CN108012421A - Control separate wells aperture and independent lines thickness production method - Google Patents
Control separate wells aperture and independent lines thickness production method Download PDFInfo
- Publication number
- CN108012421A CN108012421A CN201711094339.2A CN201711094339A CN108012421A CN 108012421 A CN108012421 A CN 108012421A CN 201711094339 A CN201711094339 A CN 201711094339A CN 108012421 A CN108012421 A CN 108012421A
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- Prior art keywords
- substrate
- aperture
- film
- etching
- laser
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Abstract
The invention discloses control separate wells aperture and independent lines thickness production method, include the following steps：Substrate is repaired,Substrate surface process,Laser deposition of conductor pattern pattern forming,Circuit is molded,The designed lines film,Substrate drills,Substrate and line film contraposition,Cure under pressure,Drilling etches and enters library storage,The rotating speed of sander is 400 550r/min in the step 1),Laser Modulation frequency in the step 3) is 1200 5000Hz,Pulse width is 60 150ns,The mean power of laser is 10 200W,Step 2) the non-metal optical inducing catalysis agent aldehydes is solid-state or liquid or gaseous trihydroxylic alcohol,The thermoplasticity loading material is polyvinyl chloride,Makrolon and polybutylene terephthalate (PBT),After substrate is attached on vacuum cup by the step 6),Drilling beams are made to match with wiring board with alignment mark,The present invention,It is simple in structure,It is easy to use,Easy to accurately control the thickness of the size in aperture and circuit line,Effectively lift the convenience used.
Description
Technical field
The present invention relates to board production technical field, specifically separate wells aperture and independent lines thickness making side in order to control
Method.
Background technology
With the continuous development of electronic communication, the function of communication product is more and more.In order to more preferably play electronics production
The function of product, current high-end mobile electronic device are largely equipped with touching display screen, and the size of display screen is also gradually increased, and is shown
The increasing of display screen causes being multiplied for power consumption.In order to increase the stand-by time of electronic product, manufacturer in design all most
Limits reduce the size of wiring board, to increase the capacity of battery；The circuit board size of high-end electronic product at present, from it
Preceding and product etc. is reduced to less than the 50% of product size greatly.The function of circuit board increases and volume reduces, and causes circuit board device
Part is laid out more crypto set and the number of plies persistently rises.And being incremented by with the circuit board number of plies, pressing number is consequently increased during production,
Board production flow also becomes increasingly complex.Existing circuit board is unable to control control separate wells aperture and independent lines in production
Thickness, therefore, it is necessary to design a kind of control separate wells aperture and independent lines thickness production method.
The content of the invention
It is an object of the invention to provide control separate wells aperture and independent lines thickness production method, to solve above-mentioned background
The problem of being proposed in technology.
In order to solve the above technical problem, the present invention provides following technical solution：Control separate wells aperture and independent lines thick
Production method is spent, is included the following steps：
1) substrate is repaired：Substrate is cut into the required size of circuit board by substrate cut machine, is carried out by sander
Grinding process, it is stand-by after the completion of processing；
2) substrate surface process：Non-metal optical inducing catalysis agent aldehyde is added in the surface of substrate is with thermoplasticity loading material
Class, is component with injection molding machine injection molding, wherein, the content of non-metal optical inducing catalysis agent alcohols is 5-15%, injection molding
Temperature is 80-150 DEG C；
3) laser deposition of conductor pattern pattern forming：Irradiated with the laser beam that wavelength is 1000-1500nm on the surface of component
Trace arrangements pattern, is 5-15s in the time of component surface irradiation, forms it into trace arrangements pattern；
4) circuit is molded：It is 4-6's that the substrate for being carved with trace arrangements pattern is immersed pH value under 20-30 DEG C of temperature environment
The mixed solution of nickel chloride and silver nitrate, soaking time 5-15min；Then it is the mixing of component from nickel chloride and silver nitrate is molten
Liquid takes out, and is cleaned with distilled water；The component after cleaning is put into the solution containing reducing agent of PH=5-6 again and is soaked
Bubble, soaking time 10-30min so that component surface generates corresponding metal core；Finally metal core is carried out at electro-coppering again
Reason, forms it into conducting wire；
5) the designed lines film：It is scanned, is obtained along the surface of the substrate with circuit line using line scanning device
Curve map, according to the distribution of curve in curve map, what definite layering was cut cuts standard；Then set again using 3-D scanning
It is standby that the substrate with circuit line is scanned, the threedimensional model of model is built according to gained three-dimensional data；Further according to step
The standard that cuts determined in rapid 1 cuts the threedimensional model obtained in step 2, obtains the film figure of corresponding different layers
Case；It is connected on the position for marking out location hole on the film pattern of gained again；Phase is obtained after finally the film pattern is exported
The film answered；
6) substrate drills：Preset the corresponding etching to compensate value of thick copper coin independence PAD；By independently when redesigning line film
No Copper treatment is done in the position of the need drilling of PAD according to its corresponding corresponding etching to compensate value, wherein, size that line film need to be emptied etc.
Corresponding etching to compensate value is first gone in boring aperture；Then amended line film is designed, row line of going forward side by side pattern transfer, after etching
The position of the need drilling of independent PAD and the size gap of boring aperture are between ± 2mil, that is, the Circular Aperture emptied is with drilling hole
Footpath size is in ± 2mil；Finally drilled using laser drilling machine；
7) substrate and line film contraposition：Screw is pressed into the film corresponds to location hole, the film is then fitted in printing
Circuit board surface, screw one end penetrate printed circuit board and correspond in location hole, complete printed circuit board and are bonded with film aligning；
8) cure under pressure：It is spare to prepare a block protection plate；Then the bottom and top of protection board and substrate are laid with respectively
Prepreg, carries out pre-pressing, the temperature of the pre-pressing is less than the glass transition temperature of the prepreg, and can make
The prepreg is molten into liquid, to realize the bonding of interlayer；Finally pressed using pressing machine.
9) drilling etching：The fixing bolt that substrate and line film contraposition use is disassembled, then using chemical drugs
Agent is etched through hole, forms it into uniform through hole；
10) library storage is entered：Finished product is carried out to store into section, and is recorded.
According to above-mentioned technical proposal, the rotating speed of sander is 400-550r/min in the step 1).
According to above-mentioned technical proposal, the Laser Modulation frequency in the step 3) is 1200-5000Hz, and pulse width is
60-150ns, the mean power of the laser is 10-200W.
According to above-mentioned technical proposal, step 2) the non-metal optical inducing catalysis agent aldehydes is solid-state or liquid or gaseous state
Trihydroxylic alcohol, the thermoplasticity loading material is polyvinyl chloride, makrolon and polybutylene terephthalate (PBT).
According to above-mentioned technical proposal, after substrate is attached on vacuum cup by the step 6), make drilling with alignment mark
Light beam matches with wiring board, using the figure on through hole or wiring board as mark；Then laser drilling machine is opened, determines light
Cover size；Reset laser parameter, calibration collecting lens position；Last laser beam emitting device, carries out laser drill.
According to above-mentioned technical proposal, the pressing-in temp of the step 8) pressing machine is 30-40 DEG C, and is maintained 10-20 minutes,
The hot pressing pressure of the pressing machine is 200-600MPa.
According to above-mentioned technical proposal, the step 9) coats corrosion-resistant glue on the predetermined portions on the surface of workpiece, to work
Surface after the corrosion-resistant glue of coating of part carries out mask process；Spray erosion is carried out with the first etching solution to the workpiece after mask process
Carve, to form initial concaveconvex structure on the surface of work；Demoulding processing is carried out to the workpiece after etching, to remove workpiece surface
Mask；Workpiece after demoulding is handled, which is put into the second etching solution, to be soaked, to remove the seamed edge of continuous initial convex-concave structure
With reduce the etch depth of micro-structure to be formed；Workpiece after immersion with water rinsing, drying and then is polished, so that in work
The through hole of fixed size is formed on the surface of part.
Compared with prior art, the beneficial effect that is reached of the present invention is：The present invention will be by that will be carved with trace arrangements pattern
Substrate immersed under 20-30 DEG C of temperature environment pH value be 4-6 nickel chloride and silver nitrate mixed solution, soaking time 5-
15min；Then component is taken out from the mixed solution of nickel chloride and silver nitrate, and is cleaned with distilled water；After cleaning again
Component be put into the solution containing reducing agent of PH=5-6 and soak, soaking time 10-30min so that component surface generates
Corresponding metal core；Finally metal core carries out plating Copper treatment again, forms it into conducting wire, can effective accurate control circuit
The thickness of line, effectively lifts the convenience used；The making of location hole is carried out by using the film, can effectively be molded difference
The location hole of size, easy to accurately control the diameter of location hole, effectively lifts the convenience used.
Brief description of the drawings
Attached drawing is used for providing a further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
Apply example to be used to explain the present invention together, be not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the integral manufacturing flow chart of the present invention；
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
Referring to Fig. 1, the present invention provides technical solution：Separate wells aperture and independent lines thickness production method are controlled, including
Following steps：
1) substrate is repaired：Substrate is cut into the required size of circuit board by substrate cut machine, is carried out by sander
Grinding process, it is stand-by after the completion of processing；
2) substrate surface process：Non-metal optical inducing catalysis agent aldehyde is added in the surface of substrate is with thermoplasticity loading material
Class, is component with injection molding machine injection molding, wherein, the content of non-metal optical inducing catalysis agent alcohols is 5-15%, injection molding
Temperature is 80-150 DEG C；
3) laser deposition of conductor pattern pattern forming：Irradiated with the laser beam that wavelength is 1000-1500nm on the surface of component
Trace arrangements pattern, is 5-15s in the time of component surface irradiation, forms it into trace arrangements pattern；
4) circuit is molded：It is 4-6's that the substrate for being carved with trace arrangements pattern is immersed pH value under 20-30 DEG C of temperature environment
The mixed solution of nickel chloride and silver nitrate, soaking time 5-15min；Then it is the mixing of component from nickel chloride and silver nitrate is molten
Liquid takes out, and is cleaned with distilled water；The component after cleaning is put into the solution containing reducing agent of PH=5-6 again and is soaked
Bubble, soaking time 10-30min so that component surface generates corresponding metal core；Finally metal core is carried out at electro-coppering again
Reason, forms it into conducting wire；
5) the designed lines film：It is scanned, is obtained along the surface of the substrate with circuit line using line scanning device
Curve map, according to the distribution of curve in curve map, what definite layering was cut cuts standard；Then set again using 3-D scanning
It is standby that the substrate with circuit line is scanned, the threedimensional model of model is built according to gained three-dimensional data；Further according in step 1
The definite standard that cuts cuts the threedimensional model obtained in step 2, obtains the film pattern of corresponding different layers；It is connected on
The position of location hole is marked out on the film pattern of gained again；Finally by the film pattern output after obtain the corresponding film；
6) substrate drills：Preset the corresponding etching to compensate value of thick copper coin independence PAD；By independently when redesigning line film
No Copper treatment is done in the position of the need drilling of PAD according to its corresponding corresponding etching to compensate value, wherein, size that line film need to be emptied etc.
Corresponding etching to compensate value is first gone in boring aperture；Then amended line film is designed, row line of going forward side by side pattern transfer, after etching
The position of the need drilling of independent PAD and the size gap of boring aperture are between ± 2mil, that is, the Circular Aperture emptied is with drilling hole
Footpath size is in ± 2mil；Finally drilled using laser drilling machine；
7) substrate and line film contraposition：Screw is pressed into the film corresponds to location hole, the film is then fitted in printing
Circuit board surface, screw one end penetrate printed circuit board and correspond in location hole, complete printed circuit board and are bonded with film aligning；
8) cure under pressure：It is spare to prepare a block protection plate；Then the bottom and top of protection board and substrate are laid with respectively
Prepreg, carries out pre-pressing, the temperature of pre-pressing is less than the glass transition temperature of prepreg, and can make prepreg
Liquid is molten into, to realize the bonding of interlayer；Finally pressed using pressing machine.
9) drilling etching：The fixing bolt that substrate and line film contraposition use is disassembled, then using chemical drugs
Agent is etched through hole, forms it into uniform through hole；
10) library storage is entered：Finished product is carried out to store into section, and is recorded.
According to above-mentioned technical proposal, the rotating speed of sander is 400-550r/min in step 1).
According to above-mentioned technical proposal, the Laser Modulation frequency in step 3) is 1200-5000Hz, pulse width 60-
150ns, the mean power of laser is 10-200W.
According to above-mentioned technical proposal, step 2) non-metal optical inducing catalysis agent aldehydes is solid-state or liquid or gaseous three
First alcohol, thermoplasticity loading material are polyvinyl chloride, makrolon and polybutylene terephthalate (PBT).
According to above-mentioned technical proposal, after substrate is attached on vacuum cup by step 6), make drilling beams with alignment mark
Match with wiring board, using the figure on through hole or wiring board as mark；Then laser drilling machine is opened, determines that light shield is big
It is small；Reset laser parameter, calibration collecting lens position；Last laser beam emitting device, carries out laser drill.
According to above-mentioned technical proposal, the pressing-in temp of step 8) pressing machine is 30-40 DEG C, and is maintained 10-20 minutes, pressing
The hot pressing pressure of machine is 200-600MPa.
According to above-mentioned technical proposal, step 9) coats corrosion-resistant glue on the predetermined portions on the surface of workpiece, to workpiece
Coat the surface after corrosion-resistant glue and carry out mask process；Spray etching is carried out with the first etching solution to the workpiece after mask process,
To form initial concaveconvex structure on the surface of work；Demoulding processing is carried out to the workpiece after etching, to remove workpiece surface
Mask；Workpiece after demoulding is handled, which is put into the second etching solution, to be soaked, with remove the seamed edge of continuous initial convex-concave structure and
Reduce the etch depth of micro-structure to be formed；Workpiece after immersion with water rinsing, drying and then is polished, so that in workpiece
Surface on formed fixed size through hole.
Operation principle：The present invention under 20-30 DEG C of temperature environment by the substrate for being carved with trace arrangements pattern by immersing PH
It is worth the mixed solution of the nickel chloride and silver nitrate for 4-6, soaking time 5-15min；Then by component from nickel chloride and nitric acid
The mixed solution of silver takes out, and is cleaned with distilled water；Again by the component after cleaning be put into PH=5-6 containing reducing agent
Soaked in solution, soaking time 10-30min so that component surface generates corresponding metal core；Finally metal core carries out electricity again
Copper plating treatment, forms it into conducting wire, can effective accurate control circuit line thickness, effectively lift the convenience used；
The making of location hole is carried out by using the film, can effectively be molded different size of location hole, easy to accurately control positioning
The diameter in hole, effectively lifts the convenience used.
Finally it should be noted that：The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention,
Although the present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still may be used
To modify to the technical solution described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic.
Within the spirit and principles of the invention, any modification, equivalent replacement, improvement and so on, should be included in the present invention's
Within protection domain.
Claims (7)
1. control separate wells aperture and independent lines thickness production method, it is characterised in that：Include the following steps：
1) substrate is repaired：Substrate is cut into the required size of circuit board by substrate cut machine, is polished by sander
Processing, it is stand-by after the completion of processing；
2) substrate surface process：Non-metal optical inducing catalysis agent aldehydes is added in the surface of substrate is with thermoplasticity loading material,
It is component with injection molding machine injection molding, wherein, the content of non-metal optical inducing catalysis agent alcohols is 5-15%, injection molding temperature
For 80-150 DEG C；
3) laser deposition of conductor pattern pattern forming：The circuit irradiated with the laser beam that wavelength is 1000-1500nm on the surface of component
Arrangement pattern, is 5-15s in the time of component surface irradiation, forms it into trace arrangements pattern；
4) circuit is molded：The substrate for being carved with trace arrangements pattern is immersed into the chlorination that pH value is 4-6 under 20-30 DEG C of temperature environment
The mixed solution of nickel and silver nitrate, soaking time 5-15min；Then the mixed solution of component from nickel chloride and silver nitrate is taken
Go out, and cleaned with distilled water；The component after cleaning is put into the solution containing reducing agent of PH=5-6 again and is soaked, is soaked
The bubble time is 10-30min so that component surface generates corresponding metal core；Finally metal core carries out plating Copper treatment again, makes it
Form conducting wire；
5) the designed lines film：It is scanned using line scanning device along the surface of the substrate with circuit line, obtains curve
Figure, according to the distribution of curve in curve map, what definite layering was cut cuts standard；Then three-dimensional scanning device pair is used again
The substrate with circuit line is scanned, and the threedimensional model of model is built according to gained three-dimensional data；Further according in step 1
The definite standard that cuts cuts the threedimensional model obtained in step 2, obtains the film pattern of corresponding different layers；It is connected on
The position of location hole is marked out on the film pattern of gained again；Corresponding phenanthrene is obtained after finally the film pattern is exported
Woods；
6) substrate drills：Preset the corresponding etching to compensate value of thick copper coin independence PAD；By independent PAD's when redesigning line film
No Copper treatment is done in the position that need to be drilled according to its corresponding corresponding etching to compensate value, wherein, the size that line film need to be emptied, which is equal to, bores
Corresponding etching to compensate value is first gone in hole aperture；Then amended line film is designed, row line of going forward side by side pattern transfer is independent after etching
Between ± 2mil, that is, the Circular Aperture emptied is big with boring aperture for the position of the need drilling of PAD and the size gap of boring aperture
It is small in ± 2mil；Finally drilled using laser drilling machine；
7) substrate and line film contraposition：Screw is pressed into the film corresponds to location hole, the film is then fitted in printed circuit
Plate surface, screw one end penetrate printed circuit board and correspond in location hole, complete printed circuit board and are bonded with film aligning；
8) cure under pressure：It is spare to prepare a block protection plate；Then it is solid the bottom and top of protection board and substrate to be laid with half respectively
Change piece, carry out pre-pressing, the temperature of the pre-pressing is less than the glass transition temperature of the prepreg, and can make described
Prepreg is molten into liquid, to realize the bonding of interlayer；Finally pressed using pressing machine.
9) drilling etching：The fixing bolt that substrate and line film contraposition use is disassembled, then using chemical agent pair
Through hole is etched, and forms it into uniform through hole；
10) library storage is entered：Finished product is carried out to store into section, and is recorded.
2. control separate wells aperture according to claim 1 and independent lines thickness production method, it is characterised in that：The step
It is rapid 1) in the rotating speed of sander be 400-550r/min.
3. control separate wells aperture according to claim 1 and independent lines thickness production method, it is characterised in that：The step
It is rapid 3) in Laser Modulation frequency be 1200-5000Hz, pulse width 60-150ns, the mean power of the laser is 10-
200W。
4. control separate wells aperture according to claim 1 and independent lines thickness production method, it is characterised in that：The step
Rapid 2) non-metal optical inducing catalysis agent aldehydes is solid-state or liquid or gaseous trihydroxylic alcohol, and the thermoplasticity loading material is poly-
Vinyl chloride, makrolon and polybutylene terephthalate (PBT).
5. control separate wells aperture according to claim 1 and independent lines thickness production method, it is characterised in that：The step
It is rapid 6) substrate is attached on vacuum cup after, drilling beams and wiring board is matched with alignment mark, using through hole or line
Figure on the plate of road is as mark；Then laser drilling machine is opened, determines light shield size；Laser parameter is reset, calibrates light harvesting
Mirror position；Last laser beam emitting device, carries out laser drill.
6. control separate wells aperture according to claim 1 and independent lines thickness production method, it is characterised in that：The step
The pressing-in temp of rapid 8) pressing machine is 30-40 DEG C, and is maintained 10-20 minutes, and the hot pressing pressure of the pressing machine is 200-
600MPa。
7. control separate wells aperture according to claim 1 and independent lines thickness production method, it is characterised in that：The step
Rapid that corrosion-resistant glue 9) is coated on the predetermined portions on the surface of workpiece, the surface after the corrosion-resistant glue of coating to workpiece is into line mask
Processing；Spray etching is carried out with the first etching solution to the workpiece after mask process, it is initial concavo-convex to be formed on the surface of work
Structure；Demoulding processing is carried out to the workpiece after etching, to remove the mask of workpiece surface；Workpiece after demoulding is handled is put into
Soaked in two etching solutions, to remove the seamed edge of continuous initial convex-concave structure and reduce the etching of micro-structure to be formed is deep
Degree；Workpiece after immersion with water rinsing, drying and then is polished, so as to form the through hole of fixed size on the surface of workpiece.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711094339.2A CN108012421A (en) | 2017-11-09 | 2017-11-09 | Control separate wells aperture and independent lines thickness production method |
| PCT/CN2017/112925 WO2019090859A1 (en) | 2017-11-09 | 2017-11-24 | Manufacturing method for controlling independent pore size and independent wire thickness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711094339.2A CN108012421A (en) | 2017-11-09 | 2017-11-09 | Control separate wells aperture and independent lines thickness production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108012421A true CN108012421A (en) | 2018-05-08 |
Family
ID=62051313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711094339.2A Pending CN108012421A (en) | 2017-11-09 | 2017-11-09 | Control separate wells aperture and independent lines thickness production method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108012421A (en) |
| WO (1) | WO2019090859A1 (en) |
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| Publication number | Publication date |
|---|---|
| WO2019090859A1 (en) | 2019-05-16 |
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Application publication date: 20180508 |