CN113068311B - Manufacturing method of precise circuit and circuit board - Google Patents
Manufacturing method of precise circuit and circuit board Download PDFInfo
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- CN113068311B CN113068311B CN202110291328.3A CN202110291328A CN113068311B CN 113068311 B CN113068311 B CN 113068311B CN 202110291328 A CN202110291328 A CN 202110291328A CN 113068311 B CN113068311 B CN 113068311B
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- circuit
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- groove
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Abstract
The invention discloses a manufacturing method of a precision circuit and a circuit board, wherein the manufacturing method comprises the following steps: a circuit groove is formed on the surface of the insulating base material through laser ablation; depositing a copper layer on the surface of the insulating base material and the circuit groove by electroless copper plating; then removing the copper layer on the surface of the insulating base material by grinding the plate; and depositing a nickel layer on the copper layer of the circuit groove by chemical nickel deposition to fill and level the circuit groove, and grinding to level the surface of the circuit to obtain the precise circuit. The method of the invention omits the processes of dry film, exposure, development, liquid medicine etching, copper plating and the like by optimizing the process flow, can manufacture ultra-precise circuits with the circuit and the line distance smaller than 30 mu m, simultaneously optimizes the production flow and improves the production efficiency and the qualification rate of finished products.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a precise circuit and a circuit board.
Background
The 21 st century has entered the highly information-oriented society, the demand of information consumption is more and more vigorous, the high speed, high performance and light, thin and short are the mainstream development trend of future electronic products, the microelectronic packaging technology is also developed at a high speed, and lighter, thinner and higher-packaging-density devices are applied more and more, so that the circuit board serving as the electronic component supporting platform is promoted to be changed to the direction of high density, high integration and fine miniaturization; therefore, the wiring density of the circuit board is more and more precise, and the line width and the space are gradually developed to the micron-scale ultra-precision direction.
At present, two methods and processes are available for manufacturing the precision circuit of the printed circuit board. One is negative film process: the front process (copper-clad plate cutting → pressing → drilling) → chemical copper deposition → electroplating → dry film pasting → exposure → developing → etching → film removal; the other is a positive film process: the front process (copper clad laminate cutting → pressing → drilling) → chemical copper deposition → electroplating → dry film pasting → exposure → development → copper plating/tin plating → etching → film removal.
The wiring technology of the traditional electronic circuit is mainly based on subtractive method and semi-additive method processes, wet process technologies such as chemical copper, flash etching, electroplating, micro etching and the like are required to be used for SAP (semi-additive method) and m-SAP (improved SAP method), the lateral etching problem inevitably exists by adopting the chemical etching method, the lateral etching size is closely related to the copper thickness, and the difficulty of copper foil manufacturing and pressing processing exists when the bottom copper thickness is less than 12 mu m; in order to increase the binding force between the copper foil and the base material, the modes of roughening the surface of the copper foil and roughening the surface of resin are adopted, which can increase the processing cost, and the roughened surface has adverse effect on the transmission of signals; the process steps also have the problems of complex procedures, high energy consumption, high cost, serious environmental pollution and the like.
In addition, because the thickness of copper on the surface of the printed circuit board is generally required to be more than 25 micrometers, and meanwhile, the width and the spacing between leads obtained by the conventional method for manufacturing the printed circuit board are generally controlled to be more than 30 μm/30 μm (line width/spacing) under the influence of factors such as uniformity after copper plating, development accuracy of a dry film, alignment exposure accuracy, etching uniformity, side etching and the like, and the product production cost is higher and the qualification rate is lower as the line width and the line spacing are smaller and the density is higher, it is difficult to manufacture ultra-precise lines with the line width/spacing of less than 30 μm/30 μm, such as ultra-high density lines with the line width/spacing of 20 μm/20 μm and 10 μm/10 μm and the like, the more precise lines are difficult to manufacture by the conventional method, and the method for printing by the high-performance conductive nano conductive ink has the problems of difficult material preparation and extremely low production efficiency.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the manufacturing method of the precise circuit, which omits the processes of dry film, exposure, development, liquid medicine etching, copper plating and the like by optimizing the process flow, can manufacture the ultra-precise circuit with the circuit and the line distance smaller than 30 mu m, optimizes the production flow and improves the production efficiency and the qualification rate of finished products.
In order to solve the technical problem, the invention provides a method for manufacturing a precise circuit, which comprises the following steps:
s1, ablating a circuit groove on the surface of an insulating base material by using laser;
s2, depositing a copper layer on the surface of the insulating base material and the circuit groove through chemical copper deposition;
s3, removing the copper layer on the surface of the insulating base material through plate grinding;
and S4, depositing a nickel layer on the copper layer of the circuit groove by chemical nickel deposition to fill the circuit groove, and grinding to flatten the surface of the circuit to obtain the precise circuit.
Further, in step S1, the insulating base material is a polyimide film with a thickness of more than or equal to 25 μm, BT resin, a ceramic base material or mirror glass.
Further, in step S1, a 355 nm UV laser is adopted to ablate a line groove on the surface of the insulating substrate, the marking speed during laser ablation is 100mm/S, the frequency is 50KHz, and the pulse width is 5 muS.
Further, in step S1, the line width and the line gap of the line groove are both less than 30 μm, and the depth is more than or equal to 20 μm.
Further, in step S1, the cross section of the line groove is an inverted triangle.
Further, in step S2, the thickness of the copper layer is 0.3 μm.
Further, in step S3, a needle brush containing silicon carbide abrasive is used for grinding during plate grinding, and the particle size of the abrasive is larger than or equal to 800 meshes.
Further, in step S3, the polishing pressure current was 0.3A, and the polishing rate was 3m/min.
Further, in step S4, the chemical nickel deposition is not performed by micro etching, and after the chemical nickel deposition, the surface of the board is smoothed by grinding the board, so that the surface of the precision circuit is flush with the surface of the insulating substrate.
The invention also provides a circuit board on which the precise circuit manufactured by the manufacturing method is manufactured.
Compared with the prior art, the invention has the following beneficial effects:
(1) The method comprises the steps of firstly ablating a line groove, and then forming a line in a deposition mode in the line groove, so that an embedded structure is formed between the line and a substrate, wiring on various smooth insulating materials is realized, compared with the prior art, the method saves the processes of dry film, exposure, development, liquid medicine etching, copper plating and the like, can manufacture ultra-precise lines with the line and the line distance smaller than 30 micrometers, improves the manufacturing capability of the line width and the line distance of more than 30 micrometers to the manufacturing capability of the line width and the line distance of 10 micrometers, simultaneously optimizes the production process, improves the production efficiency and the qualification rate of finished products, does not adopt electroplating and etching processes with serious pollution, realizes water-saving production, and reduces the manufacturing difficulty and the environmental protection problem caused by chemical etching and electroplating;
(2) Firstly, depositing a copper layer in a circuit groove, and then depositing an autocatalytic nickel layer in the circuit groove to form a circuit, wherein firstly, the problem that the copper deposition thickness is limited and the copper circuit cannot be directly formed is solved, secondly, the problem that the copper layer on the surface of an insulating base material is too thick and is not convenient to grind and remove and the cost of the copper material is reduced is avoided, and thirdly, the conductivity of the circuit is increased and the surface treatment of the circuit is completed by adopting a chemical nickel gold mode;
(3) Compared with the prior art, the method has the advantages that the modes of copper foil surface roughening and resin surface roughening are not needed, and the signal transmission quality of the circuit is improved;
(4) The cross section of the line groove is in an inverted triangle shape, so that the cross section of the line formed in the line groove is also in the inverted triangle shape, the binding force between the line and the insulating base material is increased, the surface of the line groove does not need to be roughened, the skin effect of a rough lead and the influence of parasitic capacitance are favorably reduced, the parasitic capacitance of a signal transmission line is reduced, and the transmission loss is reduced;
(5) When the board is ground, a needle brush containing silicon carbide abrasive is adopted for grinding, scraps are not easy to fall off, and grinding sand can break the circuit groove and the metal copper layer in the circuit groove after the scraps fall off, so that the circuit quality can be improved, the grain size of the abrasive is more than or equal to 800 meshes, and parameters during grinding are controlled, so that the copper layer and the catalytic palladium on the surface of the insulating base material can be effectively removed;
(6) The surface of the circuit is flush with the surface of the insulating base material by filling and leveling the circuit groove, so that the later combination with a chip or other components is facilitated;
(7) The method of the invention forms the precise circuit on the surface of the insulating base material directly, so that the method of the invention can be directly applied to the insulating base materials such as polyimide film, BT resin, ceramic base material, mirror glass and the like, and the whole process is simple, the cost is low, and the method is easy to be introduced into batch production.
Drawings
FIG. 1 is a partial SEM image of a fine line formed in a line trench in an embodiment.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The method for manufacturing a precision circuit shown in this embodiment sequentially includes the following processing steps:
(1) Cutting: an insulating substrate having a size of 500 × 600mm and a thickness of 100 μm was prepared, and the insulating substrate was a polyimide film.
(2) Laser grooving: according to a circuit pattern required to be designed, a 355 nm UV laser is adopted to ablate a corresponding circuit groove on one surface of the polyimide film; the marking speed during laser ablation is 100mm/S, the frequency is 50KHz, the pulse width is 5 MuS, the line width of the line groove is 20 Mum, the spacing (namely the line gap) is 20 Mum, the depth is 20 Mum, and the cross section of the line groove is in an inverted triangle shape.
(3) Copper deposition: depositing a copper layer with the thickness of 0.3 mu m on the surface of the polyimide film and the inner wall of the circuit groove in a chemical copper deposition mode, wherein the copper deposition layer is thinner, and the copper layer on the surface of the polyimide film and palladium for catalysis can be removed by grinding during later grinding, and only the copper layer in the circuit groove is left; the chemical copper deposition can adopt a horizontal chemical copper production line with ionic palladium as a catalyst or a vertical chemical copper production line with colloidal palladium as a catalyst.
(4) Grinding a plate: the surface of the polyimide film is ground by a needle brush containing silicon carbide abrasive to remove a copper layer and palladium for catalysis on the surface of the polyimide film, the particle size of the abrasive is not less than 800 meshes, the grinding pressure current is 0.3A, and the grinding speed is 3m/min.
(5) Depositing nickel: taking a copper layer in a circuit groove as a seed, depositing an autocatalytic nickel layer on the copper layer of the circuit groove by chemical nickel deposition, and filling the circuit groove by utilizing the characteristic of no thickness limitation of nickel deposition so as to enable the surface of the circuit to be flush with the surface of a polyimide film to prepare a precise circuit (shown in figure 1); the chemical nickel deposition adopts a chemical nickel-gold production line in the circuit board industry for production, and the liquid medicine of a micro-etching groove in the chemical nickel-gold production line needs to be replaced by pure water, namely, the micro-etching treatment is not carried out in the chemical nickel deposition process, so that the deposited chemical copper layer is prevented from being removed by the micro-etching liquid medicine.
In other embodiments, the insulating substrate may be BT resin, ceramic substrate, mirror glass, or the like.
In other embodiments, the thickness of the insulating substrate may be other dimensions greater than or equal to 25 μm.
In other embodiments, the line width and line gap of the line groove can be other sizes less than 30 μm.
In other embodiments, in step (2), a circuit groove may be ablated on both surfaces of the polyimide film, so as to form a double-sided circuit structure after a circuit is deposited later.
Example 2
The manufacturing method of a precision circuit shown in this embodiment is substantially the same as the manufacturing method described in embodiment 1, except that the following steps are further included after the step (5):
(6) Grinding a plate: after nickel is deposited, the surface of the board is flattened by a grinding board so that the surface of the precise circuit is flush with the surface of the insulating base material.
Example 3
The method for manufacturing a circuit board shown in this embodiment further includes, on the basis of the manufacturing method described in embodiment 1 or 2, the following steps after the nickel deposition in embodiment 1 or the grinding plate in embodiment 2:
and a post-process: and then sequentially manufacturing a solder mask layer on the polyimide film, performing solder mask windowing position gold immersion treatment, molding treatment and FQC detection to obtain the circuit board.
The technical solutions provided by the embodiments of the present invention are described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present invention, and the descriptions of the embodiments above are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A method for manufacturing a precision circuit is characterized by comprising the following steps:
s1, forming a circuit groove on the surface of an insulating base material by laser ablation;
s2, depositing a copper layer on the surface of the insulating base material and the circuit groove through chemical copper deposition;
s3, removing the copper layer on the surface of the insulating base material through a grinding plate;
and S4, depositing a nickel layer on the copper layer of the circuit groove by chemical nickel deposition to fill the circuit groove, and grinding to flatten the surface of the circuit to obtain the precise circuit.
2. The method for manufacturing a precision circuit according to claim 1, wherein in step S1, the insulating base material is a polyimide film, BT resin, ceramic base material or mirror glass with a thickness of 25 μm or more.
3. The method for manufacturing a precision circuit according to claim 1, wherein in step S1, a 355 nm UV laser is used to ablate a circuit groove on the surface of the insulating substrate, the marking speed during laser ablation is 100mm/S, the frequency is 50KHz, and the pulse width is 5 μ S.
4. The method for manufacturing a precision circuit according to claim 3, wherein in step S1, the line width and the line gap of the circuit groove are both less than 30 μm, and the depth is not less than 20 μm.
5. The method for manufacturing a precision circuit according to any one of claims 1 to 4, wherein in step S1, the cross section of the circuit groove is an inverted triangle.
6. The method for fabricating a precision line according to claim 1, wherein in step S2, the thickness of the copper layer is 0.3 μm.
7. The method for manufacturing the precision circuit according to claim 1, wherein in the step S3, a needle brush containing silicon carbide abrasive is used for grinding when the plate is ground, and the particle size of the abrasive is not less than 800 meshes.
8. The method of claim 7, wherein in step S3, the polishing pressure current is 0.3A, and the polishing speed is 3m/min.
9. The method for manufacturing a precision circuit according to claim 1, wherein in step S4, the surface of the board is smoothed by grinding the board after the nickel deposition without performing a microetching process during the chemical nickel deposition, so that the surface of the precision circuit is flush with the surface of the insulating substrate.
10. A circuit board on which a precision wiring manufactured by the manufacturing method according to any one of claims 1 to 9 is manufactured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110291328.3A CN113068311B (en) | 2021-03-18 | 2021-03-18 | Manufacturing method of precise circuit and circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110291328.3A CN113068311B (en) | 2021-03-18 | 2021-03-18 | Manufacturing method of precise circuit and circuit board |
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| CN113068311A CN113068311A (en) | 2021-07-02 |
| CN113068311B true CN113068311B (en) | 2022-11-18 |
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| CN111356296A (en) * | 2020-02-19 | 2020-06-30 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Preparation method of circuit board precision line, circuit board precision line and circuit board |
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| CN100393784C (en) * | 2004-12-08 | 2008-06-11 | 三之星机带株式会社 | Method for forming inorganic thin film on polyimide resin and method for producing polyimide resin having reformed surface for forming inorganic thin film |
| EP1863327A1 (en) * | 2005-03-22 | 2007-12-05 | Cluster Technology Co., Ltd | Process for producing wiring board, and wiring board |
| KR100974655B1 (en) * | 2008-06-17 | 2010-08-09 | 삼성전기주식회사 | Printed Circuit Board and Manufacturing Method Thereof |
| KR100991105B1 (en) * | 2009-10-23 | 2010-11-01 | 한국기계연구원 | Method for fabricating highly conductive fine patterns using self-patterned conductors and plating |
| CN106879165A (en) * | 2017-02-25 | 2017-06-20 | 深圳市聚龙高科电子技术有限公司 | The preparation method and embedded integration wiring board of a kind of integrated circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104919572A (en) * | 2012-12-28 | 2015-09-16 | 印可得株式会社 | Method for forming conductive pattern, conductive film, conductive pattern, and transparent conductive film |
| CN103945644A (en) * | 2014-05-13 | 2014-07-23 | 张伯平 | Flat circuit board and manufacturing method thereof |
| CN107666765A (en) * | 2016-07-29 | 2018-02-06 | 同扬光电（江苏）有限公司 | Circuit board structure |
| CN108055784A (en) * | 2017-11-17 | 2018-05-18 | 江门崇达电路技术有限公司 | A kind of production method of wiring board |
| CN111356296A (en) * | 2020-02-19 | 2020-06-30 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Preparation method of circuit board precision line, circuit board precision line and circuit board |
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| CN113068311A (en) | 2021-07-02 |
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