JP2021061356A - Manufacturing method of laminated ceramic electronic component - Google Patents

Abstract

To provide a technique which can form a side margin part on the side face of a laminate by a punching method.SOLUTION: In the manufacturing method of a laminated ceramic electronic component, a series of first side margin sheets are thermocompression-bonded to the first side faces of a plurality of laminates, which are held on a first elastic surface through a first adhesive sheet, in a first condition which includes pressing force by a highly rigid surface. A first side margin part is formed by punching the thermocompression-bonded first side margin sheet with the first side faces of the plurality of laminates. The plurality of laminates are transferred from the first adhesive sheet to the second adhesive sheet. A series of second side margin sheets are thermocompression bonded to the second side faces of the plurality of laminates, which are held on a second elastic surface through the second adhesive sheet and the first side margin part, in a second condition which includes pressing force by a highly rigid surface and is different from the first condition. A second side margin part is formed by punching the thermocompression-bonded second side margin sheet with the second side faces of the plurality of laminates.SELECTED DRAWING: Figure 13

Description

The present invention relates to a method for manufacturing a laminated ceramic electronic component to which a side margin portion is retrofitted.

A technique for retrofitting a side margin portion in the manufacturing process of a multilayer ceramic capacitor is known (see, for example, Patent Document 1). This technique is advantageous for miniaturization and large capacity of the multilayer ceramic capacitor because the side surface of the laminate in which the internal electrodes are exposed can be reliably protected even by the thin side margin portion.

As an example, in the method for manufacturing a laminated ceramic capacitor described in Patent Document 1, a laminated sheet in which a ceramic sheet on which an internal electrode is printed is laminated is cut, and a plurality of laminated bodies having a cut surface on which the internal electrode is exposed as a side surface are formed. To make. Then, by punching the ceramic sheet on the side surface of the laminated body, a side margin portion is formed on the side surface of the laminated body.

Further, Patent Document 1 discloses a method of punching out a ceramic sheet while heating in order to enhance the adhesiveness of the side margin portion to the side surface of the laminated body. In this configuration, it is necessary to keep the temperature of the ceramic sheet at the time of punching below the transition point in order to prevent the ceramic sheet from being crushed without being punched.

Japanese Unexamined Patent Publication No. 2012-209039

However, in the method of punching out the ceramic sheet while heating, the stress applied to the ceramic sheet is concentrated in the vicinity of the corners of the laminated body, so that the side margin portion is likely to be locally deformed. Further, at a temperature lower than the transition point, it is difficult to obtain the effect of improving the adhesiveness of the side margin portion to the side surface of the laminated body after punching.

In view of the above circumstances, an object of the present invention is to provide a technique capable of satisfactorily forming a side margin portion on a side surface of a laminated body by a punching method.

In order to achieve the above object, in the method for manufacturing a laminated ceramic electronic component according to an embodiment of the present invention, a plurality of ceramic layers laminated in the first axial direction and a plurality of interiors located between the plurality of ceramic layers. On a first adhesive sheet having electrodes and first and second side surfaces facing the second axis direction orthogonal to the first axis and exposing the plurality of internal electrodes, and holding the second side surface. A plurality of laminates arranged in are prepared.
A series of first side margin sheets are formed under the first condition including pressing by the high rigidity surface against the first side surface of the plurality of laminated bodies held on the first elastic surface via the first adhesive sheet. It is thermocompression bonded.
The first side margin portion is formed by punching the thermocompression-bonded first side margin sheet on the first side surface of the plurality of laminated bodies.
The plurality of laminates on which the first side margin portion is formed are transferred from the first pressure-sensitive adhesive sheet to the second pressure-sensitive adhesive sheet.
The first condition includes pressing by a high-rigidity surface against the second side surface of the plurality of laminated bodies held on the second elastic surface via the second adhesive sheet and the first side margin portion. A series of second side margin sheets are thermocompression bonded under a second condition different from that of.
The second side margin portion is formed by punching the thermocompression-bonded second side margin sheet at the second side surface of the plurality of laminated bodies.

In this configuration, when the first and second side margin sheets are thermocompression bonded to the side surfaces of the plurality of laminated bodies, the first and second side margin sheets are pressed by a highly rigid surface that does not elastically deform. As a result, non-uniform stress is less likely to be applied between the side surfaces of the plurality of laminated bodies and the first and second side margin sheets, so that the first and second side margin portions having a more uniform thickness can be formed. ..
Further, the first side margin portion receives pressing force in a state of being easily deformed by heating not only at the time of thermocompression bonding of the first side margin sheet before punching but also at the time of thermocompression bonding of the second side margin sheet. Become. Therefore, the first side margin portion tends to be thinner than the second side margin portion. In this respect, in this configuration, by making the conditions of thermocompression bonding of the first and second side margin sheets different from each other, it is possible to make it difficult for a difference in thickness to occur between the first and second side margin portions. ..

Under the first and second conditions, at least one of the temperature of the high-rigidity surface, the pressing force applied from the high-rigidity surface, and the pressing time by the high-rigidity surface may be different from each other.
The compositions of the first and second side margin sheets may be different from each other.
The elastic moduli of the first and second elastic surfaces may be different from each other.
In these configurations, it becomes easy to individually control the thickness of the first and second side margin portions.

As described above, according to the present invention, it is possible to provide a technique capable of satisfactorily forming a side margin portion on a side surface of a laminated body by a punching method.

It is a perspective view of the multilayer ceramic capacitor which concerns on one Embodiment of this invention. It is sectional drawing which follows the AA' line of FIG. 1 of the said monolithic ceramic capacitor. It is sectional drawing along the line BB'of FIG. 1 of the said monolithic ceramic capacitor. It is a flowchart which shows the manufacturing method of the said monolithic ceramic capacitor. It is a top view of the ceramic sheet prepared in the ceramic sheet preparation process of the said manufacturing method. It is a perspective view which shows the laminating process of the said manufacturing method. It is a top view which shows the cutting process of the said manufacturing method. It is a partial cross-sectional view which shows the said cutting process. It is a perspective view of the unfired ceramic body obtained by the side margin part forming step of the said manufacturing method. It is a flowchart which shows the formation method of the side margin part in the said manufacturing method. It is a partial cross-sectional view which shows the 1st thermocompression bonding process of the said formation method. It is a partial cross-sectional view which shows the 1st punching process of the said formation method. It is a partial cross-sectional view which shows the 2nd thermocompression bonding process of the said formation method. It is a partial cross-sectional view which shows the 2nd punching process of the said formation method.

<Multilayer ceramic capacitor 10>
Hereinafter, the multilayer ceramic capacitor 10 according to the embodiment of the present invention will be described with reference to the drawings. Note that FIGS. 1 to 9 show X-axis, Y-axis, and Z-axis that are orthogonal to each other as appropriate. The X-axis, Y-axis, and Z-axis define a fixed coordinate system fixed to the monolithic ceramic capacitor 10.

[Structure of Multilayer Ceramic Capacitor 10]
FIGS. 1 to 3 are views showing a multilayer ceramic capacitor 10 according to an embodiment of the present invention. FIG. 1 is a perspective view of the multilayer ceramic capacitor 10. FIG. 2 is a cross-sectional view of the monolithic ceramic capacitor 10 along the AA'line of FIG. FIG. 3 is a cross-sectional view of the monolithic ceramic capacitor 10 along the line BB'of FIG.

The multilayer ceramic capacitor 10 includes a ceramic body 11, a first external electrode 14, and a second external electrode 15. The ceramic element 11 is a hexahedron having first and second end faces orthogonal to the X axis, first and second side surfaces orthogonal to the Y axis, and first and second main surfaces orthogonal to the Z axis. It is configured as.

The external electrodes 14 and 15 cover both end faces of the ceramic body 11 and face each other in the X-axis direction with the ceramic body 11 interposed therebetween. The external electrodes 14 and 15 extend from each end surface of the ceramic body 11 to the main surface and the side surface. As a result, in the external electrodes 14 and 15, both the cross section parallel to the XY plane and the cross section parallel to the XY plane are U-shaped.

The shapes of the external electrodes 14 and 15 are not limited to those shown in FIG. For example, the external electrodes 14 and 15 may extend from both end faces of the ceramic element 11 to only one main surface, and may have an L-shaped cross section parallel to the XZ plane. Further, the external electrodes 14 and 15 do not have to extend to any of the main surfaces and side surfaces.

The external electrodes 14 and 15 are formed of good electric conductors. Examples of good conductors of electricity forming the external electrodes 14 and 15 include copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), and gold (Au). Examples thereof include metals or alloys containing the above as a main component.

The ceramic element 11 is made of dielectric ceramic and has a laminate 16 and first and second side margin portions 17a and 17b. The laminated body 16 has first and second side surfaces S1 and S2 that are orthogonal to the Y-axis and face each other in the Y-axis direction. Further, the laminated body 16 has first and second end faces orthogonal to the X-axis and facing the X-axis direction, and first and second main surfaces orthogonal to the Z-axis and facing the Z-axis direction. ..

The laminated body 16 has a structure in which a plurality of flat plate-shaped ceramic layers extending along an XY plane are laminated in the Z-axis direction. The laminated body 16 has a capacitance forming portion 18 and a cover portion 19. The cover portion 19 covers the capacitance forming portion 18 from above and below in the Z-axis direction, and constitutes the first and second main surfaces of the laminated body 16.

The capacitance forming portion 18 is arranged between the plurality of ceramic layers and has a plurality of sheet-shaped first and second internal electrodes 12 and 13 extending along an XY plane. The internal electrodes 12 and 13 are alternately arranged along the Z-axis direction. That is, the internal electrodes 12 and 13 face each other in the Z-axis direction with the ceramic layer interposed therebetween.

The first internal electrode 12 is drawn out to the end face covered with the first external electrode 14. On the other hand, the second internal electrode 13 is drawn out to the end face covered with the second external electrode 15. As a result, the first internal electrode 12 is connected only to the first external electrode 14, and the second internal electrode 13 is connected only to the second external electrode 15.

The internal electrodes 12 and 13 are formed over the entire width of the capacitance forming portion 18 in the Y-axis direction, and are exposed on the side surfaces S1 and S2 of the laminated body 16, respectively. The first side margin portion 17a covers the first side surface S1 of the laminated body 16, and the second side margin portion 17b covers the second side surface S2 of the laminated body 16. Thereby, the insulating property between the internal electrodes 12 and 13 on both side surfaces S1 and S2 of the laminated body 16 can be ensured.

With such a configuration, in the multilayer ceramic capacitor 10, when a voltage is applied between the first external electrode 14 and the second external electrode 15, a plurality of layers between the first internal electrode 12 and the second internal electrode 13 are applied. A voltage is applied to the ceramic layer of. As a result, in the multilayer ceramic capacitor 10, electric charges corresponding to the voltage between the first external electrode 14 and the second external electrode 15 are stored.

In the ceramic element 11, dielectric ceramics having a high dielectric constant are used in order to increase the capacitance of each ceramic layer between the internal electrodes 12 and 13. Examples of the dielectric ceramics having a high dielectric constant include materials having a perovskite structure containing barium (Ba) and titanium (Ti) represented by _{barium titanate (BaTIO 3).}

The ceramic layer includes strontium titanate (SrTIO ₃ ), calcium titanate (CaTIO ₃ ), magnesium titanate (MgTIO ₃ ), calcium zirconate (CaZrO ₃ ), and calcium zirconate titanate (Ca (Zr, Ti)). It may be composed of a composition system such as _{O 3} ), barium zirconate (BaZrO ₃ ), and titanium oxide (TiO _2).

The internal electrodes 12 and 13 are formed of good electric conductors. Nickel (Ni) is typically mentioned as a good conductor of electricity forming the internal electrodes 12 and 13, and in addition to this, copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), and the like. Examples thereof include metals or alloys containing gold (Au) or the like as a main component.

[Manufacturing method of multilayer ceramic capacitor 10]
FIG. 4 is a flowchart showing a method of manufacturing the multilayer ceramic capacitor 10 according to the present embodiment. 5 to 9 are views showing a manufacturing process of the monolithic ceramic capacitor 10. Hereinafter, a method for manufacturing the monolithic ceramic capacitor 10 will be described with reference to FIGS. 5 to 9 as appropriate with reference to FIG.

(Step S01: Ceramic sheet preparation)
In step S01, a first ceramic sheet 101 and a second ceramic sheet 102 for forming the capacitance forming portion 18 and a third ceramic sheet 103 for forming the cover portion 19 are prepared. The ceramic sheets 101, 102, and 103 are configured as an unfired dielectric green sheet containing dielectric ceramics as a main component.

The ceramic sheets 101, 102, and 103 are formed into a sheet shape using, for example, a roll coater or a doctor blade. The thicknesses of the ceramic sheets 101 and 102 are adjusted according to the thickness of the ceramic layer in the capacitance forming portion 18 after firing. The thickness of the third ceramic sheet 103 can be adjusted as appropriate.

FIG. 5 is a plan view of the ceramic sheets 101, 102, 103. At this stage, the ceramic sheets 101, 102, and 103 are configured as large-sized sheets that are not individualized. FIG. 5 shows cutting lines Lx and Ly for individualizing each multilayer ceramic capacitor 10. The cutting line Lx is parallel to the X axis, and the cutting line Ly is parallel to the Y axis.

As shown in FIG. 5, an unfired first internal electrode 112 corresponding to the first internal electrode 12 is formed on the first ceramic sheet 101, and an unfired first internal electrode 112 corresponding to the second internal electrode 13 is formed on the second ceramic sheet 102. The second internal electrode 113 for firing is formed. An internal electrode is not formed on the third ceramic sheet 103 corresponding to the cover portion 19.

The internal electrodes 112 and 113 can be formed by applying an arbitrary conductive paste to the ceramic sheets 101 and 102. The method for applying the conductive paste can be arbitrarily selected from known techniques. For example, a screen printing method or a gravure printing method can be used for applying the conductive paste.

In the internal electrodes 112 and 113, gaps in the X-axis direction along the cutting line Ly are formed every other cutting line Ly. The gap between the first internal electrode 112 and the gap between the second internal electrodes 113 are arranged alternately in the X-axis direction. That is, the cutting line Ly passing through the gap of the first internal electrode 112 and the cutting line Ly passing through the gap of the second internal electrode 113 are alternately arranged.

(Step S02: Lamination)
In step S02, the laminated sheet 104 is produced by laminating the ceramic sheets 101, 102, 103 prepared in step S01 as shown in FIG. In the laminated sheet 104, the first ceramic sheet 101 and the second ceramic sheet 102 corresponding to the capacitance forming portion 18 are alternately laminated in the Z-axis direction.

Further, in the laminated sheet 104, the third ceramic sheet 103 corresponding to the cover portion 19 is laminated on the upper and lower surfaces of the alternately laminated ceramic sheets 101 and 102 in the Z-axis direction. In the example shown in FIG. 6, three third ceramic sheets 103 are laminated, but the number of third ceramic sheets 103 can be changed as appropriate.

The laminated sheet 104 is integrated by crimping the ceramic sheets 101, 102, 103. For crimping the ceramic sheets 101, 102, 103, for example, hydrostatic pressure pressurization or uniaxial pressurization is preferably used. This makes it possible to increase the density of the laminated sheet 104.

(Step S03: Disconnection)
In step S03, the laminated sheet 104 obtained in step S02 is cut along the cutting lines Lx and Ly to produce an unfired laminated body 116. The laminated body 116 corresponds to the laminated body 16 after firing. For example, a push-cutting blade or a rotary blade can be used for cutting the laminated sheet 104.

7 and 8 are schematic views for explaining an example of step S03. FIG. 7 is a plan view of the laminated sheet 104. FIG. 8 is a cross-sectional view of the laminated sheet 104 along the YY plane. The laminated sheet 104 is cut by the push-cutting blade BL along the cutting lines Lx and Ly while being held by the adhesive cut sheet C such as a foam release sheet.

First, as shown in FIG. 8A, the push-cutting blade BL is arranged above the laminated sheet 104 in the Z-axis direction, and the tip thereof is arranged toward the laminated sheet 104 downward in the Z-axis direction. Next, as shown in FIG. 8B, the push-cutting blade BL is moved downward in the Z-axis direction until it reaches the cut sheet C, and penetrates the laminated sheet 104.

Then, as shown in FIG. 8C, the push-cutting blade BL is pulled out from the laminated sheet 104 by moving it upward in the Z-axis direction. As a result, the laminated sheet 104 is cut in the X-axis and Y-axis directions, and a laminated body 116 having first and second side surfaces S1 and S2 in which the internal electrodes 112 and 113 are exposed in the Y-axis direction is formed.

(Step S04: Forming a side margin portion)
In step S04, the laminated body 116 obtained in step S03 is provided with an unfired first side margin portion 117a on the first side surface S1 and an unfired second side margin portion 117b on the second side surface S2. As a result, as shown in FIG. 9, an unfired ceramic body 111 in which the side surfaces S1 and S2 in which the internal electrodes 112 and 113 are exposed is covered with the side margin portions 117a and 117b is obtained.

In the side margin portions 117a and 117b formed by the method according to the present embodiment, high adhesiveness to the side surfaces S1 and S2 of the laminated body 116 can be obtained while suppressing local deformation. Thereby, high reliability and yield of the multilayer ceramic capacitor 10 can be realized. Details of the method of forming the side margin portions 117a and 117b in step S04 will be described later.

(Step S05: Baking)
In step S05, the ceramic element 11 of the multilayer ceramic capacitor 10 shown in FIGS. 1 to 3 is produced by firing the ceramic element 111 shown in FIG. 9 obtained in step S04. That is, in step S05, the laminated body 116 becomes the laminated body 16, and the side margin portions 117a and 117b become the side margin portions 17a and 17b.

The firing temperature in step S05 can be determined based on the sintering temperature of the ceramic body 111. For example, when a barium titanate (BaTIO ₃ ) -based material is used, the firing temperature can be about 1000 to 1300 ° C. Further, the calcination can be performed, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.

(Step S06: External electrode formation)
In step S06, the multilayer ceramic capacitors 10 shown in FIGS. 1 to 3 are manufactured by forming the external electrodes 14 and 15 at both ends of the ceramic body 11 obtained in step S05 in the X-axis direction. The method for forming the external electrodes 14 and 15 in step S06 can be arbitrarily selected from known methods.

From the above, the monolithic ceramic capacitor 10 is completed. In this manufacturing method, side margin portions 117a and 117b are formed on the side surfaces S1 and S2 of the laminated body 116 in which the internal electrodes 112 and 113 are exposed, so that the plurality of internal electrodes 12 and 13 in the ceramic body 11 are in the Y-axis direction. The positions of the ends of the ceramics are aligned within 0.5 μm.

<Method of forming side margin portions 117a and 117b>
FIG. 10 is a flowchart showing a method of forming the side margin portions 117a and 117b in step S04. 11 to 14 are diagrams for explaining a method of forming the side margin portions 117a and 117b. Hereinafter, a method of forming the side margin portions 117a and 117b will be described with reference to FIGS. 11 to 14 as appropriate with reference to FIG.

Note that FIGS. 11 to 14 show x-axis, y-axis, and z-axis that are orthogonal to each other. The x-axis, y-axis, and z-axis define a real-space coordinate system that is fixed with respect to real space, unlike the above-mentioned X-axis, Y-axis, and Z-axis. The x-axis and y-axis extend in the horizontal direction, that is, the xy plane becomes a horizontal plane. The z-axis extends vertically up and down.

(Step S41: Change the orientation of the laminated body)
In step S41, the orientation of the plurality of laminated bodies 116 after step S03 is changed. That is, in the state immediately after step S03 shown in FIG. 8C, the side surfaces S1 and S2 of the laminated bodies 116 that are adjacent to each other are close to each other in the Y-axis direction and thus face each other. , It is difficult to form the side margin portion 117 in S1. Therefore, in step S41, the directions of the side surfaces S1 and S2 of the plurality of laminated bodies 116 are changed from the horizontal direction (y-axis direction) to the vertical direction (z-axis direction).

As a method of changing the orientation of the side surfaces S1 and S2 of the plurality of laminated bodies 116, for example, a known method such as a rolling method can be used. In the rolling method, the laminated body 116 is first pasted from the cut sheet C to the first adhesive sheet F1 having extensibility, and the first adhesive sheet F1 is stretched to widen the interval in the y-axis direction of the laminated body 116.

Then, the plurality of laminated bodies 116 are rolled on the first adhesive sheet F1 in the y-axis direction. At this time, all the laminated bodies 116 can be rolled at once by using, for example, a rolling board. As a result, the laminated body 116 is rotated by 90 °, and the side surfaces S1 and S2 can be directed upward and downward in the z-axis direction, respectively.

In each of the plurality of laminated bodies 116 after step S41, the second side surface S2 facing downward in the z-axis direction is held by the first adhesive sheet F1, and the first side surface S1 faces upward in the z-axis direction (FIG. 11). See (A)). As a result, the first side margin portion 117a can be collectively formed for the first side surface S1 facing upward in the z-axis direction in all the laminated bodies 116.

(Step S42: First thermocompression bonding)
In step S42, the first side margin sheet 117s1 constituting the first side margin portion 117a is thermocompression bonded to the first side surface S1 of the plurality of laminated bodies 116 directed upward in the z-axis direction in step S41. 11 (A) to 11 (C) are views showing a process of crimping the first side margin sheet 117s1 to the first side surface S1 of the plurality of laminated bodies 116 in step S42.

In step S42, first, as shown in FIG. 11A, the lower surface of the first adhesive sheet F1 in the z-axis direction is held by the first elastic surface q1 forming the upper surface of the first elastic member D1 in the z-axis direction. Then, a series of first side margin sheets 117s1 extending along the XY plane are arranged on the first side surface S1 of the plurality of laminated bodies 116 so that they can be collectively covered.

The first side margin sheet 117s1 is configured as an unfired dielectric green sheet. The configuration of the first side margin sheet 117s1 may be the same as or different from the configuration of the ceramic sheets 101, 102, 103 prepared in step S01 for forming the laminated body 116.

The first elastic member D1 has a flat plate shape extending along an XY plane and is made of various elastic materials such as rubber. The first elastic surface q1 is flat in a free state under no pressing force. The first elastic member D1 may hold the first adhesive sheet via another sheet such as a release sheet. In this case, the upper surface of the other sheet in the z-axis direction is the first elastic surface q1. Will be.

Further, a rigid body pressing member G, which is a flat plate-shaped rigid body extending along the XY plane, is arranged above the first side margin sheet 117s1 in the z-axis direction. The rigid body pressing member G has a high-rigidity surface p which is a plane forming a lower surface in the z-axis direction. The rigid body pressing member G can press the first side margin sheet 117s1 by the highly rigid surface p whose planar shape is maintained without being elastically deformed.

The rigid body pressing member G is formed of a material generally classified as a rigid body, such as stainless steel or aluminum. Therefore, the rigid body pressing member G may be slightly elastically deformed to the extent that its influence can be ignored on the highly rigid surface p at the time of pressing. In addition, another sheet such as a release sheet may be provided on the lower surface of the rigid body pressing member G in the z-axis direction, and in this case, the lower surface of the other sheet in the z-axis direction becomes the high rigidity surface p.

In the rigid body pressing member G, the high-rigidity surface p is heated in order to apply heat to the first side margin sheet 117s1 at the time of pressing. In the rigid body pressing member G, for example, the highly rigid surface p can be heated from the inside by a heater provided inside. The temperature of the high-rigidity surface p in step S42 is preferably set to be equal to or higher than the transition point of the first side margin sheet 117s1.

Next, as shown in FIG. 11B, the rigid body pressing member G is moved downward in the z-axis direction, and the first side margin sheet 117s1 is pushed downward in the z-axis direction by the high-rigidity surface p. As a result, the plurality of laminated bodies 116 compress and deform the first elastic member D1 in the z-axis direction by pressing the first elastic surface q1 via the first adhesive sheet F1.

At this time, the first side margin sheet 117s1 pressed against the high-rigidity surface p of the rigid body pressing member G is pressed against the first side surface S1 of the plurality of laminated bodies 116 in a state of being softened by the heat applied from the high-rigidity surface p. .. As a result, the first side margin sheet 117s1 adheres to the first side surface S1 of the plurality of laminated bodies 116 by flexibly deforming according to the fine uneven shape. Therefore, in the first side margin sheet 117s1, high adhesiveness to the first side surface S1 of the plurality of laminated bodies 116 can be obtained.

Further, in the rigid body pressing member G, since the planar shape of the high rigidity surface p is maintained at the time of pressing, it is uniform on the first side margin sheet 117s1 between the high rigidity surface p and the first side surface S1 of the plurality of laminated bodies 116. Pressure is applied. As a result, in the rigid body pressing member G, the first side margin sheet 117s1 can be satisfactorily thermocompression bonded to the first side surface S1 of the plurality of laminated bodies 116 while maintaining the planar shape without local deformation. it can.

Further, in the state shown in FIG. 11B, even if the dimensions of the plurality of laminated bodies 116 in the z-axis direction vary, the laminated bodies 116 sink downward in the z-axis direction to the first elastic surface q1. This variation is offset by the difference in the amount of filling, and the positions of the first side surface S1 in the z-axis direction are aligned along the high-rigidity surface p. As a result, the first side margin sheet 117s1 can be satisfactorily thermocompression bonded to the first side surface S1 of all the laminated bodies 116.

Then, as shown in FIG. 11C, the rigid body pressing member G is moved upward in the z-axis direction. As a result, the highly rigid surface p of the rigid body pressing member G is separated from the first side margin sheet 117s1, the pressing force applied from the first adhesive sheet F1 to the first elastic surface q1 is released, and the first elastic member D1 is elastically restored. By doing so, the original thickness is restored.

(Step S43: First punching)
In step S43, the first side margin sheet 117s1 thermocompression bonded in step S42 is punched out by the first side surface S1 of the plurality of laminated bodies 116. 12 (A) to 12 (C) are views showing a process of punching the first side margin sheet 117s1 at the first side surface S1 of the plurality of laminated bodies 116 in step S43.

In step S43, first, as shown in FIG. 12A, the lower surface of the first adhesive sheet F1 in the z-axis direction is held by the holding member H, which is a flat plate-shaped rigid body extending along the XY plane. The holding member H can be made of, for example, metal. Further, an elastic body pressing member E, which is a flat plate-shaped elastic body extending along the XY plane, is arranged above the first side margin sheet 117s1 in the z-axis direction. The elastic body pressing member E can be formed of, for example, various rubbers or various elastomers.

Next, as shown in FIG. 12B, the elastic body pressing member E is moved downward in the z-axis direction until it comes into contact with the first side margin sheet 117s1, and the elastic body pressing member E further moves the first side margin sheet 117s1. Is pushed downward in the z-axis direction. In step S43, unlike step S42, heat is not applied to the first side margin sheet 117s1.

At this time, the elastic body pressing member E bites into the space between the plurality of laminated bodies 116, so that the region of the first side margin sheet 117s1 that is not held by the first side surface S1 of the laminated body 116 is downward in the z-axis direction. Push down to. As a result, the first side margin sheet 117s1 is cut along the contour of the first side surface S1 of each laminated body 116 by the shearing force applied in the z-axis direction.

Then, as shown in FIG. 12C, the elastic body pressing member E is moved upward in the z-axis direction to separate the elastic body pressing member E from the first side margin sheet 117s1. At this time, the first side margin sheet 117s1 remaining on the first side surface S1 of each laminated body 116 becomes the first side margin portion 117a. The first side margin sheet 117s1 remaining in the space between the plurality of laminated bodies 116 is removed.

(Step S44: Transfer)
In step S44, the plurality of laminates 116 on which the first side margin portion 117a is formed in step S43 are transferred from the first adhesive sheet F1 to the second adhesive sheet F2. Specifically, from the state after step S43, first, the second adhesive sheet F2 is attached to the first side margin portion 117 formed on the first side surface S1 of the plurality of laminated bodies 116.

Next, the plurality of laminated bodies 116 having the first side margin portion 117a sandwiched between the first and second adhesive sheets F1 and F2 are inverted up and down in the z-axis direction. Then, the first adhesive sheet F1 is peeled off from the second side surface S2 of the plurality of laminated bodies 116. As a result, in each of the plurality of laminated bodies 116, the second side surface S2 faces upward in the z-axis direction (see FIG. 13A).

(Step S45: Second thermocompression bonding)
In step S45, the second side margin sheet 117s2 constituting the second side margin portion 117b is thermocompression bonded to the second side surface S2 of the plurality of laminated bodies 116 directed upward in the z-axis direction in step S44. 13 (A) to 13 (C) are views showing a process of crimping the second side margin sheet 117s2 to the second side surface S2 of the plurality of laminated bodies 116 in step S45.

In step S45, first, as shown in FIG. 13A, the lower surface of the second adhesive sheet F2 in the z-axis direction is held by the second elastic surface q2 forming the upper surface of the second elastic member D2 in the z-axis direction. Then, a series of second side margin sheets 117s2 extending along the XY plane are arranged on the second side surface S2 of the plurality of laminated bodies 116 so that they can be collectively covered.

The second side margin sheet 117s2 is configured as an unfired dielectric green sheet. The configuration of the second side margin sheet 117s2 is the same as the configuration of the first side margin sheet 117s1 and the ceramic sheets 101, 102, 103 prepared in step S01 for forming the laminated body 116, but is different. May be good.

The second elastic member D2 has a flat plate shape extending along the XY plane and is made of various elastic materials such as rubber. The second elastic surface q2 is flat in a free state under no pressing force. The second elastic member D2 may hold the second adhesive sheet via another sheet such as a release sheet. In this case, the upper surface of the other sheet in the z-axis direction is the second elastic surface q2. Will be.

Further, a rigid body pressing member G similar to that in step S42 is arranged above the second side margin sheet 117s2 in the z-axis direction. In the rigid body pressing member G, the high-rigidity surface p is heated in order to apply heat to the second side margin sheet 117s2 at the time of pressing. The temperature of the high-rigidity surface p in step S45 is preferably set to be equal to or higher than the transition point of the second side margin sheet 117s2.

Next, as shown in FIG. 13B, the rigid body pressing member G is moved downward in the z-axis direction, and the second side margin sheet 117s2 is pushed downward in the z-axis direction by the high-rigidity surface p. As a result, the plurality of laminated bodies 116 compress and deform the second elastic member D2 in the z-axis direction by pressing the second elastic surface q2 via the second adhesive sheet F2 and the first side margin portion 117a.

At this time, the second side margin sheet 117s2 pressed against the high-rigidity surface p of the rigid body pressing member G is pressed against the second side surface S2 of the plurality of laminated bodies 116 in a state of being softened by the heat applied from the high-rigidity surface p. .. As a result, the second side margin sheet 117s2 is in close contact with the second side surface S2 of the plurality of laminated bodies 116 by being flexibly deformed according to the fine uneven shape. Therefore, in the second side margin sheet 117s2, high adhesiveness to the second side surface S2 of the plurality of laminated bodies 116 can be obtained.

Further, in the rigid body pressing member G, since the planar shape of the high rigidity surface p is maintained at the time of pressing, it is uniform on the second side margin sheet 117s2 between the high rigidity surface p and the second side surface S2 of the plurality of laminated bodies 116. Pressure is applied. As a result, in the rigid body pressing member G, the second side margin sheet 117s2 can be satisfactorily thermocompression bonded to the second side surface S2 of the plurality of laminated bodies 116 while maintaining the planar shape without local deformation. it can.

Further, in the state shown in FIG. 13B, even if the dimensions of the plurality of laminated bodies 116 in the z-axis direction vary, the laminated bodies 116 sink downward to the second elastic surface q2 in the z-axis direction. This variation is offset by the difference in the amount of filling, and the positions of the second side surface S2 in the z-axis direction are aligned along the high-rigidity surface p. As a result, the second side margin sheet 117s2 can be satisfactorily thermocompression bonded to the second side surface S2 of all the laminated bodies 116.

Then, as shown in FIG. 13C, the rigid body pressing member G is moved upward in the z-axis direction. As a result, the highly rigid surface p of the rigid body pressing member G is separated from the second side margin sheet 117s2, the pressing force applied from the second adhesive sheet F2 to the second elastic surface q2 is released, and the second elastic member D2 is elastically restored. By doing so, the original thickness is restored.

(Step S46: Second punching)
In step S46, the second side margin sheet 117s2 thermocompression bonded in step S45 is punched out by the second side surface S2 of the plurality of laminated bodies 116. 14 (A) to 14 (C) are views showing a process of punching the second side margin sheet 117s2 at the second side surface S2 of the plurality of laminated bodies 116 in step S46.

In step S46, first, as shown in FIG. 14A, the lower surface of the second adhesive sheet F2 in the z-axis direction is held by the same holding member H as in step S43. Further, an elastic body pressing member E similar to step S43 is arranged above the first side margin sheet 117s1 in the z-axis direction.

Next, as shown in FIG. 14B, the elastic body pressing member E is moved downward in the z-axis direction until it comes into contact with the second side margin sheet 117s2, and the elastic body pressing member E further moves the second side margin sheet 117s2. Is pushed downward in the z-axis direction. In step S46, unlike step S45, heat is not applied to the second side margin sheet 117s2.

At this time, the elastic body pressing member E bites into the space between the plurality of laminated bodies 116, so that the region of the second side margin sheet 117s2 that is not held by the second side surface S2 of the laminated body 116 is downward in the z-axis direction. Push down to. As a result, the second side margin sheet 117s2 is cut along the contour of the second side surface S2 of each laminated body 116 by the shearing force applied in the z-axis direction.

Then, as shown in FIG. 14C, the elastic body pressing member E is moved upward in the z-axis direction to separate the elastic body pressing member E from the second side margin sheet 117s2. At this time, the second side margin sheet 117s2 remaining on the second side surface S2 of each laminated body 116 becomes the second side margin portion 117b. The second side margin sheet 117s2 remaining in the space between the plurality of laminated bodies 116 is removed.

Then, the plurality of laminated bodies 116 on which the side margin portions 117a and 117b are formed are peeled off from the second adhesive sheet F2. As a result, the unfired ceramic element 111 shown in FIG. 9 is obtained, and the side margin forming step according to step S04 is completed.

(Details of thermocompression bonding conditions)
In the present embodiment, as described above, in step S42, the first thermocompression bonding is performed to improve the adhesiveness of the laminated body 116 of the first side margin portion 117a to the first side surface S1, and in step S45, the second side margin portion is formed. A second thermocompression bonding is performed to enhance the adhesiveness of the laminated body 116 of 117b to the second side surface S2.

However, the first side margin portion 117a formed before the second side margin portion 117b is affected not only by the first thermocompression bonding but also by heat and pressing force in the second thermocompression bonding. Therefore, in the laminated body 116, the first side margin portion 117a formed on the first side surface S1 tends to be thinner than the second side margin portion 117b formed on the second side surface S2.

On the other hand, in the present embodiment, in order to suppress the difference in thickness between the side margin portions 117a and 117b, the first thermocompression bonding in step S42 and the second thermocompression bonding in step S45 are performed under different conditions. That is, the first condition of the first thermocompression bonding and the second condition of the second thermocompression bonding are set so that the difference in thickness is less likely to occur in the side margin portions 117a and 117b, respectively.

The first condition of the first thermocompression bonding and the second condition of the second thermocompression bonding can be different from any one of the arbitrary factors that affect the deformation mode of the side margin sheets 117s1 and 117s2. Examples of such an element include the temperature of the high-rigidity surface p, the pressing force applied from the high-rigidity surface p, and the pressing time by the high-rigidity surface p. This makes it possible to control the thicknesses of the side margin portions 117a and 117b separately.

Further, in order to control the thickness of the side margin portions 117a and 117b separately, the compositions of the side margin sheets 117s1 and 117s2 can be different. For example, in the side margin sheets 117s1 and 117s2, the amounts of organic components such as binders and solvents can be different. That is, in the side margin sheets 117s1 and 117s2, the flexibility can be increased as the amount of the organic component is increased, and the flexibility can be decreased as the amount of the organic component is decreased.

Further, in order to control the thickness of the side margin portions 117a and 117b separately, the first elastic surface q1 of the first elastic member D1 used for the first thermocompression bonding and the second elastic member D2 used for the second thermocompression bonding. It is also possible to make the elastic modulus different from that of the two elastic surfaces q2. That is, the higher the elastic modulus of the elastic surfaces q1 and q2, the more rapidly the pressing force can be applied to the side margin sheets 117s1, 117s2, and the lower the elastic modulus of the elastic surfaces q1 and q2, the more the side margin sheets 117s1, A pressing force can be gently applied to 117s2.

In addition, in the second thermocompression bonding, the first side margin portion 117a can be cooled in order to make the first side margin portion 117a less likely to be deformed. For example, in the state shown in FIG. 13B, by cooling the second elastic surface q2 of the second elastic member D2, the first side margin portion 117a can be cooled via the second adhesive sheet F2. As a result, the heat applied to the second side margin sheet 117s2 from the highly rigid surface p of the rigid body pressing member G makes it difficult for the first side margin portion 117a to rise in temperature.

<Other Embodiments>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made.

For example, in the above embodiment, the manufacturing method of the multilayer ceramic capacitor 10 has been described as an example of the multilayer ceramic electronic component, but the manufacturing method of the present invention can be applied to all the multilayer ceramic electronic components. Examples of such multilayer ceramic electronic components include chip varistor, chip thermistor, and multilayer inductor.

10 ... Laminated ceramic capacitor 11 ... Ceramic element 12, 13 ... Internal electrode 14, 15 ... External electrode 16 ... Laminated body 17a, 17b ... Side margin 18 ... Capacity forming part 19 ... Cover part 101, 102, 103 ... Ceramic sheet 104 ... Laminated sheet 111 ... Ceramic element 112, 113 ... Internal electrode 116 ... Laminated body 117 ... Side margin portion 117s1, 117s2 ... Side margin sheet S1, S2 ... Side surface F1, F2 ... Adhesive sheet G ... Rigid body pressing member p ... High Rigid surfaces D1, D2 ... Elastic members q1, q2 ... Elastic surface E ... Elastic body pressing member H ... Holding member

Claims (4)

A plurality of ceramic layers laminated in the first axis direction, a plurality of internal electrodes located between the plurality of ceramic layers, and the plurality of internal electrodes facing the second axis direction orthogonal to the first axis. A plurality of laminates arranged on the first adhesive sheet having the first and second side surfaces exposed to the surface and holding the second side surface are prepared.
A series of first side margin sheets are provided under the first condition including pressing by the high rigidity surface against the first side surface of the plurality of laminated bodies held on the first elastic surface via the first adhesive sheet. Thermocompression bonding
A first side margin portion is formed by punching the thermocompression-bonded first side margin sheet at the first side surface of the plurality of laminated bodies.
The plurality of laminates on which the first side margin portion is formed are transferred from the first pressure-sensitive adhesive sheet to the second pressure-sensitive adhesive sheet.
The first condition includes pressing by the high-rigidity surface against the second side surface of the plurality of laminated bodies held on the second elastic surface via the second adhesive sheet and the first side margin portion. A series of second side margin sheets are thermocompression bonded under different second conditions.
A method for manufacturing a laminated ceramic electronic component that forms a second side margin portion by punching the thermocompression-bonded second side margin sheet at the second side surface of the plurality of laminated bodies. The method for manufacturing a laminated ceramic electronic component according to claim 1.
A method for manufacturing a laminated ceramic electronic component in which at least one of the temperature of the high-rigidity surface, the pressing force applied from the high-rigidity surface, and the pressing time by the high-rigidity surface are different from each other under the first and second conditions. The method for manufacturing a laminated ceramic electronic component according to claim 1 or 2.
A method for manufacturing a laminated ceramic electronic component in which the compositions of the first and second side margin sheets are different from each other. The method for manufacturing a laminated ceramic electronic component according to any one of claims 1 to 3.
A method for manufacturing a laminated ceramic electronic component in which the elastic moduli of the first and second elastic surfaces are different from each other.

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