CN117641772A - Preparation method of multilayer circuit board - Google Patents
Preparation method of multilayer circuit board Download PDFInfo
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- CN117641772A CN117641772A CN202311364854.3A CN202311364854A CN117641772A CN 117641772 A CN117641772 A CN 117641772A CN 202311364854 A CN202311364854 A CN 202311364854A CN 117641772 A CN117641772 A CN 117641772A
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- copper
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- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 229910052802 copper Inorganic materials 0.000 claims abstract description 49
- 239000010949 copper Substances 0.000 claims abstract description 49
- 239000011347 resin Substances 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 238000005234 chemical deposition Methods 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000000151 deposition Methods 0.000 claims abstract description 15
- 230000008021 deposition Effects 0.000 claims abstract description 13
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 239000000243 solution Substances 0.000 claims description 31
- 238000001723 curing Methods 0.000 claims description 14
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical group O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- 239000012670 alkaline solution Substances 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 6
- 229910021645 metal ion Inorganic materials 0.000 claims description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 6
- 238000011416 infrared curing Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 4
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 3
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 3
- MNUSMUGFHGAOIW-UHFFFAOYSA-N cyclohexane-1,1,2-tricarboxylic acid Chemical compound OC(=O)C1CCCCC1(C(O)=O)C(O)=O MNUSMUGFHGAOIW-UHFFFAOYSA-N 0.000 claims description 3
- NAGJZTKCGNOGPW-UHFFFAOYSA-N dithiophosphoric acid Chemical compound OP(O)(S)=S NAGJZTKCGNOGPW-UHFFFAOYSA-N 0.000 claims description 3
- 235000019253 formic acid Nutrition 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000002086 nanomaterial Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 239000011152 fibreglass Substances 0.000 claims description 2
- 230000008901 benefit Effects 0.000 abstract description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- -1 2-bipyridine Chemical compound 0.000 description 1
- 238000010146 3D printing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001182 laser chemical vapour deposition Methods 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Abstract
The invention relates to the technical field of PCB production, in particular to a preparation method of a multilayer circuit board. The preparation method comprises the following steps: s1, preparing a chemical deposition solution containing copper ions, wherein a lifting platform is arranged in a trough; placing a substrate on top of a lifting platform to enable the substrate to be in contact with the chemical deposition solution; s2, importing the three-dimensional model of the circuit board circuit into software to slice to generate a laser scanning track, focusing laser at a contact interface of the substrate and the chemical deposition solution, and generating a corresponding copper circuit on the surface of the substrate by liquid deposition according to the laser scanning track; s3, enabling the mobile platform to move in the longitudinal direction, and forming a three-dimensional copper circuit structure on the surface of the substrate by utilizing laser; s4, stripping the obtained three-dimensional copper circuit from the substrate, injecting resin into the mold, combining the resin with the three-dimensional copper circuit and generating a multilayer circuit board, and the method can efficiently and stably produce the three-dimensional copper circuit structure with high precision and has the advantages of low cost and easiness in operation.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a preparation method of a multilayer circuit board.
Background
As electronic products gradually tend to be lightweight, high-performance and high-reliability, multilayer circuit boards have become one of the essential components of modern electronic products. Nowadays, the manufacturing process of the multilayer circuit board is more mature, and the multilayer circuit board is widely applied to various application fields. However, in the manufacturing process of the multilayer circuit board, the problems of complex manufacturing, long processing period, unstable products and the like often occur. These problems stem from the increasing technical demands for information storage in multilayer circuit boards, and the existing manufacturing methods cannot meet the high-demand production level and efficiency.
Accordingly, there is a need for a more efficient and accurate method of manufacturing multi-layer circuit boards that addresses various challenges faced in modern circuit board manufacturing. In recent years, laser technology has been applied to multilayer circuit board manufacturing, achieving the advantages of higher transmission rates, better signal integrity, and lower signal noise. Along with the rapid development of laser technology, the application of the laser technology in the 3C industry is increasingly remarkable, and the laser technology is not only used for laser turning and milling, but also used for generating a plurality of laser metallization methods, and comprises novel processes such as laser direct writing of metal powder, laser induced front-end transfer, laser chemical vapor deposition, laser induced chemical liquid deposition, laser induced plasma auxiliary etching and the like.
In response to the above challenges, the industry has proposed related solutions.
Chinese patent CN203261570U proposes a ceramic laser metallization and metal layer structure, forming a three-dimensional substrate by laser engraving, and then preparing a conductive loop on the three-dimensional substrate by electroplating/chemical deposition. The method only etches the three-dimensional pattern on the ceramic substrate by laser, and does not directly form the conductive pattern, so that the precision is low.
Chinese patent CN106133891B proposes a method for manufacturing pulse mode direct write laser metallization, which comprises pre-setting a target material on a substrate, sintering the target material on the surface of the substrate by laser, and simultaneously bonding the two materials together. Although the method can realize the surface metallization of the substrate, the area which is not sintered by laser is required to be removed by post-treatment, the material utilization rate is low, the environment is not protected, and the surface quality cannot be ensured.
Chinese patent CNCN201910615328.7 proposes a method for preparing a 3D printed circuit board, which comprises the steps of manufacturing a conductive circuit by a 3D printing technology, and coating and solidifying the conductive circuit by insulating liquid. The method consumes a large amount of energy, and meanwhile, the printed conductive line has low precision, complex process and difficult post-treatment.
Disclosure of Invention
One of the purposes of the present invention is to avoid the shortcomings of the prior art and to provide a method for manufacturing a multi-layer circuit board, which is capable of efficiently and stably producing a three-dimensional copper circuit structure with high precision, and has the advantages of low cost and easy operation.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the preparation method of the multilayer circuit board comprises the following steps:
s1, preparing a chemical deposition solution containing copper ions, and injecting the chemical deposition solution into a trough, wherein a lifting platform is arranged in the trough;
placing a substrate on top of the lift platform and contacting the substrate with a chemical deposition solution;
s2, a laser system is adopted, a three-dimensional model of the circuit board circuit is led into software to be sliced to generate a laser scanning track, laser is focused at a contact interface of the substrate and the chemical deposition solution, and a corresponding copper circuit is generated on the surface of the substrate through liquid deposition according to the laser scanning track;
s3, enabling the mobile platform to move in the longitudinal direction, and forming a three-dimensional copper circuit structure on the surface of the substrate by utilizing laser;
s4, stripping the obtained three-dimensional copper circuit from the substrate, then placing the substrate in a mold, injecting resin into the mold, combining the resin with the three-dimensional copper circuit, and generating the multilayer circuit board.
In some embodiments, the electroless deposition solution comprises a metal ion-containing complexing agent, a metal copper ion-containing solution, a stabilizer, a reducing agent, an alkaline solution;
wherein the complexing agent containing metal ions comprises one or more than two of ethylenediamine tetraacetic acid, dithiophosphoric acid and cyclohexane tricarboxylic acid;
the metal copper ion-containing solution is one or the combination of more than two of copper sulfate, copper chloride and copper nitrate;
the stabilizer is one or the combination of more than two of 2, 2-bipyridine and/or o-diazo film;
the reducing agent is formaldehyde and/or formic acid;
the alkaline solution is one or the combination of more than two of sodium hydroxide, potassium hydroxide and sodium carbonate.
In some embodiments, a moving structure is further provided at the bottom of the lifting platform, along which the lifting platform moves.
In some embodiments, the substrate comprises any one of glass, ceramic, fiberglass, epoxy, polyimide.
In some embodiments, the substrate is placed before the top of the lifting platform, and the substrate is further cleaned, dried and surface treated;
the surface treatment includes one or more of microstructure preparation, nanostructure preparation, surface finishing, roughening, and surface chemical treatment.
In some embodiments, the laser system is one of a single laser system, a multiple laser system;
the laser light source of the laser system comprises one or more of nanosecond laser, picosecond laser and femtosecond laser.
In some embodiments, the trough is disposed within a processing chamber, and at least one of an ultrasonic control system, a temperature control system, and a vacuum control device is disposed within the chamber.
In some embodiments, the resin comprises one or more of a sound sensitive resin material, a light sensitive resin material, a heat sensitive resin material.
In some embodiments, the curing means of the resin comprises one or more of ultrasonic curing, ultraviolet curing, infrared curing.
The preparation method of the multilayer circuit board has the beneficial effects that:
(1) According to the preparation method of the multilayer circuit board, laser scanning is carried out on the chemical deposition solution at the contact position of the substrate and the chemical deposition solution by adopting laser, wherein a laser moving path is designed according to a preset three-dimensional copper route, so that the three-dimensional copper route can be formed after the laser carries out redox treatment on the chemical deposition solution, the three-dimensional copper route can be directly formed, other additional operation steps are not needed, and the operation method is simple; since the laser moving path is operated by the laser system, the operability is stable, and the moving path is designed according to the three-dimensional copper route, the moving path is accurate, and the manufactured three-dimensional copper route has the advantage of high accuracy.
(2) According to the preparation method of the multilayer circuit board, the three-dimensional copper circuit is manufactured firstly, so that the three-dimensional copper circuit and the resin can be solidified only by injecting the resin, the corresponding multilayer circuit board is obtained, the production efficiency of the multilayer circuit board is further improved, the rapid prototype manufacturing of the multilayer circuit board can be realized, meanwhile, the types of materials for solidification are various, and the solidification mode comprises contact type and non-contact type alternative modes.
Drawings
FIG. 1 is a diagram showing the operation of a multilayer circuit board manufacturing method for depositing copper lines according to an embodiment of the present invention;
FIG. 2 is a diagram showing the operation of a multilayer circuit board manufacturing method for depositing a three-dimensional copper wire according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a stripped three-dimensional copper wire in accordance with an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a cured resin and a three-dimensional copper wire according to an embodiment of the present invention.
Detailed Description
Preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the invention. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Example 1
Referring to fig. 1 to 4, the method for manufacturing a multilayer circuit board disclosed in this embodiment includes the following steps:
s1, preparing a chemical deposition solution containing copper ions, and injecting the chemical deposition solution into a trough, wherein a lifting platform is arranged in the trough; preferably, the surface on which the top of the lifting platform is located is a horizontal surface.
The substrate is placed on the top of the lifting platform, and is contacted with the chemical deposition solution, and the lifting platform is used for driving the substrate to move in the longitudinal direction, so that the subsequent chemical deposition solution can form a three-dimensional copper circuit in the vertical direction.
S2, a laser system is adopted, a three-dimensional model of the circuit board circuit is led into software to be sliced to generate a laser scanning track, laser is focused at a contact interface of the substrate and the chemical deposition solution, and a corresponding copper circuit is generated on the surface of the substrate through liquid deposition according to the laser scanning track;
in practical application, the three-dimensional model of the circuit board circuit is converted into a moving path of laser, so that the laser is controlled to move, and a corresponding copper circuit is obtained.
S3, enabling the lifting platform to move in the longitudinal direction, and forming a three-dimensional copper circuit structure on the surface of the substrate by utilizing laser;
specifically, when the lifting platform moves in the longitudinal direction, a corresponding three-dimensional copper circuit structure is formed in the longitudinal direction. Therefore, through the mutual matching of the laser path planning and the lifting platform, a second-layer circuit and a conducting circuit between layers can be formed, and a three-dimensional copper circuit structure is formed through layer-by-layer superposition.
S4, stripping the obtained three-dimensional copper circuit from the substrate, then placing the substrate in a mold, injecting resin into the mold, combining the resin with the three-dimensional copper circuit, and generating the multilayer circuit board.
Specifically, the three-dimensional copper line is directly peeled off from the substrate. Then resin is injected to enable the three-dimensional copper circuit to be embedded in the resin, and the corresponding multilayer circuit board is obtained.
The single laser or multiple lasers are adopted to deposit the copper circuit on the surface of the substrate, so that the deposition efficiency of the three-dimensional copper circuit can be effectively improved, the deposition quality of the three-dimensional copper circuit can be effectively improved, and the three-dimensional copper circuit has the characteristics of rapid forming and environmental protection; the three-dimensional copper circuit can be deposited on various substrates, and the multilayer circuit board is manufactured.
The chemical deposition solution 1 comprises a complexing agent containing metal ions, a solution containing metal copper ions, a stabilizer, a reducing agent and an alkaline solution;
wherein the complexing agent containing metal ions comprises one or more than two of ethylenediamine tetraacetic acid, dithiophosphoric acid and cyclohexane tricarboxylic acid;
the metal copper ion-containing solution is one or the combination of more than two of copper sulfate, copper chloride and copper nitrate;
the stabilizer is one or the combination of more than two of 2, 2-bipyridine and/or o-diazo film;
the reducing agent is formaldehyde and/or formic acid;
the alkaline solution is one or the combination of more than two of sodium hydroxide, potassium hydroxide and sodium carbonate.
In this embodiment, a moving structure is further disposed at the bottom of the lifting platform, and the lifting platform moves along the moving structure.
The movable platform can drive the lifting platform to move in the horizontal direction, and the lifting platform is matched with the movable structure, so that the substrate can move upwards in the X-axis direction and the Y-axis direction, and the three-dimensional copper lines with various configurations are obtained.
In this embodiment, the substrate 2 includes any one of glass, ceramic, glass fiber, epoxy, and polyimide.
In this embodiment, before the substrate 2 is placed on top of the lifting platform 5, cleaning, drying and surface treatment are further required to be performed on the substrate 2;
the substrate 2 is cleaned, dried and surface treated, so that the substrate can better manufacture the three-dimensional copper circuit meeting the requirements.
The surface treatment includes one or more of microstructure preparation, nanostructure preparation, surface finishing, roughening, and surface chemical treatment.
In this embodiment, the laser system 3 is one of a single laser system and a multiple laser system;
the laser light source of the laser system 3 comprises one or a combination of at least two of nanosecond laser, picosecond laser and femtosecond laser, and the laser wavelength comprises ultraviolet, green light and infrared; the laser power is 1-200W; the repetition frequency is 1-2000 kHz.
In this embodiment, the trough 4 is disposed in a processing chamber, and at least one of an ultrasonic control system, a temperature control system, and a vacuum control device is disposed in the chamber.
Wherein the ultrasonic control system can remove bubbles and avoid bubbles generated by the resin 8. The temperature control system controls the reaction and curing speed of the resin 8, so that the combination of the resin 8 and the three-dimensional copper circuit 7 can be better realized.
In the process of laser-induced liquid phase deposition of the three-dimensional copper line 7, the above-mentioned auxiliary systems are matched for processing, so that bubbles generated in the deposition process can be reduced, high-precision and high-quality deposition of the three-dimensional copper line 7 can be realized, and stripping of the three-dimensional copper line 7 from the substrate 2 can be facilitated.
In this embodiment, the resin 8 includes one or more of a sound-sensitive resin material, a light-sensitive resin material, and a heat-sensitive resin material.
In this embodiment, the curing mode of the resin 8 includes one or more of ultrasonic curing, ultraviolet curing and infrared curing.
The high-precision three-dimensional copper circuit 7 structure is manufactured by a laser liquid phase deposition technology, and then three different surface insulation part curing modes of ultrasonic curing, ultraviolet curing and infrared curing are used, so that the method can adapt to most use scenes and can realize contact and non-contact curing.
Example 2
S1, preparing a chemical deposition solution 1 containing copper ions by adopting a zirconia ceramic plate 2 with the thickness of 1mm according to the requirements of a multilayer circuit board; specifically, the chemical deposition solution 1 containing copper ions contains the ethylenediamine tetraacetic acid, copper sulfate, 2-bipyridine, formaldehyde and sodium hydroxide; placing the zirconia ceramic plate 2 on top of the lifting platform and bringing the substrate 2 into contact with the electroless deposition solution 1;
s2, a single laser system 3 is adopted, a three-dimensional model of a circuit board circuit is imported into software to be sliced to generate a laser scanning track, ultraviolet nanosecond laser 3 is focused at a contact interface of the zirconia ceramic plate 2 and the chemical deposition solution 1, and a corresponding copper circuit is generated on the surface of the zirconia ceramic plate 2 according to the laser scanning track;
s3, enabling the movable platform 6 to move in the longitudinal direction, and forming a three-dimensional copper circuit structure 7 on the surface of the zirconia ceramic plate 2 by utilizing ultraviolet nanosecond laser 3;
s4, stripping the obtained three-dimensional copper circuit 7 from the zirconia ceramic plate 2, then placing the three-dimensional copper circuit into a die, injecting heat-sensitive resin 8 into the die, and combining the resin 8 and the three-dimensional copper circuit 7 in an infrared curing mode to obtain the required multi-layer circuit board.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In the description of the present application, it should be understood that, where azimuth terms such as "front, rear, upper, lower, left, right", "transverse, vertical, horizontal", and "top, bottom", etc., indicate azimuth or positional relationships generally based on those shown in the drawings, only for convenience of description and simplification of the description, these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present application; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are merely for convenience of distinguishing the corresponding components, and unless otherwise stated, the terms have no special meaning, and thus should not be construed as limiting the scope of the present application.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The preparation method of the multilayer circuit board is characterized by comprising the following steps of:
s1, preparing a chemical deposition solution containing copper ions, and injecting the chemical deposition solution into a trough, wherein a lifting platform is arranged in the trough;
placing a substrate on top of the lift platform and contacting the substrate with a chemical deposition solution;
s2, a laser system is adopted, a three-dimensional model of the circuit board circuit is led into software to be sliced to generate a laser scanning track, laser is focused at a contact interface of the substrate and the chemical deposition solution, and a corresponding copper circuit is generated on the surface of the substrate through liquid deposition according to the laser scanning track;
s3, enabling the mobile platform to move in the longitudinal direction, and forming a three-dimensional copper circuit structure on the surface of the substrate by utilizing laser;
s4, stripping the obtained three-dimensional copper circuit from the substrate, then placing the substrate in a mold, injecting resin into the mold, combining the resin with the three-dimensional copper circuit, and generating the multilayer circuit board.
2. The method of manufacturing a multilayer circuit board according to claim 1, wherein the electroless deposition solution comprises a metal ion-containing complexing agent, a metal copper ion-containing solution, a stabilizer, a reducing agent, and an alkaline solution;
wherein the complexing agent containing metal ions comprises one or more than two of ethylenediamine tetraacetic acid, dithiophosphoric acid and cyclohexane tricarboxylic acid;
the metal copper ion-containing solution is one or the combination of more than two of copper sulfate, copper chloride and copper nitrate;
the stabilizer is one or the combination of more than two of 2, 2-bipyridine and/or o-diazo film;
the reducing agent is formaldehyde and/or formic acid;
the alkaline solution is one or the combination of more than two of sodium hydroxide, potassium hydroxide and sodium carbonate.
3. The method of claim 1, wherein a moving structure is further provided at a bottom of the lifting platform, and the lifting platform moves along the moving structure.
4. The method of manufacturing a multilayer circuit board according to claim 1, wherein the substrate comprises any one of glass, ceramic, fiberglass, epoxy, polyimide.
5. The method of claim 1, wherein the substrate is further cleaned, dried and surface treated before being placed on top of the lift platform;
the surface treatment includes one or more of microstructure preparation, nanostructure preparation, surface finishing, roughening, and surface chemical treatment.
6. The method for manufacturing a multilayer circuit board according to claim 1, wherein the laser system is one of a single laser system and a multiple laser system;
the laser light source of the laser system comprises one or more of nanosecond laser, picosecond laser and femtosecond laser.
7. The method of claim 1, wherein the trough is disposed in a processing chamber, and wherein at least one of an ultrasonic control system, a temperature control system, and a vacuum control device is disposed in the chamber.
8. The method of manufacturing a multilayer circuit board according to claim 1, wherein the resin comprises one or more of an acoustic resin material, a photosensitive resin material, and a thermal resin material.
9. The method of manufacturing a multilayer circuit board according to claim 1, wherein the curing means of the resin includes one or more of ultrasonic curing, ultraviolet curing, and infrared curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311364854.3A CN117641772A (en) | 2023-10-20 | 2023-10-20 | Preparation method of multilayer circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311364854.3A CN117641772A (en) | 2023-10-20 | 2023-10-20 | Preparation method of multilayer circuit board |
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| CN117641772A true CN117641772A (en) | 2024-03-01 |
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|---|---|---|---|
| CN202311364854.3A Pending CN117641772A (en) | 2023-10-20 | 2023-10-20 | Preparation method of multilayer circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN117641772A (en) |
-
2023
- 2023-10-20 CN CN202311364854.3A patent/CN117641772A/en active Pending
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