JP2017054863A - Sheet application device and manufacturing method of electronic component employing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet application device which can be appropriately used for applying a sheet when manufacturing an electronic component that is produced via the step of applying a covering ceramic sheet to a side surface with an exposed internal electrode, or the like and a manufacturing method of an electronic component capable of efficiently manufacturing a high-reliability electronic component by employing the same.SOLUTION: The sheet application device comprises: (a) a sheet supply part 5 in which a wound long sheet 111 is mounted so as to be fed out; (b) a sheet cutting part 10 including a chip holding part 11 for holding a chip 110 and a sheet support part 12 for supporting the fed-out sheet 111 and configured to bring a part of the sheet 111 supplied from the sheet supply part 5 and supported by the sheet support part 12 into contact with the chip 110 held by the chip holding part 11, thereby moving the part of the sheet 111 to the chip 110; and (c) a sheet recovery part 20 for recovering the remaining sheet 111 that has been partially moved to the chip 110.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sheet applicator and a method of manufacturing an electronic component using the same, and more specifically, for example, a sheet applicator used when a ceramic sheet or the like is attached to a chip to be an electronic component, and the same The present invention relates to a method for manufacturing an electronic component manufactured through a process of attaching a sheet such as a ceramic sheet to a chip.

  For example, as shown in FIG. 7, a conventional general multilayer ceramic capacitor has a pair of end faces 104a and 104b of a chip 110 in which a plurality of internal electrodes 102a and 102b are laminated via a ceramic layer 101 which is a dielectric layer. In addition, a pair of external electrodes 105a and 105b is provided so as to be electrically connected to the internal electrodes 102a and 102b.

And such a multilayer ceramic capacitor is usually
(1) A step of laminating a ceramic green sheet and an internal electrode layer to form a laminated sheet,
(2) cutting the laminated sheet and dividing it into individual unfired chips;
(3) A step of forming a laminate by firing individual unfired laminated chips,
(4) Manufactured through a step of forming external electrodes on the laminate.

  In recent years, in order to further increase the capacity of multilayer ceramic capacitors, as shown in FIG. 8, internal electrodes 102a and 102b and ceramic layer 101 are laminated, and internal electrodes 102a and 102b are alternately disposed on the opposite end face. A chip 110 that is drawn out and does not have a ceramic portion that covers the side surface, and forms an unfired chip with the internal electrodes 102a and 102b exposed from the side surface, and a ceramic sheet for coating on the side surface of the chip A method of manufacturing a multilayer ceramic capacitor in which a ceramic ceramic sheet covering a side surface is small by pasting (ceramic green sheet), and a multilayer ceramic capacitor having a large acquisition capacity with respect to the volume of the product is obtained. Have been developed, and multilayer ceramic capacitors manufactured by such a method are put to practical use. It has come.

  And in patent document 1, after forming the chip | tip which does not have the ceramic part which coat | covers a side surface, and sticking the ceramic sheet | seat for a coating | coated to the side surface, it passes through the process of baking, and is reliable with small and large capacity | capacitance. A method for manufacturing a multilayer ceramic capacitor that makes it possible to manufacture a high-performance multilayer ceramic capacitor with high yield is disclosed.

Japanese Patent Laying-Open No. 2015-026721

  However, in the case of a method for manufacturing a multilayer ceramic capacitor having a step of attaching a ceramic sheet for coating on a side surface as in Patent Document 1, there are many manufacturing steps compared to a conventional method for manufacturing a multilayer ceramic capacitor. Therefore, there is a problem that productivity is lowered, and the fact is that improvement of productivity is an issue.

  The present invention solves the above-described problem, and in the case of manufacturing an electronic component manufactured through a step of applying a ceramic sheet for coating on the side surface where the internal electrode is exposed, the sheet is applied. It is an object of the present invention to provide a sheet applying apparatus that can be suitably used, and an electronic component manufacturing method that can efficiently manufacture a highly reliable electronic component using the sheet applying device.

In order to solve the above problems, the sheet applying apparatus of the present invention is:
A sheet supply unit that is loaded with a wound long sheet and supplies the sheet;
A chip holding unit for holding a chip; and a sheet support unit for supporting the sheet supplied from the sheet supply unit, and a part of the sheet supported by the sheet support unit and held by the chip holding unit A sheet cutting part configured to bring a part of the sheet into the chip by bringing the chip into contact with the chip; and
And a sheet collecting unit that collects the remaining sheet partially transferred to the chip.

  In the sheet applying apparatus of the present invention, it is preferable that the apparatus further includes a roll that feeds the sheet that has passed through the sheet cutting section, and that has a diameter that decreases from the end in the axial direction toward the center.

A region of the sheet corresponding to the center of the tension roll, that is, a center region in the width direction perpendicular to the longitudinal direction of the long sheet includes a region where a part of the sheet is applied to the chip and no sheet exists. Therefore, when the sheet is conveyed with a large force, the sheet extends in the central region in the width direction, and it becomes difficult to convey the sheet in a flat state.
On the other hand, as described above, there is no sheet when the roll that feeds the sheet that has passed through the sheet cutting section and further includes a roll that decreases in diameter as it approaches the center from the end in the axial direction. The width direction both end side areas that do not include the area or the area where the sheet does not exist are conveyed with a large force, and the central area in the width direction of the sheet is conveyed with a small force. The remaining sheet after the transfer can be reliably collected while being kept flat, and the present invention can be more effectively realized.

  In addition, it is preferable to further include a bar that is positioned upstream and downstream of the sheet support portion and that abuts the sheet and applies tension to the sheet.

  When a bar that abuts against the sheet and applies tension to the sheet is provided, it is possible to suppress or prevent the sheet from becoming loose, wrinkling, or difficult to convey. It is possible to carry the product reliably, which is meaningful.

  The bar does not come into contact with the sheet when the sheet is conveyed, but comes into contact with the sheet when the sheet stops and a part of the sheet moves to the chip, thereby tensioning the sheet. It is preferable that it is comprised so that.

  When the sheet is transported, the bar does not come into contact with the sheet, and when the sheet stops and a part of the sheet is applied to the chip, the bar comes into contact with the sheet so that tension is applied to the sheet. Since the bar does not touch the sheet while it is stopped and the sheet does not receive an excessively large force, it is possible to tension the sheet only when necessary, and the sheet is conveyed reliably It becomes possible.

The wound long sheet is attached to a film,
A peeling mechanism that is located upstream from the sheet supply unit and downstream from the sheet support unit, and peels the sheet from the film;
A film recovery section for recovering the film from which the sheet has been peeled;
Is preferably further provided.

  A long sheet is affixed to the film, located upstream from the sheet supply unit and downstream from the sheet support unit, a peeling mechanism for peeling the sheet from the film, and a film for collecting the film from which the sheet has been peeled By including the recovery unit, the sheet can be conveyed to the front of the sheet cutout part in a stable state where the sheet is adhered to the film, which is significant.

Moreover, it is preferable that the said sheet | seat support part is located in the one side of the said sheet | seat, and the said chip | tip holding | maintenance part and the said film collection | recovery part are located in the other side of the said sheet | seat.
The surface of the sheet that is affixed to the film is less likely to have foreign matter attached to it than the exposed surface that is not affixed to the film. It becomes possible to affix the surface, which has been affixed to the film, with a low possibility of foreign matter adhering to the chip.

  Further, by configuring the chip holding part and the film recovery part to be located on one side and the sheet support part to be located on the other side, it becomes possible to surely peel the sheet, and the present invention is more effective. It can be announced.

The sheet supply unit supplies a sheet attached to the film,
The sheet support unit abuts a part of the sheet affixed to the film and a chip held by the chip holding unit to transfer a part of the sheet to the chip,
It is preferable that the sheet collecting unit collects the remaining sheet attached to the film, part of which has been transferred to the chip.

  With the above configuration, even when the sheet collecting unit collects the remaining sheet attached to the film, a part of which has been transferred to the chip, the sheet can be reliably applied to the chip. A sheet applying apparatus can be provided.

In the electronic component manufacturing method according to the present invention, the sheet applying apparatus according to the present invention is used to bring the sheet supported by the sheet supporting portion into contact with the chip held by the chip holding portion. A step of applying a part of the sheet to the chip;
And firing the chip provided with a part of the sheet to obtain a main body of the electronic component.

  The sheet applying apparatus of the present invention includes a sheet supply unit that feeds out a long sheet, a chip holding unit, and a sheet support unit that supports the fed sheet, and a part of the sheet supported by the sheet support unit And a sheet cutting unit for bringing the chip held by the chip holding unit into contact with each other and transferring a part of the sheet to the chip, and a sheet collecting unit for collecting the remaining sheet with a part transferred to the chip. Therefore, it is possible to continuously supply and convey the sheet using a long sheet, to reliably apply the sheet to the chip, and to continuously collect the remaining sheet.

  As a result, the sheet can be efficiently applied to the chip. For example, when manufacturing a multilayer ceramic capacitor by forming a green chip that does not have a ceramic part that covers the side surface and pasting a ceramic sheet for coating on the side surface, the multilayer ceramic capacitor can be produced. It becomes possible to manufacture well.

  Further, the electronic component manufacturing method of the present invention uses the above-described sheet applying apparatus of the present invention to bring the sheet supported by the sheet support portion and the chip held by the chip holding portion into contact with each other, Since it includes a step of applying a part of the sheet to the chip and a step of obtaining the main body of the electronic component by baking the chip provided with a part of the sheet, for example, it does not have a ceramic part that covers the side surface. In the case of manufacturing a multilayer ceramic capacitor through a process of forming a green chip and attaching a ceramic sheet for coating on the side surface thereof, the multilayer ceramic capacitor can be manufactured with high productivity.

It is a figure which shows schematic structure of the sheet | seat provision apparatus concerning Embodiment 1 of this invention. It is a figure explaining operation | movement of the sheet | seat provision apparatus concerning Embodiment 1 of this invention, Comprising: It is a figure which shows the state which made the sheet | seat approach the chip | tip. It is a figure explaining operation | movement of the sheet | seat provision apparatus concerning Embodiment 1 of this invention, Comprising: It is a figure which shows the state which presses a sheet | seat against a chip | tip and is providing the sheet | seat to a chip | tip. It is a figure which shows the structure of the electronic component manufactured through the process of sticking a sheet | seat using the sheet | seat provision apparatus concerning Embodiment 1 of this invention, Comprising: (a) is a perspective view, (b) is front sectional drawing. is there. It is a figure which shows the structure of the chip | tip obtained by dividing | segmenting the mother laminated body produced at the manufacturing process of the electronic component shown in FIG. It is a perspective view which shows the chip | tip of the state which provided the sheet | seat to a pair of side surface which the internal electrode exposed. It is sectional drawing which shows the structure of the multilayer ceramic capacitor which is one of typical electronic components. It is a perspective view which shows the structure of the chip | tip formed in 1 process of the manufacturing method of the conventional electronic component.

Embodiments of the present invention will be described below to describe the features of the present invention in more detail.
In this embodiment, a sheet applying apparatus used when manufacturing a multilayer ceramic capacitor, which is one of electronic components, as shown in FIGS. 4A and 4B will be described as an example.

  4A and 4B, the multilayer ceramic capacitor has a pair of side surfaces 103 (103a, 103b) of a chip 110 in which a plurality of internal electrodes 102 (102a, 102b) are stacked via a ceramic layer 101. A ceramic layer 111 is attached as an insulating layer, and a pair of external electrodes 105 (105a, 105b) are disposed on the pair of end faces 104 (104a, 104b) so as to be electrically connected to the internal electrodes 102 (102a, 102b). It has a structure.

  As shown in FIG. 5, the multilayer ceramic capacitor is manufactured from a chip 110 obtained by cutting and dividing the mother multilayer body M. In the chip 110, the internal electrode layers 102 (102 a, 102 b) adjacent to each other in the stacking direction are alternately drawn out from a pair of end faces 104 facing each other, and a ceramic is formed on a pair of side surfaces 103 (103 a, 103 b) facing each other. Each of the internal electrode layers 102 alternately stacked with the layers 101 has a structure exposed. An unfired ceramic sheet 111 is attached to the pair of side surfaces 103 of the chip 110 as shown in FIG. 6 and fired, and then external electrodes are formed at both ends of the chip 110 as shown in FIGS. A multilayer ceramic capacitor is produced by forming 105

  As a preferred embodiment of the present invention, a sheet applying apparatus used in the process of attaching the ceramic sheet 111 to the pair of side surfaces 103 of the chip 110 will be described.

<1> Sheet Applying Device As shown in FIG. 1, the sheet applying device according to this embodiment includes (a) a sheet supply unit 5 for supplying a sheet 111 and (b) applying a part of the sheet 111 to a chip 110. A sheet cutting section 10 for performing the above operation, and (c) a sheet collecting section 20 for collecting the remaining sheet 111, a part of which has been transferred to the chip 110.

  In the sheet applying apparatus according to the embodiment, as shown in FIG. 1, a sheet-like material made of a material that can be expanded in the surface direction, in which the chips 110 are aligned and held in a matrix at predetermined intervals. The holding jig 13 is sucked and held on the lower surface of the chip holding unit 11 so that the chip 111 is held by the chip holding unit 11.

  Moreover, the sheet | seat support part 12 is comprised so that the sheet | seat 111 may be supported via the elastic layer 12a which used the silicon rubber for the surface.

  In the sheet applying apparatus of this embodiment, the sheet supply unit 5 of (a) includes a sheet feeding roll 5a that feeds the wound long sheet 111.

  The sheet cutting unit 10 of (b) includes a chip holding unit 11 that holds the chip 110 and a sheet support unit 12 that supports the fed sheet 111. The sheet cutting unit 10 is supplied from the sheet supply unit 5, and a part of the sheet 111 supported by the sheet support unit 12 and the chip 110 held by the chip holding unit 11 are brought into contact with each other, so that the sheet 111 A part is configured to be transferred to the chip 110. That is, in the sheet applying apparatus according to this embodiment, a part of the sheet 111 strikes the chip 110 by pressing the chip 110 held by the chip holding unit 11 and the sheet 111 supported by the sheet support unit 12. It is pulled out and transferred to the chip. In other words, the sheet 111 is cut out by part of the sheet 111 being punched into the chip 110. In addition, the aspect by which the sheet | seat 111 is cut off is not restricted to the method by punching, Other known means may be used.

  Note that a chip holding unit 11 that holds the chip 110 and a sheet support unit 12 that supports the sheet 111 are provided. A part of the sheet 111 supported by the sheet support unit 12 is punched out with a chip, and one sheet 111 is formed. The mechanism for applying the portion to the chip is also described in the above-mentioned Patent Document 1 (Japanese Patent Laid-Open No. 2015-026721).

  The sheet collecting unit 20 in (c) is a mechanism that collects the remaining sheet 111 partially transferred to the chip 110, and includes a sheet take-up roll 20a.

  In addition, the sheet applying apparatus according to this embodiment is in contact with the sheet 111, holds the sheet 111, and passes the sheet 111 between the chip holding unit 11 and the sheet support unit 12 while applying tension to the sheet 111. At the same time, in the sheet application step of applying a part of the sheet 111 supported by the sheet support unit 12 to the chip 110 held by the chip holding unit 11, a tension roll 15 for applying tension to the sheet 111 is disposed downstream thereof. A support roll 25 is provided that supports the sheet 111 that has been provided and has undergone the sheet application step. The tension roll 15 and the support roll 25 are rolls for feeding the sheet 111 that has passed through the sheet cutting section. And at least 1 of the roll which sends the sheet | seat 111 which passed the sheet | seat cutting part is comprised so that a diameter may become small as it approaches the center from the edge of an axial direction. In the present embodiment, the tension roll 15 is configured to have a diameter that decreases from the end in the axial direction toward the center.

In addition, it is preferable that the rate of change of the diameter of the tension roll 15 from the end in the axial direction toward the center is, for example, 2 to 3%. Note that the change rate of 2 to 3% means a state of change in which the center diameter is 97 to 98 when the end diameter is 100.
Further, in the vicinity of the tension roll 15, an auxiliary roll 15 a for height adjustment for defining the height of the sheet 111 is provided.
Note that the support roll 25 may be configured such that the diameter decreases as it approaches the center from the end in the axial direction.

Further, the sheet applying apparatus of this embodiment is located upstream and downstream of the sheet support unit 12 and applies a part of the sheet 111 supported by the sheet support unit 12 to the chip 110 held by the chip holding unit 11. In the sheet applying step, the bars 16a and 16b that abut the sheet 111 and apply tension to the sheet 111 are provided.
The bars 16a and 16b do not come into contact with the sheet 111 when the sheet 111 is conveyed, but come into contact with the sheet 111 when the sheet 111 stops and a part of the sheet 111 moves to the chip 110. It is comprised so that tension may be given to.
However, as a configuration for applying tension to the sheet 111 at the time of applying the sheet, it is possible to adopt a configuration in which the bars 16a and 16b are not provided and only the above-described tension roll 15 is provided.

  Further, the tension roll 15 can also function to peel off the remaining part other than the part applied to the chip of the sheet 111 attached to the chip 110 in the sheet applying process.

  Further, in the sheet applying apparatus of this embodiment, the sheet 111 is configured to be supplied from the sheet supply unit 5 in a state of being attached to the film 2, and between the sheet supply unit 5 and the sheet support unit 12. A peeling mechanism 23 that functions to peel the sheet 111 from the film 2 is disposed therebetween.

  The peeling mechanism 23 includes rolls 21 and 22 for peeling the sheet, and the sheet 111 attached to the film 2 is configured to be conveyed between the roll 21 and the roll 22. And it is comprised so that the sheet | seat 111 may be handed over to the tension roll 15 via the roll 21, and the film 2 may be wound up by the film winding roll 30a via the roll 21. FIG.

  And in the sheet | seat provision apparatus of this embodiment, the above-mentioned film winding roll 30a comprises the film collection | recovery part 30 which collect | recovers the films 2 after the sheet | seat 111 peeled. However, the film collection unit 30 may be a collection box or the like, and is not limited to a configuration using a roll.

  Further, in the sheet applying apparatus of this embodiment, when one region A1 separated by the sheet 111 is on one side and the other region A2 is on the other side, the chip holding unit 11 and the film recovery unit 22 are on the other side. The seat support 12 is configured to be positioned in the space A1 on one side. That is, the surface 111a of the sheet 111 that has been affixed to the film 2 is less likely to have foreign matter attached than the surface 111b that has not been affixed to the film 1, and has the above configuration. , The surface (surface pasted on the film 2) 111 a that is less likely to have foreign matter is facing the chip 110, and the surface 111 b not pasted on the film 2 is facing the sheet support portion 12. Will do. Therefore, the clean surface 111a that has been attached to the film 2 of the sheet 111 is attached to the chip 110, and the reliability of the product can be ensured.

  In addition, the sheet applying apparatus according to this embodiment further includes rolls 26 and 27 and the like in order to reliably convey the sheet, but may be omitted depending on circumstances.

  Moreover, in the sheet | seat provision apparatus of this invention, the above-mentioned peeling mechanism 23 and the film collection | recovery part 30 are not provided, but after using the sheet | seat provision process in the state which the sheet | seat 111 was affixed on the film 2, it is on a film. The remaining sheet may be collected together with the film by the sheet collecting unit 20.

<2> Method for applying a sheet to a chip
Next, a method for applying a sheet to a chip using the sheet applying apparatus configured as described above and the operation at that time will be described.

(1) First, the sheet feeding roll 5a and the film take-up roll 30a are rotated to start the supply of the sheet 111 attached to the film 2.
When the sheet 111 is conveyed and reaches the rolls 21 and 22 for sheet peeling, the sheet 111 and the film 2 are peeled as described above.
The peeled sheet 111 passes through the tension roll 15 and the support roll 25 disposed on the downstream side thereof, and is taken up by the rotation of the sheet take-up roll 20a constituting the sheet collection unit 20.

(2) Next, the tension roll 15 is moved from the position upstream of the sheet cutting section 10 shown in FIG. 1 to the position downstream of the sheet cutting section 10 shown in FIG. The height is adjusted so that the distance between the chip 110 held by the portion 11 and the sheet 111 is shortened.
Although the peeling roll 21 and the tension roll 15 have the same height, the height of the both is different from that of the downstream support roll 25, and the roll 21 and the tension roll 15 are It is disposed at a position higher than the support roll 25 on the downstream side.

Therefore, even when the tension roll 15 is moved between the upstream side and the downstream side, the sheet 111 held between the roll 21 and the tension roll 15 is kept horizontal.
Further, since an auxiliary roll 15a for height adjustment is disposed in the vicinity of the tension roller, the sheet 111 held between the auxiliary roll 15a and the downstream support roll 25 is kept horizontal.

  Since the tension roll 15 has the same height as the roll 21 as described above, the tension roll 15 moves to a position downstream of the sheet cutting section 10 as shown in FIG. Then, the horizontally held sheet 111 approaches the chip holding unit 11 via the sheet-like holding jig 13 made of a material that can be expanded in the surface direction.

  (3) Thereafter, the sheet support unit 12 is raised and the sheet 111 supported by the sheet support unit 12 is pressed against the lower surface of the chip 110 (see FIG. 3), so that a part of the sheet 111, that is, the chip The portion pressed against the lower surface of 110 is applied to the chip 110.

  In the process of applying the sheet 111 to the chip 110, the bars 16 a and 16 b positioned upstream and downstream of the sheet support 12 and the chip holder 11 are abutted against the sheet 111 as the sheet support 12 moves up. Appropriate tension is applied to the sheet 111 in contact therewith.

  As the sheet support 12 further moves up, the sheet 111 to which an appropriate tension is applied comes into contact with the lower surface of the chip 110, and the sheet support 12 having an elastic layer 12a made of silicon rubber on the surface further. By pressing the sheet 111 against the lower surface of the chip 110, the portion of the sheet 111 pressed against the lower surface of the chip 110 is punched out and is reliably applied to the chip 110. According to this method, a part of the sheet 111 is cut out in a state where the long sheet 111 is tensioned. Then, the conveyance of the sheet 111, the partial cutting of the sheet 111, and the collection of the remaining sheets 111 can be performed by a series of operations. Further, in the present embodiment, the chip 110 is positioned above, and the surface of the chip 110 to which a part of the sheet 111 is attached faces downward. Therefore, impurities such as dust are hardly placed on the surface of the chip 110 to which a part of the sheet 111 is attached.

  (4) Thereafter, the sheet support portion 12 is lowered, and the remaining portion of the sheet 111 that is partly applied to the chip 110 is lowered together with the sheet support portion 12. At this time, the remaining part of the sheet 111 is separated from the bars 16a and 16b.

  (5) Then, the tension roll 15 is moved from the position downstream of the sheet cutting section 10 shown in FIG. 3 to the position upstream of the sheet cutting section 10 shown in FIG. Prepare for the process. When the tension roll 15 is moved from a position downstream of the sheet cutting unit 10 to a position upstream of the sheet cutting unit 10, the sheet 111 is not conveyed.

  By repeating the above steps (1) to (5), it is possible to continuously and reliably apply the sheet 111 to the chip 110.

<3> Method for Manufacturing Electronic Component Next, a method for manufacturing an electronic component (in this embodiment, a multilayer ceramic capacitor) using the above-described sheet applying apparatus will be described.
In this embodiment, the case where the multilayer ceramic capacitor shown in FIGS. 4 to 6 is manufactured through the process of applying the sheet 111 to the chip 110 using the above-described sheet applying apparatus will be described as an example.

In addition, the process of manufacturing this multilayer ceramic capacitor is as follows:
(1) A step of producing a laminated block that is an aggregate of individual chips (step S1);
(2) a step of cutting the laminated block and dividing it into individual chips (step S2);
(3) A step of applying a ceramic sheet (ceramic green sheet) for covering the side surface of the chip to the side surface of the chip (step S3);
(4) a step of firing the chip with the ceramic sheet attached to the side surface (step S4);
(5) A step of forming external electrodes on the fired chip (step S5) is mainly provided.

Hereinafter, each process is demonstrated in order.
(Step S1) Production of laminated block A ceramic slurry containing ceramic powder, a binder and a solvent is prepared. The ceramic slurry is formed into a sheet shape on a carrier film using a die coater, a gravure coater, or the like to produce a ceramic green sheet.
Next, a conductive paste is printed on the ceramic green sheet by a method such as screen printing or gravure printing to form an electrode pattern having a predetermined shape on the surface of the ceramic green sheet.
Then, a plurality of ceramic green sheets on which this electrode pattern is formed and ceramic green sheets on which no electrode pattern is formed are laminated in a predetermined order, and a laminated block is produced by thermocompression bonding.

(Step S2) Cutting of Laminate Block The laminate block produced as described above is cut into a matrix and divided into individual chips (see FIG. 5). The laminated block may be divided only in one direction and separated into rod-shaped chips.
In addition, when the laminated block is cut and divided at a plurality of locations by the press cutting method using a cutting blade, the cut surface and one of the pair of main surfaces of the laminated block are cut so that the angle is slightly less than 90 °. It is preferable to do so.

(Step S3) Application of Ceramic Sheet for Coating to Chip (S3-1) Holding a plurality of chips obtained by cutting a laminated block into pieces and having adhesiveness and capable of being expanded in the surface direction While being held on the jig, the holding jig is expanded in the surface direction, the interval between adjacent chips is increased, and each chip is rolled so that the cut surface of each chip becomes the upper surface.
Then, the holding jig 13 holding each chip 110 is held by the chip holding jig 11 (see FIGS. 1 to 3) of the above-described <1> sheet applying apparatus.

  (S3-2) Then, according to the method for applying a sheet to the chip of <2> above, the covering ceramic sheet 111 (see FIG. 6) is attached to the cut surface of the chip 110 (the side surface 103a in FIG. 5).

  (S3-3) Then, each chip is further rolled, the opposite cut surface (side surface 103b in FIG. 5) is exposed toward the upper surface side, and the cutting surface (side surface 103b in FIG. 5) is coated with ceramic. A sheet 111 is pasted.

In addition, even if a chip | tip is a stick-shaped chip | tip mentioned above, the ceramic sheet | seat for a coating | cover can be affixed similarly.
However, in the case of a rod-shaped chip, after the ceramic sheet for covering is attached, the rod-shaped chip is cut to be divided into individual chips.

  When the ceramic sheet for coating is applied to the chip, the sheet support part 12 (see FIG. 3) is raised to increase the speed at which the sheet 111 is pressed against the chip 110 held by the chip holding part 11. The ceramic sheet can be made difficult to stretch, and the break starting point can be easily formed.

  The movement speed of the sheet 110 (relative movement speed of the chip and the sheet) from the time when the sheet 111 is pressed against the chip 110 to the time when the break start point is generated on the sheet 111 is 0.6 mm / s or more and 1 mm / s or less. It is preferable that the relative movement speed of the sheet until the sheet is punched after the break starting point is smaller than the moving speed from the start of pressing to the break starting point, and is 0.2 mm / s. As mentioned above, it is preferable that it is 0.4 mm / s or less.

  In addition, by controlling the temperature of the sheet 111 and the chip 110 when the sheet 111 is pressed against the chip 110, it is possible to easily form the fracture starting point.

  Specifically, the temperature of the chip 110 is preferably lower than the glass transition temperature of the resin component contained in the sheet 111. For example, when the glass transition temperature of the sheet 111 is 40 ° C., it is preferable to provide a difference of 10 ° C. or more and set the temperature of the chip 110 to 10 ° C. or more and 30 ° C. or less. The chip 110 can be cooled by, for example, a cooler provided in the chip holding unit 11 so that the temperature falls within the above-described temperature range.

  In addition, an organic solvent is used for bonding the chip 110 and the covering sheet 111. However, if a large amount of the organic solvent is used, the covering sheet 111 is likely to be stretched, and a break start point is difficult to be formed. Therefore, it is desirable to reduce the amount of the organic solvent used from the viewpoint of facilitating formation of the fracture starting point. In addition, it is desirable to use the sheet 111 that can ensure adhesion even when the amount of the organic solvent used is small.

  The coating sheet is usually formed by coating a ceramic slurry on a polyethylene terephthalate (PET) film. Depending on the type of PET film and the drying conditions during coating, the resin component contained in the sheet may be By segregating to the PET film side, peeling the PET film, and bonding the surface of the sheet with the PET film attached to the chip, the chip and the sheet are securely bonded even with a small amount of organic solvent used. It becomes possible.

  Moreover, although the sheet | seat support part 12 shown in FIGS. 1-3 is equipped with the elastic layer 12a which used the silicon rubber on the surface, the elastic layer 12a is an organic solvent used for adhesion | attachment of the chip | tip 110 and the sheet | seat 1 for coating | cover. Swells and decreases in hardness. And when hardness falls, it becomes difficult to give required stress to the sheet | seat 111 for a coating | cover, and it becomes difficult to form a fracture | rupture starting point in the sheet | seat 111. FIG. Therefore, as a countermeasure against this, it is preferable to configure the elastic layer 12a using silicon rubber so that it can be automatically and periodically replaced.

  Further, the organic solvent penetrates into the elastic layer 12a using silicon rubber, and the uncrosslinked component in the elastic layer 12a is driven out to the surface, or the swelling of the elastic layer 12a is saturated and the organic solvent becomes the surface of the elastic layer 12a. May accumulate. In such a case, since the uncrosslinked component and the residual solvent contain an adhesive component, the chip 110 adheres to the surface of the elastic layer 12a at a stage after a part of the sheet 111 is applied to the chip 110. There is a problem that the chip holder 11 falls off.

As a countermeasure for this, for example, it is preferable to carry out a process of removing the uncrosslinked component of the elastic layer 12a by using a solvent or pressurizing.
Further, it is preferable to periodically scrape and remove the residual solvent on the surface of the elastic layer 12a.

  (S3-4) Thereafter, the chip with the covering sheet attached to the side surface is fired under predetermined conditions. As a result, a sintered chip is obtained.

  (S3-5) Then, external electrodes are formed on both ends of the fired chip by, for example, a method of applying and baking a conductive paste. Thereby, a multilayer ceramic capacitor having a structure as shown in FIGS. 4A and 4B is obtained.

  By manufacturing the multilayer ceramic capacitor by the method of the above embodiment, it is possible to efficiently manufacture a small size, large capacity and highly reliable multilayer ceramic capacitor.

  In the above embodiment, the case where a multilayer ceramic capacitor is manufactured has been described as an example. However, the present invention is not limited to a multilayer ceramic capacitor, and other electronic components such as a multilayer varistor, a multilayer LC composite component, and a multilayer substrate are manufactured. It is possible to apply to a wide range of cases.

  The present invention is not limited to the above embodiment even in other respects, and it relates to the configuration of the chip holding part, the sheet supporting part, the sheet cutting part, etc., and various applications and modifications within the scope of the invention. Can be added.

DESCRIPTION OF SYMBOLS 2 Film 5 Sheet supply part 5a Sheet feeding roll 10 Sheet cutting part 11 Chip holding part 12 Sheet support part 12a Elastic layer using silicon rubber 13 Holding jig (expansion sheet)
DESCRIPTION OF SYMBOLS 15 Tension roll 15a Auxiliary roll 16a, 16b for height adjustment Bar 20 Sheet | seat collection | recovery part 20a Sheet take-up roll 21,22 Roll for sheet peeling 23 Peeling mechanism 25 Support roll 30 Film collection | recovery part 30a Film take-up roll 101 Ceramic layer 102 (102a, 102b) Internal electrode 103 (103a, 103b) Side surface of chip 104 (104a, 104b) End surface of chip 105 (105a, 105b) External electrode 110 Chip 111 Sheet 111a Surface affixed to sheet film 111b The surface of the sheet that was not attached to the film A1 One area separated by the sheet A2 The other area separated by the sheet

Claims (8)

A sheet supply unit that is loaded with a wound long sheet and supplies the sheet;
A chip holding unit for holding a chip; and a sheet support unit for supporting the sheet supplied from the sheet supply unit, and a part of the sheet supported by the sheet support unit and held by the chip holding unit A sheet cutting part configured to bring a part of the sheet into the chip by bringing the chip into contact with the chip; and
A sheet collecting apparatus, comprising: a sheet collecting unit that collects a remaining sheet partially transferred to the chip. The sheet applying apparatus according to claim 1, further comprising a roll that feeds the sheet that has passed through the sheet cutting section, and has a diameter that decreases from an axial end toward the center.   The sheet applying apparatus according to claim 1, further comprising a bar that is positioned upstream and downstream of the sheet support portion and that abuts the sheet and applies tension to the sheet.   The bar does not contact the sheet when the sheet is conveyed, but contacts the sheet when the sheet stops and a part of the sheet moves to the chip, thereby applying tension to the sheet. The sheet applying apparatus according to claim 3, wherein the sheet applying apparatus is configured as described above. The wound long sheet is attached to a film,
A peeling mechanism that is located upstream from the sheet supply unit and downstream from the sheet support unit, and peels the sheet from the film;
A film recovery section for recovering the film from which the sheet has been peeled;
The sheet applying apparatus according to claim 1, further comprising:   The sheet applying apparatus according to claim 5, wherein the sheet supporting unit is located on one side of the sheet, and the chip holding unit and the film collecting unit are located on the other side of the sheet. The sheet supply unit supplies a sheet attached to the film,
The sheet support unit abuts a part of the sheet affixed to the film and a chip held by the chip holding unit to transfer a part of the sheet to the chip,
The sheet applying apparatus according to any one of claims 1 to 4, wherein the sheet collecting unit collects the remaining sheet that is partially transferred to the chip and attached to the film. The sheet applying apparatus according to claim 1, wherein the sheet supported by the sheet support unit and the chip held by the chip holding unit are brought into contact with each other, thereby the sheet Applying a part of the chip to the chip;
Firing the chip to which a part of the sheet is applied to obtain a main body of the electronic component.

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