JP2009099698A - Stacked coil component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacked coil component which can suppress the occurrence of delamination. <P>SOLUTION: In the stacked coil component, the other end 12b of a spiral first conductor 12 is connected to the other end 14b of a spiral second conductor 14, the other end 16b of a spiral third conductor 16 is connected to the other end 18b of a spiral fourth conductor 18, and one end 14a of the second conductor 14 is connected to one end 16a of the third conductor 16 through a third via 20c. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a small multilayer coil component used in various electronic devices.

  As shown in FIG. 4, this type of conventional multilayer coil component is provided with a plurality of conductors 2 on the top surfaces of a plurality of insulating layers 1 and via electrodes (not shown) formed on the plurality of insulating layers 1. A spiral coil is formed by connecting the conductors 2 to each other. In addition, each of the plurality of conductors 2 is configured with a number of turns of 3/4 turns, and the number of turns is increased by overlapping the plurality of conductors 2 in the stacking vertical direction. By adopting such a configuration, noise removal is performed by increasing the impedance generated in the coil.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2007-123726 A

  In the conventional multilayer coil component described above, since a plurality of conductors 2 having 3/4 turns are stacked, a large distortion occurs due to the difference in contraction behavior of the insulating layer 1 and the conductor 2 during firing, As a result, there is a problem that delamination is likely to occur.

  The present invention solves the above-described conventional problems, and an object of the present invention is to provide a laminated coil component that can suppress the occurrence of delamination.

  In order to achieve the above object, the present invention has the following configuration.

  According to a first aspect of the present invention, there is provided a spiral first conductor provided on the upper surface of the first insulating layer, and a first via provided on the upper surface of the first conductor. A second insulating layer and a second spiral layer provided on an upper surface of the second insulating layer and having one end connected to one end of the first conductor via the first via A conductor, a third insulating layer provided on the upper surface of the second conductor, a spiral third conductor provided on the upper surface of the third insulating layer, and an upper surface of the third conductor; A fourth insulating layer provided with a second via, and an end of the third conductor provided on the upper surface of the fourth insulating layer, the one end of which is provided via the second via A fourth conductor connected to the second conductor, connecting the other end of the first conductor and the other end of the second conductor, and other than the third conductor The other end of the fourth conductor and the one end of the second conductor and one end of the third conductor via a third via formed in the third insulating layer. According to this configuration, since the first to fourth conductors are formed in a spiral shape, a high impedance can be obtained without increasing the number of stacked layers. The occurrence of lamination can be suppressed, and the first and second conductors are arranged in parallel, and the third and fourth conductors are also arranged in parallel, greatly increasing the DC resistance value. The effect of being able to be reduced is obtained.

  In the invention according to claim 2 of the present invention, in particular, the shape of the first conductor and the shape of the second conductor are the same shape, and the shape of the third conductor and the shape of the fourth conductor are the same shape. Therefore, according to this configuration, it is not necessary to provide conductors having different shapes, and thus an operational effect that productivity can be improved is obtained.

  The invention described in claim 3 of the present invention is particularly one in which the number of turns of the first to fourth conductors is set to 1 turn or more. According to this configuration, an effect of obtaining a high impedance can be obtained. It is what

  In the invention according to claim 4 of the present invention, in particular, the first to third vias are formed in the substantially central portions of the second to fourth insulating layers, respectively. Since the formed insulating layer has no directionality, an effect of improving productivity can be obtained.

  As described above, the multilayer coil component according to the present invention connects the other end of the spiral first conductor and the other end of the spiral second conductor, and the other of the spiral third conductor. An end and the other end of the spiral fourth conductor are connected, and one end of the second conductor and one end of the third conductor are connected via a third via. Therefore, it is possible to obtain a high impedance without increasing the number of laminated layers, thereby suppressing the occurrence of delamination, and arranging the first conductor and the second conductor in parallel, and the third Since the conductor and the fourth conductor are also arranged in parallel, an excellent effect is obtained in that the direct current resistance value can be greatly reduced.

  Hereinafter, a laminated coil component according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is an exploded perspective view of a laminated coil component according to an embodiment of the present invention, and FIG. 2 is a perspective view of the laminated coil component.

  As shown in FIGS. 1 and 2, the laminated coil component according to the embodiment of the present invention includes a first conductor 12 provided on the upper surface of the first insulating layer 11, and the first conductor 12. A second insulating layer 13 provided on the upper surface, a spiral second conductor 14 provided on the upper surface of the second insulating layer 13 and connected to the first conductor 12, and the second A third insulating layer 15 provided on the upper surface of the conductor 14, a spiral third conductor 16 provided on the upper surface of the third insulating layer 15, and an upper surface of the third conductor 16. Provided on the upper surface of the fourth insulating layer 17 and connected to the third conductor 16, and on the upper surface of the fourth conductor 18. And a fifth insulating layer 19 provided.

In the above configuration, the first insulating layer 11, the second insulating layer 13, the third insulating layer 15, the fourth insulating layer 17, and the fifth insulating layer 19 are made of a magnetic material, and Fe It is formed in a sheet shape from a magnetic material such as ferrite based on ₂ O ₃ and has an insulating property.

  In addition, first to third vias 20a to 20c are provided at substantially central portions of the second insulating layer 13, the fourth insulating layer 17, and the third insulating layer 15, respectively. The third vias 20a to 20c are configured by filling a hole penetrating the insulating layer with a conductor such as silver.

  As described above, since the first to third vias 20a to 20c are formed at the substantially central portions of the second to fourth insulating layers 13, 17, and 15, the vias 20a to 20c are formed. In addition, the insulating layer has no directionality, which can improve productivity.

  The first conductor 12 is provided on the upper surface of the first insulating layer 11, and one end 12a of the first conductor 12 is connected to the first via 20a.

  The second conductor 14 is provided on the upper surface of the second insulating layer 13, and one end portion 14a of the second conductor 14 is connected to the first via 20a and the third via 20c. .

  The third conductor 16 is provided on the upper surface of the third insulating layer 15, and one end 16a of the third conductor 16 is connected to the second via 20b and the third via 20c. Yes.

  Further, the fourth conductor 18 is provided on the upper surface of the fourth insulating layer 17, and one end portion 18a of the fourth conductor 18 is connected to the second via 20b.

  Furthermore, the first conductor 12, the second conductor 14, the third conductor 16, and the fourth conductor 18 are formed by plating a conductive material such as silver in a spiral shape.

  In addition, with the above-described configuration, the first conductor 12 and the second conductor 14 are connected, the second conductor 14 and the third conductor 16 are connected, and the third conductor 16 is further connected. And the fourth conductor 18 are connected.

  The shape of the first conductor 12 and the shape of the second conductor 14 are the same shape, and the shape of the third conductor 16 and the shape of the fourth conductor 18 are also the same shape. By adopting the same shape structure as described above, it is not necessary to provide conductors having different shapes, so that productivity can be improved.

  Further, the first to fourth conductors 12, 14, 16, and 18 have a number of turns of 1 or more, and by using such a structure, high impedance can be obtained.

  Furthermore, a dummy insulating layer 21 is provided on the lower surface of the first insulating layer 11 and the upper surface of the fifth insulating layer 19, and the dummy insulating layer 21 is formed in a sheet shape and has an insulating property. Have. Further, the number of the first to fifth insulating layers 11, 13, 15, 17, 19, and the dummy insulating layer 21 is not limited to the number shown in FIG.

  Here, if each of the insulating layers 11, 13, 15, 17, 19, and 21 is made of the same material, the bonding properties of the insulating layers are improved, so that a stable product can be obtained.

  Then, by laminating the first to fifth insulating layers 11, 13, 15, 17, 19 and the dummy insulating layer 21, a main body portion 22 of the multilayer coil component as shown in FIG. 2 is configured. .

  In addition, a first external electrode 23 and a second external electrode 24 are provided at both ends of the main body 22, and the first external electrode 23 is connected to the other end 12 b of the first conductor 12 and the second external electrode 24. The second conductor 14 is connected to the other end 14 b of the second conductor 14, and the second external electrode 24 is connected to the other end 16 b of the third conductor 16 and the other end 18 b of the fourth conductor 18.

  That is, the other end portion 12b of the first conductor 12 and the other end portion 14b of the second conductor 14 are connected via the first external electrode 23, and the other end portion 16b of the third conductor 16 is connected to the second end portion 16b. The other end 18 b of the fourth conductor 18 is connected via the second external electrode 24.

  The equivalent circuit of the laminated coil component according to the embodiment of the present invention includes a first conductor 12 and a second conductor 14 arranged in parallel as shown in FIG. The fourth conductor 18 is arranged in parallel, and the parallel conductors are connected in series by the third via 20c.

  Next, a method for manufacturing a laminated coil component according to an embodiment of the present invention will be described.

  In FIG. 1 and FIG. 2, first, rectangular first to fifth insulating layers 11, 13, 15, 17, 19 and a dummy insulating layer are formed by using a mixture of magnetic material powder and resin as raw materials. A predetermined number of 21 is prepared. At this time, each of the second insulating layer 13, the fourth insulating layer 17, and the third insulating layer 15 is drilled by laser, punching, or the like, and filled with silver. First to third vias 20a to 20c are formed.

  Next, the first insulating layer 11 is disposed on the upper surface of the predetermined number of dummy insulating layers 21.

  Next, a spiral first conductor 12 is formed on the upper surface of the first insulating layer 11 by plating.

  Next, the second insulating layer 13 provided with the first via 20 a is disposed on the upper surface of the first conductor 12. At this time, the one end portion 12a of the first conductor 12 and the first via 20a are connected.

  Next, a spiral second conductor 14 is formed on the upper surface of the second insulating layer 13 by plating. At this time, one end of the second conductor 14 and the first via 20a are connected.

  Next, the third insulating layer 15 provided with the third via 20 c is disposed on the upper surface of the second conductor 14. At this time, the one end portion 14a of the second conductor 14 and the third via 20c are connected.

  Next, a spiral third conductor 16 is formed on the upper surface of the third insulating layer 15 by plating. At this time, the one end portion 16a of the third conductor 16 and the third via 20c are connected.

  Next, the fourth insulating layer 17 provided with the second via 20 b is disposed on the upper surface of the third conductor 16. At this time, the one end portion 16a of the third conductor 16 and the second via 20b are connected.

  Next, a spiral fourth conductor 18 is formed on the upper surface of the fourth insulating layer 17 by plating. At this time, the one end 18a of the fourth conductor 18 and the second via 20b are connected.

  The first conductor 12, the second conductor 14, the third conductor 16, and the fourth conductor 18 are formed by plating a conductor having a predetermined pattern shape on a separately prepared base plate (not shown). Then, the conductor is formed by transferring the conductor to each insulating layer.

  Next, the fifth insulating layer 19 is disposed on the upper surface of the fourth conductor 18, and then a predetermined number of dummy insulating layers 21 are disposed on the upper surface of the fifth insulating layer 19, so that the main body of the multilayer coil component is provided. 22 is formed.

  In the above manufacturing process, a plurality of first conductors 12, second conductors 14, third conductors 16, and fourth conductors 18 are provided in each insulating layer in order to improve manufacturing efficiency. Thereafter, a plurality of main body portions 22 may be obtained simultaneously by cutting into individual pieces.

  Next, the main body 22 is fired at a predetermined temperature and time.

  Next, the first and second external electrodes 23 and 24 are formed by applying and baking a silver paste on both ends of the main body 22.

  Finally, a nickel plating layer (not shown) is formed on the surfaces of the first and second external electrodes 23 and 24 by plating, and a low melting point metal plating layer such as tin or solder is further formed on the surface of the nickel plating layer by plating. (Not shown).

  As described above, in one embodiment of the present invention, the other end 12b of the spiral first conductor 12 and the other end 14b of the spiral second conductor 14 are connected, and the spiral first conductor 12 is connected. The other end 16 b of the third conductor 16 and the other end 18 b of the spiral fourth conductor 18, and one end 14 a of the second conductor 14 and one end 16 a of the third conductor 16 Are connected via the third via 20c, so that a high impedance can be obtained without increasing the number of stacked layers, and the effect of suppressing the occurrence of delamination can be obtained.

  That is, since the first conductor 12, the second conductor 14, the third conductor 16, and the fourth conductor 18 are formed in a spiral shape having a long conductor length of one turn or more, the number of conductors is small. However, it is possible to obtain a sufficient conductor length to obtain a predetermined impedance, which can reduce the number of laminated layers and suppress the occurrence of delamination.

  Further, as shown in FIG. 3, the first conductor 12 and the second conductor 14 are arranged in parallel, and the third conductor 16 and the fourth conductor 18 are also arranged in parallel. It is also possible to obtain an effect that can be greatly reduced.

  The laminated coil component according to the embodiment of the present invention is provided with one each of the first to fourth conductors, but may be an array type provided with a plurality of each.

  Also, the first conductor 12 and the fourth conductor 18 may be arranged in series, the second conductor 14 and the third conductor 16 may be arranged in series, and these may be arranged in parallel. It is.

  The multilayer coil component according to the present invention has an effect of suppressing the occurrence of delamination, and is particularly useful as a small multilayer coil component used as a noise countermeasure for mobile phones, information devices, etc. It will be.

1 is an exploded perspective view of a laminated coil component according to an embodiment of the present invention. Perspective view of the same laminated coil component Equivalent circuit diagram of the same laminated coil component An exploded perspective view of a conventional multilayer coil component

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 1st insulating layer 12 1st conductor 12a One end part of 1st conductor 12b Other end part of 1st conductor 13 2nd insulating layer 14 2nd conductor 14a One end part of 2nd conductor 14b 2nd 15 3rd insulating layer 16 3rd conductor 16a One end part of 3rd conductor 16b The other end part of 3rd conductor 17 4th insulating layer 18 4th conductor 18a 4th conductor One end portion 18b The other end portion of the fourth conductor 20a First via 20b Second via 20c Third via

Claims (4)

A spiral first conductor provided on the upper surface of the first insulating layer, a second insulating layer provided on the upper surface of the first conductor and having a first via, and the second insulation A spiral second conductor provided on the upper surface of the layer and having one end connected to one end of the first conductor via the first via, and provided on the upper surface of the second conductor; A third conductive layer, a spiral third conductor provided on the top surface of the third insulating layer, and a fourth conductor provided on the top surface of the third conductor and having a second via. An insulating layer, and a fourth conductor provided on an upper surface of the fourth insulating layer and having one end connected to one end of the third conductor via the second via, Connect the other end of the first conductor and the other end of the second conductor, and connect the other end of the third conductor and the other end of the fourth conductor. While, the second conductor end and the third conductor third laminated coil component to be connected via a via the one end portion formed on the third insulating layer of. The multilayer coil component according to claim 1, wherein the first conductor and the second conductor have the same shape, and the third conductor and the fourth conductor have the same shape. The multilayer coil component according to claim 1, wherein the number of turns of the first to fourth conductors is one turn or more. The multilayer coil component according to claim 1, wherein the first to third vias are formed at substantially central portions of the second to fourth insulating layers.

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