is to provide a technique for improving the adhesiveness of the side margins to the side surfaces of the laminate.

To achieve the above object, in a method for manufacturing a multilayer ceramic electronic component according to one aspect of the present invention, a plurality of uniaxially laminated ceramic layers and a plurality of internal electrodes positioned between the plurality of ceramic layers are provided. , a side surface where the plurality of internal electrodes are exposed, and a side margin sheet are prepared.
A hydrophilic surface is formed by imparting hydrophilicity to at least one of the side surface and the side margin sheet by a discharge treatment.
The side surface and the side margin sheet are adhered using the hydrophilic surface as an adhesive surface.
In this configuration, by providing a hydrophilic surface as an adhesion surface between the side surface of the laminate and the side margin sheet, high adhesiveness between the side surface of the laminate and the side margin sheet can be obtained.

In the manufacturing method described above, the side surfaces and the side margin sheets may be bonded via an adhesive material having a liquid component larger than that of the plurality of ceramic layers and the side margin sheets.
In this case, it is preferable to form the hydrophilic surface on both the side surface and the side margin sheet.
Moreover, it is preferable that the adhesive contains 0.1 wt % or more of water.

In the above manufacturing method, the side surface and the side margin sheet may be directly adhered.
In this case, the hydrophilic surface may be provided on the side surface, and the hydrophilic surface may not be provided on the side margin sheet.
Further, it is preferable that the amount of the liquid component in the side margin sheets is larger than that in the ceramic sheets.
Furthermore, it is preferable that the side margin sheet contains 0.05 wt % or more of moisture.

As described above, according to the present invention, it is possible to provide a technique for improving the adhesiveness of the side margins to the side surfaces of the laminate.

1 is a perspective view of a laminated ceramic capacitor according to one embodiment of the present invention; FIG. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line AA' in FIG. 1; 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line BB' of FIG. 1; FIG. 4 is a flow chart showing a method for manufacturing the laminated ceramic capacitor. FIG. 4 is a plan view of a ceramic sheet prepared in step S01 of the manufacturing method; It is a perspective view which shows step S02 of the said manufacturing method. It is a top view which shows step S03 of the said manufacturing method. It is a fragmentary sectional view which shows said step S03. It is sectional drawing which shows step S04 of the said manufacturing method. It is a sectional view showing Step S05 of the above-mentioned manufacturing method. It is sectional drawing which shows said step S05. It is sectional drawing which shows step S06 of the said manufacturing method. It is sectional drawing which shows step S07 of the said manufacturing method. It is sectional drawing which shows said step S07. FIG. 4 is a perspective view of an unfired ceramic body obtained in step S07; It is a sectional view showing other forms of the above-mentioned step S05.

A multilayer ceramic capacitor 10 according to an embodiment of the present invention will be described below with reference to the drawings. In the drawings, X-axis, Y-axis, and Z-axis that are orthogonal to each other are shown as appropriate. The X-axis, Y-axis, and Z-axis define a fixed coordinate system fixed with respect to the multilayer ceramic capacitor 10 .

The drawings also show, where appropriate, mutually orthogonal x-, y-, and z-axes. The x-axis, y-axis, and z-axis define a real space coordinate system that is fixed with respect to the real space, unlike the X-axis, Y-axis, and Z-axis described above. The x- and y-axes extend horizontally, ie the xy plane is horizontal. The z-axis extends vertically up and down.

[Structure of Multilayer Ceramic Capacitor 10]
1 to 3 are diagrams showing a multilayer ceramic capacitor 10 according to one embodiment of the present invention. FIG. 1 is a perspective view of a laminated ceramic capacitor 10. FIG. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line AA' in FIG. FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line BB' of FIG.

A laminated ceramic capacitor 10 includes a ceramic element body 11 , a first external electrode 14 and a second external electrode 15 . The ceramic body 11 is a hexahedron having first and second end surfaces orthogonal to the X axis, first and second side surfaces orthogonal to the Y axis, and first and second main surfaces orthogonal to the Z axis. configured as

All of the first and second end faces, the first and second side faces, and the first and second principal faces of the ceramic body 11 are configured as flat faces. The flat surface according to the present embodiment does not have to be strictly a flat surface as long as it is recognized as flat when viewed as a whole. It also includes surfaces that have a gently curved shape, etc.

The external electrodes 14 and 15 cover both end surfaces of the ceramic body 11 and face each other in the X-axis direction with the ceramic body 11 interposed therebetween. The external electrodes 14 and 15 extend from each end surface of the ceramic body 11 to the main surface and side surfaces. As a result, the external electrodes 14 and 15 have a U-shaped cross section parallel to the XZ plane and a cross section parallel to the XY plane.

The shape of the external electrodes 14 and 15 is not limited to that shown in FIG. For example, the external electrodes 14 and 15 may extend from both end surfaces of the ceramic body 11 to only one main surface and have an L-shaped cross section parallel to the XZ plane. Also, the external electrodes 14 and 15 do not have to extend to any of the main surfaces and side surfaces.

The external electrodes 14 and 15 are made of a good electrical conductor. Good electrical conductors forming the external electrodes 14 and 15 include, for example, copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), and gold (Au). and the like as a main component. In addition, in this embodiment, the main component shall mean the component with the highest content ratio.

The ceramic body 11 is made of dielectric ceramics and has a laminate 16 and first and second side margin portions 17a and 17b. The laminate 16 has first and second side surfaces S1 and S2 facing each other in the Y-axis direction, first and second end faces facing each other in the X-axis direction, and first and second main surfaces facing each other in the Z-axis direction. , has

The laminate 16 has a structure in which a plurality of flat ceramic layers extending along the XY plane are laminated in the Z-axis direction. The laminate 16 has a capacitance forming portion 18 and a cover portion 19 . The cover portion 19 covers the capacitance forming portion 18 from above and below in the Z-axis direction, and constitutes first and second main surfaces of the laminate 16 .

The capacitance forming portion 18 has a plurality of sheet-like first and second internal electrodes 12 and 13 arranged between a plurality of ceramic layers and extending along the XY plane. The internal electrodes 12 and 13 are alternately arranged along the Z-axis direction. That is, the internal electrodes 12 and 13 face each other in the Z-axis direction with the ceramic layer interposed therebetween.

The first internal electrode 12 is drawn out to the end face covered with the first external electrode 14 . On the other hand, the second internal electrode 13 is drawn out to the end surface covered with the second external electrode 15 . Thereby, the first internal electrode 12 is connected only to the first external electrode 14 and the second internal electrode 13 is connected only to the second external electrode 15 .

The internal electrodes 12 and 13 are formed over the entire width of the capacitance forming portion 18 in the Y-axis direction and exposed to both side surfaces S1 and S2 of the laminate 16, respectively. That is, in the ceramic body 11, both ends of the internal electrodes 12 and 13 in the Y-axis direction are aligned on both side surfaces S1 and S2 of the laminate 16 along the Z-axis direction.

In the ceramic body 11 , the first side margin portion 17 a covers the first side surface S<b>1 of the laminate 16 and the second side margin portion 17 b covers the second side surface S<b>2 of the laminate 16 . Thereby, in the ceramic body 11, insulation between the internal electrodes 12 and 13 on both side surfaces S1 and S2 of the laminate 16 can be ensured.

With such a configuration, in the multilayer ceramic capacitor 10, when a voltage is applied between the first external electrode 14 and the second external electrode 15, the plurality of voltages between the first internal electrode 12 and the second internal electrode 13 A voltage is applied to the ceramic layer of As a result, in the multilayer ceramic capacitor 10 , electric charges corresponding to the voltage between the first external electrode 14 and the second external electrode 15 are stored.

In the ceramic body 11, dielectric ceramics with a high dielectric constant are used in order to increase the capacitance of each ceramic layer between the internal electrodes 12,13. Dielectric ceramics with a high dielectric constant include, for example, perovskite structure materials containing barium (Ba) and titanium (Ti), represented by barium titanate (BaTiO ₃ ).

The ceramic layer includes strontium titanate (SrTiO ₃ ), calcium titanate (CaTiO ₃ ), magnesium titanate (MgTiO ₃ ), calcium zirconate (CaZrO ₃ ), calcium zirconate titanate (Ca(Zr,Ti) O ₃ ), barium zirconate (BaZrO ₃ ), and titanium oxide (TiO ₂ ).

The internal electrodes 12 and 13 are made of a good electrical conductor. Nickel (Ni) is typically used as a good electrical conductor forming the internal electrodes 12 and 13. In addition, copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), A metal or alloy containing gold (Au) or the like as a main component can be used.

[Manufacturing Method of Multilayer Ceramic Capacitor 10]
FIG. 4 is a flow chart showing the manufacturing method of the multilayer ceramic capacitor 10 according to this embodiment. 5 to 15 are diagrams showing the manufacturing process of the multilayer ceramic capacitor 10. FIG. Hereinafter, a method for manufacturing the laminated ceramic capacitor 10 will be described along FIG. 4 with reference to FIGS. 5 to 15 as appropriate.

(Step S01: Ceramic sheet preparation)
In step S01, the first ceramic sheet 101 and the second ceramic sheet 102 for forming the capacitance forming portion 18, and the third ceramic sheet 103 for forming the cover portion 19 are prepared. The ceramic sheets 101, 102, 103 are configured as unfired dielectric green sheets containing dielectric ceramics as a main component.

The ceramic sheets 101, 102, 103 are formed into sheets using, for example, a roll coater or a doctor blade. The thicknesses of the ceramic sheets 101 and 102 are adjusted according to the thickness of the ceramic layers in the capacitor forming portion 18 after firing. The thickness of the third ceramic sheet 103 can be adjusted appropriately.

FIG. 5 is a plan view of the ceramic sheets 101, 102, 103. FIG. At this stage, the ceramic sheets 101, 102, 103 are constructed as large sheets that are not singulated. FIG. 5 shows cutting lines Lx and Ly used when singulating each laminated ceramic capacitor 10 . The cutting line Lx is parallel to the X-axis, and the cutting line Ly is parallel to the Y-axis.

As shown in FIG. 5, unfired first internal electrodes 112 corresponding to the first internal electrodes 12 are formed on the first ceramic sheet 101 , and unfired first internal electrodes 112 corresponding to the second internal electrodes 13 are formed on the second ceramic sheet 102 . A fired second internal electrode 113 is formed. No internal electrodes are formed on the third ceramic sheet 103 corresponding to the cover portion 19 .

The internal electrodes 112, 113 can be formed by applying any conductive paste to the ceramic sheets 101, 102. FIG. A method for applying the conductive paste can be arbitrarily selected from known techniques. For example, a screen printing method or a gravure printing method can be used to apply the conductive paste.

In the internal electrodes 112 and 113, gaps in the X-axis direction along the cutting line Ly are formed every other cutting line Ly. The gaps between the first internal electrodes 112 and the gaps between the second internal electrodes 113 are alternately arranged in the X-axis direction. That is, the cutting lines Ly passing through the gaps between the first internal electrodes 112 and the cutting lines Ly passing through the gaps between the second internal electrodes 113 are arranged alternately.

(Step S02: Lamination)
In step S02, ceramic sheets 101, 102, and 103 prepared in step S01 are laminated as shown in FIG. In the laminated sheet 104, the first ceramic sheets 101 and the second ceramic sheets 102 corresponding to the capacitance forming portion 18 are alternately laminated in the Z-axis direction.

In the laminated sheet 104, the third ceramic sheet 103 corresponding to the cover portion 19 is laminated on the upper and lower surfaces of the alternately laminated ceramic sheets 101 and 102 in the Z-axis direction. Although three third ceramic sheets 103 are laminated in the example shown in FIG. 6, the number of third ceramic sheets 103 can be changed as appropriate.

The laminated sheet 104 is integrated by pressing the ceramic sheets 101, 102, 103 together. For pressure bonding of the ceramic sheets 101, 102, 103, it is preferable to use, for example, hydrostatic pressurization or uniaxial pressurization. Thereby, it is possible to increase the density of the laminated sheet 104 .

(Step S03: Disconnect)
In step S03, the laminate sheet 104 obtained in step S02 is cut along cutting lines Lx and Ly to produce an unfired laminate 116. FIG. Laminate 116 corresponds to laminate 16 after firing. For cutting the laminated sheet 104, for example, a press cutting blade or a rotating blade can be used.

7 and 8 are schematic diagrams for explaining an example of step S03. FIG. 7 is a plan view of the laminated sheet 104. FIG. FIG. 8 is a cross-sectional view of the laminated sheet 104 along the YZ plane. The laminated sheet 104 is cut by the press cutting blade BL along the cutting lines Lx and Ly while being held by an adhesive cut sheet C such as a foam release sheet.

First, as shown in FIG. 8A, the press-cutting blade BL is arranged above the laminated sheet 104 in the Z-axis direction, and the tip thereof faces the laminated sheet 104 below in the Z-axis direction. Next, as shown in FIG. 8B, the press cutting blade BL is moved downward in the Z-axis direction until it reaches the cut sheet C, and penetrates the laminated sheet 104 .

Then, as shown in FIG. 8C, the press cutting blade BL is moved upward in the Z-axis direction to pull out from the laminated sheet 104 . As a result, the laminate sheet 104 is cut in the X-axis and Y-axis directions to form a laminate 116 having first and second side surfaces S1 and S2 from which the internal electrodes 112 and 113 are exposed in the Y-axis direction.

(Step S04: discharge process 1)
In this embodiment, discharge treatment is performed as a pretreatment for forming the side margin portions 117a and 117b. A discharge device P that generates a discharge with a high voltage is used for the discharge treatment. The discharge treatment is intended to impart hydrophilicity to the surface to be treated, and examples thereof include nitrogen plasma treatment, argon plasma treatment, oxygen plasma treatment, corona discharge treatment, and the like.

In step S04, a discharge process is performed to form the first side margin portion 117a satisfactorily. Specifically, the first side surfaces S1 of the multiple laminates 116 and one surface of the first side margin sheet 117s1 are subjected to the discharge treatment. The first side margin sheet 117s1 is an insulating ceramic sheet prepared for forming the first side margin portion 117a.

Like the ceramic sheets 101, 102, and 103, the first side margin sheet 117s1 is configured as an unfired dielectric green sheet containing dielectric ceramics as a main component. The first side margin sheet 117s1 is formed into a sheet shape using, for example, a roll coater or a doctor blade.

In step S<b>04 , the orientation of the plurality of laminates 116 after step S<b>03 is changed so that the first side faces S<b>1 of the plurality of laminates 116 are collectively subjected to the discharge treatment. That is, the plurality of laminates 116 immediately after step S03 shown in FIG. 8C are changed from a state in which the side surfaces S1 and S2 are close to each other in the Y-axis direction to a state in which the side surfaces S1 and S2 face up and down in the vertical direction. .

As a method for changing the directions of the side surfaces S1 and S2 of the plurality of laminates 116, for example, a known method such as a rolling method can be used. In the rolling method, first, the laminate 116 is changed from the cut sheet C to the stretchable first adhesive sheet F1, and the first adhesive sheet F1 is stretched to widen the gap between the laminates 116 .

Then, the plurality of laminates 116 are rolled on the first adhesive sheet F1. At this time, all the laminates 116 can be rolled collectively by using, for example, a rolling disc. As a result, the laminate 116 is rotated by 90°, and the side surfaces S1 and S2 can be oriented upward and downward in the z-axis direction, respectively, as shown in FIG. 9A.

That is, in each of the plurality of stacked bodies 116 after rolling, the second side surface S2 facing downward in the z-axis direction is held by the first adhesive sheet F1, and the first side surface S1 faces upward in the z-axis direction. This makes it possible to collectively perform the discharge treatment on the first side surfaces S1 of all the laminates 116 facing upward in the z-axis direction.

In the discharge treatment in step S04, as shown in FIG. 9A, discharge irradiation is performed by a discharge device P facing the first side surfaces S1 of the multiple laminates 116. As shown in FIG. Hydrophilicity is imparted to the first side surfaces S1 of the plurality of laminates 116 that have been irradiated with discharge as the number of hydrophilic groups increases. As a result, the first side surfaces S1 of the plurality of laminates 116 become hydrophilic surfaces T. As shown in FIG.

Similarly, as shown in FIG. 9B, discharge irradiation is performed by a discharge device P facing the first side margin sheet 117s1. Hydrophilicity is imparted to the irradiated surface of the first side margin sheet 117s1 that has been irradiated with discharge as the number of hydrophilic groups increases. As a result, one surface of the first side margin sheet 117s1 becomes a hydrophilic surface T. As shown in FIG.

In this embodiment, the hydrophilicity of the target surface before and after the discharge treatment is determined from the wettability of water, and specifically, the contact angle of the dropped water with respect to the surface is evaluated. That is, in the present embodiment, the contact angle of water on the hydrophilic surface T that has been subjected to the discharge treatment is smaller than the contact angle of water on the surface before the discharge treatment.

(Step S05: Side Margin Formation 1)
In step S05, the laminate 116 is provided with the unfired first side margin portions 117a. The first side margin portion 117a is formed by punching out the first side margin sheet 117s1 at the first side surface S1 of each laminate 116. As shown in FIG. In step S05, an adhesive D is used to enhance the adhesiveness between each laminate 116 and the first side margin portion 117a.

In the adhesive D used in step S05, the amount of the liquid component such as the binder and the solvent causes the ceramic sheets 101, 102, and 103 forming the plurality of ceramic layers of the laminate 116 and the first side margin portion 117a to form the first side margin portion 117a. More than one side margin sheet 117s1. Thereby, high wettability with respect to the hydrophilic surface T can be obtained in the adhesive D. FIG.

In the adhesive D used in step S05, from the viewpoint of obtaining higher wettability with respect to the hydrophilic surface T, it is preferable that the amount of the liquid component such as the binder and the solvent is 1.0 wt % or more. Moreover, in order to obtain a higher wettability with respect to the hydrophilic surface T, the adhesive D further preferably contains 0.1 wt % or more of water as a liquid component.

As shown in FIG. 10, the adhesive D is placed on the first side S1 of each laminate 116. As shown in FIG. For arranging the adhesive D on the first side surface S1 of each laminate 116, for example, a dispenser capable of discharging a certain amount of the adhesive D can be used. Alternatively, the adhesive D may be applied to the first side surface S1 of each laminate 116 using any application device.

Next, the first side margin sheets 117s1 are punched out from the first side surfaces S1 of the multiple laminates 116 on which the adhesive D is arranged. First, as shown in FIG. 11A, the hydrophilic surface T of the first side margin sheet 117s1 is made to face upward in the z-axis direction of the first side surfaces S1 of the plurality of laminates 116 on which the adhesive D is arranged. .

Then, as shown in FIG. 11(B), with the holding member H holding the lower surface of the first adhesive sheet F1 in the z-axis direction, the first side margin sheet 117s1 is held by the elastic member E disposed above in the z-axis direction. toward the holding member H and pushed downward in the z-axis direction. As a result, the elastic member E bites into the space between the multiple laminates 116 .

At this time, the elastic member E presses the first side margin sheet 117s1 against the first side surfaces S1 of the multiple laminates 116 with the adhesive D therebetween. As a result, the adhesive D having a large amount of liquid component is wetted and spread on both the hydrophilic surfaces T of the first side margin sheets 116 and the hydrophilic surfaces T of the first side margin sheets 117s1.

At the same time, the first side margin sheet 117s1 is pushed downward in the z-axis direction by the elastic member E around the first side surface S1 of the laminate 116. As shown in FIG. As a result, the first side margin sheet 117s1 is cut along the contour of the first side surface S1 of each laminate 116 by a shearing force applied in the z-axis direction to separate into pieces.

The separated first side margin sheet 117s1 remains on the first side surface S1 of each laminate 116 and becomes the first side margin portion 117a. In the laminates 116 and the first side margin portions 117a bonded via the adhesive D in this way, high adhesiveness can be obtained due to the action of the adhesive D that adheres tightly to the hydrophilic surfaces T of both sides without gaps. be done.

Then, as shown in FIG. 11C, by moving the elastic member E upward in the z-axis direction, the elastic member E is separated from the first side margin sheet 117s1. The first side margin sheet 117s1 remaining in the spaces between the plurality of laminates 116 having the first side margin portions 117a is removed.

(Step S06: discharge process 2)
In step S06, a discharge process is performed to form the second side margin portion 117b satisfactorily. Specifically, the second side surfaces S2 of the plurality of laminates 116 and one surface of the second side margin sheet 117s2 are subjected to discharge treatment. The second side margin sheet 117s2 is an insulating ceramic sheet prepared for forming the second side margin portion 117b.

Like the first side margin sheet 117s1, the second side margin sheet 117s2 is configured as an unfired dielectric green sheet containing dielectric ceramics as a main component. The second side margin sheet 117s2 may have the same configuration as the first side margin sheet 117s1 or may have a different configuration.

In step S06, the plurality of laminates 116 on which the first side margin portions 117a are formed in step S05 are transferred from the first adhesive sheet F1 to the second adhesive sheet F2. Specifically, after step S<b>05 , first, the second adhesive sheet F<b>2 is attached to the first side margin portions 117 a formed on the first side surfaces S<b>1 of the plurality of laminates 116 .

Next, the plurality of laminates 116 formed with the first side margin portions 117a sandwiched between the first and second adhesive sheets F1 and F2 are turned upside down in the z-axis direction. Then, the first adhesive sheet F1 is peeled off from the second side surfaces S2 of the multiple laminates 116 . As a result, the second side surface S2 of each of the plurality of laminates 116 faces upward in the z-axis direction (see FIG. 12A).

In the discharge treatment in step S06, as shown in FIG. 12A, discharge irradiation is performed by a discharge device P facing the second side surfaces S2 of the plurality of laminates 116. As shown in FIG. Hydrophilicity is imparted to the second side surfaces S2 of the plurality of laminates 116 that have been irradiated with the discharge as the number of hydrophilic groups increases. As a result, the second side surfaces S2 of the plurality of laminates 116 become hydrophilic surfaces T. As shown in FIG.

Similarly, as shown in FIG. 12B, discharge irradiation is performed by a discharge device P facing the second side margin sheet 117s2. Hydrophilicity is imparted to the irradiated surface of the second side margin sheet 117s2 that has been irradiated with the discharge as the number of hydrophilic groups increases. As a result, one surface of the second side margin sheet 117s2 becomes a hydrophilic surface T. As shown in FIG.

(Step S07: Side Margin Formation 2)
In step S<b>07 , unfired second side margin portions 117 b are provided on the laminate 116 . The second side margin portion 117b is formed by punching out the second side margin sheet 117s2 at the second side surface S2 of each laminate 116. As shown in FIG. In step S07, an adhesive D is used to enhance the adhesiveness between each laminate 116 and the second side margin portion 117b.

As shown in FIG. 13, the adhesive D is placed on the second side S2 of each laminate 116. As shown in FIG. The placement of the adhesive D in step S07 can be performed using a dispenser or the like as in step S05. The composition of the adhesive D used in step S07 may be the same as in step S05 or different from that in step S05.

In the adhesive D used in step S07, the amount of the liquid component such as the binder and the solvent increases the amount of the ceramic sheets 101, 102, and 103 forming the plurality of ceramic layers of the laminate 116 and the second side margin portion 117b forming the second side margin portion 117b. More than 2 side margin sheets 117s2. Thereby, high wettability with respect to the hydrophilic surface T can be obtained in the adhesive D. FIG.

In the adhesive D used in step S07, from the viewpoint of obtaining higher wettability with respect to the hydrophilic surface T, it is preferable that the amount of the liquid component such as the binder and the solvent is 1.0 wt % or more. Moreover, from the viewpoint of obtaining higher wettability with respect to the hydrophilic surface T, the adhesive D further preferably contains 0.1 wt % or more of water as a liquid component.

Next, the second side margin sheets 117s2 are punched out from the second side surfaces S2 of the plurality of laminates 116 on which the adhesive D is arranged. First, as shown in FIG. 14A, the hydrophilic surface T of the second side margin sheet 117s2 is made to face upward in the z-axis direction of the second side surfaces S2 of the plurality of laminates 116 on which the adhesive D is arranged. .

Then, as shown in FIG. 14(B), while the lower surface of the second adhesive sheet F2 in the z-axis direction is held by the holding member H, the second side margin sheet 117s2 is held by the elastic member E arranged above in the z-axis direction. toward the holding member H and pushed downward in the z-axis direction. As a result, the elastic member E bites into the space between the multiple laminates 116 .

At this time, the second side margin sheet 117s2 is pressed against the second side surfaces S2 of the plurality of laminates 116 by the elastic member E with the adhesive D therebetween. As a result, the adhesive D with a large amount of liquid component is wetted and spread on both the second side surfaces S2, which are the hydrophilic surfaces T of the plurality of laminates 116, and the hydrophilic surfaces T of the second side margin sheets 117s2.

At the same time, the second side margin sheet 117 s 2 is pushed downward in the z-axis direction by the elastic member E around the second side surface S 2 of the laminate 116 . As a result, the second side margin sheet 117s2 is cut along the contour of the second side surface S2 of each laminate 116 by a shearing force applied in the z-axis direction and separated into pieces.

The separated second side margin sheet 117s2 remains on the second side surface S2 of each laminate 116 and becomes the second side margin portion 117b. In each laminate 116 and the second side margin portion 117b that are adhered via the adhesive D in this way, high adhesiveness can be obtained by the action of the adhesive D that adheres to the hydrophilic surfaces T of both without gaps. be done.

Then, as shown in FIG. 14C, by moving the elastic member E upward in the z-axis direction, the elastic member E is separated from the second side margin sheet 117s2. The second side margin sheet 117s2 remaining in the spaces between the plurality of laminates 116 having the second side margin portions 117b is removed.

As a result, the unfired ceramic body 111 shown in FIG. 15 is obtained. In the ceramic body 111, the side margin portions 117a and 117b are highly adhesive to the side surfaces S1 and S2 of the laminate 116, so that the side margin portions 117a and 117b are less likely to separate from the side surfaces S1 and S2 of the laminate 116. .

(Step S08: Firing)
In step S08, ceramic element body 11 of multilayer ceramic capacitor 10 shown in FIGS. 1 to 3 is produced by firing ceramic element body 111 shown in FIG. 15 obtained in step S07. That is, by step S08, the laminate 116 becomes the laminate 16, and the side margin portions 117a and 117b become the side margin portions 17a and 17b.

The sintering temperature in step S<b>08 can be determined based on the sintering temperature of the ceramic body 111 . For example, when a barium titanate (BaTiO ₃ )-based material is used, the firing temperature can be about 1000 to 1300°C. Also, the firing can be performed, for example, in a reducing atmosphere or in a low oxygen partial pressure atmosphere.

(Step S09: External electrode formation)
In step S09, external electrodes 14 and 15 are formed on both ends of the ceramic body 11 obtained in step S08 in the X-axis direction to fabricate the multilayer ceramic capacitor 10 shown in FIGS. A method for forming the external electrodes 14 and 15 in step S06 can be arbitrarily selected from known methods.

By the above, the multilayer ceramic capacitor 10 is completed. In this manufacturing method, the side margin portions 117a and 117b are formed on the side surfaces S1 and S2 of the laminate 116 where the internal electrodes 112 and 113 are exposed. are aligned within a range of 0.5 μm.

[Other embodiments]
Although the embodiments of the present invention have been described above, it is needless to say that the present invention is not limited to the above-described embodiments and can be modified in various ways.

For example, the discharge treatment in steps S04 and S06 is preferably applied to both the plurality of laminates 116 and the side margin sheets 117s1 and 117s2, but may be applied to only one of them. Also, the discharge treatments in steps S04 and S06 may include discharge irradiation two or more times, and may include different types of discharge treatments.

Also, in steps S05 and S07, the adhesive D may be provided on the side margin sheets 117s1 and 117s2 instead of the side surfaces S1 and S2 of the multiple laminates . In this case, the adhesive D may be applied to the entire surface of the side margin sheets 117 s 1 and 117 s 2 , or the adhesive D may be placed only at positions facing the plurality of laminates 116 .

Furthermore, steps S05 and S07 are not limited to the configuration in which the side margin sheets 117s1 and 117s2 are punched at the side surfaces S1 and S2 of the multiple laminates . For example, the side margin portions 117 a and 117 b obtained by cutting the side margin sheets 117 s 1 and 117 s 2 into pieces in advance may be attached to the side surfaces S 1 and S 2 of the plurality of laminates 116 .

In addition, in steps S05 and S07, adhesive D may not be used, that is, side margin portions 117a and 117b may be directly adhered to side surfaces S1 and S2 of multiple laminates . Also in this case, the side surfaces S1 and S2 of the plurality of laminates 116 and the side margin portions 117a and 117b are brought into close contact with each other due to the action of the hydrophilic surface T. FIG.

FIG. 16 shows a configuration in which the first side margin portions 117a are directly adhered to the first side surfaces S1 of the multiple laminates 116 in step S05. In this configuration, the first side margin sheets 117s1 are punched out from the first side surfaces S1 of the multiple laminates 116, so that the first side margin portions 117a are directly formed on the first side surfaces S1 of the respective laminates .

In this case, as shown in FIG. 16, only the first side surfaces S1 of the multiple laminates 116 are provided with the hydrophilic surfaces T, and the first side margin sheets 117s1 are not provided with the hydrophilic surfaces T. In this configuration, it is preferable that the amount of the liquid component in the first side margin sheet 117s1 is larger than that in the plurality of ceramic layers forming the laminate .

Thereby, high wettability with respect to the hydrophilic surface T is obtained in the first side margin sheet 117s1. Therefore, since the first side margin sheet 117s1 wets and spreads without gaps on the first side surfaces S1, which are the hydrophilic surfaces T of the plurality of laminates 116, the first side margin portions 117a are highly adhered to the first side surfaces S1 of the laminates 116. You get sex.

Similarly, in step S07, only the second side surfaces S2 of the multiple laminates 116 are provided with hydrophilic surfaces T, and the amount of the liquid component in the second side margin sheets 117s2 is greater than that of the multiple ceramic layers constituting the laminate 116. By increasing the amount, high adhesiveness of the second side margin portion 117b to the second side surface S2 of the laminate 116 can be obtained.

In the above configuration, in the side margin sheets 117s1 and 117s2, from the viewpoint of obtaining higher wettability with respect to the hydrophilic surface T, the amount of the liquid component such as the binder and solvent is preferably 1.0 wt % or more. Further, the side margin sheets 117s1 and 117s2 more preferably contain 0.05 wt % or more of water as a liquid component in order to obtain even higher wettability with respect to the hydrophilic surface T.

In the above embodiment, the manufacturing method of the multilayer ceramic capacitor 10 is explained as an example of the multilayer ceramic electronic component, but the manufacturing method of the present invention can be applied to multilayer ceramic electronic components in general. Examples of such multilayer ceramic electronic components include chip varistors, chip thermistors, and multilayer inductors.

DESCRIPTION OF SYMBOLS 10... Laminated ceramic capacitor 11... Ceramic element body 12, 13... Internal electrode 14, 15... External electrode 16... Laminated body 17a, 17b... Side margin part 18... Capacitance formation part 19... Cover part 111... Ceramic element body 112, 113 ... Internal electrode 116 ... Laminated body 117a, 117b ... Side margin part 117s1, 117s2 ... Side margin sheet D ... Adhesive material S1, S2 ... Side surface

Claims (7)

a laminate having a plurality of ceramic layers laminated in a uniaxial direction, a plurality of internal electrodes positioned between the plurality of ceramic layers, and side surfaces on which the plurality of internal electrodes are exposed; a side margin sheet; prepare a
forming a hydrophilic surface by imparting hydrophilicity to at least one of the side surface and the side margin sheet by a discharge treatment;
A method for manufacturing a multilayer ceramic electronic component, wherein the side surface and the side margin sheet are bonded using the hydrophilic surface as an adhesive surface. A method for manufacturing a multilayer ceramic electronic component according to claim 1,
A method of manufacturing a multilayer ceramic electronic component, wherein the side surfaces and the side margin sheets are bonded via an adhesive material having a liquid component larger than that of the plurality of ceramic layers and the side margin sheets. A method for manufacturing a multilayer ceramic electronic component according to claim 2,
A method for manufacturing a multilayer ceramic electronic component, wherein the hydrophilic surfaces are formed on both the side surfaces and the side margin sheets. A method for manufacturing a multilayer ceramic electronic component according to claim 2 or 3,
A method for manufacturing a multilayer ceramic electronic component, wherein the adhesive contains 0.1 wt% or more of water. A method for manufacturing a multilayer ceramic electronic component according to claim 1,
A method of manufacturing a multilayer ceramic electronic component, wherein the side surface and the side margin sheet are directly bonded. A method for manufacturing a multilayer ceramic electronic component according to claim 5,
The hydrophilic surface is provided on the side surface, and the side margin sheet is not provided with the hydrophilic surface,
A method for manufacturing a multilayer ceramic electronic component, wherein the amount of liquid component in the side margin sheets is larger than that in the ceramic sheets. A method for manufacturing a multilayer ceramic electronic component according to claim 5 or 6,
A method for producing a multilayer ceramic electronic component, wherein the side margin sheet contains 0.05 wt% or more of water.

Images