JP7417357B2 - Manufacturing method for laminated ceramic electronic components - Google Patents

Description

The present invention relates to a method for manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor.

Multilayer ceramic electronic components such as multilayer ceramic capacitors are typically manufactured as follows. First, unfired ceramic sheets on which internal electrode patterns are formed are laminated, and the sheets are pressed together from the lamination direction. By cutting the press-bonded large-sized laminated sheet, a ceramic element body having a functional part on which internal electrodes are laminated and a margin part around the functional part is separated into pieces. A multilayer ceramic electronic component is manufactured by firing this ceramic body and forming external electrodes.

In the ceramic sheet, no internal electrode pattern is formed in the region corresponding to the margin portion, and a step is formed due to the thickness of the internal electrode pattern. Therefore, even after the crimping process of the laminated sheet, gaps tend to remain in the margins, and defects such as delamination due to insufficient crimping in the margins tend to occur.

Therefore, for example, Patent Document 1 discloses a method for manufacturing a ceramic electronic component, in which a step compensation cover is formed on at least one of the upper and lower surfaces of a ceramic body to compensate for steps caused by internal electrodes. ing.
Patent Document 2 discloses a method for manufacturing a multilayer ceramic capacitor in which a sheet-like elastic body is interposed between a pressure plate and a group of raw material sheets and a crimping process is performed.

JP 2014-22719 Publication JP2015-26841A

On the other hand, there is a need for a method that can more simply and reliably prevent defects such as delamination at the margin.

In view of the above circumstances, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component that can easily and reliably prevent defects such as delamination in the margin portion.

In order to achieve the above object, a method for manufacturing a laminated ceramic electronic component according to one embodiment of the present invention includes the step of laminating ceramic sheets on which internal electrode patterns are formed in a first direction to produce a laminated sheet. .
The laminated sheet is pressed in the first direction.
By cutting the crimped laminated sheet, a plurality of ceramic bodies each having a functional part on which internal electrodes are laminated and a margin part around the functional part are produced.
The plurality of ceramic bodies described above are subjected to hydrostatic pressure while encased in water and a bag or in a net.
The hydrostatically pressurized ceramic body is fired.

In this configuration, after the laminated sheet is pressure-bonded, the laminated sheet is cut into pieces and the ceramic body is hydrostatically pressed. As a result, even a margin portion having a small number of layers of internal electrodes or a small number of layers due to the internal electrodes not being laminated can be crimped from a direction other than the first direction. Therefore, it is possible to improve the adhesion of the ceramic sheet in the margin portion and reliably prevent delamination.

The process of producing the plurality of ceramic bodies is as follows:
cutting the pressed laminated sheet to produce a ceramic laminated chip having the functional part and an end margin part located outside the functional part in a second direction perpendicular to the first direction; ,
The method may include a step of forming a side margin portion so as to cover the ceramic multilayer chip from a third direction perpendicular to the first direction and the second direction.

As a result, the later attached side margin portions are also crimped from the third direction by hydrostatic pressure. Therefore, it is possible to increase the capacity of the multilayer ceramic electronic component by securing the cross area of the internal electrodes, and to improve the adhesion between the side margin part and the ceramic multilayer chip, thereby preventing delamination of the side margin part. I can do it.

The hydrostatic pressurization of the plurality of ceramic bodies may be performed at the same pressure as the pressure bonding of the plurality of laminated sheets.
Thereby, the ceramic body can be sufficiently crimped and delamination can be more reliably prevented .

As described above, according to the present invention, it is possible to provide a method for manufacturing a multilayer ceramic electronic component that can easily and reliably prevent defects such as delamination in the margin portion.

FIG. 1 is a perspective view of a multilayer ceramic capacitor according to a first embodiment of the present invention. 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line AA' in FIG. 1. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line BB' in FIG. 1. FIG. It is a flowchart which shows the manufacturing method of the said laminated ceramic capacitor. It is a perspective view showing the manufacturing process of the above-mentioned multilayer ceramic capacitor. It is a perspective view showing the manufacturing process of the above-mentioned multilayer ceramic capacitor. It is a perspective view showing the manufacturing process of the above-mentioned multilayer ceramic capacitor. It is a flowchart which shows the manufacturing method of the multilayer ceramic capacitor based on 2nd Embodiment of this invention. It is a perspective view showing the manufacturing process of the above-mentioned multilayer ceramic capacitor. It is a perspective view showing the manufacturing process of the above-mentioned multilayer ceramic capacitor. It is a perspective view showing the manufacturing process of the above-mentioned multilayer ceramic capacitor. It is a perspective view showing the manufacturing process of the above-mentioned multilayer ceramic capacitor.

Embodiments of the present invention will be described below with reference to the drawings.
In the drawings, mutually orthogonal X, Y, and Z axes are shown as appropriate. The X, Y, and Z axes are common to all figures.

<First embodiment>
[Overall configuration of multilayer ceramic capacitor 10]
1 to 3 are diagrams showing a multilayer ceramic capacitor 10 according to a first embodiment of the present invention. FIG. 1 is a perspective view of a multilayer ceramic capacitor 10. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line AA' in FIG. FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line BB' in FIG.

The multilayer ceramic capacitor 10 includes a ceramic body 11 , a first external electrode 14 , and a second external electrode 15 . The ceramic body 11 typically has two end faces 11a facing the X-axis direction, two side faces 11b facing the Y-axis direction, and two main faces 11c facing the Z-axis direction. . Note that the edges connecting each surface of the ceramic body 11 are rounded.

The external electrodes 14 and 15 each cover the end surface 11a of the ceramic body 11 and are opposed to each other in the X-axis direction with the ceramic body 11 in between. The external electrodes 14 and 15 extend from each end surface 11a of the ceramic body 11 to the main surface 11c and side surface 11b. As a result, in the external electrodes 14 and 15, both the cross section parallel to the XZ plane and the cross section parallel to the XY plane are U-shaped. Note that the shapes of the external electrodes 14 and 15 are not limited to those shown in FIG.

The external electrodes 14 and 15 are made of a good electrical conductor. Examples of good electrical conductors forming the external electrodes 14 and 15 include copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), and gold (Au). Examples include metals or alloys whose main components are

The ceramic body 11 includes a capacitor forming portion 16, an end margin portion 17, a side margin portion 18, and a cover portion 19.
The capacitor forming section 16 is configured as a functional section in this embodiment.
The end margin portion 17 is located outside the capacitance forming portion 16 in the X-axis direction. The side margin portion 18 is located on the outside of the capacitance forming portion 16 in the Y-axis direction. The end margin section 17 and the side margin section 18 are configured as a margin section in this embodiment.
The cover portion 19 is located on the outer side of the capacitance forming portion 16 in the Z-axis direction.

The capacitor forming portion 16 includes first internal electrodes 12 and second internal electrodes 13 that are alternately stacked in the Z-axis direction with a plurality of ceramic layers 20 in between. The internal electrodes 12 and 13 are made of a good electrical conductor. Typical good electrical conductors forming the internal electrodes 12 and 13 include nickel (Ni), and also include copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), Examples include metals or alloys whose main component is gold (Au) or the like.

The internal electrodes 12 and 13 are each formed into a sheet shape extending along the XY plane. The first internal electrode 12 is drawn out to one end surface 11 a of the ceramic body 11 and connected to the first external electrode 14 . The second internal electrode 13 is drawn out to the other end surface 11 a of the ceramic body 11 and connected to the second external electrode 15 . As a result, when a voltage is applied between the first external electrode 14 and the second external electrode 15, the voltage is applied to the ceramic layer 20 between the first internal electrode 12 and the second internal electrode 13, forming a capacitance. Charge corresponding to the voltage is stored in the section 16 .

In the ceramic body 11, a dielectric ceramic having a high dielectric constant is used in order to increase the capacitance of each ceramic layer 20 between the internal electrodes 12 and 13. Examples of high dielectric constant dielectric ceramics include materials with a perovskite structure containing barium (Ba) and titanium (Ti), typified by barium titanate (BaTiO ₃ ).

The ceramic layer 20 is made of strontium titanate (SrTiO ₃ )-based, calcium titanate (CaTiO ₃ )-based, magnesium titanate (MgTiO ₃ )-based, calcium zirconate (CaZrO ₃ )-based, calcium zirconate titanate (Ca (Zr,Ti)O ₃ )-based, barium zirconate (BaZrO ₃ )-based, titanium oxide (TiO ₂ )-based, etc. may be used.

The end margin portion 17 is made of insulating ceramic and is provided between the capacitor forming portion 16 and the external electrodes 14 and 15, respectively. That is, the end margin portion 17 is provided between the first internal electrode 12 and the end surface 11a on the side from which it is not drawn out, and between the second internal electrode 13 and the end surface 11a on the side from which it is not drawn out. , respectively. The end margin portion 17 ensures insulation between the first internal electrode 12 and the second external electrode 15, and also ensures insulation between the second internal electrode 13 and the first external electrode 14.

The side margin portion 18 is formed of insulating ceramic, and ensures insulation of the capacitor forming portion 16 in the Y-axis direction, and protects the capacitor forming portion 16 .
The cover portion 19 is also formed of insulating ceramics, and ensures insulation of the capacitor forming portion 16 in the Z-axis direction, as well as protecting the capacitor forming portion 16 .

The insulating ceramic used for the end margin section 17, the side margin section 18, and the cover section 19 may include the dielectric ceramic used for the ceramic body 11. This suppresses internal stress that may occur between the end margin portion 17, side margin portion 18, and cover portion 19 and the capacitance forming portion 16.

In the end margin portion 17, only one of the internal electrodes 12 and 13 and the ceramic layer 20 are alternately laminated. Further, in the side margin portion 18, only the ceramic layer 20 is laminated. In other words, the end margin section 17 and the side margin section 18 have a structure in which the number of stacked layers is smaller than that of the capacitor forming section 16.

As shown in the manufacturing method below, the ceramic body 11 of this embodiment is manufactured by pressurizing the end margin portion 17 and the side margin portion 18 not only from the Z-axis direction but also from the X-axis direction and the Y-axis direction. It is made by As a result, in the end margin section 17 and the side margin section 18, a gap due to a step equal to the thickness of the internal electrodes 12 and 13 formed at the boundary with the capacitance formation section 16 is removed from the X-axis direction and the Y-axis direction. Filled with a pressurized ceramic layer 20. Therefore, the end margin portion 17 and the side margin portion 18 are configured such that the thickness in the Z-axis direction gradually decreases toward the end surface 11a and the side surface 11b, and has a rounded shape.

[Method for manufacturing multilayer ceramic capacitor 10]
FIG. 4 is a flowchart showing a method for manufacturing the multilayer ceramic capacitor 10. 5 to 7 are diagrams showing the manufacturing process of the multilayer ceramic capacitor 10. The method for manufacturing the multilayer ceramic capacitor 10 of the first embodiment will be described below along with FIG. 4 and with appropriate reference to FIGS. 5 to 7.

(Step S11: Preparation of laminated sheet 104)
In step S11, a laminated sheet 104 is produced by laminating the first ceramic sheet 101 and the second ceramic sheet 102 on which the internal electrodes 112 and 113 are formed, and the third ceramic sheet 103.

Ceramic sheets 101, 102, and 103 shown in FIG. 5 are configured as unfired dielectric green sheets containing dielectric ceramic as a main component. At this stage, the ceramic sheets 101, 102, 103 are configured as large sheets that are not separated into pieces. FIG. 5 shows cutting lines Lx and Ly when dividing each multilayer ceramic capacitor 10 into individual pieces. The cutting line Lx is parallel to the X-axis, and the cutting line Ly is parallel to the Y-axis.

A first internal electrode pattern 112p corresponding to the first internal electrode 12 is formed on the first ceramic sheet 101. A second internal electrode pattern 113p corresponding to the second internal electrode 13 is formed on the second ceramic sheet 102. Each internal electrode pattern 112p, 113p forms internal electrodes 12, 13 of each multilayer ceramic capacitor 10 by cutting along cutting lines Lx and Ly. The internal electrode patterns 112p and 113p can be formed by applying any conductive paste to the ceramic sheets 101 and 102 using a printing method or the like. Note that no internal electrode pattern is formed on the third ceramic sheet 103.

The first internal electrode pattern 112p has a substantially rectangular shape extending in the X-axis direction across one cutting line Ly. These first internal electrode patterns 112p are arranged with cutting lines Lx and Ly interposed therebetween. In the first ceramic sheet 101, a region along the cutting line Lx where the first internal electrode pattern 112p is not formed forms a side margin portion 18. In the first ceramic sheet 101, a region along the cutting line Ly where the first internal electrode pattern 112p is not formed forms an end margin portion 17.

The second internal electrode pattern 113p is also configured similarly to the first internal electrode pattern 112p. However, the second internal electrode pattern 113p is formed to be shifted by one chip in the X-axis direction or the Y-axis direction from the first internal electrode pattern 112p. In the second ceramic sheet 102, a region along the cutting line Lx where the second internal electrode pattern 113p is not formed forms a side margin portion 18. In the second ceramic sheet 102, a region along the cutting line Ly where the second internal electrode pattern 113p is not formed forms an end margin portion 17.

In the ceramic sheets 101 and 102, a step (not shown) corresponding to the thickness of the internal electrode patterns 112p and 113p is formed at the boundary between the area where the internal electrode patterns 112p and 113p are formed and the area where they are not formed. ing.

As shown in FIG. 5, in the laminated sheet 104, a third ceramic sheet 103 is laminated on the upper and lower surfaces in the Z-axis direction of the laminated body in which the first ceramic sheets 101 and the second ceramic sheets 102 are alternately laminated in the Z-axis direction. The body is placed. The number and thickness of these ceramic sheets 101, 102, 103 can be adjusted as appropriate.

In the laminated sheet 104, a portion where the regions where the internal electrode patterns 112p and 113p are not formed corresponds to a margin portion. On the other hand, in the laminated sheet 104, a portion where both the internal electrode patterns 112p and 113p are laminated corresponds to a capacitance forming portion. A step corresponding to the thickness of the internal electrode patterns 112p and 113p is formed at the boundary between the area corresponding to the margin part and the area corresponding to the capacitor formation part in the laminated sheet 104.

(Step S12: Pressure bonding of the laminated sheet 104)
In step S12, the laminated sheet 104 is pressed in the Z-axis direction. This pressure bonding can be performed by, for example, a uniaxial pressing method or a hydrostatic pressing method.

In the case of the uniaxial pressing method, for example, the laminated sheet 104 is sandwiched between a pair of pressure plates facing each other in the Z-axis direction, and the laminated sheet 104 is pressurized by pressing these pressure plates in the Z-axis direction. In the case of the hydrostatic pressurization method, the laminated sheet 104 supported by a jig such as a metal frame is submerged in water, and the laminated sheet 104 is pressurized by applying pressure to the water. The temperature and pressure during pressurization are, for example, 30 to 100°C and 30 to 150 MPa. As a result, the region corresponding to the capacitor forming portion where both the internal electrode patterns 112p and 113p are laminated is compressed and compacted in the Z-axis direction.

On the other hand, as described above, steps are formed in the Z-axis direction along the outer edges of the internal electrode patterns 112p and 113p. Therefore, if the laminated sheet 104 is only crimped in the Z-axis direction, the side edges of the internal electrode patterns 112p and 113p in the X-axis direction and the Y-axis direction and the ceramic sheets 101 and 102 are difficult to be brought into close contact with each other, and the internal electrode patterns Gaps tend to remain along the outer edges of 112p and 113p. Therefore, the area corresponding to the margin in the laminated sheet 104 is not sufficiently consolidated even after this step, and remains in a low-density state.

(Step S13: Cutting)
In step S13, the laminated sheet 104 obtained in step S12 is cut along cutting lines Lx and Ly. In this way, an unfired ceramic body 111u is produced.

FIG. 6 is a schematic perspective view of the ceramic body 111u obtained in step S13.
As shown in these figures, the ceramic body 111u includes a capacitance forming section 116 in which internal electrodes 112 and 113 are laminated, and a margin section around the capacitance forming section 116 (end margin section 117u and side margin section 118u). , and a cover portion 119u located on the outside of the capacitance forming portion 116 in the Z-axis direction.

The ceramic body 111u has, for example, a substantially rectangular angular shape. The end margin portion 117u and the side margin portion 118u have a structure in which unfired ceramic layers are stacked at a lower density than the capacitance forming portion 116. If this ceramic body 111u were to be fired, the end margin portions and side margin portions would remain in a state of low adhesion, making delamination likely to occur.

(Step S14: Hydrostatic pressurization of ceramic body)
In step S14, the cut ceramic body 111u obtained in step S13 is subjected to hydrostatic pressure.

In this step, first, a plurality of ceramic bodies 111u are placed in an arbitrary bag, net, or the like. Thereby, a plurality of ceramic bodies 111u can be processed at once, and productivity can be maintained.

Subsequently, a bag, a net, or the like containing the plurality of ceramic bodies 111u is attached to a jig or the like and submerged in water in a water tank, and the water is pressurized. When a bag is used, for example, water is added inside the bag so that the same pressure as the outside of the bag is applied to each ceramic element 111u inside the bag. Alternatively, if sufficient spacing between the ceramic bodies 111u can be ensured within the bag, the bag may be vacuum-sealed.

The temperature of the hydrostatic pressurization in this step is, for example, 30 to 100°C. The pressure of the hydrostatic pressurization in this step is 30 to 150 MPa, and may be the same pressure as the pressure bonding of the laminated sheet 104 in step S12. Here, the same pressure as in the pressure bonding of the laminated sheet 104 in step S12 includes substantially the same range, and includes, for example, a pressure of 90% or more and 110% or less of the pressure in the pressure bonding of the laminated sheet 104. By setting the pressure to be 90% or more of the pressure during pressure bonding of the laminated sheet 104, the effect of the hydrostatic pressurization in this step can be fully exhibited. By setting the pressure to be 110% or less of the pressure during crimping of the laminated sheet 104, large deformation of the capacitance forming portion 16 is suppressed, and a preferable shape of the laminated ceramic capacitor 10 is maintained.

By the hydrostatic pressurization in this step, the ceramic body 111 is pressurized from all directions including the Z-axis direction, the X-axis direction, and the Y-axis direction. As a result, the ceramic layers of the end margin section 117 and the side margin section 118 are crushed and brought into close contact with the side edges of the internal electrodes 112 and 113. Therefore, the gap caused by the difference in level between the internal electrodes 112 and 113 is filled with the ceramic layer, and the end margin portion 117 and the side margin portion 118 are consolidated.

FIG. 7 is a schematic perspective view of the ceramic body 111 obtained in step S14.
As shown in the figure, the ceramic body 111 includes a capacitance forming portion 116 (see FIG. 6), an end margin portion 117, a side margin portion 118, and a cover portion 119. The ceramic body 111 has a rounded structure as a whole, similar to the ceramic body 11 shown in FIGS. 1 to 3. Specifically, in the ceramic body 111, the end portion in the X-axis direction where the end margin portion 117 is formed is configured such that the thickness in the Z-axis direction gradually decreases as it goes outward in the X-axis direction. Similarly, the end portion in the Y-axis direction where the side margin portion 118 is formed is also configured such that the thickness in the Z-axis direction becomes gradually thinner toward the outside in the Y-axis direction.

That is, by applying hydrostatic pressure in this step, the ceramic layers of the end margin portion 117 and the side margin portion 118 are deformed so as to fill the gaps formed at the side end portions of the internal electrodes 112 and 113. As a result, the ceramic layer is crushed toward the side ends of the internal electrodes 112, 113, and the thickness in the Z-axis direction becomes gradually thinner as it moves away from the internal electrodes 112, 113. Therefore, a rounded ceramic body 111 shown in FIG. 7 is produced.

(Step S15: Baking)
In step S15, the unfired ceramic body 111 obtained in step S14 is fired to produce the ceramic body 11 of the multilayer ceramic capacitor 10 shown in FIGS. 1 to 3. The firing temperature in step S15 can be determined based on the sintering temperature of the ceramic body 111. Further, the firing can be performed, for example, under a reducing atmosphere or under a low oxygen partial pressure atmosphere.

(Step S16: External electrode formation)
In step S16, external electrodes 14 and 15 are formed at both ends in the X-axis direction of the ceramic body 11 obtained in step S15. The method for forming the external electrodes 14 and 15 in step S16 can be arbitrarily selected from known methods. As a result, a multilayer ceramic capacitor 10 as shown in FIGS. 1 to 3 is formed.

Note that part of the processing in step S16 above may be performed before step S15. For example, before step S15, an unfired electrode material is applied to both end surfaces of the unfired ceramic body 111 in the X-axis direction, and in step S15, the unfired ceramic body 111 is fired and at the same time The base layer of the external electrodes 14 and 15 may be formed by baking the material. Alternatively, an unfired electrode material may be applied to the ceramic body 111 that has been subjected to the binder removal process, and then fired simultaneously.

In the above manufacturing method, after the ceramic body 111u is separated from the pressed laminated sheet 104, the ceramic body 111 is hydrostatically pressed again. As a result, the margin portions 117u and 118u, which had a low density in the compression bonding process of step S12, are also sufficiently consolidated.

Therefore, by firing the ceramic body 111 obtained by the hydrostatic pressurization in step S14, it is possible to obtain the ceramic body 11 that can prevent delamination of the end margin portion 17 and the side margin portion 18. I can do it.

Actually, based on the above manufacturing method, an example sample of the multilayer ceramic capacitor 10 subjected to the hydrostatic pressurization in step S14 and a comparative example sample of the multilayer ceramic capacitor 10 not subjected to the hydrostatic pressurization were fabricated, and delamination was performed. We investigated the incidence of These samples were manufactured according to specifications such that the dimension in the X-axis direction after firing was 3.2 mm, and the dimensions in the Y-axis and Z-axis directions were 1.6 mm.

Table 1 shows the dimensions of the unfired (immediately before firing) ceramic body samples of Examples and Comparative Examples. These dimensions are the dimensions obtained by measuring the dimensions of each ceramic body sample at the largest portion in the X-axis direction, Y-axis direction, and Z-axis direction, respectively, and calculating the average value of each of 100 samples. Note that the dimensions of the example samples are the dimensions after performing hydrostatic pressurization after singulation.

As shown in Table 1, the dimensions in all directions of the example sample were slightly smaller than that of the comparative example sample. This is considered to be because the margin portion was pressurized from all directions by hydrostatic pressure after singulation, and the step caused by the internal electrode was filled with the ceramic portion, resulting in an overall reduction in size.

When the external appearance of the samples of Examples and Comparative Examples was visually confirmed, it was found that the ends of the samples of Examples were rounded in the X-axis direction and the Y-axis direction. In contrast, the sample of the comparative example was angular as a whole and had a substantially rectangular parallelepiped shape.

Subsequently, each sample after firing was visually inspected for the occurrence of delamination at the margin. Then, based on the number of samples in which delamination occurred among the 600 samples, the delamination incidence rate in each of the examples and comparative examples was calculated.

In the sample of the comparative example in which hydrostatic pressurization was not performed after singulation, the delamination occurrence rate was 2.1%, and there were some samples in which delamination occurred. On the other hand, in the samples of Examples in which hydrostatic pressure was applied after singulation, the delamination occurrence rate was 0%, confirming that delamination can be reliably prevented.

As described above, according to the present embodiment, delamination can be reliably prevented while maintaining productivity through a simple process of applying hydrostatic pressure to the ceramic body 111u after being singulated.

<Second embodiment>
In the first embodiment, the ceramic body 111u including the side margin portions 118u was produced by cutting the laminated sheet 104, but the present invention can also be applied to a manufacturing method in which the side margin portions are added later.
In the following, the same configurations as those in the first embodiment are denoted by the same reference numerals, and mainly the parts different from the first embodiment will be explained.

FIG. 8 is a flowchart showing a method for manufacturing the multilayer ceramic capacitor 10 according to the second embodiment. 9 to 12 are diagrams showing the manufacturing process of the multilayer ceramic capacitor 10 according to the second embodiment. Hereinafter, a method for manufacturing the multilayer ceramic capacitor 10 of the second embodiment will be described along with FIG. 8 and with appropriate reference to FIGS. 9 to 12.

(Step S21: Laminated sheet production)
In step S21, similarly to step S11, the first ceramic sheet 201 and the second ceramic sheet 202 on which the internal electrode patterns 212p and 213p are formed, and the third ceramic sheet 203 are laminated to form the laminated sheet 204. Create.

As shown in FIG. 9, a first internal electrode pattern 212p is formed on the first ceramic sheet 201, and a second internal electrode pattern 213p is formed on the second ceramic sheet 202. The third ceramic sheet 203 has no internal electrode pattern formed thereon.

Each internal electrode pattern 212p, 213p is composed of a plurality of strip-shaped electrode patterns extending across a cutting line Lx parallel to the X-axis direction and along a cutting line Ly parallel to the Y-axis direction. That is, in the ceramic sheets 201 and 202 of this embodiment, a region corresponding to the side margin portion is not formed around the cutting line Lx.

As shown in FIG. 9, in the laminated sheet 204, like the laminated sheet 104, the first ceramic sheet 201 and the second ceramic sheet 202 are alternately laminated in the Z-axis direction. A stack of third ceramic sheets 203 is arranged.

(Step S22: Laminated sheet pressure bonding)
In step S22, similarly to step S12, the laminated sheet 204 is crimped in the Z-axis direction. This pressure bonding can be performed by, for example, a uniaxial pressing method or a hydrostatic pressing method.
The area corresponding to the end margin portion in the laminated sheet 204 after this step is in a low density state with gaps remaining, similar to the laminated sheet 104.

(Step S23: Cutting)
In step S23, the pressed laminated sheet 204 is cut along cutting lines Lx and Ly. As a result, an unfired ceramic multilayer chip (multilayer chip) 205 is produced.

FIG. 10 is a perspective view schematically showing the laminated chip 205 obtained in step S23. The laminated chip 205 includes a capacitor forming portion 216 in which internal electrodes 212 and 213 are stacked, an end margin portion 217u located outside the capacitor forming portion 216 in the X-axis direction, and an end margin portion 217u located outside the capacitor forming portion 216 in the Z-axis direction. It has a cover part 219u. Internal electrodes 212 and 213 are exposed from the cut surface 205b of the stacked chip 205 facing in the Y-axis direction.

The stacked chip 205 has an approximately rectangular parallelepiped shape. As described above, the end margin portion 217u has a gap due to the step difference between the internal electrodes 212 and 213 even after the crimping in step S22. Therefore, the end margin portion 217u has a structure in which one of the internal electrodes 212 and 213 and unfired ceramic layers are alternately laminated at a lower density than the capacitance forming portion 216.

(Step S24: Formation of side margin portion)
In step S24, an unfired side margin portion 218 is provided on the cut surface 205b of the stacked chip 205 obtained in step S23, where the internal electrodes 212, 213 are exposed.

The side margin portion 218 is formed, for example, by attaching a ceramic green sheet to the cut surface 205b of the laminated chip 205. Specifically, for example, the side margin portion 218 is formed by pressing the cut surface 205b against the ceramic green sheet and punching out the ceramic green sheet using the cut surface 205b.

FIG. 11 is a perspective view schematically showing an unfired ceramic body 211u in which an unfired side margin portion 218 is formed on the laminated chip 205. The ceramic body 211u includes a capacitor forming portion 216 (see FIG. 10), an end margin portion 217u and a side margin portion 218u around the capacitor forming portion 216, and a cover portion 219u.

(Step S25: Hydrostatic pressurization of ceramic body)
In step S25, as in step S14 of the first embodiment, the ceramic body 211u is hydrostatically pressurized. As a result, the end margin portion 217u and the side margin portion 218u are pressurized from all directions including the Z-axis direction, the X-axis direction, and the Y-axis direction. Therefore, the end margin portion 217u is consolidated, and the side margin portion 218u is brought into close contact with the stacked chip 205.

As a result, as shown in FIG. 12, a rounded ceramic body 211 having a capacitance forming portion 216 (see FIG. 10), an end margin portion 217, a side margin portion 218, and a cover portion 219 is formed. It is formed.

(Step S26: Firing)
In step S26, similarly to step S15 of the first embodiment, the unfired ceramic body 211 obtained in step S25 is fired. As a result, the ceramic body 11 of the multilayer ceramic capacitor 10 shown in FIGS. 1 to 3, which has the same configuration as the first embodiment, is manufactured.

(Step S27: External electrode formation)
In step S27, similar to step S16 of the first embodiment, external electrodes 14 and 15 are formed at both ends in the X-axis direction of the ceramic body 11 obtained in step S26. As a result, a multilayer ceramic capacitor 10 as shown in FIGS. 1 to 3 is formed.

In the above manufacturing method, since the side margin portion 18 is added later, the positions of the ends of the plurality of internal electrodes 12 and 13 in the ceramic body 11 in the Y-axis direction vary within 0.5 μm in the Z-axis direction. Align along. Thereby, it is possible to sufficiently secure the intersection area of the internal electrodes 12 and 13 in the ceramic body 11, and it is possible to increase the capacity of the multilayer ceramic capacitor 10.

Further, by applying hydrostatic pressure to the ceramic body 211u on which the side margin portion 218u is formed in step S25, the side margin portion 218 can be brought into close contact with the cut surface 205b of the laminated chip 205. Therefore, defects such as delamination at the bonding interface between the stacked chip 205 and the side margin portion 218 can be prevented.

Further, similarly to the first embodiment, the end margin portion 217 is also compacted in step S25 so as to fill the gap caused by the step at the periphery of the internal electrodes 212 and 213, thereby preventing defects such as delamination. can.

Although each embodiment of the present invention has been described above, the present invention is not limited only to the above-described embodiments, and it goes without saying that various changes can be made without departing from the gist of the present invention. For example, an embodiment of the present invention can be a combination of each embodiment.

For example, in the above embodiments, a multilayer ceramic capacitor has been described as an example of a ceramic electronic component, but the present invention is applicable to all multilayer ceramic electronic components in which pairs of internal electrodes are alternately arranged. Examples of such laminated ceramic electronic components include piezoelectric elements.

10...Multilayer ceramic capacitor (multilayer ceramic electronic component)
16... Capacity forming section (functional section)
17...End margin part (margin part)
18...Side margin part (margin part)
101,102,201,202...Ceramic sheet 112p,113p,212p,213p...Internal electrode pattern 104,204...Laminated sheet 112,113,212,213...Internal electrode 116,216...Unfired capacitor forming part (unfired functional part)
117u, 117, 217u, 217...Unfired end margin part (unfired margin part)
118u, 118, 218u, 218...Unfired side margin part (unfired margin part)
205...Laminated chip (ceramic laminated chip)

Claims (3)

A laminated sheet is produced by laminating ceramic sheets on which internal electrode patterns are formed in a first direction,
Pressing the laminated sheet in the first direction,
By cutting the crimped laminated sheet, a plurality of ceramic bodies each having a functional part in which internal electrodes are laminated and a margin part around the functional part are produced;
hydrostatically pressurizing the plurality of ceramic bodies in water and a bag or in a net;
A method for manufacturing a laminated ceramic electronic component, comprising firing the plurality of ceramic bodies subjected to hydrostatic pressure. A method for manufacturing a laminated ceramic electronic component according to claim 1, comprising:
The step of producing the plurality of ceramic bodies includes:
cutting the pressed laminated sheet to produce a ceramic laminated chip having the functional part and an end margin part located outside the functional part in a second direction perpendicular to the first direction; ,
A method for manufacturing a multilayer ceramic electronic component, comprising: forming a side margin portion so as to cover the ceramic multilayer chip from a third direction perpendicular to the first direction and the second direction. A method for manufacturing a multilayer ceramic electronic component according to claim 1 or 2, comprising:
The method for manufacturing a laminated ceramic electronic component, wherein the hydrostatic pressurization of the plurality of ceramic bodies is performed at the same pressure as the pressure bonding of the laminated sheets.

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