JP2012099600A - Manufacturing method of lamination type electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamination type electronic component that corresponds to heavy-current and high inductance.SOLUTION: The lamination type electronic component on the basis of one embodiment of the invention includes: a first drying process for drying a via conductor pattern; and a second drying process for drying an internal conductor pattern. Therefore, the swelling of a first ceramic green sheet and a second ceramic green sheet can be prevented by solution included in the via conductor pattern and the internal conductor pattern.

Description

  The present invention relates to a method for manufacturing a multilayer electronic component in which a coil-shaped inner conductor is embedded. Such multilayer electronic components can be used, for example, as inductors, transformers, coil components, LC components, or feedthrough capacitors in a wide variety of electronic devices typified by industrial electronic devices and consumer electronic products.

  As an electronic component in which a coil-shaped inner conductor is embedded, for example, a multilayer inductor described in Patent Document 1 is known. The multilayer inductor described in Patent Document 1 is manufactured by laminating a plurality of magnetic green sheets having a conductor pattern printed on the upper surface to form a green multilayer body and firing it.

  Further, after forming the green laminate, pressure is applied to the green laminate in the stacking direction to press the magnetic green sheets so that no gap is generated between the magnetic green sheets.

JP 2006-148027 A

  In recent years, there has been a demand for multilayer electronic components that can handle large currents and high inductances. A method of increasing the thickness of the internal conductor is used to make the multilayer electronic component compatible with a large current and a high inductance.

  However, when the thickness of the inner conductor is increased by using the method described in Patent Document 1, it is difficult to sufficiently press the magnetic green sheet even if pressure is applied to the magnetic green sheet in the stacking direction. Become. Further, since it is necessary to apply a large pressure, there is a possibility that the conductor paste as the inner conductor is deformed and the inductance of the inner conductor fluctuates.

  The present invention has been made in view of such a conventional technique, and an object thereof is to provide a multilayer electronic component corresponding to a large current and a high inductance.

  According to one aspect of the present invention, there is provided a method for manufacturing a multilayer electronic component comprising: a first preparation step of preparing a first ceramic green sheet having through holes opened on an upper surface and a lower surface; and vias in the through holes. A first disposing step of disposing a conductor pattern; a first drying step of drying the via conductor pattern disposed in the through hole; and a penetrating pattern opening on an upper surface and a lower surface; A second preparatory step of preparing a second ceramic green sheet having a thickness greater than that of the first ceramic green sheet; and an upper surface of the first ceramic green sheet dried by the first drying step. A lamination step of laminating two ceramic green sheets, and an interior corresponding to the shape of the through pattern in the through pattern so as to be joined to the via conductor pattern A second disposing step of disposing a body pattern; a second drying step of drying the internal conductor pattern disposed in the penetrating pattern; the first ceramic green sheet and the second And a firing step of firing the ceramic green sheet.

  According to the method for manufacturing a multilayer electronic component based on the above aspect, since the second ceramic green sheet in which the internal conductor pattern is disposed in the through hole is used, a gap is hardly generated between the ceramic green sheets. Become. Therefore, it becomes easy to press-fit the ceramic green sheet.

  In addition, since the via conductor pattern and the inner conductor pattern are dried by the first drying step and the second drying step, respectively, the first ceramic green sheet and the solvent contained in the via conductor pattern and the inner conductor pattern Swelling of the second ceramic green sheet can be suppressed.

  Moreover, since the strength of the via conductor pattern and the internal conductor pattern can be increased by drying the via conductor pattern and the internal conductor pattern, the second ceramic green sheet is laminated on the upper surface of the first ceramic green sheet. In the laminating step, it is possible to suppress deformation of the conductor paste that becomes the inner conductor.

It is a perspective view which shows the multilayer electronic component of one Embodiment, and its manufacturing method. It is a disassembled perspective view of embodiment shown in FIG. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 1st Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 1st Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 1st Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 1st Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 1st Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 2nd Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 2nd Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 2nd Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 2nd Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 2nd Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 3rd Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 3rd Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 3rd Embodiment. It is a disassembled perspective view which shows 1 process of the manufacturing method of the multilayer electronic component of 3rd Embodiment. It is AA sectional drawing of embodiment shown in FIG. It is a plane perspective view of embodiment shown in FIG.

  Hereinafter, the multilayer electronic component of this embodiment and the manufacturing method thereof will be described in detail with reference to the drawings. However, in the drawings referred to below, for the convenience of explanation, among the members constituting the following embodiments, only the main members necessary for explaining the characteristic configuration are shown in a simplified manner. Therefore, the multilayer electronic component of the present embodiment can include arbitrary constituent members that are not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

The manufacturing method of the multilayer electronic component 1 according to the first embodiment includes the following steps. That is,
(1) a first preparation step of preparing a first ceramic green sheet 3 having a through-hole 3a that opens to an upper surface and a lower surface;
(2) a first disposing step of disposing the via conductor pattern 5 in the through hole 3a;
(3) a first drying step of drying the via conductor pattern 5 disposed in the through hole 3a; and (4) a first ceramic green sheet 3 having a through pattern 7a opened on the upper surface and the lower surface. A second preparation step of preparing a second ceramic green sheet 7 having a thickness greater than
(5) a laminating step of laminating the second ceramic green sheet 7 on the upper surface of the first ceramic green sheet 3 dried by the first drying step;
(6) a second arrangement step of arranging an internal conductor pattern 9 corresponding to the shape of the through pattern 7a in the through pattern 7a so as to be joined to the via conductor pattern 5;
(7) a second drying step of drying the internal conductor pattern 9 disposed in the through pattern 7a;
(8) A firing step of firing the first ceramic green sheet 3 and the second ceramic green sheet 7.

  Thus, according to the manufacturing method of the multilayer electronic component of the first embodiment, the second ceramic green sheet 3 in which the internal conductor pattern 9 is disposed in the through hole is used. A gap is less likely to occur between the sheets. Therefore, it becomes easy to press-fit the ceramic green sheet.

  Also, instead of drying after forming the green laminate 11, the first drying step is performed each time after the first disposing step, and the second drying step is performed after the second disposing step. The via conductor pattern 5 and the internal conductor pattern 9 are each dried by performing each time. Therefore, swelling of the first ceramic green sheet 3 and the second ceramic green sheet 7 by the solvent contained in the via conductor pattern 5 and the internal conductor pattern 9 can be suppressed.

  Since swelling of the first ceramic green sheet 3 can be suppressed, when the first ceramic green sheet 3 is handled, when the second ceramic green sheet 7 is laminated on the upper surface of the first ceramic green sheet 3, or The first ceramic green sheet 3 can be prevented from being partially deformed when the laminate 11 is pressed and fired. Therefore, it is possible to suppress an increase in variation in thickness between the first ceramic green sheet 3 and the via conductor pattern 5 disposed in the through hole 3a of the first ceramic green sheet 3.

Similarly, since the second ceramic green sheet 7 can be prevented from swelling, the second ceramic green sheet 7 is placed on the upper surface of the first ceramic green sheet 3 when the second ceramic green sheet 7 is handled. It is possible to suppress the second ceramic green sheet 7 from being partially deformed when being laminated or when the laminated body 11 is pressed and fired. Therefore, it is possible to suppress an increase in variation in thickness between the second ceramic green sheet 7 and the internal conductor pattern 9 disposed in the through pattern 7 a included in the second ceramic green sheet 7.

  Therefore, it is suppressed that a gap is generated between the first and second ceramic green sheets 5 and 7 inside the green laminate 11 due to the thickness variation caused by the partial deformation. Therefore, in order to join a plurality of ceramic green sheets to each other, it is not always necessary to apply a large pressure in the stacking direction, so that the possibility of deformation of the internal conductor paste can be reduced.

  Further, by drying the via conductor pattern 5 and the internal conductor pattern 9 respectively, the strength of the via conductor pattern 5 and the internal conductor pattern 9 can be increased, so that the second ceramic is formed on the upper surface of the first ceramic green sheet 3. In the laminating process of laminating the green sheets 7, it is possible to suppress deformation of the conductor paste serving as the internal conductor.

  As a result, it is possible to provide the multilayer electronic component 1 corresponding to a large current and a high inductance.

(1) First Preparation Step First, a plurality of first ceramic green sheets 3 are produced. Specifically, a mixing member is prepared by mixing a raw material powder containing glass powder and ceramic powder, an organic solvent, and a binder. As the raw material powder, for example, silicon oxide (SiO ₂ ), alumina (Al ₂ O ₃ ), zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), magnesium oxide (MgO), and calcium oxide (CaO) are used. be able to. A plurality of first ceramic green sheets 3 can be produced by forming the mixing member into a sheet.

  Furthermore, the through hole 3a that opens to the upper surface and the lower surface may be formed by punching out a part of the sheet after the above-mentioned mixing member is formed into a sheet shape. Further, when the mixing member is formed into a sheet shape, the through hole 3a may be formed by forming the sheet into a sheet shape so as to exclude a portion that becomes the through hole 3a. In this way, as shown in FIG. 3, a plurality of first ceramic green sheets 3 having through-holes 3 a opened on the upper surface and the lower surface can be prepared.

(2) First Arrangement Step Next, as shown in FIG. 3, a conductor paste is arranged as a via conductor pattern 5 in the through hole 3a. As the conductive paste, for example, a material obtained by adding a glassy material for adding adhesion to an insulating material to a metal material powder such as copper, silver, gold, platinum, or nickel can be used. The above metal materials can be used as a single, alloy or mixture, and a mixture of an organic solvent and a binder can be used as a conductor paste.

(3) 1st drying process Next, the via conductor pattern 5 arrange | positioned in the through-hole 3a is dried. Note that the drying process in the present embodiment means that the via conductor pattern 5 is exposed after the via conductor pattern 5 is disposed and before the internal conductor pattern 9 is disposed on the via conductor pattern 5. This does not indicate inevitable drying in the manufacturing process. That is, it means that a step of drying the via conductor pattern 5 is added separately.

Specifically, for example, the via conductor pattern 5 can be dried by applying a dry wind to the via conductor pattern 5 disposed in the through hole 3a. The via conductor pattern 5 is dried by placing the first ceramic green sheet 3 having the via conductor pattern 5 in the through hole 3a in a drying chamber set at a temperature higher than room temperature for a predetermined time. Also good. Further, the via conductor pattern 5 may be dried by performing microwave heating. By these methods, it can be set as the 1st drying process of drying the via conductor pattern 5 arrange | positioned by the through-hole 3a. The drying time can be appropriately set according to the type of material used as the via conductor pattern 5, the organic solvent, and the binder content.

(4) Second Preparation Step Next, a plurality of second ceramic green sheets 7 are produced. Specifically, similarly to the first ceramic green sheet 3, a mixing member is prepared by mixing a raw material powder containing glass powder and ceramic powder, an organic solvent, and a binder. As the raw material powder, for example, silicon oxide (SiO ₂ ), alumina (Al ₂ O ₃ ), zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), magnesium oxide (MgO), and calcium oxide (CaO) are used. be able to. A plurality of second ceramic green sheets 7 can be produced by forming the mixing member into a sheet shape.

  At this time, the thickness of the internal conductor pattern 9 can be increased by making the thickness of the second ceramic green sheet 7 larger than the thickness of the first ceramic green sheet 3. Therefore, the resistance value of the internal wiring can be reduced, the current value can be increased, and the inductance value can be increased.

  The second ceramic green sheet 7 may be constituted by a single sheet having a thickness larger than the thickness of the first ceramic green sheet 3, but is not limited thereto. For example, the second ceramic green sheet 7 having a thickness larger than the thickness of the first ceramic green sheet 3 may be formed by stacking a plurality of ceramic green sheets.

  At this time, when the second ceramic green sheet 7 is formed by laminating a plurality of ceramic green sheets having a thickness equivalent to that of the first ceramic green sheet 3, the first ceramic green sheet 3 and the second ceramic green sheet 3 Since a ceramic green sheet having a certain thickness may be prepared as the ceramic green sheet 7, productivity can be improved.

  Furthermore, the penetration pattern 7a opening on the upper surface and the lower surface may be formed by punching out a part of the sheet after the above-mentioned mixing member is formed into a sheet shape. Further, when the mixing member is formed into a sheet shape, the penetrating pattern 7a may be formed by forming the sheet into a sheet shape so as to exclude a portion that becomes the penetrating pattern 7a. In this way, as shown in FIG. 4, a plurality of second ceramic green sheets 7 having penetrating patterns 7a opened on the upper and lower surfaces can be prepared.

  The first ceramic green sheet 3 and the second ceramic green sheet 7 in the present embodiment have a rectangular outer peripheral shape when viewed in plan, but are not particularly limited thereto. For example, the outer peripheral shape in plan view may be a polygonal shape such as a hexagonal shape or an octagonal shape, or a curved shape such as an elliptical shape or a circular shape.

(5) Lamination process Next, as shown in FIG. 4, the 2nd ceramic green sheet 7 is laminated | stacked on the upper surface of the 1st ceramic green sheet 3 dried by the 1st drying process. At this time, the second ceramic green sheet 7 is laminated so that the through pattern 7 a is connected to a part of the through hole 3 a of the first ceramic green sheet 3. In other words, the second ceramic green sheet 7 is laminated on the upper surface of the first ceramic green sheet 3 so that a part of the via conductor pattern 5 is exposed in the opening on the lower surface side of the penetrating pattern 7a.

(6) Second Arrangement Step Next, as shown in FIG. 5, the inner conductor pattern 9 corresponding to the shape of the penetration pattern 7a is arranged in the penetration pattern 7a. At this time, since a part of the via conductor pattern 5 is exposed at the opening on the lower surface side of the through pattern 7a, the internal conductor pattern 9 and the via conductor pattern 5 are joined.

  As the internal conductor pattern 9, similarly to the via conductor pattern 5, for example, a conductive paste in which a glassy material for adding adhesion to an insulating material is added to a metal material powder such as copper, silver, gold, or platinum nickel. Can be used. The above metal materials can be used as a single, alloy or mixture, and a mixture of an organic solvent and a binder can be used as a conductor paste.

  In particular, it is preferable to use the same metal material as the inner conductor pattern 9 and the via conductor pattern 5. Variations in the electrical resistivity of the internal conductor pattern 9 and the electrical resistivity of the via conductor pattern 5 can be reduced.

  In the manufacturing method of the multilayer electronic component 1 of the present embodiment, the through pattern 7a is formed in a so-called C-shape that is substantially annular when viewed in plan. Therefore, when viewed in plan, the inner conductor pattern 9 is formed in a so-called C-shape that is substantially annular.

  As will be described later, internal conductor patterns 9 adjacent in the stacking direction are electrically connected via via conductor patterns 5. Therefore, the coiled internal wiring wound in the stacking direction of the multilayer electronic component 1 can be formed inside the stacked body 11 after firing. By forming the internal wiring in this way, the multilayer electronic component 1 can act as a chip inductor.

(7) 2nd drying process Next, the internal conductor pattern 9 arrange | positioned in the penetration pattern 7a is dried. Note that the second drying process in the present embodiment is unavoidable in the manufacturing process due to the internal conductor pattern 9 being exposed after the internal conductor pattern 9 is disposed and before firing. It does not indicate dryness. That is, it means that a step of drying the internal conductor pattern 9 is added separately.

  As a method for drying the internal conductor pattern 9, specifically, for example, the internal conductor pattern 9 can be dried by applying a dry wind to the internal conductor pattern 9 disposed in the through pattern 7a. Also, the second ceramic green sheet 7 in which the inner conductor pattern 9 is disposed in the through pattern 7a is placed in a drying chamber set at a temperature higher than normal temperature for a predetermined time to dry the inner conductor pattern 9. Also good. Moreover, you may dry the internal conductor pattern 9 by performing a microwave heating. By these methods, it can be set as the 2nd drying process which dries the internal conductor pattern 9 arrange | positioned by the penetration pattern 7a. The drying time can be appropriately set according to the type of material used as the internal conductor pattern 9, the organic solvent, and the binder content.

In the method for manufacturing the multilayer electronic component 1 of the present embodiment, as shown in FIG. 2, the thickness in the stacking direction of the first ceramic green sheet 3 and the via conductor pattern 5 is the same as that of the second ceramic green sheet 7 and the internal It is smaller than the thickness of the conductor pattern 9 in the stacking direction. Therefore, it is preferable because the electrical resistance of the internal conductor can be reduced without excessively increasing the overall size (height in the stacking direction) of the multilayer electronic component 1.

  Next, as shown in FIG. 6, the first ceramic green sheet 3 is newly laminated on the upper surface of the second ceramic green sheet 7 dried in the second drying step. At this time, the 1st ceramic green sheet 3 is laminated | stacked so that the through-hole 3a may connect with a part of penetration pattern 7a of the 2nd ceramic green sheet 7. FIG. In other words, the first ceramic green sheet 3 is laminated on the upper surface of the second ceramic green sheet 7 so that the via conductor paste is exposed in the opening on the lower surface side of the through hole 3a.

  Next, as shown in FIG. 7, the via conductor pattern 5 is disposed in the through hole 3a. At this time, since the internal conductor pattern 9 is exposed in the opening on the lower surface side of the through hole 3a, the internal conductor pattern 9 and the via conductor pattern 5 are joined. Further, the via conductor pattern 5 disposed in the through hole 3a is dried. As a method of drying the via conductor pattern 5, the method as already shown may be used.

  Further, as shown in FIG. 7, by repeating the steps (2), (3), (5) to (7), the via conductor pattern 5 is disposed in the through hole 3a. The green laminate 11 in which the ceramic green sheets 3 and the second ceramic green sheets 7 in which the internal conductor patterns 9 are arranged in the through patterns 7a are alternately laminated can be produced.

  3 to 7 are exploded perspective views for clarifying the laminated structure of the present embodiment. Therefore, the numbers of the plurality of first ceramic green sheets 3 and the plurality of second ceramic green sheets 7 are not limited to the numbers shown in the exploded perspective views shown in FIGS. In addition, third ceramic green sheets 15 having the same composition as the first ceramic green sheet 3 are disposed at both ends in the stacking direction of the green laminate 11 so that the via conductor pattern 5 and the inner conductor pattern 9 are not exposed. You may do it.

  When the second ceramic green sheet 7 is formed by stacking a plurality of ceramic green sheets, the first ceramic green sheet 7 formed in this way is laminated by the laminating process. After laminating on the upper surface of the sheet 3, the internal conductor pattern may be disposed by the second disposing step.

  Alternatively, the following may be performed as the stacking step and the second disposing step. First, one of the ceramic green sheets constituting the second ceramic green sheet 7 is laminated on the upper surface of the first ceramic green sheet 3 dried in the first drying step, and formed on the ceramic green sheet. A conductive paste to be a part of the internal conductor pattern 9 is disposed in the through hole. And as a 2nd drying process, this electrically conductive paste is dried.

  Next, another one of the ceramic green sheets constituting the second ceramic green sheet 7 is laminated on the upper surface of the ceramic green sheet, and the through holes formed in the other ceramic green sheets are stacked. A conductive paste that becomes a part of the internal conductor pattern 9 is disposed. And as a 2nd drying process, this electrically conductive paste is dried.

  That is, the second ceramic green sheet 7 and the internal conductor pattern 9 are formed by overlapping a plurality of ceramic green sheets and a plurality of conductive pastes, respectively. You may arrange | position the 2nd ceramic green sheet 7 and the internal conductor pattern 9 on the upper surface of the 1st ceramic green sheet 3 by drying each of electrically conductive paste.

  When the second ceramic green sheet 7 and the internal conductor pattern 9 are disposed on the upper surface of the first ceramic green sheet 3 by drying each of the plurality of conductive pastes in this way, the internal conductor pattern 9 Can be dried more efficiently. Therefore, it is possible to further suppress deformation of the conductor paste that becomes the inner conductor pattern 9.

  Further, when the internal conductor pattern 9 is formed by stacking a plurality of conductive pastes, the width of the conductive paste in the direction perpendicular to the stacking direction is positioned above the stacking direction in the cross section parallel to the stacking direction. It is preferable that the inner conductor pattern is smaller.

  In the process of disposing a plurality of conductor pastes to be the inner conductor pattern 9 on the first ceramic green sheet 3, there may be an inevitable shift in the manufacturing process between the plurality of conductor pastes. However, as described above, the conductor paste positioned on the upper side in the stacking direction has a smaller width in the direction perpendicular to the stacking direction, so that the conductor paste positioned on the upper side can be stably positioned on the conductor paste positioned on the lower side. Can be made. Therefore, it is possible to reduce the possibility of partial thickness variations in the internal conductor pattern 9.

(8) Firing step As described above, the laminate 11 is produced by pressing and firing the green laminate 11 in which the first ceramic green sheets 3 and the second ceramic green sheets 7 are alternately laminated. . Although the optimum firing temperature differs depending on the material used as the ceramic green sheet and the conductor paste, in the method for manufacturing the multilayer electronic component 1 of this embodiment, the firing may be performed at a temperature of about 850 ° C. to 1150 ° C.

  Furthermore, as shown in FIGS. 1-2, a pair of external electrode 13 is formed in the side surface of the laminated body 11 baked. One of the pair of external electrodes 13 is electrically connected to the via conductor pattern 5 or the internal conductor pattern 9 located on the lowermost surface side of the multilayer body 11. The other of the pair of external electrodes 13 is electrically connected to the via conductor pattern 5 or the internal conductor pattern 9 located on the uppermost side of the multilayer body 11. The external electrode 13 is a member for electrically connecting to external wiring (not shown) via a lead terminal or the like.

  As the pair of external electrodes 13, for example, a metal material powder such as copper, silver, gold, platinum, or nickel can be used. Moreover, you may add the vitreous for adding adhesiveness with an insulating material. The pair of external electrodes 13 is formed by a method such as coating baking, sputtering or vapor deposition.

  In addition, although the external electrode 13 in this embodiment is arrange | positioned at the side surface of the laminated body 11, it is not restricted to this in particular. For example, one of the pair of external electrodes 13 may be disposed on the upper surface of the multilayer body 11, and the other of the pair of external electrodes 13 may be disposed on the lower surface of the multilayer body 11. Further, both of the pair of external electrodes 13 may be disposed on the lower surface of the multilayer body 11.

  Moreover, it is preferable to form plating on the surface exposed from the laminate 11 of the external electrode 13. This is because deterioration of the external electrode 13 exposed to the outside can be suppressed. Further, when the external electrode 13 and an external wiring (not shown) are electrically connected via a lead terminal or the like, the bondability between the external electrode 13 and the lead terminal can be improved. As plating, for example, nickel plating, copper plating, silver plating, gold plating, and tin plating can be used. Specifically, for example, after nickel plating is formed on the surface exposed from the laminate 11 of the external electrodes 13, gold plating may be further formed on the surface of the nickel plating.

  As described above, the multilayer electronic component 1 of this embodiment can be manufactured.

  Next, the manufacturing method of the multilayer electronic component of the second embodiment will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.

The manufacturing method of the multilayer electronic component of the second embodiment includes the following steps. That is, (1) a first preparation step of preparing a first ceramic green sheet 3 having a through-hole 3a opened on the upper surface and the lower surface;
(2) a first disposing step of disposing the via conductor pattern 5 in the through hole 3a;
(3) a first drying step of drying the via conductor pattern 5 disposed in the through hole 3a, and (4) an upper surface of the first ceramic green sheet 3 dried by the first drying step, Disposing an inner conductor pattern 9 having a thickness larger than that of the via conductor pattern 5 so as to be joined to the via conductor pattern 5;
(5) a second drying step for drying the internal conductor pattern 9;
(6) A second ceramic green sheet 7 having an opening on the upper surface and the lower surface and having a penetration pattern 7a corresponding to the shape of the internal conductor pattern 9 and having a thickness larger than that of the first ceramic green sheet 3 is prepared. Preparation process,
(7) a laminating step of laminating the second ceramic green sheet 7 on the upper surface of the first ceramic green sheet 3 so that the internal conductor pattern 9 dried by the second drying step is located in the through pattern 7a; ,
(8) A firing step of firing the first ceramic green sheet 3 and the second ceramic green sheet 7 laminated by the lamination step.

  As described above, according to the method for manufacturing the multilayer electronic component 1 of the second embodiment, the internal conductor pattern 9 is arranged in the through hole, as in the method for manufacturing the multilayer electronic component 1 of the first embodiment. Since the second ceramic green sheet 3 to be provided is used, a gap is hardly generated between the ceramic green sheets. Therefore, it becomes easy to press-fit the ceramic green sheet.

  In addition, instead of drying after forming the green laminate 11, the first drying step is performed each time after the first disposing step and before the step of disposing the second ceramic green sheet 7. The via conductor pattern 5 and the inner conductor pattern 9 are each dried by performing the second drying process each time. Therefore, swelling of the first ceramic green sheet 3 and the second ceramic green sheet 7 by the solvent contained in the via conductor pattern 5 and the internal conductor pattern 9 can be suppressed.

  Since swelling of the first ceramic green sheet 3 can be suppressed, when the first ceramic green sheet 3 is handled, when the second ceramic green sheet 7 is laminated on the upper surface of the first ceramic green sheet 3, or The first ceramic green sheet 3 can be prevented from being partially deformed when the laminate 11 is pressed and fired. Therefore, it is possible to suppress an increase in variation in thickness between the first ceramic green sheet 3 and the via conductor pattern 5 disposed in the through hole 3a of the first ceramic green sheet 3.

  Similarly, since the second ceramic green sheet 7 can be prevented from swelling, the second ceramic green sheet 7 is placed on the upper surface of the first ceramic green sheet 3 when the second ceramic green sheet 7 is handled. It is possible to suppress the second ceramic green sheet 7 from being partially deformed when being laminated or when the laminated body 11 is pressed and fired. Therefore, it is possible to suppress an increase in variation in thickness between the second ceramic green sheet 7 and the internal conductor pattern 9 disposed in the through pattern 7 a included in the second ceramic green sheet 7.

  Therefore, it is suppressed that a gap is generated between the first and second ceramic green sheets 7 inside the green laminate 11 due to the thickness variation caused by the partial deformation. Therefore, in order to join a plurality of ceramic green sheets to each other, it is not always necessary to apply a large pressure in the stacking direction, so that the possibility that the via conductor pattern 5 is deformed can be reduced.

  Further, by drying the via conductor pattern 5 and the internal conductor pattern 9 respectively, the strength of the via conductor pattern 5 and the internal conductor pattern 9 can be increased, so that the second ceramic is formed on the upper surface of the first ceramic green sheet 3. In the laminating process of laminating the green sheets 7, it is possible to suppress deformation of the conductor paste serving as the internal conductor.

  As a result, it is possible to provide the multilayer electronic component 1 corresponding to a large current and a high inductance.

(1) First Preparation Step First, a plurality of first ceramic green sheets 3 are produced. Specifically, it may be produced in the same manner as the first ceramic green sheet 3 in the first embodiment. As shown in FIG. 8, the through holes 3a that open to the upper surface and the lower surface may also be formed in the same manner as the through holes 3a in the first embodiment.

(2) First Arrangement Step Next, as shown in FIG. 8, a conductor paste is disposed as a via conductor pattern 5 in the through hole 3a. As the conductive paste, the same material as the conductive paste in the first embodiment can be used.

(3) 1st drying process Next, the via conductor pattern 5 arrange | positioned in the through-hole 3a is dried. As a method for drying the via conductor pattern 5, for example, the via conductor pattern 5 is dried by applying a dry air to the via conductor pattern 5 disposed in the through hole 3a, as in the method in the first embodiment. The via conductor pattern 5 is dried by placing the first ceramic green sheet 3 in which the via conductor pattern 5 is disposed in the through hole 3a in a drying chamber set to a temperature higher than normal temperature for a predetermined time. Or the method of drying the via conductor pattern 5 by performing microwave heating is mentioned.

(4) Inner Conductor Pattern Arrangement Step Next, as shown in FIG. 9, the inner conductor pattern having a thickness larger than the via conductor pattern 5 on the upper surface of the first ceramic green sheet 3 dried by the first drying step. 9 is disposed. At this time, the internal conductor pattern 9 is disposed so as to be joined to the via conductor pattern 5. As the internal conductor pattern 9, the same material as that of the conductor paste in the first embodiment can be used.

  At this time, by making the thickness of the internal conductor pattern 9 larger than the thickness of the via conductor pattern 5, the resistance value of the internal wiring can be reduced, the current value can be increased, and the inductance value can be increased.

  The internal conductor pattern 9 may be constituted by one conductor paste having a thickness larger than that of the via conductor pattern 5, but is not limited thereto. For example, the inner conductor pattern 9 having a thickness larger than the thickness of the via conductor pattern 5 may be formed by overlapping a plurality of conductor pastes.

(5) Second Drying Step Next, the internal conductor pattern 9 disposed on the upper surface of the first ceramic green sheet 3 is dried. As a method of drying the internal conductor pattern 9, for example, by applying a dry wind to the internal conductor pattern 9 disposed on the upper surface of the first ceramic green sheet 3, as in the method of the first embodiment. The inner conductor pattern 9 is dried, and the first ceramic green sheet 3 having the inner conductor pattern 9 disposed on the upper surface is placed in a drying chamber set at a temperature higher than room temperature for a predetermined time. Or a method of drying the internal conductor pattern 9 by performing microwave heating.

(6) Second Preparation Step Next, a plurality of second ceramic green sheets 7 are produced. Specifically, it may be produced in the same manner as the second ceramic green sheet 7 in the first embodiment. As shown in FIG. 10, the penetration pattern 7 a that opens to the upper surface and the lower surface and corresponds to the shape of the internal conductor pattern 9 may be formed in the same manner as the penetration pattern 7 a in the first embodiment.

  At this time, it is easy to increase the thickness of the internal conductor pattern 9 by making the thickness of the second ceramic green sheet 7 larger than the thickness of the first ceramic green sheet 3. Therefore, the resistance value of the internal wiring can be reduced, the current value can be increased, and the inductance value can be increased.

(7) Laminating Step Next, as shown in FIG. 10, the upper surface of the first ceramic green sheet 3 is placed on the upper surface of the first ceramic green sheet 3 so that the inner conductor pattern 9 dried in the second drying step is located in the through pattern 7a. Two ceramic green sheets 7 are laminated.

  In the manufacturing method of the multilayer electronic component 1 according to the first embodiment, after the second ceramic green sheet 7 is laminated on the upper surface of the first ceramic green sheet 3, the internal conductor pattern 9 is formed in the through pattern 7a. In addition, the inner conductor pattern 9 disposed in the through pattern 7a is dried.

  On the other hand, in the method for manufacturing the multilayer electronic component 1 according to the present embodiment, the inner conductor pattern 9 is disposed on the upper surface of the first ceramic green sheet 3 and the inner conductor pattern 9 is dried, A second ceramic green sheet 7 is laminated on the upper surface of the ceramic green sheet 3.

  In this way, the internal conductor pattern 9 is disposed on the upper surface of the first ceramic green sheet 3 before the second ceramic green sheet 7 is disposed on the upper surface of the first ceramic green sheet 3. However, since the internal conductor pattern 9 is dried, it is possible to suppress the second ceramic green sheet 7 from swelling as in the first embodiment.

  Further, since the second ceramic green sheet 7 is laminated on the upper surface of the first ceramic green sheet 3 after the internal conductor pattern 9 is dried, the second ceramic is further increased than in the first embodiment. Swelling of the green sheet 7 can be suppressed.

Next, as shown in FIG. 11, the first ceramic green sheet 3 is newly laminated on the upper surface of the second ceramic green sheet 7 dried in the second drying step. At this time, the 1st ceramic green sheet 3 is laminated | stacked so that the through-hole 3a may connect with a part of penetration pattern 7a of the 2nd ceramic green sheet 7. FIG. In other words, the first ceramic green sheet 3 is laminated on the upper surface of the second ceramic green sheet 7 so that the inner conductor pattern 9 is exposed at the opening on the lower surface side of the through hole 3a.

  Next, as shown in FIG. 12, the via conductor pattern 5 is disposed in the through hole 3a. At this time, since the internal conductor pattern 9 is exposed in the opening on the lower surface side of the through hole 3a, the internal conductor pattern 9 and the via conductor pattern 5 are joined. Further, the via conductor pattern 5 disposed in the through hole 3a is dried. As a method of drying the via conductor pattern 5, the method as already shown may be used.

  Further, as shown in FIG. 12, the first ceramic green sheet in which the via conductor pattern 5 is disposed in the through hole 3a by repeating the steps (2) to (5) and (7) described above. 3 and the second ceramic green sheet 7 in which the internal conductor pattern 9 is located in the through pattern 7a can be produced.

  8 to 12 are exploded perspective views for clarifying the laminated structure of the present embodiment. Therefore, the numbers of the plurality of first ceramic green sheets 3 and the plurality of second ceramic green sheets 7 are not limited to the numbers shown in the exploded perspective views shown in FIGS. In addition, third ceramic green sheets 15 having the same composition as the first ceramic green sheet 3 are disposed at both ends in the stacking direction of the green laminate 11 so that the via conductor pattern 5 and the inner conductor pattern 9 are not exposed. You may do it.

  When the internal conductor pattern 9 is formed by overlapping a plurality of conductor pastes, these conductive pastes may be dried as a second drying step after the plurality of conductive pastes are disposed. It is not limited to this. For example, when disposing a plurality of conductive pastes, the second drying step may be performed by drying each of the conductive pastes.

  Thus, when the internal conductor pattern 9 is disposed on the upper surface of the first ceramic green sheet 3 by drying each of the plurality of conductive pastes, the internal conductor pattern 9 can be further efficiently dried. it can. Therefore, it is possible to further suppress deformation of the conductor paste that becomes the inner conductor pattern 9.

  Further, when the internal conductor pattern 9 is formed by overlapping a plurality of conductive pastes, in the cross-section parallel to the stacking direction, the stacking direction is the same as in the method for manufacturing the stacked electronic component of the first embodiment. It is preferable that the width of the conductive paste in the direction perpendicular to the inner conductor pattern is as small as the inner conductor pattern located on the upper side in the stacking direction.

(8) Firing step As described above, the laminate 11 is produced by pressing and firing the green laminate 11 in which the first ceramic green sheets 3 and the second ceramic green sheets 7 are alternately laminated. . Although the optimum firing temperature differs depending on the material used as the ceramic green sheet and the conductor paste, in the method for manufacturing the multilayer electronic component 1 of this embodiment, the firing may be performed at a temperature of about 850 ° C. to 1150 ° C.

  Further, a pair of external electrodes 13 is formed on the side surface of the fired multilayer body 11 as in the multilayer electronic component 1 of the first embodiment. As the pair of external electrodes 13, the same material as that of the external electrode 13 in the first embodiment can be used.

  As described above, the multilayer electronic component 1 of this embodiment can be manufactured.

  Next, the manufacturing method of the multilayer electronic component of the third embodiment will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.

The manufacturing method of the multilayer electronic component of the third embodiment includes the following steps. That is, (1) a first preparation step of preparing a plurality of first ceramic green sheets 3 having through-holes 3a opened on the upper surface and the lower surface;
(2) a first disposing step of disposing the via conductor pattern 5 in the through hole 3a;
(3) a first drying step for drying the via conductor pattern 5 disposed in the through hole 3a; and (4) a through pattern 7a corresponding to the shape of the internal conductor pattern 9 while opening in the upper and lower surfaces. A second preparation step of preparing a plurality of second ceramic green sheets 7 having a thickness greater than that of the first ceramic green sheets;
(5) a second disposing step of disposing the internal conductor pattern 9 in the through pattern 7a;
(6) a second drying step of drying the internal conductor pattern 9 disposed in the through pattern 7a;
(7) The plurality of first ceramic green sheets 3 so that the via conductor patterns 5 dried by the first drying step adjacent to each other are connected via the internal conductor patterns 9 dried by the second drying step. And a laminating step of alternately laminating a plurality of second ceramic green sheets 7;
(8) A firing step of firing the first ceramic green sheet 3 and the second ceramic green sheet 7 laminated by the lamination step.

  Thus, according to the method for manufacturing the multilayer electronic component of the third embodiment, the internal conductor pattern 9 is disposed in the same manner as in the method of manufacturing the multilayer electronic component 1 of the first embodiment. Since the second ceramic green sheet 7 is used, a gap is hardly generated between the ceramic green sheets. Therefore, it becomes easy to press-fit the ceramic green sheet.

  Also, instead of drying after forming the green laminate 11, the first drying step is performed each time after the first disposing step, and the second drying step is performed after the second disposing step. The via conductor pattern 5 and the internal conductor pattern 9 are each dried by performing each time. Therefore, swelling of the first ceramic green sheet 3 and the second ceramic green sheet 7 by the solvent contained in the via conductor pattern 5 and the internal conductor pattern 9 can be suppressed.

  Since swelling of the first ceramic green sheet 3 can be suppressed, when the first ceramic green sheet 3 is handled, when the second ceramic green sheet 7 is laminated on the upper surface of the first ceramic green sheet 3, or The first ceramic green sheet 3 can be prevented from being partially deformed when the laminate 11 is pressed and fired. Therefore, it is possible to suppress an increase in variation in thickness between the first ceramic green sheet 3 and the via conductor pattern 5 disposed in the through hole 3a of the first ceramic green sheet 3.

  Similarly, since the second ceramic green sheet 7 can be prevented from swelling, the second ceramic green sheet 7 is placed on the upper surface of the first ceramic green sheet 3 when the second ceramic green sheet 7 is handled. It is possible to suppress the second ceramic green sheet 7 from being partially deformed when being laminated or when the laminated body 11 is pressed and fired. Therefore, it is possible to suppress an increase in variation in thickness between the second ceramic green sheet 7 and the internal conductor pattern 9 disposed in the through pattern 7 a included in the second ceramic green sheet 7.

  Therefore, it is suppressed that a gap is generated between the first and second ceramic green sheets 7 inside the green laminate 11 due to the thickness variation caused by the partial deformation. Therefore, in order to join a plurality of ceramic green sheets to each other, it is not always necessary to apply a large pressure in the stacking direction, so that the possibility of deformation of the internal conductor paste can be reduced.

  Further, by drying the via conductor pattern 5 and the internal conductor pattern 9 respectively, the strength of the via conductor pattern 5 and the internal conductor pattern 9 can be increased, so that the second ceramic is formed on the upper surface of the first ceramic green sheet 3. In the laminating process of laminating the green sheets 7, it is possible to suppress deformation of the conductor paste serving as the internal conductor.

  As a result, it is possible to provide the multilayer electronic component 1 corresponding to a large current and a high inductance.

(1) First Preparation Step First, a plurality of first ceramic green sheets 3 are produced. Specifically, it may be produced in the same manner as the first ceramic green sheet 3 in the first embodiment. As shown in FIG. 13, the through holes 3a that open to the upper surface and the lower surface may also be formed in the same manner as the through holes 3a in the first embodiment.

(2) First Arrangement Step Next, as shown in FIG. 13, a conductor paste is arranged as a via conductor pattern 5 in the through hole 3a. As the conductive paste, the same material as the conductive paste in the first embodiment can be used.

(3) 1st drying process Next, the via conductor pattern 5 arrange | positioned in the through-hole 3a is dried. As a method for drying the via conductor pattern 5, for example, the via conductor pattern 5 is dried by applying a dry air to the via conductor pattern 5 disposed in the through hole 3a, as in the method in the first embodiment. The via conductor pattern 5 is dried by placing the first ceramic green sheet 3 in which the via conductor pattern 5 is disposed in the through hole 3a in a drying chamber set to a temperature higher than normal temperature for a predetermined time. Or the method of drying the via conductor pattern 5 by performing microwave heating is mentioned.

(4) Second Preparation Step Next, a plurality of second ceramic green sheets 7 are produced. Specifically, it may be produced in the same manner as the second ceramic green sheet 7 in the first embodiment. As shown in FIG. 14, the penetration pattern 7 a that opens to the upper surface and the lower surface and corresponds to the shape of the internal conductor pattern 9 may be formed in the same manner as the penetration pattern 7 a in the first embodiment.

  At this time, it is easy to increase the thickness of the internal conductor pattern 9 by making the thickness of the second ceramic green sheet 7 larger than the thickness of the first ceramic green sheet 3. Therefore, the resistance value of the internal wiring can be reduced, the current value can be increased, and the inductance value can be increased.

(5) Second Arrangement Step Next, as shown in FIG. 14, a conductor paste is arranged as an internal conductor pattern 9 in the through pattern 7a. As the conductive paste, the same material as the conductive paste in the first embodiment can be used.

  At this time, the inner conductor pattern 9 may be disposed by filling the penetration pattern 7a with the conductor paste as the inner conductor pattern 9. Alternatively, first, the internal conductor pattern 9 may be prepared, and the second ceramic green sheet 7 may be disposed so that the internal conductor pattern 9 is positioned in the through pattern 7a.

  The internal conductor pattern 9 may be constituted by one conductor paste having a thickness larger than that of the via conductor pattern 5, but is not limited thereto. For example, the internal conductor pattern 9 having a thickness larger than the thickness of the via conductor pattern 5 may be formed by overlapping a plurality of conductor pastes in the same manner as in the method for manufacturing the multilayer electronic component of the second embodiment.

(6) 2nd drying process Next, the internal conductor pattern 9 arrange | positioned in the penetration pattern 7a is dried. As a method of drying the internal conductor pattern 9, as in the method of the first embodiment, for example, the internal conductor pattern 9 is dried by applying a dry wind to the internal conductor pattern 9 disposed in the through pattern 7a. The inner conductor pattern 9 is dried by placing the second ceramic green sheet 7 in which the inner conductor pattern 9 is disposed in the penetrating pattern 7a in a drying chamber set to a temperature higher than normal temperature for a predetermined time. Or the method of drying the via conductor pattern 5 by performing microwave heating is mentioned.

(7) Lamination Step Next, as shown in FIG. 15, the second ceramic green sheet 7 is laminated on the upper surface of the first ceramic green sheet 3. Further, as shown in FIG. 16, the first ceramic green sheet 3 is further laminated on the upper surface of the second ceramic green sheet 7. In this way, the plurality of first ceramic green sheets 3 and the plurality of second ceramic green sheets 7 are alternately stacked. At this time, the ceramic green sheets are laminated so that the via conductor patterns 5 dried by the first drying step adjacent to each other are connected via the internal conductor patterns 9 dried by the second drying step. .

  In the manufacturing method of the multilayer electronic component 1 according to the first embodiment, after the second ceramic green sheet 7 is laminated on the upper surface of the first ceramic green sheet 3, the internal conductor pattern 9 is formed in the through pattern 7a. In addition, the inner conductor pattern 9 disposed in the through pattern 7a is dried.

  On the other hand, in the method for manufacturing the multilayer electronic component 1 of the present embodiment, the internal conductor pattern 9 is disposed in the through pattern 7a, and the internal conductor pattern 9 disposed in the through pattern 7a is dried. After that, the second ceramic green sheet 7 is laminated on the upper surface of the first ceramic green sheet 3.

  As described above, the via conductor pattern 5 is disposed in the through hole 3a, and the first ceramic green sheet 3 in which the via conductor pattern 5 disposed in the through hole 3a is dried, and the through pattern 7a. And the second ceramic green sheet 7 prepared by drying the inner conductor pattern 9 disposed in the through pattern 7a, and the second ceramic green sheet 7 respectively. Even when the green sheet 7 is disposed on the upper surface of the first ceramic green sheet 3, since the via conductor pattern 5 and the inner conductor pattern 9 are dried, as in the first embodiment, Swelling of the first ceramic green sheet 3 and the second ceramic green sheet 7 can be suppressed.

  Moreover, in the manufacturing method of the multilayer electronic component 1 of the first embodiment and the second embodiment, the step of laminating the first ceramic green sheet 3 or the second ceramic green sheet 7 and the first drying Since the process or the second drying process is alternately performed, the time required for manufacturing the multilayer electronic component 1 is increased as the number of stacked layers increases.

  On the other hand, in the multilayer electronic component manufacturing method of the present embodiment, the plurality of first ceramic green sheets 3 in which the via conductor pattern 5 is disposed in the through hole 3a and the internal conductor in the through pattern 7a. Since the first drying step and the second drying step can be performed simultaneously on the plurality of second ceramic green sheets 7 on which the pattern 9 is disposed, the number of stacked layers is increased. However, the time for producing the multilayer electronic component 1 can be shortened.

  13 to 16 are exploded perspective views for clarifying the laminated structure of the present embodiment. Therefore, the numbers of the plurality of first ceramic green sheets 3 and the plurality of second ceramic green sheets 7 are not limited to the numbers shown in the exploded perspective views shown in FIGS. In addition, third ceramic green sheets 15 having the same composition as the first ceramic green sheet 3 are disposed at both ends in the stacking direction of the green laminate 11 so that the via conductor pattern 5 and the inner conductor pattern 9 are not exposed. You may do it.

  When the internal conductor pattern 9 is formed by overlapping a plurality of conductor pastes, these conductive pastes may be dried as a second drying step after the plurality of conductive pastes are disposed. It is not limited to this. For example, as in the method of manufacturing the multilayer electronic component of the second embodiment, when the plurality of conductive pastes are respectively disposed, the second drying step may be performed by drying each of the conductive pastes.

  Further, when the internal conductor pattern 9 is formed by overlapping a plurality of conductive pastes, in the cross-section parallel to the stacking direction, the stacking direction is the same as in the method for manufacturing the stacked electronic component of the first embodiment. It is preferable that the width of the conductive paste in the direction perpendicular to the inner conductor pattern is as small as the inner conductor pattern located on the upper side in the stacking direction.

(8) Firing step As described above, the laminate 11 is produced by pressing and firing the green laminate 11 in which the first ceramic green sheets 3 and the second ceramic green sheets 7 are alternately laminated. . Although the optimum firing temperature differs depending on the material used as the ceramic green sheet and the conductor paste, in the method for manufacturing the multilayer electronic component 1 of this embodiment, the firing may be performed at a temperature of about 850 ° C. to 1150 ° C.

  Further, a pair of external electrodes 13 is formed on the side surface of the fired multilayer body 11 as in the multilayer electronic component 1 of the first embodiment. As the pair of external electrodes 13, the same material as that of the external electrode 13 in the first embodiment can be used.

  As described above, the multilayer electronic component 1 of this embodiment can be manufactured.

  In the manufacturing method of the multilayer electronic component of each of the above embodiments, the thickness of the second ceramic green sheet 7 and the internal conductor pattern 9 is larger than the thickness of the first ceramic green sheet 3 and the via conductor pattern 5, respectively. Therefore, since the total amount of organic solvent and binder contained in the internal conductor pattern 9 is larger than the total amount of organic solvent and binder contained in the via conductor pattern 5, the via conductor pattern 5 is dried in the first drying step. It is preferable that the internal conductor pattern 9 is further dried in the second drying step.

  Specifically, it is preferable that the time for drying the internal conductor pattern 9 in the second drying step is longer than the time for drying the via conductor pattern 5 in the first drying step. As a result, the inner conductor pattern 9 can be efficiently dried, so that the possibility that the inner conductor pattern 9 is deformed can be further reduced.

  Moreover, although the internal conductor pattern 9 can be efficiently dried by adjusting the time for drying the via conductor pattern 5 and the internal conductor pattern 9 as described above, the via conductor pattern 5 in the first drying step is dried. The internal conductor pattern 9 can also be efficiently dried by increasing the temperature at which the internal conductor pattern 9 is dried in the second drying step, rather than the temperature at which the internal conductor pattern 9 is dried. For example, a first drying chamber for drying the via conductor pattern 5 and a second drying chamber for drying the internal conductor pattern 9 are prepared, and the internal temperature of the second drying chamber is higher than the internal temperature of the first drying chamber. Is set high, the internal conductor pattern 9 can be efficiently dried as described above.

  Moreover, in the manufacturing method of the multilayer electronic component of each of the above embodiments, as shown in FIG. 17, among the plurality of internal conductor patterns 9, at least two internal conductors adjacent in the stacking direction via the via conductor pattern 5. The pattern 9 has a width L1 in a direction perpendicular to the stacking direction of the internal conductor patterns 9a located on the upper surface side of the second ceramic green sheet 7 in the cross section parallel to the stacking direction, and the lower surface of the second ceramic green sheet 7 It is preferably smaller than the width L2 in the direction perpendicular to the stacking direction of the inner conductor patterns 9b located on the side.

  In the process of disposing the internal conductor pattern 9 on the upper surface of the first ceramic green sheet 3, an inevitable shift in the manufacturing process may occur. Moreover, in the manufacturing method of the multilayer electronic component 1 of each of the above embodiments, since the first ceramic green sheet 3 is suppressed from swelling, the second ceramic green sheet 7 and the internal conductor pattern 9 are suppressed. However, there is a possibility that an inevitable thickness variation in the manufacturing process may occur.

  Therefore, of at least two internal conductor patterns 9 adjacent to each other in the laminating direction, a portion located on the first ceramic green sheet 3 located on the lower surface side of the internal conductor pattern 9a located on the upper surface side, and the lower surface side There is a possibility that a step is generated between the portion located on the inner conductor pattern 9b located at the position.

  However, as described above, the width L1 in the direction perpendicular to the stacking direction of the inner conductor patterns 9a located on the upper surface side of the first ceramic green sheet 3 has the inner conductor located on the lower surface side of the first ceramic green sheet 3. By being smaller than the width L2 in the direction perpendicular to the stacking direction of the patterns 9b, the internal conductor pattern 9a located on the upper surface side can be stably positioned on the internal conductor pattern 9b located on the lower surface side. Therefore, it is possible to reduce the possibility that partial variations in thickness occur in the internal conductor pattern 9.

  In particular, as shown in FIG. 17, in the plurality of internal conductor patterns 9, in the cross section parallel to the stacking direction, the width in the direction perpendicular to the stacking direction is as small as the internal conductor pattern 9 positioned above the stacking direction. Further preferred. This is because it is possible to reduce the possibility of partial thickness variations in each internal conductor pattern 9.

  Further, as described above, when the inner conductor pattern 9 located on the upper side in the stacking direction has a smaller width in the direction perpendicular to the stacking direction, the thickness in the direction parallel to the stacking direction in the cross section parallel to the stacking direction is It is more preferable that the inner conductor pattern 9 located on the upper side in the stacking direction is larger.

  Variation in cross-sectional area between the inner conductor pattern 9a located on the upper surface side of the first ceramic green sheet 3 and the inner conductor pattern 9b located on the lower surface side of the first ceramic green sheet 3 can be reduced. Because. Since the variation in cross-sectional area of these internal conductor patterns 9 is small, the variation in resistivity of the internal conductor pattern 9 can be reduced, so that the possibility of large heat generation locally can be reduced.

  In addition, as shown in FIG. 18, when two internal conductor patterns 9 adjacent in the stacking direction are seen in a plan view, at least a part of the internal conductor pattern 9 a located on the upper surface side is made of the first ceramic green sheet 3. More preferably, it overlaps with a part of the inner conductor pattern 9b located on the lower surface side. This is because it is possible to further reduce the possibility of partial thickness variations in the internal conductor pattern 9.

  In FIG. 18, of the two internal conductor patterns 9 adjacent to each other in the stacking direction, the outer periphery of the internal conductor pattern 9 b located on the lower surface side is indicated by a dashed line for convenience. Further, the inner conductor pattern 9a located on the upper surface side is indicated by oblique lines and the outer periphery thereof is indicated by chain lines for convenience.

  In addition, although it showed about the manufacturing method of the single | mono layer laminated | stacked electronic component 1, the internal conductor pattern 9 adjacent to the lamination direction was connected via the via conductor pattern 5, and the coil shape wound toward the lamination direction was shown. You may form the aggregate | assembly of the raw laminated body 11 by which multiple internal wiring was provided side by side. After the assembly of the green laminates 11 is manufactured, the plurality of multilayer electronic components 1 can be simultaneously manufactured by dividing the raw laminates 11 and firing the raw laminates 11. . In addition, the above-described aggregate of the raw laminates 11 may be simultaneously fired and then divided into the respective multilayer electronic components 1.

  As described above, the manufacturing method of the multilayer electronic component of each embodiment has been described, but the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Multilayer type electronic component 3 ... 1st ceramic green sheet 3a ... Through-hole 5 ... Via conductor pattern 7 ... 2nd ceramic green sheet 7a ... Through-pattern 9 ...・ Inner conductor pattern 11 ... Raw laminated body (laminated body)
13 ... External electrode 15 ... Third ceramic green sheet

Claims (8)

A first preparation step of preparing a first ceramic green sheet having a through-hole opened on an upper surface and a lower surface;
A first disposing step of disposing a via conductor pattern in the through hole;
A first drying step of drying the via conductor pattern disposed in the through hole;
A second preparation step of preparing a second ceramic green sheet having a penetrating pattern opening on the upper surface and the lower surface and having a thickness larger than that of the first ceramic green sheet;
A laminating step of laminating the second ceramic green sheet on the upper surface of the first ceramic green sheet dried by the first drying step;
A second disposing step of disposing an internal conductor pattern corresponding to the shape of the through pattern in the through pattern so as to be joined to the via conductor pattern;
A second drying step of drying the inner conductor pattern disposed in the penetration pattern;
A method of manufacturing a multilayer electronic component, comprising: a firing step of firing the first ceramic green sheet and the second ceramic green sheet. A first preparation step of preparing a first ceramic green sheet having a through-hole opened on an upper surface and a lower surface;
A first disposing step of disposing a via conductor pattern in the through hole;
A first drying step of drying the via conductor pattern disposed in the through hole;
Disposing an inner conductor pattern thicker than the via conductor pattern on the upper surface of the first ceramic green sheet dried by the first drying step so as to be joined to the via conductor pattern;
A second drying step of drying the inner conductor pattern;
A second preparation step of preparing a second ceramic green sheet having an opening on the upper surface and the lower surface and having a penetration pattern corresponding to the shape of the internal conductor pattern and having a thickness larger than that of the first ceramic green sheet;
A laminating step of laminating the second ceramic green sheet on the upper surface of the first ceramic green sheet so that the inner conductor pattern dried by the second drying step is located in the through pattern;
A method for producing a multilayer electronic component, comprising: a firing step of firing the first ceramic green sheet and the second ceramic green sheet laminated by the lamination step. A first preparation step of preparing a plurality of first ceramic green sheets having through-holes opened on the upper surface and the lower surface;
A first disposing step of disposing a via conductor pattern in the through hole;
A first drying step of drying the via conductor pattern disposed in the through hole;
A second preparatory step of preparing a plurality of second ceramic green sheets that are open on the upper surface and the lower surface and have a penetration pattern corresponding to the shape of the internal conductor pattern and that are thicker than the first ceramic green sheet; ,
A second disposing step of disposing an internal conductor pattern in the through pattern;
A second drying step of drying the inner conductor pattern disposed in the penetration pattern;
A plurality of the first ceramic green sheets so that adjacent via conductor patterns dried by the first drying step are connected via the inner conductor patterns dried by the second drying step. And a laminating step of alternately laminating a plurality of the second ceramic green sheets;
A method for producing a multilayer electronic component, comprising: a firing step of firing the first ceramic green sheet and the second ceramic green sheet laminated by the lamination step.   4. The stacked electron according to claim 3, wherein the time for drying the internal conductor pattern in the second drying step is longer than the time for drying the via conductor pattern in the first drying step. A manufacturing method for parts.   4. The stacked electron according to claim 3, wherein a temperature for drying the internal conductor pattern in the second drying step is higher than a temperature for drying the via conductor pattern in the first drying step. 5. A manufacturing method for parts.   Among the plurality of internal conductor patterns, at least two internal conductor patterns adjacent to each other in the stacking direction of the first ceramic green sheet and the second ceramic green sheet via the via conductor pattern in the stacking direction. In the parallel cross section, the width of the inner conductor pattern positioned on the upper surface side of the first ceramic green sheet in the direction perpendicular to the stacking direction is set to the inner conductor positioned on the lower surface side of the first ceramic green sheet. 4. The method for manufacturing a multilayer electronic component according to claim 3, wherein a width of the pattern is smaller than a width in a direction perpendicular to the stacking direction.   The plurality of internal conductor patterns, in a cross section parallel to the stacking direction, a width in a direction perpendicular to the stacking direction is made smaller as the internal conductor pattern located on the upper side of the stacking direction. 6. A method for producing a multilayer electronic component according to 6.   When the two internal conductor patterns are seen through a plane, at least a part of the internal conductor pattern located on the upper surface side of the first ceramic green sheet is located on the lower surface side of the first ceramic green sheet. The method of manufacturing a multilayer electronic component according to claim 6, wherein the multilayer electronic component is disposed so as to overlap with a part of the internal conductor pattern.

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