JP2012060013A - Electronic component module, electronic component and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that rising of an electronic component, which is so-called a rising phenomenon, occurs during reflow for jointing the electronic component to a substrate.SOLUTION: In one embodiment of this invention, an electronic component module includes the electronic component. The electronic component includes: an insulator which has a lower face, a first side face, a second side face located on a side opposite to the first side face, a first recess formed between the lower face and the first side face, and a second recess formed between the lower face and the second side face; a coil-shaped inner conductor embedded in the insulator; a first external electrode arranged in the first recess and electrically connected to one end of the coil-shaped inner conductor; and a second external electrode arranged in the second recess and electrically connected to the other end of the coil-shaped inner conductor.

Description

  The present invention relates to an electronic component in which a coil-shaped inner conductor is embedded, and an electronic component module including the same. Such electronic components can be used, for example, as inductors, transformers, coil components, LC components, or feedthrough capacitors in a wide variety of electronic devices typified by industrial electronic devices and consumer electronics.

  As an electronic component in which a coil-shaped inner conductor is embedded, for example, a multilayer chip inductor described in Patent Document 1 is known. The multilayer chip inductor described in Patent Document 1 is obtained by laminating a predetermined number of insulating green sheets and firing a green multilayer body in which a coiled inner conductor is printed at a predetermined position inside the laminated green sheets. Is formed by.

  The multilayer chip inductor described in Patent Document 1 includes two external electrodes that are respectively disposed on two side surfaces of the fired multilayer body that are located on opposite sides of the fired multilayer body and connected to a coiled internal conductor. ing. The electronic component is mounted on the mounting substrate by bonding the external electrode to the insulating mounting substrate using a bonding member such as a solder material. Further, the wiring conductor disposed on the mounting substrate and the external conductor are electrically connected by a joining member such as a solder material.

JP 2001-232617 A

  At the time of the above reflow for bonding the multilayer chip inductor 201 (electronic component) to the insulating mounting substrate 211 (insulating substrate), as shown in FIG. 8, there is a possibility that a so-called rising phenomenon occurs. . This is because tensile stress from the joining member 215 is applied to the electronic component 201 when the external electrode 209 and the joining member 215 are joined. In particular, a relatively large tensile stress is applied to the electronic component 201 from a portion located on the side of the external electrode 209 in the bonding member 215 and bonded to the side surface of the external electrode 209.

  By reducing the amount of the joining member 215 that joins the electronic component 201 and the insulating substrate 211, the above-described rising phenomenon can be suppressed. However, there is a possibility that the bonding property between the electronic component 201 and the insulating substrate 211 may be reduced due to a decrease in the amount of the bonding member 215 used.

  The present invention has been made in view of such a conventional technique, and an electronic component module capable of reducing the possibility of a rising phenomenon while suppressing a decrease in the bonding property between the electronic component and the insulating substrate. The purpose is to provide.

  An electronic component module according to an aspect of the present invention includes a lower surface, a first side surface, and a second side surface located on the opposite side of the first side surface, and the space between the lower surface and the first side surface. An insulator having a first recess formed in the second recess and a second recess formed between the lower surface and the second side surface, a coiled internal conductor embedded in the insulator, the first A first outer electrode electrically connected to one end of the coiled inner conductor disposed in the recess, and the other of the coiled inner conductor disposed in the second recess. An electronic component including a second external electrode electrically connected to the end is provided. An electronic component module according to the above aspect includes an insulating substrate having a main surface on which the electronic component is disposed, circuit wiring disposed on the main surface of the insulating substrate, and the first external component. A first joining member that connects the electrode and the circuit wiring; and a second joining member that connects the second external electrode and the circuit wiring.

  As for the electronic component module based on said aspect, the insulator has the 1st recessed part and the 2nd recessed part. The first external electrode disposed in the first recess and the second external electrode disposed in the second recess are insulative substrates via the first bonding member or the second bonding member. Are respectively connected to circuit wirings arranged on the main surface of the circuit.

  Thus, since the 1st recessed part and the 2nd recessed part are formed in the junction part of the electronic component with respect to an insulating board | substrate, these 1st recessed part and 2nd recessed part (henceforth these recessed parts are put together) A first joining member and a second joining member (hereinafter, these joining members are collectively referred to as simply joining members) can be stored in each of the recesses. Therefore, it can suppress that a joining member accumulates on the side of an insulator excessively. As a result, the tensile stress applied to the insulator from the bonding member located on the side of the insulator can be reduced, so that the possibility of the electronic component rising can be suppressed.

It is a perspective view which shows the electronic component module of one Embodiment. (A) is a perspective view which shows the electronic component in the electronic component module shown in FIG. FIG. 2B is a perspective view in which the electronic component shown in FIG. FIG. 3 is an exploded perspective view of the electronic component shown in FIG. 2. It is AA sectional drawing of the electronic component shown in FIG. (A) is a schematic perspective view which shows the structure of the coil-shaped internal wiring in the electronic component shown in FIG. (B) is a schematic perspective view which shows the structure of the coil-shaped internal wiring in the modification of the electronic component shown in FIG. FIG. 6 is an exploded perspective view of the electronic component shown in FIG. It is BB sectional drawing of the electronic component shown in FIG.5 (b). It is the schematic which shows the rising phenomenon of an electronic component. (A) is a perspective view which shows the state which mounts an electronic component in an insulating board | substrate. (B) is a perspective view showing a state in which a rising phenomenon occurs when electronic components are mounted.

  Hereinafter, an electronic component module according to the present embodiment, an electronic component included in the electronic component module, and a manufacturing method thereof will be described in detail with reference to the drawings. However, in the drawings referred to below, for the convenience of explanation, among the members constituting the following embodiments, only the main members necessary for explaining the characteristic configuration are shown in a simplified manner. Therefore, the electronic component module according to the present embodiment can include any constituent member that is not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 4, the electronic component module 101 of the present embodiment has a lower surface, a first side surface 3 a and a first side surface 3 b located on the opposite side of the first side surface 3 a, and a lower surface and a first side surface. Embedded in the insulator 3, the insulator 3 having the first recess 5a formed between the first side surface 3a and the second recess 5b formed between the lower surface and the first side surface 3b. Arranged in the coil-shaped inner conductor 7, the first outer electrode 9a electrically connected to one end of the coil-shaped inner conductor 7, and the second recess 5b. The electronic component 1 including the second outer electrode 9b electrically connected to the other end of the coiled inner conductor 7 is provided.

  Moreover, the electronic component module 101 based on the said aspect has the insulating board | substrate 11 which has the main surface by which the electronic component 1 was arrange | positioned, the circuit wiring 13 arrange | positioned at the main surface of the insulating substrate 11, and 1st A first bonding member 15 that connects the external electrode 9a and the circuit wiring 13 and a second bonding member 17 that connects the second external electrode 9b and the circuit wiring 13 are provided.

  In the electronic component module 101 of this embodiment, the insulator 3 has a first recess 5a and a second recess 5b. The first external electrode 9a disposed in the first recess 5a and the second external electrode 9b disposed in the second recess 5b are formed by the first bonding member 15 or the second bonding member 17. Are respectively connected to circuit wirings 13 arranged on the main surface of the insulating substrate 11.

  Thus, since the recessed part 5 is formed in the junction part of the electronic component 1 with respect to the insulating board | substrate 11, the joining members 15 and 17 can be stored in these recessed parts 5, respectively. Therefore, it is possible to suppress the excessive accumulation of these joining members 15 and 17 on the side of the insulator 3. As a result, since the tensile stress applied to the insulator 3 from the joining members 15 and 17 located on the side of the insulator 3 can be reduced, the possibility that the electronic component 1 is raised can be suppressed.

  The electronic component 1 of the present embodiment includes an insulator 3 formed by laminating a plurality of insulator layers (first insulator layers 3c) each having a via hole opened on an upper surface and a lower surface, and a plurality of first insulators. A plurality of vias for electrically connecting a plurality of coil wiring conductors 19 positioned between the layers 3c and the coil wiring conductors 19 that are filled in via holes and that are adjacent to each other in the stacking direction via the first insulator layer 3c. And a conductor 21. The coiled inner conductor 7 is formed by the plurality of coil wiring conductors 19 and the plurality of via conductors 21.

  As described above, the coil wiring conductor 19 having a small influence of the thermal expansion difference even when overlapped with each other by being arranged linearly when seen in a plan view from the stacking direction is at least a plurality of via conductors 21. The touching parts overlap each other. Therefore, the inductance of the coiled inner conductor 7 can be increased.

  The electronic component 1 may have a configuration in which a plurality of first insulator layers 3c and a plurality of coil wiring conductors 19 are alternately stacked. However, as in the electronic component 1 of the present embodiment, an insulator is used. 3 is formed by alternately laminating the first insulator layer 3c and the second insulator layer 3d having the wiring formation region opened on the upper surface and the lower surface, and the coil wiring conductor 19 is formed in the wiring formation region. Preferably it is located.

  When the plurality of first insulator layers 3 c and the plurality of coil wiring conductors 19 are alternately laminated, a step is formed on the upper surface of the first insulator layer 3 c depending on the thickness of the coil wiring conductor 19. Cheap. However, the coil wiring conductor 19 is located in the wiring formation region of the second insulator layer 3d, and the layer composed of the coil wiring conductor 19 and the second insulator layer 3d is overlaid on the first insulator layer 3c. In addition, when the electronic component 1 is formed by laminating these layers, the above steps can be reduced. Therefore, it is possible to reduce the possibility of deformation due to lamination and the poor adhesion between the first insulator layer 3c and the second insulator layer 3d, and to the insulator 3 due to the thermal expansion of the coiled inner conductor 7. Stress can be relaxed.

  Further, like the electronic component 1 of the present embodiment, the thickness in the stacking direction of the first insulator layer 3c and the via conductor 21 is larger than the thickness in the stacking direction of the second insulator layer 3d and the coil wiring conductor 19. Small is preferable. Thus, since the thickness of the second insulator layer 3d and the via conductor 21 located between the first insulator layer 3c and the coil wiring conductor 19 adjacent to each other in the stacking direction is relatively small, the electronic component 1 The overall thickness can be reduced. Further, since the thickness of the entire electronic component 1 can be reduced, the number of turns of the inductor by the coiled inner conductor 7 can be increased within the allowable thickness range of the electronic component 1, and the inductance value can be increased. It becomes possible to do.

  FIG. 3 is an exploded perspective view showing a part of the laminated structure of the embodiment shown in FIG. 2 in order to clarify the laminated structure of the embodiment shown in FIG. Therefore, the numbers of the plurality of first insulator layers 3c and the plurality of second insulator layers 3d are not limited to the numbers shown in the exploded perspective view shown in FIG. Further, a coating layer made of a printing paste having the same composition as that of the first insulating layer 3c may be formed on the upper end portion in the stacking direction of the insulator 3, and the conductive via portion may also be configured by printing a conductor paste. .

  As the first insulator layer 3c and the second insulator layer 3d in the present embodiment, members having high insulating properties can be used. As the first insulator layer 3c and the second insulator layer 3d, for example, a ceramic material such as a ferrite sintered body, a forsterite sintered body, and a glass ceramic material can be used. Alternatively, an insulating resin may be used as the first insulator layer 3c and the second insulator layer 3d. Since the coiled inner conductor 7 is used as an inductor, the first insulator layer 3c and the second insulator layer 3d preferably have magnetism. Specifically, for example, a material made of ferrite, It preferably contains a magnetic material such as ferrite. In addition, the first insulator layer 3c and the second insulator layer 3d may be a combination of a nonmagnetic insulating material and a magnetic insulating material.

  The insulator 3 in the present embodiment has a rectangular outer peripheral shape when viewed in plan, but is not particularly limited thereto. For example, the outer peripheral shape in plan view may be a polygonal shape such as a hexagonal shape or an octagonal shape, or a curved shape such as an elliptical shape or a circular shape.

  The first insulator layer 3c in the present embodiment has via holes that open to the upper surface and the lower surface. The via hole is filled with a via conductor 21 that electrically connects the coil wiring conductors 19 adjacent in the stacking direction. The first insulator layer 3c is located between the coil wiring conductors 19 adjacent to each other in the stacking direction so that these coil wiring conductors 19 are separated from each other. For this reason, the first insulator layer 3c is thinner than the second insulator layer 3d, but has a thickness that can ensure insulation so that the coil wiring conductors 19 adjacent in the stacking direction are not electrically short-circuited. It is required to have.

  As the via conductor 21, a member having good conductivity is preferably used. Specifically, for example, a conductor obtained by adding a vitreous material for adding adhesiveness to an insulating material to a metal material powder such as copper, silver, gold, platinum, and nickel can be used as the via conductor 21. The above metal materials may be used alone, or may be used as an alloy or a mixture.

  The insulator 3 in the electronic component 1 of the present embodiment includes a first concave portion 5a formed between the lower surface and the first side surface 3a and a second recess formed between the lower surface and the first side surface 3b. It has a recess 5b. The insulator 3 is formed by laminating a plurality of insulator layers. The 1st recessed part 5a and the 2nd recessed part 5b cut the location where the 1st recessed part 5a and the 2nd recessed part 5b in the laminated body formed by laminating | stacking a some insulator layer are partially cut. Can be formed.

  Moreover, although the 1st recessed part 5a and the 2nd recessed part 5b may be formed by partially cutting a laminated body as mentioned above, for example, the some insulator layer which comprises the insulator 3 is laminated | stacked In this case, the first recess 5a and the second recess 5a are formed by forming in advance a groove that opens on the upper surface and the lower surface on the side surface of the insulator layer 3e that is located closest to the lower surface side of the insulator 3 among the plurality of insulator layers. The recess 5b may be formed.

  In addition, when laminating the ceramic green sheets to be the insulator layers, a groove that opens to the upper surface and the lower surface is formed in advance on the side surface of the ceramic green sheet positioned on the lowermost surface among the plurality of ceramic green sheets. One recess 5a and second recess 5b may be formed.

  As shown in FIG. 4, in the cross section of the first recess 5a and the second recess 5b perpendicular to the lower surface and the first side surface 3a, the direction of the first recess 5a parallel to the lower surface of the insulator 3 The width W1 of the second recess 5b in the direction parallel to the lower surface of the insulator 3 is larger than the width W2 of the insulator 3 in the direction parallel to the first side surface 3a. The width W4 is preferably larger than the width W4 in the direction parallel to the first side surface 3b. When the recess 5 has such a configuration, the bonding area on the surface parallel to the lower surface of the insulator 3 in the recess 5 is relatively large. Therefore, the tensile stress applied to the insulator 3 from the bonding members 15 and 17 in the lower surface direction is relatively increased, and the tensile stress applied to the insulator 3 from the bonding members 15 and 17 in the side surface direction is relatively increased. Since it becomes small, the possibility that the electronic component 1 rises can be further suppressed.

  In addition, the first recess 5a is formed only between the lower surface of the insulator 3 and the first side surface 3a, is not open on the other side surface of the insulator 3 except for the first side surface 3a, and The second recess 5b is preferably formed only between the lower surface of the insulator 3 and the first side surface 3b, and is not open to the other side surface of the insulator 3 except the first side surface 3b. The joining members 15 and 17 can be stably stored in the concave portion 5 by suppressing the joining members 15 and 17 from spreading excessively in the other side surface direction of the insulator 3. Therefore, it is possible to maintain good bonding properties between the electronic component 1 and the insulating substrate 11.

  The second insulator layer 3d in the present embodiment has wiring formation regions that open to the upper surface and the lower surface. The wiring formation region is filled with a coil wiring conductor 19. Coil wiring conductors 19 adjacent to each other in the stacking direction are electrically connected via via conductors 21 and are coiled inside wound in the stacking direction of the first insulator layer 3c and the second insulator layer 3d. A conductor 7 is formed. Thus, by forming the coiled inner conductor 7 embedded in the insulator 3, the electronic component 1 can act as a chip inductor.

  In the electronic component 1 of the present embodiment, as shown in FIG. 5A, the coiled inner conductor 7 is formed so as to be wound in a direction perpendicular to the lower surface and the upper surface of the electronic component 1. However, it is not limited to this. For example, as shown in FIG. 5B, the coiled inner conductor 7 is formed so as to wind in a direction perpendicular to the first side surface 3a and the first side surface 3b of the electronic component 1. May be.

  As shown in FIG. 5B, when the coiled inner conductor 7 is wound in a direction perpendicular to the first side surface 3a and the first side surface 3b of the electronic component 1. As shown in FIG. 6, when laminating a plurality of insulator layers constituting the insulator 3, the insulator located closest to the lower surface side and the upper surface side of the insulator 3 among the plurality of insulator layers. What is necessary is just to form the 1st recessed part 5a and the 2nd recessed part 5b by previously forming the groove | channel opened on the upper surface and the lower surface in the side surface of the layer 3e, respectively.

  Since the coiled inner conductor 7 is formed by electrically connecting the coil wiring conductors 19 adjacent to each other in the stacking direction via the via conductors 21, the coil wiring conductor is conveniently used in the present embodiment. 19. Therefore, the coil wiring conductors 19 themselves are not limited to those that have a coil shape.

  That is, since the coil wiring conductors 19 adjacent to each other in the stacking direction are electrically connected via the via conductors 21 to form a coil-shaped internal wiring, each coil wiring conductor 19 has one line. It may be a linear shape consisting of minutes, an L shape consisting of two line segments, or a U shape consisting of three line segments.

  As the coil wiring conductor 19, it is preferable to use a member having good conductivity like the via conductor 21. Specifically, for example, a conductor obtained by adding a vitreous material for adding adhesion to an insulating material to a metal material powder such as copper, silver, gold, platinum, or nickel can be used as the coil wiring conductor 19. . The above metal materials may be used alone, or may be used as an alloy or a mixture.

  The electronic component 1 of the present embodiment includes a first external electrode 9a electrically connected to one end of the coiled inner conductor 7 and a second recess 5b disposed in the first recess 5a. The second external electrode 9b electrically connected to the other end of the coiled inner conductor 7 is provided.

  In the electronic component 1 of the present embodiment, the coil wiring conductor 19 located on the uppermost side as the one end portion of the coiled inner conductor 7 composed of the coil wiring conductor 19 and the via conductor 21 is the first outer electrode 9a. Is drawn out to the surface of the insulator 3 where it is disposed, and is electrically connected to the first external electrode 9a. In addition, as the other end of the coiled inner conductor 7, the coil wiring conductor 19 located on the lowermost surface side is drawn out to the surface of the insulator 3 on which the second external electrode 9 b is disposed, and the second end It is electrically connected to the external electrode 9b.

  It is important that the first external electrode 9a is disposed at least on the surface of the first recess 5a. Therefore, the first external electrode 9a is not limited to the configuration provided only on the surface of the first recess 5a. For example, like the electronic component 1 of the present embodiment, in addition to the surface of the first recess 5a, the entire first side surface 3a, and the side surfaces adjacent to the first side surface 3a in the insulator 3, the upper surface, and the lower surface The first external electrode 9a may also be formed in a portion located in the vicinity of the first side surface 3a.

  In addition, it is important that the second external electrode 9b is disposed at least on the surface of the second recess 5b. Therefore, the second external electrode 9b is not limited to the configuration provided only on the surface of the second recess 5b. For example, like the electronic component 1 of the present embodiment, in addition to the surface of the second recess 5b, the entire first side surface 3b, and the side surface, upper surface, and lower surface adjacent to the first side surface 3b in the insulator 3 The second external electrode 9b may also be formed at a portion located in the vicinity of the first side surface 3b.

  However, as shown in FIG. 7, the first external electrode 9a is disposed only on the first recess 5a and the lower surface, and the second external electrode 9b is only on the second recess 5b and the lower surface. It is preferable that it is disposed. This is because the tensile stress applied in the side surface direction from the bonding members 15 and 17 to the insulator 3 can be relatively reduced, so that the possibility of the electronic component 1 rising can be further suppressed.

  As the first external electrode 9a and the second external electrode 9b, it is preferable to use a member having good conductivity similarly to the via conductor 21. Specifically, for example, a conductor obtained by adding a vitreous material for adding adhesion to an insulating material to a metal material powder such as copper, silver, gold, platinum, or nickel is used as the first external electrode 9a and the second electrode. The external electrode 9b can be used. The above metal materials may be used alone, or may be used as an alloy or a mixture.

  Moreover, it is preferable to form plating (not shown) on the surface exposed from the laminate (insulator 3) of the external electrode 9. This is because deterioration of the external electrode 9 exposed to the outside can be suppressed. As plating, for example, nickel plating, copper plating, silver plating, gold plating, and tin plating can be used. Specifically, for example, after nickel plating is formed on the surface exposed from the laminate of the external electrodes 9, gold plating may be further formed on the surface of the nickel plating.

  The electronic component module 101 of the present embodiment includes an insulating substrate 11 having a main surface on which the electronic component 1 is disposed. As the insulating substrate 11, a member having high insulating properties can be used. Specifically, similarly to the insulator 3, a ceramic material such as a ferrite sintered body, a forsterite sintered body, and a glass ceramic material can be used. Alternatively, an insulating resin may be used as the insulating substrate 11.

  Circuit wiring 13 is disposed on the main surface of the insulating substrate 11. The circuit wiring 13 is provided to supply power to the coiled inner conductor 7 from an external wiring (not shown). Therefore, specifically, as the circuit wiring 13, for example, a metal material such as tungsten, molybdenum, copper, silver, gold, platinum, and nickel can be used.

  The electronic component module 101 of the present embodiment includes a first bonding member 15 that connects the first external electrode 9a and the circuit wiring 13, and a second bonding member 17 that connects the second external electrode 9b and the circuit wiring 13. And. In the electronic component module 101 of the present embodiment, the first bonding member 15 and the second bonding member 17 can be stored in the first recess 5a and the second recess 5b of the insulator 3, respectively. Therefore, it is possible to suppress excessive accumulation of these joining members 15 and 17 on the side of the insulator 3. As a result, the possibility that the electronic component 1 is raised can be suppressed. The joining members 15 and 17 in the present embodiment join the electronic component 1 and the insulating substrate 11 and electrically connect the first external electrode 9a and the second external electrode 9b to the circuit wiring 13. It is used for. Therefore, it is preferable to use brazing material or solder as the joining members 15 and 17. An exemplary brazing material is silver brazing.

  Next, a method for manufacturing the electronic component 1 according to the embodiment will be described.

First, the 1st ceramic green sheet used as the part by which the coil-shaped inner conductor 7 in the insulator 3 is embed | buried is prepared. Specifically, a mixing member is prepared by mixing a raw material powder containing glass powder and ceramic powder, an organic solvent, and a binder. Examples of the raw material powder include iron oxide (Fe ₂ O ₃ ), nickel oxide (NiO), silicon oxide (SiO ₂ ), alumina (Al ₂ O ₃ ), zinc oxide (ZnO), and boron oxide (B ₂ O _3). ), Magnesium oxide (MgO), calcium oxide (CaO), and copper oxide (CuO) can be used. A plurality of first ceramic green sheets can be produced by forming the mixing member into a sheet.

  Moreover, the 1st conductor paste used as the coil-shaped inner conductor 7 is prepared. As the first conductive paste, for example, a paste obtained by adding a glassy material for adding adhesion to an insulating material to a metal material powder such as copper, silver, gold, platinum, and nickel can be used. The above metal materials can be used as a single, alloy, or mixture, and a mixture of an organic solvent and a binder can be used as the first conductor paste.

  A plurality of first ceramic green sheets are laminated so that the first conductor paste is embedded therein to form a green laminate. Specifically, in order to form the coil wiring conductor 19, a first conductor paste is disposed between the first ceramic green sheets. In order to form the via conductor 21, a via hole is provided in the first ceramic green sheet, and the first conductor paste is filled in the through hole. A biolaminate formed by laminating a plurality of first ceramic green sheets by bonding the first conductor paste filled in the through holes and the first conductor paste disposed between the first ceramic green sheets. The first conductor paste that becomes the coiled inner conductor 7 can be embedded in the body.

  Next, the 2nd ceramic green sheet for forming the 1st recessed part 5a and the 2nd recessed part 5b in the lower surface side of the insulator 3 is prepared. Specifically, as in the first ceramic green sheet, a mixing member is prepared by mixing a raw material powder containing glass powder and ceramic powder, an organic solvent, and a binder. A 2nd ceramic green sheet can be produced by shape | molding a mixing member in a sheet form.

  Grooves that open to the upper surface and the lower surface are respectively formed in the first side surface 3a and the first side surface 3b of the second ceramic green sheet produced as described above. The grooves that open to the upper surface and the lower surface may be formed by partially removing the first side surface 3a and the first side surface 3b of the second ceramic green sheet. Alternatively, the second ceramic green sheet may be produced by forming the mixing member into a sheet shape so that grooves that open to the upper surface and the lower surface are formed in advance on the first side surface 3a and the first side surface 3b.

  The 2nd ceramic green sheet produced as mentioned above is laminated | stacked on the end surface of the lamination direction of a raw laminated body. Thus, by laminating the second ceramic green sheet on the green laminate, the first recess is formed in the groove formed in the second ceramic green sheet and the end surface of the green laminate and the region surrounded by the groove. 5a and second recess 5b are formed.

  Next, the first external electrode 9a and the second external electrode 9b are formed in the regions surrounded by the grooves, which are the end surfaces of the grooves and the green laminate, which become the first recesses 5a and the second recesses 5b. A second conductor paste is disposed. As the second conductor paste, a glassy material for adding adhesion to an insulating material is added to a metal material powder such as copper, silver, gold, platinum and nickel as in the first conductor paste. A paste can be used.

  It is important that the first external electrode 9a and the second external electrode 9b are disposed on at least the surface of the first recess 5a and the surface of the second recess 5b, respectively. For this reason, the second conductive paste is not limited to the configuration provided only on the surface of the recess 5. For example, in addition to the surface of the recess 5, the second conductor paste may be disposed on the lower surface of the second ceramic green sheet and the side surface of the green laminate.

  The electronic component 1 of this embodiment can be produced by firing the green laminate produced as described above. Although the optimum firing temperature differs depending on the material used as the ceramic green sheet and the conductor paste, in the method for manufacturing the electronic component 1 of the present embodiment, the firing may be performed at a temperature of about 850 ° C. to 1000 ° C.

  As described above, in the method of manufacturing the electronic component 1 according to the present embodiment, a plurality of first ceramic green sheets are laminated so that the first conductor paste that becomes the coiled inner conductor 7 is embedded therein. A step of forming a body, a step of laminating a second ceramic green sheet in which a groove opened on the upper surface and the lower surface is formed on the first side surface 3a on the end surface in the stacking direction of the green laminate, and the groove and the green laminate And a step of disposing a second conductive paste in a region surrounded by the groove and a step of firing the green laminate.

  Moreover, in said embodiment, although the 2nd conductor paste is arrange | positioned on the upper surface of a raw laminated body, it is not restricted to this in particular. For example, after firing the green laminate, the first external electrode 9a and the second external electrode 9b are disposed on the surface of the fired laminate so as to be electrically connected to the coiled inner conductor 7. Also good. As a method of disposing these external electrodes 9 on the surface of the fired laminated body, for example, a known vapor deposition or sputtering technique may be used.

  In addition, although shown about the manufacturing method of the single-piece | unit electronic component 1, it forms the aggregate | assembly of the raw laminated body in which the 1st conductor paste used as the coil-shaped internal conductor 7 wound toward the lamination direction was provided together. May be. After producing such an assembly of raw laminates, a plurality of electronic components 1 can be produced simultaneously by dividing each raw laminate and firing each raw laminate. Further, the above-mentioned aggregate of raw laminates may be fired at the same time and then divided into the respective electronic components 1.

  As described above, the electronic component module 101, the electronic component 1, and the manufacturing method thereof according to this embodiment have been described. However, the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments can be made without departing from the scope of the present invention. For example, after the first insulator layer 3c is formed by coating the insulator paste except for the position corresponding to the VIA of the second insulator layer 3d after filling the coil conductor, the conductor paste is printed at the VIA position, Alternatively, the second insulator layer 3d after filling the coil wiring conductor adjacent to may be laminated.

  As described above, the electronic component module, the electronic component, and the manufacturing method thereof according to this embodiment have been described. However, the present invention is not limited to the above-described embodiment. In other words, various modifications and combinations of embodiments can be made without departing from the scope of the present invention. For example, after the first insulator layer is formed by the coating method of the insulator paste except for the position corresponding to the VIA of the second insulator layer after filling the coil conductor, the conductor paste is printed at the VIA position, and adjacent thereto The insulator layer after filling the second coil conductor may be laminated.

DESCRIPTION OF SYMBOLS 1 ... Electronic component 101 ... Electronic component module 3 ... Insulator 3a ... 1st side surface 3b ... 2nd side surface 3c ... 1st insulator layer 3d ... 1st Two insulator layers 5a ... first recess 5b ... second recess 7 ... coiled inner conductor 9a ... first outer electrode 9b ... second outer electrode 11 ... Insulating substrate 13 ... circuit wiring 15 ... first joining member 17 ... second joining member 19 ... coil wiring conductor 21 ... via conductor

Claims (6)

A lower surface, a first side surface, and a second side surface opposite to the first side surface; and a first recess formed between the lower surface and the first side surface; An insulator having a second recess formed between the second side surface, a coiled inner conductor embedded in the insulator, and the coiled inner conductor disposed in the first recess; A first external electrode electrically connected to one end, and a second external electrode disposed in the second recess and electrically connected to the other end of the coiled inner conductor An electronic component equipped with an electrode;
An insulating substrate having a main surface on which the electronic component is disposed;
Circuit wiring disposed on the main surface of the insulating substrate;
A first bonding member connecting the first external electrode and the circuit wiring;
An electronic component module comprising: the second external electrode and a second bonding member that connects the circuit wiring.   In a cross section of the first recess and the second recess perpendicular to the lower surface and the first side surface, a width of the first recess in a direction parallel to the lower surface is the first side surface. The width in the direction parallel to the lower surface of the second recess is greater than the width in the parallel direction, and the width in the direction parallel to the second side surface is larger than the width in the direction parallel to the second side surface. The electronic component module described.   The first external electrode is disposed only in the first recess and the lower surface, and the second external electrode is disposed only in the second recess and the lower surface. The electronic component module according to claim 1, wherein   The first recess is formed only between the lower surface and the first side surface, does not open on the other side surface of the insulator except the first side surface, and the second 2. The electron according to claim 1, wherein a recess is formed only between the lower surface and the second side surface, and is not opened on the other side surface of the insulator except the second side surface. Parts module. A lower surface, a first side surface, and a second side surface opposite to the first side surface; and a first recess formed between the lower surface and the first side surface; An insulator having a second recess formed between the second side surface;
A coiled inner conductor embedded in the insulator;
A first external electrode disposed in the first recess and electrically connected to one end of the coiled inner conductor;
An electronic component comprising a second external electrode disposed in the second recess and electrically connected to the other end of the coiled inner conductor. A step of forming a green laminate by laminating a plurality of first ceramic green sheets so that a first conductor paste to be a coiled inner conductor is embedded therein;
A step of laminating a second ceramic green sheet having grooves formed on the first side surface on the upper surface and the lower surface on the end surface in the stacking direction of the green laminate;
A step of disposing a second conductor paste in an area surrounded by the groove on the end surface of the groove and the green laminate;
And a step of firing the green laminate.

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