JP6426112B2 - Method of manufacturing laminated ceramic electronic component - Google Patents

Description

  The present invention relates to a method of manufacturing a laminated ceramic electronic component to which a side margin portion is attached.

  In recent years, with the miniaturization and higher performance of electronic devices, the demand for smaller size and higher capacity for multilayer ceramic capacitors used in electronic devices is becoming increasingly strong. In order to meet this demand, it is effective to enlarge the internal electrodes of the multilayer ceramic capacitor. In order to enlarge the internal electrode, it is necessary to make the side margin thinner for securing insulation around the internal electrode.

  On the other hand, it is difficult to form a side margin portion of uniform thickness by the accuracy of each process (for example, patterning of internal electrodes, cutting of laminated sheet, etc.) in a general method of manufacturing a laminated ceramic capacitor. Therefore, in the method of manufacturing such a multilayer ceramic capacitor, it is more difficult to secure insulation around the internal electrode as the side margin portion is thinner.

  Patent Document 1 discloses a technique for retrofitting a side margin portion. That is, in this technique, by cutting the laminated sheet, a laminated chip in which the internal electrode is exposed on the side surface is manufactured, and the side margin portion is provided on the side surface of the laminated chip. Thus, the side margin portion having a uniform thickness can be formed, so that the insulation around the internal electrode can be ensured even when the side margin portion is thinned.

  In the technology disclosed in Patent Document 1, the side margin sheet is punched by a plurality of laminated chips arranged so that the side faces the side margin sheet. As a result, side margin portions can be simultaneously formed on the side surfaces of the plurality of laminated chips, so that high mass productivity can be obtained.

JP 2012-209539 A

  In the technique disclosed in Patent Document 1, the pressing force necessary for punching out the side margin sheet on the side surface of the laminated chip increases as the number of laminated chips forming the side margin portion increases. Therefore, in this technology, in order to improve mass productivity, it is necessary to introduce a large-sized apparatus and complex equipment.

  In view of the circumstances as described above, it is an object of the present invention to provide a method of manufacturing a laminated ceramic electronic component which can easily and efficiently attach a side margin portion.

In order to achieve the above object, in a method of manufacturing a multilayer ceramic electronic component according to an aspect of the present invention, a laminated ceramic layer, an internal electrode disposed between the ceramic layers, and a side surface on which the internal electrode is exposed And a plurality of laminated chips arranged in such a manner that the side surfaces face the side margin sheet.
By applying a pressing force between the side surface and the side margin sheet for the plurality of laminated chips, an operation of punching out the side margin sheet at the side surface is performed in multiple times.

A large pressing force is required to punch out the side margin sheet collectively with a plurality of laminated chips.
In this respect, in the above configuration, since the operation for punching out the side margin sheet on the side surface of the plurality of laminated chips is performed a plurality of times, the pressing force in each punching operation may be small. For this reason, the side margin can be efficiently retrofitted without the introduction of large-sized equipment or complicated equipment.

The plurality of stacked chips may be divided into a plurality of pressing areas.
The above operation may be performed for each of the plurality of pressing areas.
In this configuration, since the punching operation is performed for each pressing area, the pressing force in each punching operation may be small.

The plurality of stacked chips may form a plurality of rows.
The plurality of rows may be respectively divided into the plurality of pressing areas.
In this configuration, since the punching operation is performed for each row of stacked chips, the pressing force in each punching operation may be small.

Each of the plurality of pressing areas may have a common shape.
You may perform the said operation | movement using the press part corresponding to the said common shape.
In this configuration, the punching operation can be performed using a common pressing unit for a plurality of pressing regions. Thereby, the apparatus and equipment for performing the punching operation can be simplified.

In the above operation, a pressing force may be applied to the side margin sheet by an elastic body.
Further, in the above operation, a pressing force may be applied to the plurality of laminated chips.
In these configurations, the punching operation can be performed better.

The above operation may be continuously performed by relatively moving the pressing portion in the arrangement direction of the plurality of laminated chips while applying pressing force between the side surface and the side margin sheet by the pressing portion. .
In this case, the pressing portion may be a roller having a central axis parallel to the arrangement direction.
In these configurations, the punching operation can be continuously performed on a plurality of laminated chips by relatively moving the pressing unit such as a roller. In these configurations, since it is not necessary to release the pressing force by the pressing unit for each punching operation, the punching operation can be performed more efficiently.

In a method of manufacturing a laminated ceramic electronic component according to an aspect of the present invention, a laminated ceramic layer, an internal electrode disposed between the ceramic layers, and first and second side surfaces where the internal electrode is exposed; A plurality of laminated chips are prepared, each having the first side face facing the first side margin sheet and the second side face facing the second side margin sheet.
By applying a pressing force to the first and second side margin sheets with respect to the plurality of laminated chips, the operation of simultaneously punching out the first and second side margin sheets at the first and second side surfaces is performed multiple times. It is divided and executed.
In this case, the pressing force is applied to the first and second side margin portions by a pair of rollers having a central axis parallel to the arrangement direction of the plurality of laminated chips, and the pair of rollers are relatively moved in the arrangement direction Thus, the above operation may be performed continuously.

  In these configurations, it is possible to simultaneously form side margin portions on both side surfaces of the laminated chip while suppressing the pressing force in each punching operation small. That is, in these configurations, the side margin can be added more efficiently.

  It is possible to provide a method of manufacturing a laminated ceramic electronic component which can be easily and efficiently retrofitted with side margin portions.

1 is a perspective view of a multilayer ceramic capacitor according to a first embodiment of the present invention. It is a sectional view along the AA 'line of the above-mentioned multilayer ceramic capacitor. It is a sectional view along the BB 'line of the above-mentioned multilayer ceramic capacitor. It is a flowchart which shows the manufacturing method of the said laminated ceramic capacitor. It is a top view of the lamination sheet prepared at Step S01 of the above-mentioned manufacturing method. It is a perspective view of the lamination sheet which shows step S02 of the said manufacturing method. It is a top view of a lamination sheet which shows Step S03 of the above-mentioned manufacturing method. It is a perspective view of a lamination chip after the above-mentioned step S03. It is a schematic diagram which shows the lamination | stacking chip stuck on the tape by said step S04. It is a schematic diagram which shows the structure of said step S04. It is a schematic diagram which shows the punching operation | movement in said step S04. It is a schematic diagram which shows the moving path | route of the press part in said step S04. It is a schematic diagram which shows the punching operation | movement in said step S04. It is a schematic diagram which shows the process of said step S04. It is a perspective view of an element after the above-mentioned step S04. It is a schematic diagram which shows the moving path | route of the press part in step S04 of the manufacturing method of the laminated ceramic capacitor which concerns on the 2nd Embodiment of this invention. It is a schematic diagram which shows the process of said step S04. It is a schematic diagram which shows the structure of step S04 of the manufacturing method of the laminated ceramic capacitor which concerns on the 3rd Embodiment of this invention. It is a schematic diagram which shows the punching operation | movement in said step S04. It is a schematic diagram which shows the structure of step S04 of the manufacturing method of the laminated ceramic capacitor which concerns on the 4th Embodiment of this invention. It is a schematic diagram which shows the punching operation | movement in said step S04. It is a schematic diagram which shows the punching operation | movement in step S04 of the manufacturing method of the laminated ceramic capacitor which concerns on the 5th Embodiment of this invention. It is a schematic diagram which shows the punching operation | movement in step S04 of the manufacturing method of the laminated ceramic capacitor concerning the 6th Embodiment of this invention. It is a schematic diagram which shows the punching operation | movement in step S04 of the manufacturing method of the laminated ceramic capacitor which concerns on the 7th Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the drawings, an X axis, a Y axis, and a Z axis which are orthogonal to one another are shown as appropriate. The X-axis, Y-axis and Z-axis are common in all the figures.

First Embodiment
[Configuration of Multilayer Ceramic Capacitor 10]
1 to 3 show a multilayer ceramic capacitor 10 according to a first embodiment of the present invention. FIG. 1 is a perspective view of a multilayer ceramic capacitor 10. FIG. 2 is a cross-sectional view of the laminated ceramic capacitor 10 taken along the line AA 'of FIG. FIG. 3 is a cross-sectional view of the laminated ceramic capacitor 10 taken along the line BB ′.

  The multilayer ceramic capacitor 10 includes an element body 11, a first outer electrode 14, and a second outer electrode 15. The external electrodes 14 and 15 are separated from each other, and face each other in the X-axis direction with the element body 11 interposed therebetween.

The element body 11 has two end surfaces facing in the X-axis direction, two side surfaces facing in the Y-axis direction, and two main surfaces facing in the Z-axis direction. The ridges connecting the faces of the body 11 are chamfered. In the element body 11, for example, the dimension in the X-axis direction can be 1.0 mm, and the dimension in the Y-axis and Z-axis directions can be 0.5 mm.
The shape of the element body 11 is not limited to such a shape. For example, each surface of the element body 11 may be a curved surface, and the element body 11 may have a rounded shape as a whole.

  The external electrodes 14 and 15 cover both end surfaces of the element body 11 in the X-axis direction, and extend to both side surfaces in the Y-axis direction and both main surfaces in the Z-axis direction connected to both end surfaces in the X-axis direction. Thereby, in any of the external electrodes 14 and 15, the shapes of the cross section parallel to the XZ plane and the cross section parallel to the XY axis are U-shaped.

The external electrodes 14 and 15 are each formed of a good conductor and function as a terminal of the multilayer ceramic capacitor 10. As a good conductor for forming the external electrodes 14 and 15, for example, a metal mainly composed of nickel (Ni), copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), gold (Au) or the like And alloys can be used.
The external electrodes 14 and 15 may have a single layer structure or a multilayer structure.

The external electrodes 14 and 15 having a multilayer structure may be configured, for example, as a two-layer structure of a base film and a surface film, or a three-layer structure of a base film, an intermediate film, and a surface film.
The undercoat film can be, for example, a baked film of a metal or alloy containing nickel, copper, palladium, platinum, silver, gold or the like as a main component.
The intermediate film can be, for example, a plated film of a metal or alloy containing platinum, palladium, gold, copper, nickel or the like as a main component.
The surface film can be, for example, a plated film of a metal or alloy containing copper, tin, palladium, gold, zinc or the like as a main component.

The element body 11 has a laminated chip 16 and a side margin portion 17.
The side margin portion 17 is in the form of a flat plate extending along the XZ plane, and covers both side surfaces P and Q of the laminated chip 16 in the Y-axis direction.
The laminated chip 16 has a capacitance forming portion 18 and a cover portion 19. The cover portion 19 has a flat plate shape extending along the X-Y plane, and covers both main surfaces in the Z-axis direction of the capacitance forming portion 18.
The side margin portion 17 and the cover portion 19 mainly function to protect the capacitance forming portion 18 and to secure insulation around the capacitance forming portion 18.

  The capacitance forming portion 18 has a plurality of first inner electrodes 12 and a plurality of second inner electrodes 13. Each of the internal electrodes 12 and 13 is in the form of a sheet extending along the XY plane, and is alternately arranged in the Z-axis direction. The first inner electrode 12 is connected to the first outer electrode 14 and is separated from the second outer electrode 15. On the contrary, the second inner electrode 13 is connected to the second outer electrode 15 and is separated from the first outer electrode 14.

  The internal electrodes 12 and 13 are each formed of a good conductor and function as an internal electrode of the multilayer ceramic capacitor 10. As good conductors for forming the internal electrodes 12 and 13, for example, metals including nickel (Ni), copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), gold (Au), or alloys thereof Materials are used.

The capacitance forming portion 18 is formed of dielectric ceramic. In the multilayer ceramic capacitor 10, in order to increase the capacitance of each dielectric ceramic layer between the internal electrodes 12 and 13, a dielectric ceramic with a high dielectric constant is used as a material for forming the capacitance forming portion 18. Examples of high dielectric constant dielectric ceramics include materials having a perovskite structure including barium (Ba) and titanium (Ti), represented by barium titanate (BaTiO ₃ ).

  The side margin portion 17 and the cover portion 19 are also formed of dielectric ceramics. The material for forming the side margin portion 17 and the cover portion 19 may be an insulating ceramic, but by using the same material as the capacitance forming portion 18, the manufacturing efficiency is improved and the internal stress in the element body 11 is Be suppressed.

  According to the above configuration, in the laminated ceramic capacitor 10, when a voltage is applied between the first outer electrode 14 and the second outer electrode 15, a plurality of layers between the first inner electrode 12 and the second inner electrode 13 are formed. A voltage is applied to the dielectric ceramic layer. Thereby, in the laminated ceramic capacitor 10, charges corresponding to the voltage between the first external electrode 14 and the second external electrode 15 are stored.

  The configuration of the multilayer ceramic capacitor 10 is not limited to a specific configuration, and a known configuration can be appropriately adopted according to the size, performance, etc. required of the multilayer ceramic capacitor 10. For example, the number of internal electrodes 12 and 13 in the capacitance forming portion 18 can be determined as appropriate.

[Method of Manufacturing Multilayer Ceramic Capacitor 10]
FIG. 4 is a flowchart showing a method of manufacturing the multilayer ceramic capacitor 10. 5 to 15 are diagrams showing a manufacturing process of the multilayer ceramic capacitor 10. As shown in FIG. Hereinafter, the method of manufacturing the laminated ceramic capacitor 10 will be described along FIG. 4 with reference to FIGS.

(Step S01: Preparation of ceramic sheet)
In step S01, the first ceramic sheet 101 and the second ceramic sheet 102 for forming the capacitance forming portion 18 and the third ceramic sheet 103 for forming the cover portion 19 are prepared.

  FIG. 5 is a plan view of the ceramic sheets 101, 102, and 103. 5 (A) shows the ceramic sheet 101, FIG. 5 (B) shows the ceramic sheet 102, and FIG. 5 (C) shows the ceramic sheet 103. The ceramic sheets 101, 102, and 103 are configured as unfired dielectric green sheets, and are formed into sheets by using, for example, a roll coater or a doctor blade.

  At the stage of step S01, the ceramic sheets 101, 102, and 103 are not separated for each laminated ceramic capacitor 10. FIG. 5 shows cutting lines Lx and Ly at the time of cutting into each laminated ceramic capacitor 10. The cutting line Lx is parallel to the X axis, and the cutting line Ly is parallel to the Y axis.

  As shown in FIG. 5, an unfired first internal electrode 112 corresponding to the first internal electrode 12 is formed on the first ceramic sheet 101, and the second ceramic sheet 102 does not correspond to the second internal electrode 13. A fired second internal electrode 113 is formed. Note that no internal electrode is formed on the third ceramic sheet 103 corresponding to the cover portion 19.

  The internal electrodes 112 and 113 can be formed using any conductive paste. For example, a screen printing method or a gravure printing method can be used to form the internal electrodes 112 and 113 with a conductive paste.

  The internal electrodes 112 and 113 are disposed over two regions adjacent to each other in the X-axis direction partitioned by the cutting line Ly, and extend in a band shape in the Y-axis direction. The first inner electrode 112 and the second inner electrode 113 are shifted in the X-axis direction by one row of the region partitioned by the cutting line Ly. That is, the cutting line Ly passing through the center of the first inner electrode 112 passes through the area between the second inner electrodes 113, and the cutting line Ly passing through the center of the second inner electrode 113 passes through the area between the first inner electrodes 112. Passing through.

(Step S02: lamination)
In step S02, the laminated sheet 104 is produced by laminating the ceramic sheets 101, 102, and 103 prepared in step S01.

  FIG. 6 is a perspective view of the laminated sheet 104 obtained in step S02. In FIG. 6, the ceramic sheets 101, 102, and 103 are disassembled and shown for convenience of explanation. However, in the actual laminated sheet 104, the ceramic sheets 101, 102, and 103 are pressure-bonded and integrated by hydrostatic pressure or uniaxial pressure. Thereby, a high density laminated sheet 104 is obtained.

In the laminated sheet 104, the first ceramic sheet 101 and the second ceramic sheet 102 corresponding to the capacitance forming portion 18 are alternately laminated in the Z-axis direction.
In the laminated sheet 104, the third ceramic sheet 103 corresponding to the cover portion 19 is laminated on the uppermost surface and the lowermost surface in the Z-axis direction of the ceramic sheets 101 and 102 laminated alternately. In the example shown in FIG. 6, three third ceramic sheets 103 are stacked, but the number of third ceramic sheets 103 can be changed as appropriate.

(Step S03: Disconnection)
In step S03, the non-fired laminated chip 116 is manufactured by cutting the laminated sheet 104 obtained in step S02.

FIG. 7 is a plan view of the laminated sheet 104 after step S03. The laminated sheet 104 is cut along the cutting lines Lx and Ly in a state of being stuck to the tape T1 as a holding member.
Thereby, the lamination sheet 104 is singulated, and the lamination chip 116 shown in FIG. 8 is obtained. In the laminated chip 116, side faces P and Q which are cut surfaces to which the internal electrodes 112 and 113 are exposed are formed.

  The method of cutting the laminated sheet 104 is not limited to a particular method. For example, for cutting the laminated sheet 104, techniques using various blades can be used. Examples of the blade that can be used to cut the laminated sheet 104 include a push-cutting blade and a rotary blade (such as a dicing blade). Furthermore, for the cutting of the laminated sheet 104, for example, laser cutting or water jet cutting can be used other than the technique using various blades.

  As necessary, the laminated chip 116 after cutting is washed to remove chips and the like attached to the side surfaces P, Q and the like.

(Step S04: Side margin formation)
In step S04, the unfired side margin portion 117 is formed on the side surfaces P and Q of the laminated chip 116 obtained in step S03.
In the following description, after the side margin portion 117 is formed on the side surface P of the layered chip 116, the side margin portion 117 is formed on the side surface Q of the layered chip 116. However, the order of forming the side margin portions 117 on the side surfaces P and Q of the laminated chip 116 may be reversed.

  In the state immediately after step S03 shown in FIG. 7, the side surfaces P and Q which are cut surfaces are orthogonal to the tape T1, and the side surfaces P and Q are close to each other in the laminated chips 116 adjacent to each other. Therefore, in this state, it is difficult to provide the side margin portion 117 on the side surfaces P and Q of the layered chip 116.

In the present embodiment, in order to provide the side margin portion 117 on the side surface P, as shown in FIG. 9, the laminated chip 116 is changed from the tape T1 to the tape T2. Thereby, the laminated chip 116 is rotated by 90 °, the side surface Q is held by the tape T2, and the side surface P is opened.
The method of changing the orientation of the laminated chip 116 is not limited to a specific method. In addition, the laminated chip 116 can be held by a holding member having the same function as that of the tape T2, even if it is other than the tape T2.

  The stacked chips 116 are arranged on the tape T2 along the X-axis and Z-axis directions at predetermined intervals from each other. Thus, the side surfaces P of all the laminated chips 116 arranged on the tape T2 face upward in the Y-axis direction, so that it is possible to form the side margin portion 117 from the upper side in the Y-axis direction to any laminated chip 116. Become.

  FIG. 10 is a perspective view schematically showing the punching device E1 used in the present embodiment. The punching device E1 has a support board 300 and a pressing unit 200.

The support board 300 can hold the tape T2, for example, is connected to an intake mechanism, and is configured to be able to suction hold the tape T2.
The pressing portion 200 is composed of an elastic portion 201 having a pressing surface opposed to the support disc 300 in the Y-axis direction upward, and a holding portion 202 for holding the elastic portion 201 from the Y-axis direction upper side. The material forming the elastic portion 201 can be appropriately selected from elastic bodies such as various rubbers. The pressing portion 200 is a rod-like shape extending over the entire width in the Z-axis direction of the arrangement region of the laminated chips 116 in the tape T2.

FIG. 10A shows a state in which the laminated chip 116 is set on the support board 300 of the punching device E1. The support disk 300 holds the tape T2 from the lower side in the Y-axis direction, and the side surfaces P of the laminated chips 116 arranged on the tape T2 are all directed upward in the Y-axis direction.
In the present embodiment, the laminated chips 116 are arranged at equal intervals in 12 rows and 9 columns in the Z-axis and X-axis directions. However, the arrangement aspect such as the number and the interval of the laminated chips 116 on the tape T2 can be appropriately changed.

  From the state shown in FIG. 10A, as shown in FIG. 10B, the side margin sheet 117s for forming the side margin portion 117 is set in the punching device E1. The side margin sheet 117s collectively covers all the laminated chips 116 arranged on the tape T2 from the upper side in the Y-axis direction. The side margin sheet 117 s is in contact with the side surface P of each laminated chip 116.

  The side margin sheet 117s is not cut into pieces for each laminated chip 116, and is configured as a green sheet in which a plurality of side margin portions 117 are continuous. The side margin sheet 117s is formed into a sheet shape using, for example, a roll coater or a doctor blade, similarly to the ceramic sheets 101, 102, and 103 prepared in step S01.

As shown in FIG. 10B, the pressing portion 200 of the punching device E1 is movable in the X-axis direction along the support board 300. Thereby, the punching device E1 can make the pressing portion 200 face the upper side in the Y-axis direction of an arbitrary row of laminated chips 116.
In addition, the pressing portion 200 of the punching device E1 can move up and down in the Y-axis direction. Thus, the punching device E1 can press the side margin sheet 117s downward in the Y-axis direction by the pressing unit 200.
In addition, in the punching device E1, the pressing unit 200 and the support board 300 may be movable relative to each other. For example, the support board 300 may be configured to be movable in the X-axis and Y-axis directions.

  The punching device E1 punches the side margin sheet 117s on the side surface P of the laminated chip 116 opposed to the pressing portion 200 by pressing the side margin sheet 117s by the pressing portion 200. In the following description, the operation of punching out the side margin sheet 117s is referred to as a punching operation.

FIG. 11 is a schematic view showing a punching operation by the punching device E1.
First, as shown in FIG. 11A, the pressing unit 200 is moved downward in the Y-axis direction while facing the row of the stacked chips 116. As a result, the elastic portion 201 of the pressing portion 200 presses the side margin sheet 117s.

  When the elastic portion 201 presses the side margin sheet 117s, the side margin sheet 117s is pressed against the laminated chip 116. At the same time, the elastic portion 201 bulges the side margin sheet 117s downward in the Y-axis direction in the vacant area V where the laminated chip 116 is not disposed.

  As a result, a shear force in the Y-axis direction is applied to the side margin sheet 117s between the area on the laminated chip 116 and the vacant area V. The shear force separates the side margin sheet 117s between the area on the laminated chip 116 and the vacant area V. By holding the pressing portion 200 at this position for a predetermined time, the side margin sheet 117s can be separated more reliably.

Then, as shown in FIG. 11B, when the pressing portion 200 is returned upward in the Y-axis direction, the side margin portion 117 separated from the side margin sheet 117s remains on the laminated chip 116. As described above, the side margin portions 117 can be formed on the side surfaces P of all the laminated chips 116 aligned in the Z-axis direction.
Thus, the punching operation by the punching device E1 is completed.

FIG. 12 is a schematic view showing a moving path of the pressing unit 200 in the punching device E1. In FIG. 12, the movement path of the pressing unit 200 is indicated by a block arrow.
In the punching device E1, n pressing areas An each including one row of stacked chips 116 aligned in the Z-axis direction are set on the support plate 300. That is, the stacked chips 116 in the nth row in the X-axis direction are arranged in the pressing area An.
The number of pressing areas An can be appropriately determined according to the number of rows of the laminated chips 116. In the present embodiment, pressing areas A1 to A9 are set.

  In the punching device E1, the pressing portions 200 are sequentially disposed in the pressing regions A1 to A9, and one punching operation is performed in each of the pressing regions A1 to A9.

  FIG. 13A shows a state immediately after the punching operation is performed in the pressing area A1. At this time, the side margin portion 117 is formed on the side surface P of the layered chip 116 disposed in the pressing area A1, and the side margin portion 117 is not formed on the side surface P of the layered chip 116 disposed in the pressing area A2 or later. .

  FIG. 13B shows a state immediately after the punching operation is performed in the pressing area A2 following the pressing area A1. At this time, the side margin portion 117 is formed on the side surface P of the laminated chip 116 disposed in the pressing area A2.

  As shown in FIG. 14, the punching device E1 sequentially executes the punching operation similarly for the pressing area A3 and thereafter. Thus, side margin portions 117 are formed on the side surfaces P of all the laminated chips 116 arranged on the tape T2.

  As described above, in the punching device E1, by performing the punching operation for each pressing area An, the side margin portion 117 is formed in multiple times with respect to the laminated chips 116 arranged on the tape T2. For this reason, compared with the case where the punching operation is performed collectively for all the pressing areas An, the pressing force required for one punching operation may be small.

  Further, in the punching device E1, the side margin portion 117 can be continuously formed on the side surface P of the laminated chip 116 arranged on the tape T2 by sequentially executing the punching operation in the pressing area An. Therefore, in the punching device E1, the side margin portion 117 can be efficiently retrofitted to the side surface P of the laminated chip 116.

The punching device E1 may execute the punching operation simultaneously for a plurality of pressing areas An. In this case, the punching device E1 may have a plurality of pressing portions 200.
The pressing area An is set for each row of the stacked chips 116 aligned in the Z-axis direction as described above, or may be set for each row of the stacked chips 116 aligned in the X-axis direction. In this case, the pressing unit 200 can press each row of the laminated chip 116 and can be configured to be movable in the Z-axis direction.

In step S04, as in the side surface P of the layered chip 116, the side margin portion 117 is also formed on the side surface Q of the layered chip 116.
Specifically, by transferring the laminated chip 116 from the tape T2 to the tape T3, the side margin portion 117 provided on the side surface P of the laminated chip 116 is held by the tape T3. Thereby, the direction of the side surfaces P and Q of each laminated chip 116 is opposite to the direction shown in FIG. 9, and the side surface Q faces upward in the Y-axis direction.
Therefore, the side margin portion 117 can be formed on the side surface Q of the laminated chip 116 in the same manner as the side surface P.

Thus, the unfired body 111 shown in FIG. 15 is obtained.
The shape of the element body 111 can be determined according to the shape of the element body 11 after firing. For example, in order to obtain an element body 11 of 1.0 mm × 0.5 mm × 0.5 mm, an element body 111 of 1.2 mm × 0.6 mm × 0.6 mm can be produced.

(Step S05: Baking)
In step S05, the unfired element body 111 obtained in step S04 is fired to produce the element body 11 of the multilayer ceramic capacitor 10 shown in FIGS. The firing can be performed, for example, under a reducing atmosphere or under a low oxygen partial pressure atmosphere.

(Step S06: External electrode formation)
In step S06, the external electrodes 14 and 15 are formed on the element body 11 obtained in step S05, thereby producing the multilayer ceramic capacitor 10 shown in FIGS.

  In step S06, first, an unbaked electrode material is applied to cover one end surface in the X-axis direction of element body 11, and an unbaked electrode material is applied to cover the other end surface in the X-axis direction of element body 11. Do. The unbaked electrode material applied to the element body 11 is baked, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere to form a base film on the element body 11. Then, an intermediate film and a surface film are formed by plating such as electrolytic plating on the base film baked into the element body 11, and the external electrodes 14 and 15 are completed.

  Note that part of the process in step S06 described above may be performed before step S05. For example, before step S05, unfired electrode materials are applied to both end surfaces of the unfired element 111 in the X-axis direction, and the unfired electrode material is simultaneously fired in step S05. The underlying layer may be formed by baking the outer electrodes 14 and 15.

Second Embodiment
The method of manufacturing the multilayer ceramic capacitor 10 according to the second embodiment of the present invention is the same as the first embodiment except for the configuration described below of step S04 in FIG. In the second embodiment, the description of the same configuration as that of the first embodiment will be omitted as appropriate.

  FIG. 16 is a schematic view showing a punching device E2 according to the present embodiment. The punching device E2 has a support board 300 similar to the punching device E1 according to the first embodiment, and a pressing portion 210 having a shape different from that of the punching device E1 according to the first embodiment. In FIG. 16, the moving path of the pressing unit 210 is indicated by a block arrow.

In the punching device E2, a pressing area Bn is set on the support plate 300. Unlike the pressing area An according to the first embodiment, the pressing area Bn includes four rows and three columns of laminated chips 116 in the Z-axis and X-axis directions.
The number of pressing areas Bn can be appropriately determined in accordance with the arrangement of the laminated chips 116. In the present embodiment, pressing areas B1 to B9 are set. The pressing areas B1 to B9 are arranged in an inverted S shape.

  The pressing portion 210 of the punching device E2 has a shape corresponding to the pressing regions B1 to B9, and is configured to be able to press the pressing regions B1 to B9. In the punching device E2, the pressing portions 210 are sequentially arranged in the pressing regions B1 to B9, and one punching operation is performed in each of the pressing regions B1 to B9.

  As shown in FIG. 17, the punching device E2 sequentially performs the punching operation in the pressing regions B1 to B9 to form the side margin portions 117 on the side surfaces P of all the laminated chips 116 arranged on the tape T2. Ru.

The number of rows and the number of columns of the laminated chips 116 included in the pressing region Bn can be changed as appropriate. In this case, the shape of the pressing portion 210 can be changed corresponding to the pressing area Bn.
The punching device E2 may execute the punching operation simultaneously for a plurality of pressing areas Bn. In this case, the punching device E2 may have a plurality of pressing portions 210.

Third Embodiment
The method of manufacturing the multilayer ceramic capacitor 10 according to the third embodiment of the present invention is the same as the first embodiment except for the configuration described below of step S04 in FIG. In the third embodiment, the description of the same configuration as that of the first embodiment will be omitted as appropriate.

  The punching device E3 according to the present embodiment includes a support board 300 similar to the punching device E1 according to the first embodiment, and a roller 220 which is a pressing portion different from the punching device E1 according to the first embodiment. Have.

  FIG. 18 is a perspective view schematically showing the punching device E3. The roller 220 of the punching device E3 is configured as a cylindrical elastic member held by a central shaft member 221 parallel to the Z axis. The roller 220 is rotatable around the central shaft member 221. The material forming the roller 220 can be appropriately selected from elastic bodies such as various rubbers.

  The punching device E3 moves the roller 220 in the X axis direction while rotating the roller 220 in a state where a pressing force is applied to the side margin sheet 117s. The punching device E3 can perform the punching operation continuously in each of the pressing areas A1 to A9 by passing the pressing areas A1 to A9 along the X-axis direction.

  FIG. 19A shows a state immediately after the roller 220 passes the pressing area A1. At this time, the side margin portion 117 is formed on the side surface P of the layered chip 116 disposed in the pressing area A1, and the side margin portion 117 is not formed on the side surface P of the layered chip 116 disposed in the pressing area A2 or later. .

  FIG. 19B shows a state immediately after passing through the pressing area A2 following the pressing area A1. At this time, the side margin portion 117 is formed on the side surface P of the laminated chip 116 disposed in the pressing area A2. When the punching device E3 passes the roller 220 to the pressing area A9, the side margin portions 117 are formed on the side surfaces P of all the laminated chips 116 arranged on the tape T2.

  As described above, in the punching device E3 according to the present embodiment, in the punching operation in the pressing areas A1 to A9, it is not necessary to move the roller 220 up and down in the Y axis direction for each pressing area A1 to A9. Therefore, in the present embodiment, the side margin portion 117 can be attached to the side surface P of the laminated chip 116 more efficiently.

In the punching device E3 according to the present embodiment, it is possible to change the conditions of the punching operation in accordance with the hardness of the side margin sheet 117s and the like.
As an example, in the case where the side margin sheet 117s is soft, it is preferable that the shearing force be applied more sharply to the side margin sheet 117s in the punching operation. That is, it is preferable that the speed at which the roller 220 pushes down the side margin sheet 117s is high in the vacant area V where the laminated chip 116 is not disposed.
For this purpose, for example, it is effective to reduce the radius R of the roller 220 shown in FIG. It is also effective to increase the moving speed of the roller 220 in the X-axis direction.

  The moving direction of the roller 220 in the punching operation by the punching device E3 is not limited to the X-axis direction, and it may be the arrangement direction of the laminated chips 116 along the XZ plane. That is, the moving direction of the roller 220 may be the Z-axis direction or a direction oblique to the X-axis and the Z-axis. In this case, the orientation of the central shaft member 221 of the roller 220 can be changed along the XZ plane.

  Further, the punching device E3 may have a plurality of rollers 220 aligned along the XZ plane. In this case, the plurality of rollers 220 can simultaneously perform the punching operation in the plurality of pressing areas An.

Fourth Embodiment
The method of manufacturing the multilayer ceramic capacitor 10 according to the fourth embodiment of the present invention is the same as the first embodiment except for the configuration described below of step S04 in FIG. In the fourth embodiment, the description of the same configuration as that of the first embodiment will be omitted as appropriate.

  In this embodiment, a punching device E1 similar to that of the first embodiment is used.

FIG. 20 is a schematic view showing the configuration of the present embodiment.
As shown in FIG. 20A, the side surface P of the laminated chip 116 is directed downward in the Y-axis direction to be opposed to the support board 300, contrary to the first embodiment. The side margin sheet 117 s is disposed on the support board 300 via a flat elastic plate 400. The material forming the elastic plate 400 can be appropriately selected from elastic bodies such as various rubbers.
Then, as shown in FIG. 20B, the layered chip 116 is set on the side margin sheet 117s so that the side surface P contacts the side margin sheet 117s.

FIG. 21 is a schematic view showing a punching operation by the punching device E1.
First, as shown in FIG. 21A, the pressing unit 200 is moved downward in the Y-axis direction in a state in which the pressing unit 200 is opposed to the row of the laminated chips 116 disposed in the pressing area A1. Thereby, the pressing unit 200 presses the tape T2, and presses the laminated chip 116 against the side margin sheet 117s.

  When the laminated chip 116 is pressed against the side margin sheet 117s, a pressing force is applied to the elastic plate 400 from the side margin sheet 117s. Thereby, the elastic plate 400 is raised so as to push up the side margin sheet 117s in the Y-axis direction upward in the region V between the stacked chips 116.

  As a result, a shear force in the Y-axis direction is applied to the side margin sheet 117 s between the area on the laminated chip 116 and the area V between the laminated chips 116. The shear force separates the side margin sheet 117s between the area on the laminated chip 116 and the area V between the laminated chips 116.

  Then, when the pressing portion 200 is returned upward in the Y-axis direction, the side margin portion 117 separated from the side margin sheet 117 s remains on the laminated chip 116. Thus, the side margin portion 117 can be formed on the side surface P of the laminated chip 116 disposed in the pressing area A1.

  Next, as shown in FIG. 21B, the pressing portion 200 is moved from the pressing area A1 to the pressing area A2, and the punching operation is performed in the pressing area A2. Thus, the side margin portion 117 can be formed on the side surface P of the laminated chip 116 disposed in the pressing area A2. Similarly, the side margin portions 117 can be formed on the side surfaces P of all the laminated chips 116 by performing the punching operation in the pressing area A3 and thereafter.

Fifth Embodiment
The method of manufacturing the multilayer ceramic capacitor 10 according to the fifth embodiment of the present invention is the same as the fourth embodiment except for the configuration described below of step S04 in FIG. In the fifth embodiment, the description of the same configuration as that of the fourth embodiment will be omitted as appropriate.

  In this embodiment, a punching device E3 similar to that of the third embodiment is used.

  FIG. 22 is a schematic view showing a punching operation according to the present embodiment. The punching device E 3 moves the roller 220 in the X-axis direction while rotating the roller 220 in a state where the pressing force is applied to the tape T 2 by the roller 220. The punching device E3 can perform the punching operation continuously in each of the pressing areas A1 to A9 by passing the pressing areas A1 to A9 along the X-axis direction.

  FIG. 22A shows a state immediately after the roller 220 passes the pressing area A1. At this time, the side margin portion 117 is formed on the side surface P of the layered chip 116 disposed in the pressing area A1, and the side margin portion 117 is not formed on the side surface P of the layered chip 116 disposed in the pressing area A2 or later. .

  FIG. 22B shows a state immediately after passing through the pressing area A2 following the pressing area A1. At this time, the side margin portion 117 is formed on the side surface P of the laminated chip 116 disposed in the pressing area A2. When the punching device E3 passes the roller 220 to the pressing area A9, the side margin portions 117 are formed on the side surfaces P of all the laminated chips 116 arranged on the tape T2.

Sixth Embodiment
The method of manufacturing the multilayer ceramic capacitor 10 according to the sixth embodiment of the present invention is the same as the third embodiment except for the configuration described below of step S04 in FIG. In the sixth embodiment, the description of the same configuration as that of the third embodiment will be omitted as appropriate.

  FIG. 23 is a schematic view showing a configuration of a punching device E4 according to the present embodiment. The punching device E4 according to the present embodiment includes two rollers 220A and 220B having the same configuration as the roller 220 of the punching device E3 according to the third embodiment. The rollers 220A and 220B are held by the central shaft members 221A and 221B, respectively, and arranged at intervals in the Y-axis direction.

  In the punching device E4, the lower roller 220B in the Y-axis direction holds the tape T2, and the upper roller 220A in the Y-axis direction presses the side margin sheet 117s. That is, the laminated chip 116 is nipped by the rollers 220A and 220B via the tape T2 and the side margin sheet 117s.

  The punching device E4 moves the rollers 220A and 220B in the X-axis direction while rotating the rollers 220A and 220B while applying pressure between the side margin sheet 117s and the tape T2 by the rollers 220A and 220B. That is, the punching device E4 can perform the punching operation continuously in each of the pressing areas A1 to A9 by causing the rollers 220A and 220B to pass the pressing areas A1 to A9 along the X-axis direction.

Seventh Embodiment
The manufacturing method of the multilayer ceramic capacitor 10 according to the seventh embodiment of the present invention is the same as the sixth embodiment except for step S04 in FIG. About the 7th embodiment, the explanation is suitably omitted about the same composition as a 6th embodiment.

  In the seventh embodiment, a punching device E4 similar to that of the sixth embodiment is used.

  FIG. 24 is a schematic view showing a punching operation according to the present embodiment. In the present embodiment, the laminated chip 116 is arranged between the two side margin sheets 117sA and 117sB without being attached to the tape T2. The side margin sheet 117sA is disposed on the side surface P of the layered chip 116, and the side margin sheet 117sB is disposed on the side surface Q of the layered chip 116.

  In the punching device E4, the roller 220A on the upper side in the Y-axis direction presses the side margin sheet 117sA, and the roller 220B on the lower side in the Y-axis direction presses the side margin sheet 117sB. That is, the laminated chip 116 is nipped by the rollers 220A and 220B via the side margin sheets 117sA and 117sB.

  The punching device E4 moves the rollers 220A and 220B in the X-axis direction while rotating the rollers 220A and 220B while applying pressure between the side margin sheets 117sA and 117sB by the rollers 220A and 220B. Thus, the side margin sheet 117s can be punched out simultaneously on both side surfaces P and Q of the laminated chip 116. That is, in the present embodiment, the side margin portions 117 can be simultaneously provided on both side surfaces P and Q of the laminated chip 116 by one punching operation.

  Therefore, in the present embodiment, the punching device E4 causes the rollers 220A and 220B to pass through the pressing regions A1 to A9 along the X-axis direction, so that both side surfaces P of all the laminated chips 116 arrayed on the tape T2 are , Q can be provided with side margin portions 117 simultaneously. Thereby, it is possible to perform step S04 very efficiently.

<Other Embodiments>
As mentioned above, although embodiment of this invention was described, this invention is not limited only to the above-mentioned embodiment, of course, a various change can be added.

For example, the steps shown in FIG. 4 may be switched in order as needed.
As an example, after firing the unfired laminated chip 116 singulated in step S 03 to form the laminated chip 16, the side margin portion 117 may be provided on the laminated chip 16. In this case, steps S04 to S06 can be performed on the laminated chip 16 after firing.

  Further, in the above embodiment, a laminated ceramic capacitor has been described as an example of the laminated ceramic electronic component, but the present invention is applicable to all laminated ceramic electronic components in which internal electrodes forming a pair are alternately arranged. As such a laminated ceramic electronic component, a piezoelectric element etc. are mentioned, for example.

DESCRIPTION OF SYMBOLS 10 ... Laminated ceramic capacitor 11 ... Element 12, 13 ... Internal electrode 14, 15 ... External electrode 16 ... Laminated chip 17 ... Side margin part 18 ... Capacity formation part 19 ... Cover part 104 ... Lamination sheet 111 ... Unbaked element 112, 113 Unbaked internal electrode 116 Unbaked laminated chip 117 Unbaked side margin portion 117s Side margin sheet 200 Pressed portion 201 Elastic portion 300 Support plate P, Q Side surface T1, T2 Tapes A1 to A9: Pressing area V: Empty area

Claims (10)

A plurality of stacked layers each having a laminated ceramic layer, an internal electrode disposed between the ceramic layers, and a side surface on which the internal electrode is exposed, the side surface facing the side margin sheet Prepare the chip,
For the plurality of stacked chips, by applying a pressing force between the side surface and the side margin sheet, it said-out side margin disconnect hit the sheet at the side, to the side margin sheet punched attached to the side surface operation A method of manufacturing a multilayer ceramic electronic component, which is carried out in several times. A method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein
Dividing the plurality of laminated chips into a plurality of pressing areas;
A method of manufacturing a multilayer ceramic electronic component, wherein the operation is performed for each of the plurality of pressing areas. A method of manufacturing a multilayer ceramic electronic component according to claim 2, wherein
The plurality of stacked chips form a plurality of rows,
A method of manufacturing a multilayer ceramic electronic component, wherein the plurality of rows are respectively divided into the plurality of pressing regions. A method of manufacturing a laminated ceramic electronic component according to claim 2 or 3, wherein
The plurality of pressing areas have a common shape, respectively
A method of manufacturing a multilayer ceramic electronic component, wherein the operation is performed using a pressing portion corresponding to the common shape. A method of manufacturing a multilayer ceramic electronic component according to any one of claims 2 to 4, wherein
In the operation, a pressing force is applied to the side margin sheet by an elastic body. A method of manufacturing a multilayer ceramic electronic component according to any one of claims 2 to 4, wherein
Place the side margin sheet on an elastic body,
In the operation, a pressing force is applied to the plurality of laminated chips. A method of manufacturing a laminated ceramic electronic component. A method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein
The ceramic ceramic electronic device continuously executes the operation by relatively moving the pressing portion in the arrangement direction of the plurality of laminated chips while applying a pressing force between the side surface and the side margin sheet by the pressing portion. Method of manufacturing parts. 8. A method of manufacturing a multilayer ceramic electronic component according to claim 7, wherein
The method for manufacturing a multilayer ceramic electronic component, wherein the pressing portion is a roller having a central axis parallel to the arrangement direction. It has a laminated ceramic layer, an internal electrode disposed between the ceramic layers, and first and second side surfaces where the internal electrode is exposed, and the first side surface is used as a first side margin sheet. Preparing a plurality of laminated chips arranged facing each other with the second side facing the second side margin sheet,
For the plurality of stacked chips, said by applying a pressing force to the first and second side margin sheet, disconnect strike the first and respectively the first and second side margin sheet in the second aspect simultaneously punched An operation of attaching the first and second side margin sheets to the first and second side surfaces in a plurality of times is performed. A method of manufacturing a multilayer ceramic electronic component according to claim 9, which is:
By relatively moving the pair of rollers in the arranging direction while applying pressing force to the first and second side margin sheets by the pair of rollers having central axes parallel to the arranging direction of the plurality of laminated chips. A method of manufacturing a multilayer ceramic electronic component, wherein the operation is continuously performed.

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