JP2021170658A - Manufacturing method for laminated ceramic electronic component - Google Patents

Abstract

To provide a manufacturing method that can easily manufacture a laminated ceramic electronic component.SOLUTION: A manufacturing method for a laminated ceramic electronic component comprises: a step of forming a dummy portion on a main surface in a lamination direction of a mother block including a plurality of laminated ceramic green sheets and an inner electrode pattern; a step of cutting the mother block with the dummy portion along a first direction to obtain a plurality a rod-like green bock bodies with dummy portions having inner electrodes exposed onto cut side surfaces; a step of rolling the rod-like green block bodies with dummy portions, with an interval between the rod-like green block bodies with dummy portions widened, to bring all of the cut side surfaces into opened surfaces; a step of forming unbaked ceramic protection layers, on the cut side surfaces brought into the opened surfaces; a step of cutting the rod-like green block bodies with dummy portions having the unbaked ceramic protection layers formed, along a cutting line in a second direction orthogonal to the first direction, so as to obtain a plurality of unbaked part main bodies; and a step of removing the dummy portions.SELECTED DRAWING: None

Description

The present invention relates to a method for manufacturing a laminated ceramic electronic component.

A multilayer ceramic capacitor is an example of a multilayer ceramic electronic component. In order to manufacture a monolithic ceramic capacitor, for example, a ceramic green sheet on which an internal electrode is formed is laminated, the obtained unfired component body is fired, and then an external surface is attached to the opposite end faces of the sintered part body. Form electrodes. As a result, a monolithic ceramic capacitor is obtained in which the internal electrodes drawn out on the end faces on both sides are electrically connected to the external electrodes.

In recent years, as electronic components have become smaller and more sophisticated, multilayer ceramic capacitors are required to be smaller and have higher capacities. In order to reduce the size and increase the capacity of the multilayer ceramic capacitor, it is effective to increase the effective area of the internal electrodes occupying the ceramic green sheet, that is, the area of the internal electrodes facing each other.

For example, Patent Document 1 describes a step of producing a mother block including a plurality of laminated ceramic green sheets and internal electrode patterns arranged along a plurality of interfaces between the ceramic green sheets. By cutting the mother block along a cutting line in the first direction and a cutting line in the second direction orthogonal to each other, a laminated structure composed of a plurality of ceramic layers in an unfired state and a plurality of internal electrodes is formed. A cutting step of obtaining a plurality of green chips having the internal electrodes exposed on the cutting side surface obtained by cutting along the cutting line in the first direction, and applying a ceramic paste to the cutting side surface. Disclosed is a method for manufacturing a laminated ceramic electronic component including a coating step of obtaining an unfired component body by forming an unfired ceramic protective layer and a step of firing the unfired component body.

In the method for manufacturing a laminated ceramic electronic component described in Patent Document 1, a plurality of green chips are rolled by rolling a plurality of green chips in a state where the plurality of green chips arranged in the row and column directions are widely spaced from each other. A rolling step is further performed in which the cut sides of the green chips are aligned to form an open surface, and in the coating step, ceramic paste is simultaneously applied to the cut sides of a plurality of green chips which are the open surfaces as a result of the rolling step. It is said that it is preferable to apply it.

23 (a), 23 (b), and 23 (c) are views shown from the end face direction of the green chips in order to explain an example of the rolling process of rolling the plurality of green chips.

As shown in FIG. 23A, a plurality of green chips 19 attached on the adhesive sheet 38 are placed on the support base 60 together with the adhesive sheet 38, while the rolling motion plate 61 is attached to the green chips 19. On the other hand, it is placed in a state where it can act from above. The support base 60 and the rolling motion plate 61 are preferably made of silicone rubber.

By moving the support base 60 with respect to the rolling motion plate 61 in the direction of the arrow, as shown in FIGS. 23 (b) and 23 (c), the plurality of green chips 19 are rotated by 90 degrees, and one of them is rotated. The cut side surface 20 is in a state of facing upward. If the rolling motion plate 61 is removed in this state, the cut side surface 20 becomes an open surface. Then, an unfired ceramic protective layer is formed on the cut side surface 20 of the green chip 19 which is an open surface.

24 (a), 24 (b), 24 (c), 24 (d) and 24 (e) show that the plurality of green chips on which the unfired ceramic protective layer is formed are rolled again. It is a figure which showed from the end face direction of a green chip to explain a rolling process.

As shown in FIG. 24A, the plurality of green chips 19 having the unfired ceramic protective layer 22 formed on the cut side surface 20 are supported by the support base 60 via the adhesive sheet 38, and the plurality of green chips 19 are supported. On the other hand, the rolling motion plate 61 is placed in a state where it can act from above.

By moving the support base 60 with respect to the rolling motion plate 61 in the direction of the arrow, a plurality of supports 60 are shown in FIGS. 24 (b), 24 (c), 24 (d) and 24 (e). The green tip 19 of No. 19 is repeatedly rotated 90 degrees twice, and the other cutting side surface 21 is turned upward. If the rolling motion plate 61 is removed in this state, the cut side surface 21 becomes an open surface. Then, an unfired ceramic protective layer is formed on the cut side surface 21 of the green chip 19 which is an open surface. From the above, an unfired component body can be obtained.

Subsequently, a plurality of unfired component bodies are removed from the support base together with the adhesive sheet, the adhesive sheet is peeled off from the unfired component body, and then the unfired component body is fired.

Japanese Unexamined Patent Publication No. 2012-209538

As described in Patent Document 1, an unfired ceramic protective layer can be efficiently formed by performing a rolling step of rolling a plurality of green chips.

However, as multilayer ceramic capacitors become smaller, especially thinner (lower in height), the process of rolling a thin green chip and the unfired ceramic protective layer on the cut side surface of the green chip, which is an open surface, It turned out that the process of forming the ceramics became difficult.

The above problem is not limited to the case of manufacturing a monolithic ceramic capacitor, but is a common problem in the case of manufacturing a monolithic ceramic electronic component other than a monolithic ceramic capacitor.

The present invention has been made to solve the above problems, and even in the case of manufacturing a thin laminated ceramic electronic component, a step of rolling a green chip having an internal electrode exposed on a cut side surface and an open surface. It is an object of the present invention to provide a method for manufacturing a laminated ceramic electronic component capable of easily performing a step of forming an unfired ceramic protective layer on the cut side surface of the green chip.

In the first aspect, the method for manufacturing a laminated ceramic electronic component of the present invention includes a plurality of laminated ceramic green sheets and internal electrode patterns arranged along a plurality of interfaces between the ceramic green sheets. Along a step of forming a dummy portion on at least one main surface in the stacking direction of the mother blocks and a cutting line in the first direction and a cutting line in the second direction in which the mother blocks in which the dummy portions are formed are orthogonal to each other. By cutting, it has a laminated structure composed of a plurality of ceramic layers in an unfired state and a plurality of internal electrodes, and the inside is formed on a cut side surface that appears by cutting along the cutting line in the first direction. In the process of obtaining a plurality of green chips with dummy portions with exposed electrodes and in a state where the plurality of green chips with dummy portions arranged in the row and column directions are widely spaced from each other, the plurality of green chips with dummy portions are widened. By rolling the chip, a step of aligning the cut side surfaces of each of the plurality of green chips with dummy portions to form an open surface, and forming an unfired ceramic protective layer on the cut side surface formed as the open surface. By doing so, it is characterized by including a step of obtaining an unfired component body and a step of removing the dummy portion.

When a thin laminated ceramic electronic component is manufactured by the method described in Patent Document 1, the shape of the green chip obtained by cutting the mother block is the thickness (height) T with respect to the width W when viewed from the end face direction. It becomes a rectangle with a small ratio of. Therefore, it is more difficult to roll and raise the green chip in the rolling process than when the shape of the green chip when viewed from the end face direction is close to a square. Further, even if such a thin green chip can be raised, the area of the portion where the green chip adheres to the adhesive tape after rising is small, so that the green chip comes off from the adhesive tape or adheres. Problems such as tilting with respect to the tape occur. Further, if the area of the portion where the green chip adheres to the adhesive tape is small, the same problem as described above occurs when the unfired ceramic protective layer is formed on the cut side surface. For the above reasons, it is difficult to stably manufacture thin multilayer ceramic electronic components.

In the first aspect of the present invention, the green chip with a dummy portion obtained by cutting the mother block in which the dummy portion is formed by forming a dummy portion on at least one main surface in the stacking direction of the mother block. The shape can be a shape close to a square when viewed from the end face direction. As a result, the rolling of the green chip with the dummy portion and the formation of the unfired ceramic protective layer can be easily performed as in the conventional case. By forming the unfired ceramic protective layer and then removing the dummy portion, a thin laminated ceramic electronic component can be manufactured.

In the second aspect, the method for manufacturing a laminated ceramic electronic component of the present invention includes a plurality of laminated ceramic green sheets and internal electrode patterns arranged along a plurality of interfaces between the ceramic green sheets. By forming a dummy portion on at least one main surface in the stacking direction of the mother block and cutting the mother block on which the dummy portion is formed along the cutting line in the first direction, the unfired state is obtained. A plurality of rod-shaped dummies having a laminated structure composed of a plurality of ceramic layers and a plurality of internal electrodes, and having the internal electrodes exposed on the cutting side surface appeared by cutting along the cutting line in the first direction. In the step of obtaining the green block body with a portion and in a state where the plurality of rod-shaped green block bodies with a dummy portion arranged in a predetermined direction are widely spaced from each other, the green block body with a plurality of rod-shaped dummy portions is rolled. By moving, the step of aligning the cut side surfaces of each of the plurality of rod-shaped green block bodies with dummy portions to form an open surface, and forming an unfired ceramic protective layer on the cut side surfaces formed as the open surface. By cutting the rod-shaped green block body with a dummy portion on which the unfired ceramic protective layer is formed along the cutting line in the second direction orthogonal to the first direction, a plurality of unbaked ones are formed. It is characterized by including a step of obtaining a main body of a fired part and a step of removing the dummy portion.

In the second aspect of the present invention, a rod-shaped green with a dummy portion obtained by cutting a mother block on which a dummy portion is formed by forming a dummy portion on at least one main surface in the stacking direction of the mother blocks. The shape of the block body can be made to be close to a square when viewed from the end face direction. As a result, as in the first aspect of the present invention, the green block body with a dummy portion can be easily rolled and the unfired ceramic protective layer can be easily formed. By forming the unfired ceramic protective layer and then removing the dummy portion, a thin laminated ceramic electronic component can be manufactured.

Hereinafter, when the first aspect and the second aspect of the present invention are not particularly distinguished, it is simply referred to as "a method for manufacturing a laminated ceramic electronic component of the present invention".

In the method for manufacturing a laminated ceramic electronic component of the present invention, the dummy portion may be formed by using the ceramic green sheet, or the dummy portion may be formed by using a resin. When a dummy portion is formed using a ceramic green sheet or resin, the unfired component body on which the unfired ceramic protective layer is formed, or the rod-shaped dummy on which the unfired ceramic protective layer is formed. It is preferable to remove the dummy portion from the green block body with a portion.

Further, in the method for manufacturing a laminated ceramic electronic component of the present invention, the dummy portion may be formed by using a zirconia sheet. When the dummy portion is formed by using the zirconia sheet, it is preferable to remove the dummy portion from the main body of the component on which the ceramic protective layer is formed.

The method of manufacturing a multilayer ceramic electronic component of the present invention, the dummy portion with green chip including the dummy unit, or, the thickness of the rod-like dummy parts with green block comprising said dummy portion T _G, the width W _G when the the _value of T G / _{W G} is 0.6 or more and 1.7 or less. When _{the value of T G} / W _G is in the above range, the green chip or the green block body can be easily rolled and the unfired ceramic protective layer can be easily formed.

According to the present invention, even in the case of manufacturing a thin laminated ceramic electronic component, a step of rolling a green chip having an internal electrode exposed on a cut side surface and an unfired surface on the cut side surface of the green chip as an open surface. It is possible to provide a method for manufacturing a laminated ceramic electronic component capable of easily performing the step of forming the ceramic protective layer of the above.

FIG. 1 is a perspective view schematically showing an example of a multilayer ceramic capacitor obtained by the method for manufacturing a multilayer ceramic electronic component of the present invention. FIG. 2 is a perspective view schematically showing an example of a component main body constituting the multilayer ceramic capacitor shown in FIG. 1. FIG. 3 is a perspective view schematically showing an example of a green chip prepared for manufacturing the component body shown in FIG. 2. FIG. 4 is a plan view schematically showing an example of a ceramic green sheet on which an internal electrode pattern prepared for producing the green chip shown in FIG. 3 is formed. FIG. 5A is a perspective view for explaining a process of laminating the ceramic green sheets shown in FIG. 5 (b) and 5 (c) are plan views for explaining a step of laminating the ceramic green sheets shown in FIG. FIG. 6 is a perspective view schematically showing an example of the mother block. FIG. 7 is a perspective view for explaining a process of forming a dummy portion. FIG. 8 is a perspective view for explaining a step of cutting the mother block on which the dummy portion is formed. FIG. 9 is a perspective view showing a state in which a plurality of green chips with dummy portions arranged in the row and column directions are spaced apart from each other. FIG. 10 is a schematic view showing an example of the green chip with a dummy portion according to the first embodiment from the end face direction. FIG. 11 is a schematic view showing an example of the unfired component body according to the first embodiment from the end face direction. 12 (a), 12 (b), and 12 (c) are diagrams for explaining an example of the step of removing the dummy portion in the first embodiment. FIG. 13 is a schematic view showing another example of the green chip with a dummy portion according to the first embodiment from the end face direction. FIG. 14 is a schematic view showing another example of the unfired component body according to the first embodiment from the end face direction. 15 (a), 15 (b), 15 (c), 15 (d) and 15 (e) are for explaining another example of the step of removing the dummy portion in the first embodiment. It is a figure of. FIG. 16 (a) is an LT cross-sectional view schematically showing an example of a multilayer ceramic capacitor obtained by a conventional manufacturing method, and FIG. 16 (b) is obtained by the manufacturing method according to the first embodiment of the present invention. It is an LT cross-sectional view schematically showing an example of the multilayer ceramic capacitor. FIG. 17 is a schematic view showing an example of the green chip with a dummy portion according to the third embodiment from the end face direction. FIG. 18 is a schematic view showing an example of the unfired component body according to the third embodiment from the end face direction. 19 (a) and 19 (b) are schematic views showing an example of a component body obtained after firing from the end face direction. FIG. 20 is a schematic view showing another example of the green chip with a dummy portion according to the third embodiment from the end face direction. FIG. 21 is a schematic view showing another example of the unfired component body according to the third embodiment from the end face direction. 22 (a) and 22 (b) are schematic views showing an example of a component body obtained after firing from the end face direction. 23 (a), 23 (b), and 23 (c) are views shown from the end face direction of the green chips in order to explain an example of the rolling process of rolling the plurality of green chips. 24 (a), 24 (b), 24 (c), 24 (d) and 24 (e) show that the plurality of green chips on which the unfired ceramic protective layer is formed are rolled again. It is a figure which showed from the end face direction of a green chip to explain a rolling process.

Hereinafter, a method for manufacturing the laminated ceramic electronic component of the present invention will be described.
However, the present invention is not limited to the following configurations, and can be appropriately modified and applied without changing the gist of the present invention. It should be noted that a combination of two or more of the individual desirable configurations described below is also the present invention.

As an embodiment of the method for manufacturing a multilayer ceramic electronic component of the present invention, a method for manufacturing a multilayer ceramic capacitor will be described as an example. The manufacturing method of the present invention can also be applied to multilayer ceramic electronic components other than multilayer ceramic capacitors.

First, a multilayer ceramic capacitor obtained by the method for manufacturing a multilayer ceramic electronic component of the present invention will be described.
FIG. 1 is a perspective view schematically showing an example of a multilayer ceramic capacitor obtained by the method for manufacturing a multilayer ceramic electronic component of the present invention. FIG. 2 is a perspective view schematically showing an example of a component main body constituting the multilayer ceramic capacitor shown in FIG. 1.

In the present specification, the stacking direction, width direction, and length direction of the multilayer ceramic capacitor and the component body are defined by arrows T, W, and L in the multilayer ceramic capacitor 11 shown in FIG. 1 and the component body 12 shown in FIG. 2, respectively. The direction. Here, the stacking direction, the width direction, and the length direction are orthogonal to each other. The stacking direction is a direction in which a plurality of ceramic layers 25 and a plurality of pairs of internal electrodes 26 and 27 are stacked.

Note that the thickness of the component body, (in FIG. 2, indicated length is at T _B) stacking dimension is, the width of the component body, in lateral dimension (Fig. 2, indicated by W _B Length).

The multilayer ceramic capacitor 11 shown in FIG. 1 includes a component body 12. As shown in FIG. 2, the component main body 12 has a rectangular parallelepiped shape or a substantially rectangular parallelepiped shape, and is relative to a pair of main surfaces 13 and 14 facing the stacking direction T and a width direction W orthogonal to the stacking direction T. It has a pair of side surfaces 15 and 16 and a pair of end faces 17 and 18 facing the length direction L orthogonal to the stacking direction T and the width direction W.

In the present specification, the cross section of the laminated ceramic capacitor 11 or the component main body 12 intersecting the pair of end faces 17 and 18 and along the stacking direction T is referred to as an LT cross section. Further, the cross section of the multilayer ceramic capacitor 11 or the component main body 12 that intersects the side surface 15 or the side surface 16 and is along the lamination direction T is referred to as a WT cross section. Further, the cross section of the laminated ceramic capacitor 11 or the component main body 12 that intersects the side surface 15, the side surface 16, the end surface 17 or the end surface 18 and is orthogonal to the stacking direction T is referred to as an LW cross section.

FIG. 3 is a perspective view schematically showing an example of a green chip prepared for manufacturing the component body shown in FIG. 2.
As will be described later, the component body 12 shown in FIG. 2 has an unfired ceramic protective layer 22 and an unfired ceramic protective layer 22 on a pair of side surfaces (hereinafter, referred to as cut side surfaces) 20 and 21 facing each other of the green chip 19 shown in FIG. It is obtained by firing each of the formed 23. In the following description, the portion of the component body 12 after firing derived from the green chip 19 will be referred to as a laminated portion 24.

As shown in FIGS. 2 and 3, the laminated portion 24 in the component main body 12 includes a plurality of ceramic layers 25 extending in the directions of the main surfaces 13 and 14 and laminated in a direction orthogonal to the main surfaces 13 and 14, and ceramics. It has a laminated structure composed of a plurality of pairs of internal electrodes 26 and 27 formed along the interface between the layers 25. The component body 12 has a pair of ceramic protective layers 22 and 23 arranged on the cut side surfaces 20 and 21 of the laminated portion 24 so as to provide the side surfaces 15 and 16, respectively. The thicknesses of the ceramic protective layers 22 and 23 are preferably the same as each other.

In addition, in FIGS. 1 and 2, for convenience of explanation, the boundary between the laminated portion 24 and each of the ceramic protective layers 22 and 23 is clearly shown, but such a boundary does not appear clearly. You may.

As shown in FIGS. 2 and 3, the internal electrode 26 and the internal electrode 27 face each other via the ceramic layer 25. When the internal electrode 26 and the internal electrode 27 face each other, electrical characteristics are exhibited. That is, in the multilayer ceramic capacitor 11 shown in FIG. 1, a capacitance is formed.

The internal electrode 26 has an exposed end exposed on the end surface 17 of the component body 12, and the internal electrode 27 has an exposed end exposed on the end surface 18 of the component body 12. On the other hand, since the ceramic protective layers 22 and 23 described above are arranged, the internal electrodes 26 and 27 are not exposed on the side surfaces 15 and 16 of the component body 12.

As shown in FIG. 1, the multilayer ceramic capacitor 11 is further placed on at least one pair of end faces 17 and 18 of the component body 12 so as to be electrically connected to the exposed ends of the internal electrodes 26 and 27, respectively. It includes external electrodes 28 and 29, respectively, which are formed.

The external electrodes 28 and 29 are formed on at least one pair of end faces 17 and 18 of the component body 12, respectively, and in FIG. 1, the external electrodes 28 and 29 wrap around to each part of the main faces 13 and 14 and the side surfaces 15 and 16. Has a part.

As described above, the manufacturing method of the present invention can be applied to multilayer ceramic electronic components other than multilayer ceramic capacitors. For example, when the laminated ceramic electronic component is a piezoelectric component, a piezoelectric ceramic such as PZT-based ceramic is used, and when the thermistor is used, a semiconductor ceramic such as a spinel-based ceramic is used.

As the conductive material constituting the internal electrode, for example, a metal material such as Ni, Cu, Ag, Pd, Ag—Pd alloy, Au or the like can be used.

As the ceramic material constituting the ceramic layers and a ceramic protective layer, for _example, it can be used a dielectric ceramic composed mainly of _{BaTiO 3, CaTiO 3, SrTiO 3} , CaZrO 3 , or the like.

The ceramic material constituting the ceramic protective layer preferably has at least the same main component as the ceramic material constituting the ceramic layer. In this case, it is particularly preferable that a ceramic material having the same composition is used for both the ceramic layer and the ceramic protective layer.

The external electrode is preferably composed of a base layer and a plating layer formed on the base layer. As the conductive material constituting the base layer, for example, Cu, Ni, Ag, Pd, Ag—Pd alloy, Au and the like can be used. The base layer may be formed by applying a conductive paste on the unfired component body and applying a cofire method in which the conductive paste is fired at the same time as the component body, or the conductive paste is applied on the fired component body. It may be formed by applying a post-fire method of baking. Alternatively, the base layer may be formed by direct plating, or may be formed by curing a conductive resin containing a thermosetting resin.

The plating layer formed on the base layer preferably has a two-layer structure of Ni plating and Sn plating on the Ni plating.

Next, as an example of the method for manufacturing the monolithic ceramic electronic component of the present invention, the method for manufacturing the monolithic ceramic capacitor 11 shown in FIG. 1 will be described.

It goes without saying that each of the embodiments shown below is an example, and partial replacement or combination of the configurations shown in different embodiments is possible. In the second and subsequent embodiments, the description of the matters common to the first embodiment will be omitted, and only the differences will be described. In particular, the same action and effect due to the same configuration will not be mentioned sequentially for each embodiment.

(First Embodiment)
First, a ceramic green sheet to be a ceramic layer is prepared. The ceramic green sheet contains a binder, a solvent, and the like in addition to the ceramic raw material containing the dielectric ceramic described above. The ceramic green sheet is formed on a carrier film, for example, by using a die coater, a gravure coater, a micro gravure coater, or the like.

The thickness of the ceramic green sheet is usually 3 μm or less, preferably 1 μm or less, and more preferably 0.6 μm or less.

Next, the conductive paste is printed on the ceramic green sheet with a predetermined pattern. The conductive paste includes a binder, a solvent and the like in addition to the above-mentioned metal materials.

FIG. 4 is a plan view schematically showing an example of a ceramic green sheet on which an internal electrode pattern prepared for producing the green chip shown in FIG. 3 is formed.
As shown in FIG. 4, an internal electrode pattern 32 to be each of the internal electrodes 26 and 27 is formed by printing a conductive paste with a predetermined pattern on the ceramic green sheet 31 to be the ceramic layer 25. Will be done. Specifically, a plurality of rows of band-shaped internal electrode patterns 32 are formed on the ceramic green sheet 31.

The thickness of the internal electrode pattern is not particularly limited, but is preferably 1.5 μm or less.

After that, a predetermined number of ceramic green sheets on which the internal electrode pattern is formed are laminated while being shifted, and a predetermined number of ceramic green sheets on which the internal electrode pattern is not formed are laminated above and below the ceramic green sheets.

FIG. 5A is a perspective view for explaining a process of laminating the ceramic green sheets shown in FIG.
As shown in FIG. 5A, the ceramic green sheet 31 on which the internal electrode pattern 32 is formed is shifted by a predetermined interval along the width direction of the internal electrode pattern 32, that is, by half the width direction dimension of the internal electrode pattern 32. While stacking a predetermined number of sheets. Further, a predetermined number of ceramic green sheets on which the internal electrode pattern is not printed are laminated on the upper and lower surfaces thereof.

5 (b) and 5 (c) are plan views for explaining a step of laminating the ceramic green sheets shown in FIG. 5 (b) and 5 (c) show enlarged first and second layers of ceramic green sheets, respectively.
5 (b) and 5 (c) show the cutting lines 33 in the first direction (vertical direction in FIGS. 5 (b) and 5 (c)) orthogonal to the direction in which the band-shaped internal electrode pattern 32 extends. And each part of the cutting line 34 in the second direction (the left-right direction in FIGS. 5B and 5C) orthogonal to the cutting line 34 is shown. The band-shaped internal electrode pattern 32 has a shape in which two internal electrodes 26 and 27 are connected to each other by the drawer portions, and are continuous along the second direction. In FIGS. 5 (b) and 5 (c), the cutting lines 33 and 34 are shown in common.

As a result of the laminating step, a mother block including a plurality of laminated ceramic green sheets and internal electrode patterns arranged along a plurality of interfaces between the ceramic green sheets is obtained. The obtained mother block is pressed in the stacking direction by means such as a hydrostatic pressure press.

FIG. 6 is a perspective view schematically showing an example of the mother block.
The mother block 35 shown in FIG. 6 is merely an example, and in reality, the number of layers of the ceramic green sheet 31 and the internal electrode pattern 32 and the number of rows forming the band-shaped internal electrode pattern 32 are larger.

Subsequently, a dummy portion is formed on at least one main surface of the mother block in the stacking direction. A dummy portion may be formed after the mother block is manufactured, or a dummy portion may be formed before the mother block is manufactured. In the first embodiment, a dummy portion is formed using a ceramic green sheet. If necessary, the mother block on which the dummy portion is formed is pressed in the stacking direction by means such as a hydrostatic pressure press.

FIG. 7 is a perspective view for explaining a process of forming a dummy portion.
In FIG. 7, a dummy portion 40 is formed on one main surface (upper surface in FIG. 7) of the mother block 35 after being pressed in the stacking direction.

In the first embodiment, when a dummy portion is formed on one main surface in the stacking direction of the mother blocks, a dummy portion may be formed on the upper surface in the stacking direction of the mother blocks or on the lower surface in the stacking direction of the mother blocks. A dummy portion may be formed.

In the first embodiment, the method of forming the dummy portion using the ceramic green sheet is not particularly limited, and when the dummy portion is formed on the upper surface of the mother block in the stacking direction, for example, the upper surface of the pressed mother block is formed. After placing the ceramic green sheet to be the dummy part on the surface, the mother block on which the dummy part is formed may be pressed, or after the ceramic green sheet to be the dummy part is placed on the upper surface of the mother block before being pressed. , The mother block in which the dummy portion is formed may be pressed. On the other hand, when forming a dummy portion on the lower surface in the stacking direction of the mother blocks, for example, after placing the pressed mother block on the ceramic green sheet serving as the dummy portion, the mother block on which the dummy portion is formed is formed. It may be pressed, or the ceramic green sheet as the mother block and the internal electrode pattern may be laminated on the ceramic green sheet as the dummy portion, and then the mother block on which the dummy portion is formed may be pressed. The number of ceramic green sheets to be dummy portions may be one, or a plurality of ceramic green sheets may be laminated.

In the first embodiment, it is preferable that the ceramic green sheet for forming the dummy portion contains the same ceramic raw material as the ceramic raw material for producing the mother block as a main component.

In the first embodiment, the thickness of the dummy portion is not particularly limited, when the thickness of the dummy portion with green chip obtained by cutting the mother block dummy portion is formed T _G, the width is set to W _G, It is preferable that the thickness is such that the value of T _G / W _{G is in the range described later.}

By cutting the mother block in which the dummy portion is formed along the cutting line in the first direction and the cutting line in the second direction orthogonal to each other, a green chip with a plurality of dummy portions can be obtained. For this cutting, for example, methods such as dicing, push-cutting, and laser cutting are applied.

FIG. 8 is a perspective view for explaining a step of cutting the mother block on which the dummy portion is formed.
In FIG. 8, the mother block in which the dummy portions are formed is cut along the cutting lines 33 in the first direction and the cutting lines 34 in the second direction orthogonal to each other, and a plurality of dummy portions arranged in the row and column directions. With green chip 42 is obtained. The green chip 42 with a dummy portion has a dummy portion 41 formed on the green chip 19. In FIG. 8, six green chips 42 with dummy portions are taken out from one mother block 35, but in reality, a larger number of green chips 42 with dummy portions are taken out.

As shown in FIG. 3, each green chip 19 has a laminated structure composed of a plurality of ceramic layers 25 in an unfired state and a plurality of internal electrodes 26 and 27. The cutting side surfaces 20 and 21 of the green chip 19 are surfaces that are exposed by cutting along the cutting line 33 in the first direction, and the cutting end surfaces 36 and 37 are surfaces that are exposed by cutting the cutting line 34 in the second direction. All of the internal electrodes 26 and 27 are exposed on the cut side surfaces 20 and 21. Further, only the internal electrode 26 is exposed on one of the cut end faces 36, and only the internal electrode 27 is exposed on the other cut end face 37.

As shown in FIG. 8, a mother block having dummy portions is attached onto the expandable adhesive sheet 38 so that a plurality of green chips 42 with dummy portions are arranged in the row and column directions. It is preferable to be cut in a state of being cut. In this case, the adhesive sheet 38 can be expanded by an expanding device (not shown).

FIG. 9 is a perspective view showing a state in which a plurality of green chips with dummy portions arranged in the row and column directions are spaced apart from each other.
By expanding the adhesive sheet 38 shown in FIG. 8, as shown in FIG. 9, the plurality of green chips 42 with dummy portions arranged in the row and column directions are brought into a state in which the distance between them is widened.

FIG. 10 is a schematic view showing an example of the green chip with a dummy portion according to the first embodiment from the end face direction.
In the green chip 42 with a dummy portion shown in FIG. 10, a dummy portion 41 is formed on one main surface (upper surface) of the green chips 19 in the stacking direction.

In the first embodiment, when the thickness of the dummy portion with green chip including dummy portion is _{T G,} the width _{W G,} it may be a T G = _{W G,} even T G _{<W G} to _good, it may be a T _{G> W} G. The value of T _G / _{W G} is preferably 0.6 or more. _The value of T G / _{W G} is preferably 1.7 or less.
Note that the thickness of the dummy portion with green chip in FIG. 10, a length indicated by T _G, and the width of the dummy portion with green chip in FIG. 10 is a length indicated by W _G.

Subsequently, by rolling the plurality of green chips with dummy portions, a rolling step is performed in which the cut side surfaces of the plurality of green chips with dummy portions are aligned to form an open surface.

Specifically, the rolling step can be performed by using the methods shown in FIGS. 23 (a), 23 (b) and 23 (c). That is, a plurality of green chips with dummy portions attached on the adhesive sheet are placed on the support base together with the adhesive sheet, while the rolling motion plate can act on the green chips with dummy portions from above. Placed in. The support base and rolling motion plate are preferably made of silicone rubber. By moving the support base with respect to the rolling motion plate, the plurality of green chips with dummy portions are rotated by 90 degrees, and one of the cut side surfaces is turned upward. If the rolling motion plate is removed in this state, the cut side surface becomes an open surface.

Next, an unfired ceramic protective layer is formed on the cut side surface as the open surface. The unfired ceramic protective layer is formed, for example, by pasting a green sheet for the ceramic protective layer or applying a paste for the ceramic protective layer.

It is preferable that the green sheet for the ceramic protective layer or the paste for the ceramic protective layer contains the same ceramic raw material as the ceramic raw material for producing the mother block as a main component.

After forming the unfired ceramic protective layer, a drying step is performed, if necessary. In the drying step, green chips with a dummy portion on which an unfired ceramic protective layer is formed are placed in an oven set at 120 ° C. for 5 minutes, for example.

After that, a rolling step of rolling the green chips with a plurality of dummy portions on which the unfired ceramic protective layer is formed is performed again.

Specifically, the rolling step can be performed by using the methods shown in FIGS. 24 (a), 24 (b), 24 (c), 24 (d) and 24 (e). That is, a plurality of green chips with dummy portions having an unfired ceramic protective layer formed on one of the cut side surfaces are supported by a support base via an adhesive sheet, and roll with respect to the plurality of green chips with dummy portions. The plate is placed in a state where it can act from above. By moving the support base with respect to the rolling motion plate, the plurality of green chips with dummy portions rotate 90 degrees twice, and the other cut side surface is turned upward. If the rolling motion plate is removed in this state, the cut side surface becomes an open surface.

An unfired ceramic protective layer is also formed on the cut side surface on the opposite side to the open surface in the same manner as described above. Further, after forming the unfired ceramic protective layer, a drying step is performed if necessary. From the above, an unfired component body can be obtained.

FIG. 11 is a schematic view showing an example of the unfired component body according to the first embodiment from the end face direction.
In FIG. 11, an unfired ceramic protective layer 22 is formed on one cut side surface 20 of the green chip 19 in which a dummy portion 41 is formed on one main surface in the stacking direction, and an unfired ceramic protective layer 22 is formed on the other cut side surface 21. The unfired component body 51 on which the ceramic protective layer 23 is formed is shown. The unfired component body 51 is attached to the adhesive sheet 38 with the unfired ceramic protective layer 23 facing upward.

In the first embodiment, it is preferable that the dummy portion is removed from the unfired component body on which the unfired ceramic protective layer is formed.

12 (a), 12 (b), and 12 (c) are diagrams for explaining an example of the step of removing the dummy portion in the first embodiment.
As shown in FIG. 12A, the unfired component body 51 is rotated 90 degrees so that the dummy portion 41 faces upward. In this state, as shown in FIGS. 12 (b) and 12 (c), the dummy portion 41 is removed.

The method for removing the dummy portion is not particularly limited, and examples thereof include a method of grinding the dummy portion using a grinder or the like.

After the adhesive sheet is peeled off from the unfired component body from which the dummy portion has been removed, the unfired component body is fired. The firing temperature depends on the ceramic material and the metal material contained in the unfired component body, but is, for example, in the range of 900 ° C. or higher and 1300 ° C. or lower.

An external electrode is formed by applying a conductive paste to both end faces of the main body of the component after firing, baking the paste, and plating if necessary. The conductive paste may be applied to the unfired component body, or the conductive paste may be baked at the same time as the unfired component body is fired.

In this way, the monolithic ceramic capacitor 11 shown in FIG. 1 is manufactured.

The case where the dummy portion is formed on one main surface (upper surface or lower surface) in the stacking direction of the green chips has been mainly described above, but in the first embodiment, both main surfaces (upper surface) in the stacking direction of the green chips have been mainly described. And the lower surface) may be formed with a dummy portion.

FIG. 13 is a schematic view showing another example of the green chip with a dummy portion according to the first embodiment from the end face direction.
In the green chip 44 with a dummy portion shown in FIG. 13, dummy portions 41 and 43 are formed on both main surfaces (upper surface and lower surface) of the green chip 19 in the stacking direction.

FIG. 14 is a schematic view showing another example of the unfired component body according to the first embodiment from the end face direction.
In FIG. 14, an unfired ceramic protective layer 22 is formed on one cut side surface 20 of the green chip 19 in which dummy portions 41 and 43 are formed on both main surfaces in the stacking direction, and the other cut side surface 21 is not formed. The unfired component body 52 on which the fired ceramic protective layer 23 is formed is shown. The unfired component body 52 is attached to the adhesive sheet 38 with the unfired ceramic protective layer 23 facing upward.

15 (a), 15 (b), 15 (c), 15 (d) and 15 (e) are for explaining another example of the step of removing the dummy portion in the first embodiment. It is a figure of.
As shown in FIG. 15A, the unfired component body 52 is rotated 90 degrees so that the dummy portion 41 faces upward. In this state, as shown in FIGS. 15 (b) and 15 (c), the dummy portion 41 is removed. After removing the dummy portion 41, the unfired component body 52 is rotated 180 degrees so that the dummy portion 43 is directed upward (not shown). In this state, as shown in FIGS. 15 (d) and 15 (e), the dummy portion 43 is removed.

After the adhesive sheet is peeled off from the unfired component body from which the dummy portion has been removed, the unfired component body is fired. The multilayer ceramic capacitor 11 shown in FIG. 1 is manufactured by forming external electrodes on both end faces of the component body after firing.

FIG. 16 (a) is an LT cross-sectional view schematically showing an example of a multilayer ceramic capacitor obtained by a conventional manufacturing method, and FIG. 16 (b) is obtained by the manufacturing method according to the first embodiment of the present invention. It is an LT cross-sectional view schematically showing an example of the multilayer ceramic capacitor.

When the dummy portion is not formed as in the conventional manufacturing method, as shown in FIG. 16A, the component main body 12 has a portion where the internal electrodes 26 and 27 are present and a portion where the internal electrodes 26 or 27 are not present. There will be a step between them. When step is to form the external electrodes 28 and 29 to the component body 12 occurs, the distance between the external electrode 28 and internal electrode 26 (in FIG. 16 (a), the length indicated by _{E 1),} and, the external electrode 29 Since the distance from the internal electrode 27 is short, moisture easily enters the component body 12 during the plating process or the like. Therefore, the quality of the monolithic ceramic capacitor may deteriorate.

On the other hand, when the dummy portion is formed by using the ceramic green sheet as in the manufacturing method according to the first embodiment of the present invention, the surface of the unfired component body is ground flat when the dummy portion is removed. By doing so, as shown in FIG. 16B, the step generated in the component main body 12 can be filled. As a result, in FIG. 16 (b), the manner of the length of the relationship indicated by the length and T ₂ represented by T _1, and the most principal surface of the inner electrode and the component main body is laminated on the side major surface of the component body The distance between the two becomes wider as it approaches the end face from the capacitance forming portion. In this case, the distance between the external electrode 28 and internal electrode 26 (in FIG. 16 (b), the length indicated by E _2), and, since it is possible to increase the distance between the external electrode 29 and the internal electrodes 27, Moisture is less likely to enter the component body 12 during the plating process or the like. Therefore, it is possible to prevent quality deterioration of the monolithic ceramic capacitor.

In the first embodiment, the above effect can be obtained even when the dummy portions are formed on one main surface in the stacking direction of the green chips, but the dummy portions are formed on both main surfaces in the stacking direction of the green chips. This is more effective in preventing quality deterioration because the steps on both sides can be filled. From the viewpoint of obtaining the above-mentioned effects, it is preferable that at least the dummy portion constituting the portion that fills the step contains the same ceramic raw material as the ceramic raw material for producing the mother block as a main component.

Based on the above, a multilayer ceramic electronic component having the following characteristics is also one of the present inventions.
A pair of main surfaces facing the stacking direction, a pair of side surfaces facing the width direction orthogonal to the stacking direction, a stacking direction, and a pair of side surfaces including a plurality of ceramic layers arranged in the stacking direction and a plurality of internal electrodes. A laminated ceramic electronic component including a component body having a pair of end faces opposite to each other in the length direction orthogonal to the width direction, and external electrodes provided on at least one pair of end faces of the component body. , A laminated ceramic electronic component characterized in that the distance between the internal electrode laminated on the most main surface side of the component body and the main surface of the component body becomes wider as it approaches the end face from the capacitance forming portion.

(Second Embodiment)
In the second embodiment, unlike the first embodiment, a case where a dummy portion is formed by using a resin will be described.

First, by the method described in the first embodiment, a mother block including a plurality of laminated ceramic green sheets and internal electrode patterns arranged along a plurality of interfaces between the ceramic green sheets is obtained. The obtained mother block is pressed in the stacking direction by means such as a hydrostatic pressure press.

Subsequently, a dummy portion is formed on at least one main surface of the mother block in the stacking direction. A dummy portion may be formed after the mother block is manufactured, or a dummy portion may be formed before the mother block is manufactured. In the second embodiment, a dummy portion is formed using the resin. If necessary, the mother block on which the dummy portion is formed is pressed in the stacking direction by means such as a hydrostatic pressure press.

In the second embodiment, when a dummy portion is formed on one main surface in the stacking direction of the mother blocks, a dummy portion may be formed on the upper surface in the stacking direction of the mother blocks or on the lower surface in the stacking direction of the mother blocks. A dummy portion may be formed.

In the second embodiment, the method of forming the dummy portion using the resin is not particularly limited, and when the dummy portion is formed on the upper surface of the mother block in the stacking direction, for example, the dummy portion is formed on the upper surface of the pressed mother block. After placing the resin sheet to be the part, the mother block on which the dummy part is formed may be pressed, or after the resin sheet to be the dummy part is placed on the upper surface of the mother block before being pressed, the dummy part is formed. The formed mother block may be pressed. On the other hand, when forming a dummy portion on the lower surface of the mother block in the stacking direction, for example, the pressed mother block is placed on a resin sheet to be the dummy portion, and then the mother block on which the dummy portion is formed is pressed. Alternatively, the ceramic green sheet to be the mother block and the internal electrode pattern may be laminated on the resin sheet to be the dummy portion, and then the mother block on which the dummy portion is formed may be pressed. The resin sheet serving as the dummy portion may be one sheet or a plurality of resin sheets may be laminated. Further, the form of the resin forming the dummy portion is not limited to the resin sheet.

In the second embodiment, the type of resin for forming the dummy portion is not particularly limited, and examples thereof include acrylic resin and the like.

In the second embodiment, the thickness of the dummy portion is not particularly limited, but it is preferably the same thickness as that of the first embodiment.

Then, as in the first embodiment, the mother blocks in which the dummy portions are formed are cut along the cutting lines in the first direction and the cutting lines in the second direction orthogonal to each other, thereby forming a plurality of green chips with dummy portions. Is obtained. At this time, the mother block in which the dummy portion is formed may be cut while being attached on the expandable adhesive sheet so that the green chips with the dummy portion are arranged in the row and column directions. preferable.

In the second embodiment, when the thickness of the dummy portion with green chip including dummy portion is _{T G,} the width _{W G,} it may be a T G = _{W G,} even T G _{<W G} to _good, it may be a T _{G> W} G. Preferred values of T _G / _{W G} is the same as the first embodiment.

Subsequently, as in the first embodiment, by rolling a plurality of green chips with dummy portions, a rolling step is performed in which the cut side surfaces of the plurality of green chips with dummy portions are aligned to form an open surface. An unfired ceramic protective layer is formed on the cut side surface which is an open surface. After that, a rolling step of rolling the green chips with a plurality of dummy portions on which the unfired ceramic protective layer was formed is performed again, and the unfired ceramic protective layer is also formed on the cut side surface on the opposite side as the open surface. It is formed.

In the second embodiment, it is preferable that the dummy portion is removed from the unfired component body on which the unfired ceramic protective layer is formed. The method of removing the dummy portion is the same as that of the first embodiment.

After the adhesive sheet is peeled off from the unfired component body from which the dummy portion has been removed, the unfired component body is fired. The multilayer ceramic capacitor 11 shown in FIG. 1 is manufactured by forming external electrodes on both end faces of the component body after firing.

In the second embodiment, dummy portions may be formed on both main surfaces (upper surface and lower surface) in the stacking direction of the green chips.

When a dummy portion is formed using a resin as in the manufacturing method according to the second embodiment of the present invention, a laminated ceramic electronic component is manufactured at a lower cost than when a dummy portion is formed using a ceramic green sheet. be able to.

(Third Embodiment)
In the third embodiment, unlike the first embodiment and the second embodiment, a case where a dummy portion is formed by using a zirconia sheet will be described.

First, by the method described in the first embodiment, a mother block including a plurality of laminated ceramic green sheets and internal electrode patterns arranged along a plurality of interfaces between the ceramic green sheets is obtained. The obtained mother block is pressed in the stacking direction by means such as a hydrostatic pressure press.

Subsequently, a dummy portion is formed on at least one main surface of the mother block in the stacking direction. A dummy portion may be formed after the mother block is manufactured, or a dummy portion may be formed before the mother block is manufactured. In the third embodiment, a dummy portion is formed using the zirconia sheet. If necessary, the mother block on which the dummy portion is formed is pressed in the stacking direction by means such as a hydrostatic pressure press.

In the third embodiment, when a dummy portion is formed on one main surface in the stacking direction of the mother blocks, a dummy portion may be formed on the upper surface in the stacking direction of the mother blocks or on the lower surface in the stacking direction of the mother blocks. A dummy portion may be formed.

In the third embodiment, the method of forming the dummy portion using the zirconia sheet is not particularly limited, and when the dummy portion is formed on the upper surface of the mother block in the stacking direction, for example, on the upper surface of the pressed mother block. After placing the zirconia sheet to be the dummy part, the mother block on which the dummy part is formed may be pressed, or after placing the zirconia sheet to be the dummy part on the upper surface of the mother block before being pressed, the dummy part You may press the mother block in which is formed. On the other hand, when forming a dummy portion on the lower surface of the mother block in the stacking direction, for example, the pressed mother block is placed on a zirconia sheet to be the dummy portion, and then the mother block on which the dummy portion is formed is pressed. Alternatively, the ceramic green sheet to be the mother block and the internal electrode pattern may be laminated on the zirconia sheet to be the dummy portion, and then the mother block on which the dummy portion is formed may be pressed. The number of zirconia sheets to be dummy portions may be one, or a plurality of zirconia sheets may be laminated.

In the third embodiment, the zirconia sheet for forming the dummy portion contains zirconia, a binder, a solvent, and the like. The zirconia sheet is formed on a carrier film, for example, by using a die coater, a gravure coater, a micro gravure coater, or the like.

In the third embodiment, the thickness of the dummy portion is not particularly limited, but it is preferably the same thickness as that of the first embodiment.

Then, as in the first embodiment, the mother blocks in which the dummy portions are formed are cut along the cutting lines in the first direction and the cutting lines in the second direction orthogonal to each other, thereby forming a plurality of green chips with dummy portions. Is obtained. At this time, the mother block in which the dummy portion is formed may be cut while being attached on the expandable adhesive sheet so that the green chips with the dummy portion are arranged in the row and column directions. preferable.

FIG. 17 is a schematic view showing an example of the green chip with a dummy portion according to the third embodiment from the end face direction.
In the green chip 46 with a dummy portion shown in FIG. 17, a dummy portion 45 is formed on one main surface (upper surface) of the green chips 19 in the stacking direction.

In the third embodiment, when the thickness of the dummy portion with green chip including dummy portion is _{T G,} the width _{W G,} it may be a T G = _{W G,} even T G _{<W G} to _good, it may be a T _{G> W} G. Preferred values of T _G / _{W G} is the same as the first embodiment.

Subsequently, as in the first embodiment, by rolling a plurality of green chips with dummy portions, a rolling step is performed in which the cut side surfaces of the plurality of green chips with dummy portions are aligned to form an open surface. An unfired ceramic protective layer is formed on the cut side surface which is an open surface. After that, a rolling step of rolling the green chips with a plurality of dummy portions on which the unfired ceramic protective layer was formed is performed again, and the unfired ceramic protective layer is also formed on the cut side surface on the opposite side as the open surface. It is formed.

FIG. 18 is a schematic view showing an example of the unfired component body according to the third embodiment from the end face direction.
In FIG. 18, an unfired ceramic protective layer 22 is formed on one cut side surface 20 of the green chip 19 in which a dummy portion 45 is formed on one main surface in the stacking direction, and an unfired ceramic protective layer 22 is formed on the other cut side surface 21. The unfired component body 53 on which the ceramic protective layer 23 is formed is shown. The unfired component body 53 is attached to the adhesive sheet 38 with the unfired ceramic protective layer 23 facing upward.

In the third embodiment, it is preferable that the adhesive sheet is peeled off from the unfired component body in which the dummy portion is formed, and then the unfired component body is fired in the state where the dummy portion is formed. The firing temperature depends on the ceramic material and the metal material contained in the unfired component body, but is, for example, in the range of 900 ° C. or higher and 1300 ° C. or lower.

Since the components such as the binder and the solvent contained in the zirconia sheet are burnt down, the zirconia powder remains on the main body of the component after firing. Therefore, the dummy portion can be removed by performing ultrasonic cleaning or the like. As described above, in the third embodiment, it is preferable that the dummy portion is formed from the component main body on which the ceramic protective layer is formed.

19 (a) and 19 (b) are schematic views showing an example of a component body obtained after firing from the end face direction.
FIG. 19A shows the component body 53'after the dummy portion has been removed. After firing, if necessary, the unnecessary ceramic protective layers 22 and 23 are removed to obtain the component body 12 as shown in FIG. 19 (b). Examples of the method for removing the unnecessary ceramic protective layer include a method such as barrel polishing.

In FIG. 19A, the ceramic protective layers 22 and 23 are formed at all the locations where the dummy portions are formed, but the ceramic protective layers 22 and 23 are formed at some locations where the dummy portions are formed. It may be formed. Further, the ceramic protective layers 22 and 23 may not be formed at the portion where the dummy portion is formed.

The multilayer ceramic capacitor 11 shown in FIG. 1 is manufactured by forming external electrodes on both end faces of the component body after firing.

In the third embodiment, dummy portions may be formed on both main surfaces (upper surface and lower surface) in the stacking direction of the green chips.

When a dummy portion is formed using a zirconia sheet as in the manufacturing method according to the third embodiment of the present invention, since zirconia is a material used for a firing jig, the dummy portion is not formed. Even if the main body of the fired component is fired, the effect on the product is considered to be small. When the unfired component body is fired with the dummy portion formed, it is not necessary to grind the dummy portion before firing, so that the dummy portion can be easily removed.

Further, when the dummy portion is formed by using the zirconia sheet, a plurality of green chips may be stacked via the dummy portion.

FIG. 20 is a schematic view showing another example of the green chip with a dummy portion according to the third embodiment from the end face direction.
In the green chip 47 with a dummy portion shown in FIG. 20, the green chip 19a and the green chip 19b are stacked in the stacking direction, and the dummy portion 45 is formed between the green chips 19a and 19b. The number of green chips that can be stacked is not limited to two, and may be three or more.

Subsequently, as in the first embodiment, by rolling a plurality of green chips with dummy portions, a rolling step is performed in which the cut side surfaces of the plurality of green chips with dummy portions are aligned to form an open surface. An unfired ceramic protective layer is formed on the cut side surface which is an open surface. After that, a rolling step of rolling the green chips with a plurality of dummy portions on which the unfired ceramic protective layer was formed is performed again, and the unfired ceramic protective layer is also formed on the cut side surface on the opposite side as the open surface. It is formed.

FIG. 21 is a schematic view showing another example of the unfired component body according to the third embodiment from the end face direction.
In FIG. 21, an unfired ceramic protective layer 22 is formed on one cut side surface 20 of the green chips 19a and 19b in which a dummy portion 45 is formed, and an unfired ceramic protective layer 23 is formed on the other cut side surface 21. The unfired component body 54 in which the above is formed is shown. The unfired component body 54 is attached to the adhesive sheet 38 with the unfired ceramic protective layer 23 facing upward.

22 (a) and 22 (b) are schematic views showing an example of a component body obtained after firing from the end face direction.
FIG. 22A shows the component main body 54'after the dummy portion has been removed. After firing, if necessary, the component main body 12 is separated into two, and unnecessary ceramic protective layers 22 and 23 are removed to obtain two component main bodies 12 as shown in FIG. 22 (b). .. In the present embodiment, the component body can be easily separated even with a weak force. Examples of the method for removing the unnecessary ceramic protective layer include a method such as barrel polishing.

The multilayer ceramic capacitor 11 shown in FIG. 1 is manufactured by forming external electrodes on both end faces of the component body after firing.

(Other embodiments)
In the method for manufacturing a laminated ceramic electronic component of the present invention, the method for forming a dummy portion is not limited to the method described in the above-described embodiment, and the dummy portion may be formed by another method. When forming dummy portions on both main surfaces in the stacking direction of the green chips, for example, a ceramic green sheet is used to form a dummy portion on one main surface, and a resin is used to form a dummy portion on the other main surface. May be formed.

In the above-described embodiment, the mother block on which the dummy portion is formed is cut into a cutting line in the first direction and a cutting line in the second direction to obtain a plurality of green chips with dummy portions, and then the cut side surface is not fired. Although the ceramic protective layer was formed, it can be changed as follows.

That is, by cutting the mother block in which the dummy portion is formed along only the cutting line in the first direction, a plurality of rods in which the internal electrodes are exposed on the cutting side surface that appears by cutting along the cutting line in the first direction. After obtaining a green block body with a dummy portion, an unfired ceramic protective layer was formed on the cut side surface, and then cut along a cutting line in the second direction to obtain a plurality of unfired component bodies, and then unfired. The main body of the fired component may be fired. After firing, a laminated ceramic electronic component can be manufactured by performing the same steps as in the above-described embodiment.

11 Multilayer ceramic capacitors (multilayer ceramic electronic components)
12,53', 54'Part body 13,14 Main surface 15,16 Side 17,18 End surface 19,19a, 19b Green tip 20,21 Cut side 22,23 Ceramic protective layer 24 Laminated part 25 Ceramic layer 26,27 Inside Electrodes 28, 29 External electrode 31 Ceramic green sheet 32 Internal electrode pattern 33 Cutting line in the first direction 34 Cutting line in the second direction 35 Mother block 36, 37 Cutting end face 38 Adhesive sheet 40, 41, 43, 45 Dummy part 42, 44, 46, 47 Green insert with dummy part 51, 52, 53, 54 Unfired parts Main body 60 Support base 61 Rolling operation plate

Claims (3)

The ceramic green sheet is placed on at least one main surface in the stacking direction of the mother block including the plurality of laminated ceramic green sheets and the internal electrode patterns arranged along the plurality of interfaces between the ceramic green sheets. The process of obtaining a mother block with a dummy part by forming a dummy part using the material,
By cutting the mother block with a dummy portion along a cutting line in the first direction, the mother block has a laminated structure composed of a plurality of ceramic layers in an unfired state and a plurality of internal electrodes, and the first A step of obtaining a plurality of rod-shaped green block bodies with dummy portions in which the internal electrodes are exposed on the cutting side surface that appears by cutting along a cutting line in one direction and the dummy portion and the green block body are integrated.
By rolling the plurality of rod-shaped green block bodies with dummy portions in a state where the plurality of rod-shaped green block bodies with dummy portions arranged in a predetermined direction are widely spaced from each other, the plurality of rod-shaped green block bodies having dummy portions are rolled. A process of aligning the cut side surfaces of each green block body with a dummy portion to form an open surface, and
A step of forming an unfired ceramic protective layer on the cut side surface which is the open surface, and
A plurality of unfired component bodies are formed by cutting the rod-shaped green block body with a dummy portion on which the unfired ceramic protective layer is formed along a cutting line in a second direction orthogonal to the first direction. And the process of obtaining
A method for manufacturing a laminated ceramic electronic component, which comprises a step of removing the dummy portion. The method for manufacturing a laminated ceramic electronic component according to claim 1, wherein the dummy portion is removed from the rod-shaped green block body with a dummy portion on which the unfired ceramic protective layer is formed. When the thickness of the dummy portion with green block body of the rod-shaped including the dummy portion is _{T G,} the width _{W G,} the value of T G / _{W G} is 0.6 or more, according to claim 1.7 or less The method for manufacturing a laminated ceramic electronic component according to 1 or 2.

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