CN106879165A - The preparation method and embedded integration wiring board of a kind of integrated circuit - Google Patents
The preparation method and embedded integration wiring board of a kind of integrated circuit Download PDFInfo
- Publication number
- CN106879165A CN106879165A CN201710105050.XA CN201710105050A CN106879165A CN 106879165 A CN106879165 A CN 106879165A CN 201710105050 A CN201710105050 A CN 201710105050A CN 106879165 A CN106879165 A CN 106879165A
- Authority
- CN
- China
- Prior art keywords
- conducting wire
- integrated circuit
- preparation
- wiring board
- loading plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 230000010354 integration Effects 0.000 title claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- 239000002199 base oil Substances 0.000 claims abstract description 19
- 238000007639 printing Methods 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 238000007747 plating Methods 0.000 claims description 10
- 230000003064 anti-oxidating effect Effects 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 5
- 238000005034 decoration Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 3
- 235000013358 Solanum torvum Nutrition 0.000 claims 1
- 240000002072 Solanum torvum Species 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 5
- 238000005323 electroforming Methods 0.000 abstract description 3
- 238000005240 physical vapour deposition Methods 0.000 description 9
- 238000000151 deposition Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 1
- 229920005479 Lucite® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses the preparation method and embedded integration wiring board of a kind of integrated circuit, including step：On circuit loading plate printing can electroformed deposit copper base oil；The laser carving conducting wire in the base oil；To the conducting wire electroless copper.The present invention uses laser carving electroforming mode, integrated circuit is embedded in and is designed, and solves silk tradition silk-screened conductive circuit precision problem, and disclosure satisfy that the demand of the frivolous sealing of terminal.
Description
Technical field
The present invention relates to integrated circuit fields, more particularly to a kind of integrated circuit preparation method and embedded integration line
Road plate.
Background technology
Existing antenna for mobile phone integrated circuit and button integrated circuit generally use silk-screen mode, however as 4G, 4.5G with
And 5G the needs of the times, it is very high to transmit the required precision of big data, video and radio frequency to conductive antenna circuit moment, tradition
Silk-screened conductive circuit is far not by far up to the mark, and design terminal it is frivolous to mobile phone sealing etc. require more and more higher, it is clear that tradition
Silk-screen mode cannot meet.
Therefore, prior art needs further improvement.
The content of the invention
Problem to be solved by this invention is, there is provided the preparation method and embedded integration circuit of a kind of integrated circuit
Plate, solving traditional silk-screen integrated circuit cannot meet the technical problem of high accuracy and frivolous sealing demand.
The present invention is adopted the following technical scheme that：
A kind of preparation method of integrated circuit, including step：
On circuit loading plate printing can electroformed deposit copper base oil；
The laser carving conducting wire in the base oil；
To the conducting wire electroless copper.
The preparation method of described integrated circuit, wherein, can electroformed deposit copper in the printing on circuit loading plate
Before base oil, also including step：Being printed by UV transfers or PVD and base on circuit loading plate is carried out at decoration texture
Reason.
The preparation method of described integrated circuit, wherein, it is described to the conducting wire electroless copper, specifically also include step
Suddenly：Conducting wire is placed in electroless copper in deposition cylinder.
The preparation method of described integrated circuit, wherein, it is described do the chemical plating of copper to the conducting wire after,
It is specific also to include step：Circuit loading plate is placed in deposition cylinder and plates guard metal layer.
The preparation method of described integrated circuit, wherein, the metal of the guard metal layer plating is anti-oxidation metal.
A kind of embedded integration wiring board, including circuit loading plate and conducting wire, print on the circuit loading plate
Have can electroformed deposit copper base oil, the conducting wire laser carving in the base oil and through electroless copper process.
Described embedded integration wiring board, wherein, the circuit loading plate is through UV transfers, PVD and base printing treatment.
Described embedded integration wiring board, wherein, also including coat of metal, the coat of metal is plated in through chemistry
In the conducting wire of copper plating treatment.
Described embedded integration wiring board, wherein, the metal of the guard metal layer plating is anti-oxidation metal.
Described embedded integration wiring board, wherein, the anti-oxidation metal is nickel.
Compared with prior art, the preparation method and embedded integration wiring board of the integrated circuit that the present invention is provided, use
Laser carving electroforming mode, integrated circuit is embedded in and is designed, and solves silk tradition silk-screened conductive circuit precision problem, and can expire
The demand of the sufficient frivolous sealing of terminal.
Brief description of the drawings
The flow chart of the preparation method of the integrated circuit that Fig. 1 is provided for the present invention.
The structural representation of the embedded integration wiring board that Fig. 2 is provided for the present invention.
Specific embodiment
In order that the technical problems to be solved by the invention, technical scheme and beneficial effect become more apparent, below tie
Drawings and Examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
It is used to explain the present invention, is not intended to limit the present invention.
Main idea is that, the thinking of abandoning tradition silk-screen integrated circuit, using embedded design method, passes through
Printing can the base oil of electroformed deposit copper, laser carving conducting wire, electroless copper and plating coat of metal integrated operation, will lead
Line circuit is completely embedded on wiring board, can greatly promote conducting wire precision, and be difficult loose or dislocation.
Referring to Fig. 1, Fig. 1 is the flow chart of the preparation method of the integrated circuit that the present invention is provided, including：
Step S101, on circuit loading plate printing can electroformed deposit copper base oil；Wherein, printing can electroformed deposit copper it
Before, circuit loading plate is first passed through into UV（English full name：Ultra-Violet Ray, ultraviolet）Transfer or PVD（It is English complete
Claim：Physical Vapor Deposition, physical vapour deposition (PVD)）And base printing carries out decoration texture processing.Circuit
Loading plate leads material for non-, can select transparent membrane, such as glass, PET film, lucite, PC engineering plastics and polyester film
Deng.And base oil is printed on circuit loading plate, one is that, in order to follow-up copper facing is used, two is to strengthen the coating such as UV transfers, PVD
Adhesive force on circuit loading plate again, make it more attractive and durable.When treatment is decorated, the present embodiment is using UV transfers, PVD
Single mode or combination.The base oil of the present embodiment is printed in base ink surface.
Step S102, the laser carving conducting wire in the base oil；In this step, the present embodiment is according to actual needs the bottom of at
Direct laser carving goes out corresponding conducting wire or conducting wire figure on oil, without too deep during laser carving, only need to carve out lines.When
So, the present embodiment is not limited to a kind of mode of laser carving, it would however also be possible to employ other engraving modes.
Step S103, to the conducting wire electroless copper.In copper facing, it is heavy that the conducting wire of lines at laser carving is placed in
Electroless copper is carried out in product cylinder, makes to plate required copper at conducting wire, form electrically conductive circuit.The present embodiment is not limited to
The copper facing in cylinder is deposited, it would however also be possible to employ other modes, such as copper electroforming, copper brushing plating.
By said process, be completely embedded in conducting wire on circuit loading plate by the present embodiment, and laser carving can reach
To positive and negative 2, without flash, then conductive copper one to is deposited on the circuit of standard, circuit high precision, and without flash, no
Signal transmission can be influenceed, meanwhile, conducting wire insertion design will not increase mobile phone thickness, meet lightening demand.
Further, in order to avoid wire line exposure in atmosphere, the present embodiment is doing chemistry to the conducting wire
After copper facing, circuit loading plate is placed in deposition cylinder and plates guard metal layer, conducting wire is protected, and guard metal layer
The metal of plating is anti-oxidation metal, it is to avoid oxidation by air, and the phenomenon of loose or dislocation occurs.Preferably, anti-oxidation metal
It is nickel or other not oxidizable protection metal ingredients.
Based on the preparation method of above-mentioned integrated circuit, present invention also offers a kind of by the embedded of above method preparation
Integrated circuit board, as shown in Fig. 2 including circuit loading plate 1, conducting wire 2 and coat of metal 3, in the circuit loading plate 1
On be printed with can electroformed deposit copper base oil, the laser carving of the conducting wire 2 in the base oil and through electroless copper process.Circuit
Loading plate is same through UV transfers, PVD and base printing treatment, and coat of metal 3 is plated in the conductor wire processed through electroless copper
On road 2.
Integrated circuit preparation method provided by the present invention can prepare various integrated circuits, such as antenna for mobile phone, by keyset
Into circuit etc..
In sum, the preparation method and embedded integration wiring board of the integrated circuit that the present invention is provided, using laser carving electricity
Casting mode, integrated circuit is embedded in and is designed, and solves silk tradition silk-screened conductive circuit precision problem, and disclosure satisfy that terminal
The demand of frivolous sealing.
It should be appreciated that application of the invention is not limited to above-mentioned citing, and for those of ordinary skills, can
To be improved according to the above description or converted, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Shield scope.
Claims (10)
1. a kind of preparation method of integrated circuit, it is characterised in that including step：
On circuit loading plate printing can electroformed deposit copper base oil；
The laser carving conducting wire in the base oil；
To the conducting wire electroless copper.
2. the preparation method of integrated circuit according to claim 1, it is characterised in that printed on circuit loading plate described
Brush can be before the base oil of electroformed deposit copper, also including step：Transferred or PVD and base print by UV on circuit loading plate
Brush carries out decoration texture processing.
3. the preparation method of integrated circuit according to claim 1, it is characterised in that described to conducting wire chemistry
Copper facing, specifically also includes step：Conducting wire is placed in electroless copper in deposition cylinder.
4. the preparation method of integrated circuit according to claim 1, it is characterised in that described that copper is done to the conducting wire
Chemical plating after, specifically also include step：Circuit loading plate is placed in deposition cylinder and plates guard metal layer.
5. the preparation method of integrated circuit according to claim 4, it is characterised in that the metal of the guard metal layer plating
It is anti-oxidation metal.
6. a kind of embedded integration wiring board, it is characterised in that including circuit loading plate and conducting wire, carried in the circuit
Be printed with plate can electroformed deposit copper base oil, the conducting wire laser carving in the base oil and through electroless copper process.
7. embedded integration wiring board according to claim 6, it is characterised in that the circuit loading plate transfers through UV,
PVD and base printing treatment.
8. embedded integration wiring board according to claim 6, it is characterised in that also including coat of metal, the gold
Category protective layer is plated in the conducting wire processed through electroless copper.
9. embedded integration wiring board according to claim 8, it is characterised in that the metal of the guard metal layer plating is
Anti-oxidation metal.
10. embedded integration wiring board according to claim 9, it is characterised in that the anti-oxidation metal is nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710105050.XA CN106879165A (en) | 2017-02-25 | 2017-02-25 | The preparation method and embedded integration wiring board of a kind of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710105050.XA CN106879165A (en) | 2017-02-25 | 2017-02-25 | The preparation method and embedded integration wiring board of a kind of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106879165A true CN106879165A (en) | 2017-06-20 |
Family
ID=59167631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710105050.XA Pending CN106879165A (en) | 2017-02-25 | 2017-02-25 | The preparation method and embedded integration wiring board of a kind of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106879165A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113068311A (en) * | 2021-03-18 | 2021-07-02 | 四会富仕电子科技股份有限公司 | Manufacturing method of precise circuit and circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130089980A1 (en) * | 2011-10-06 | 2013-04-11 | Globalfoundries Inc. | Mosfet integrated circuit having doped conductive interconnects and methods for its manufacture |
| CN103079366A (en) * | 2011-10-25 | 2013-05-01 | 青岛长弓塑模有限公司 | Method for manufacturing casing with circuit by spraying and laser carving |
| CN103409020A (en) * | 2013-08-14 | 2013-11-27 | 东莞劲胜精密组件股份有限公司 | Coating for circuit of LDS shell |
| CN103491728A (en) * | 2013-09-30 | 2014-01-01 | 电子科技大学 | Method for processing blind holes and fine lines of printed circuit board |
| CN104010447A (en) * | 2014-06-06 | 2014-08-27 | 昆山联滔电子有限公司 | Method for manufacturing conductor circuit |
| CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
| US20170027057A1 (en) * | 2015-07-22 | 2017-01-26 | Ibiden Co., Ltd. | Method for manufacturing printed wiring board and printed wiring board |
-
2017
- 2017-02-25 CN CN201710105050.XA patent/CN106879165A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130089980A1 (en) * | 2011-10-06 | 2013-04-11 | Globalfoundries Inc. | Mosfet integrated circuit having doped conductive interconnects and methods for its manufacture |
| CN103079366A (en) * | 2011-10-25 | 2013-05-01 | 青岛长弓塑模有限公司 | Method for manufacturing casing with circuit by spraying and laser carving |
| CN103409020A (en) * | 2013-08-14 | 2013-11-27 | 东莞劲胜精密组件股份有限公司 | Coating for circuit of LDS shell |
| CN103491728A (en) * | 2013-09-30 | 2014-01-01 | 电子科技大学 | Method for processing blind holes and fine lines of printed circuit board |
| CN104010447A (en) * | 2014-06-06 | 2014-08-27 | 昆山联滔电子有限公司 | Method for manufacturing conductor circuit |
| US20170027057A1 (en) * | 2015-07-22 | 2017-01-26 | Ibiden Co., Ltd. | Method for manufacturing printed wiring board and printed wiring board |
| CN105472901A (en) * | 2015-12-30 | 2016-04-06 | 东莞光韵达光电科技有限公司 | Laser engraving manufacturing process for fine circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113068311A (en) * | 2021-03-18 | 2021-07-02 | 四会富仕电子科技股份有限公司 | Manufacturing method of precise circuit and circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170620 |
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| WD01 | Invention patent application deemed withdrawn after publication |