CN107148155A - A kind of preparation method of three dimensional integrated circuits plate - Google Patents
A kind of preparation method of three dimensional integrated circuits plate Download PDFInfo
- Publication number
- CN107148155A CN107148155A CN201710476960.9A CN201710476960A CN107148155A CN 107148155 A CN107148155 A CN 107148155A CN 201710476960 A CN201710476960 A CN 201710476960A CN 107148155 A CN107148155 A CN 107148155A
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- CN
- China
- Prior art keywords
- preparation
- integrated circuits
- dimensional integrated
- circuits plate
- component
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention discloses a kind of preparation method of three dimensional integrated circuits plate, comprise the following steps：Non-metal optical inducing catalysis agent aldehydes is added in thermoplasticity loading material, is component with injection machine injection molding；The trace arrangements pattern irradiated with wavelength for 1000 ~ 1500nm laser beam on the surface of component；It is 4 ~ 6 nickel chloride and the mixed solution of silver nitrate that pH value is immersed under 20 ~ 30 DEG C of temperature environments；Component after cleaning is put into the solution containing reducing agent of PH=5 ~ 6 and soaked so that component surface generates corresponding metal core；Electroless copper is carried out, plating copper thickness is 8 ~ 16mm；The present invention provides a kind of preparation method of three dimensional integrated circuits plate, and the surface-mounted integrated circuit performance produced is stable, reduces cost, and reduce the pollution to environment.
Description
Technical field
The invention belongs to integrated circuit fields, and in particular to a kind of preparation method of three dimensional integrated circuits plate.
Background technology
Three-dimensional integrated circuit structure is a kind of relatively advanced electronic integrated circuit device, is collected with traditional two dimension (plane)
Compared into circuit, the conductor track structure of this three dimensional integrated circuits has obvious superiority, using also more extensive.Leading
In the technology of preparing of track body structure, the preparation of conductor rail loading material occupies highly important status.
At present generally using the method that additive is added in plastic material, it is due to additive in plasticity that it, which has problem,
What is be distributed in material is uneven, and the adhesive force of the coat of metal of metallic conductor rail is adversely affected, so as to have impact on metal
The preparation of conductor rail.Loading material currently in use is that the thing containing copper is only added in nonconducting loading material
Matter, so, the method that metal track is prepared at present is washed using impact copper facing, multiple tracks, plates thick copper, multiple tracks washing again, last
Chemical nickel plating.During the metallization of metal track, it is necessary to plated using a large amount of formaldehyde are contained as the pre-impact of reducing agent
Chemical bronze plating liquid.Formaldehyde is a kind of far-reaching material of environmental pollution, if it is possible to reduce usage amount or without that will be
One environmentally friendly major issue.
The content of the invention
In view of the above-mentioned problems, the technical problem to be solved in the present invention is a kind of preparation method of three dimensional integrated circuits plate, no
Produce the material of environmental pollution.
To achieve the above object, the technical scheme is that：A kind of preparation method of three dimensional integrated circuits plate, including with
Lower step：
Step 1：Non-metal optical inducing catalysis agent aldehydes is added in thermoplasticity loading material, is structure with injection machine injection molding
Part, wherein, the content of non-metal optical inducing catalysis agent alcohols is 5 ~ 15%, and injection molding temperature is 80 ~ 150 DEG C；
Step 2：The trace arrangements pattern irradiated with wavelength for 1000 ~ 1500nm laser beam on the surface of component, in structure
The time of part surface irradiation is 5 ~ 15s；
Step 3：It is 4 ~ 6 nickel chloride and the mixed solution of silver nitrate, soak time that pH value is immersed under 20 ~ 30 DEG C of temperature environments
For 5 ~ 15min；
Step 4：Component is taken out from the mixed solution of nickel chloride and silver nitrate, and cleaned with distilled water；
Step 5：By the component after cleaning be put into the solution containing reducing agent of PH=5 ~ 6 soak, soak time be 10 ~
30min so that component surface generates corresponding metal core；
Step 6：Electroless copper is carried out, plating copper thickness is 8 ~ 16mm.
Preferably, described non-metal optical inducing catalysis agent aldehydes is solid-state or liquid or gaseous trihydroxylic alcohol.
Preferably, described thermoplasticity loading material is polyvinyl chloride, makrolon and polybutylene terephthalate (PBT).
Preferably, the Laser Modulation frequency in the step 2 is 1000 ~ 5000Hz, and pulse width is 5 ~ 150ns.
Preferably, the average laser power in the step 2 is 10 ~ 200W.
Preferably, the temperature of the distilled water is 40 ~ 60 DEG C.
Preferably, the reducing agent in the step 5 is in ferrous sulfate, sodium borohydride, potassium borohydride and stannous oxide
It is one or more of.
Preferably, the copper plating bath of the electroless copper in the step 7 includes according to parts by weight, anhydrous cupric sulfate 10 ~ 20
Part, 5 ~ 10 parts of potassium ferrocyanide, 6 ~ 9 parts of bipyridyl, 0.5 ~ 2.5 part of sodium potassium tartrate tetrahydrate.
Preferably, the pH value of the copper plating bath is 10 ~ 12, and temperature is 50 ~ 60 DEG C.
The beneficial effects of the present invention are：The present invention provides a kind of preparation method of three dimensional integrated circuits plate, in carrying material
Without any metallic element composition in material, metallic element is overlayed on by way of plating on integrated circuit board member, and
A small amount of non-metal optical inducing catalysis agent is added in carrying plastic material so that loading material maintains carrying after laser
Original mechanical performance of material, and performance is stable, reduces cost, reduces the pollution to environment.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, following examples, to present invention progress
It is further to describe in detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, this is not limited
Invention.
Embodiment 1
A kind of preparation method of three dimensional integrated circuits plate, comprises the following steps：
Step 1：Non-metal optical inducing catalysis agent aldehydes is added in thermoplasticity loading material, is structure with injection machine injection molding
Part, wherein, the content of non-metal optical inducing catalysis agent alcohols is 15%, and injection molding temperature is 150 DEG C；
Step 2：The trace arrangements pattern that the laser beam for being 1500nm with wavelength is irradiated on the surface of component, in component surface
The time of irradiation is 15s；
Step 3：It is 6 nickel chloride and the mixed solution of silver nitrate that pH value is immersed under 30 DEG C of temperature environments, and soak time is
15min；
Step 4：Component is taken out from the mixed solution of nickel chloride and silver nitrate, and cleaned with distilled water；
Step 5：Component after cleaning is put into the solution containing reducing agent of PH=6 and soaked, soak time is 10min, is made
Obtain component surface and generate corresponding metal core；
Step 6：Electroless copper is carried out, plating copper thickness is 8mm.
Described non-metal optical inducing catalysis agent aldehydes is solid-state or liquid or gaseous trihydroxylic alcohol.
Described thermoplasticity loading material is polyvinyl chloride, makrolon and polybutylene terephthalate (PBT).
Laser Modulation frequency in the step 2 is 1000Hz, and pulse width is 5ns.
Average laser power in the step 2 is 10W.
The temperature of the distilled water is 40 DEG C.
Reducing agent in the step 5 is one kind or several in ferrous sulfate, sodium borohydride, potassium borohydride and stannous oxide
Kind.
The copper plating bath of electroless copper in the step 7 includes according to parts by weight, 10 parts of anhydrous cupric sulfate, ferrocyanide
5 parts of potassium, 6 parts of bipyridyl, 0.5 part of sodium potassium tartrate tetrahydrate.
The pH value of the copper plating bath is 10, and temperature is 50 DEG C.
Embodiment 2
A kind of preparation method of three dimensional integrated circuits plate, comprises the following steps：
Step 1：Non-metal optical inducing catalysis agent aldehydes is added in thermoplasticity loading material, is structure with injection machine injection molding
Part, wherein, the content of non-metal optical inducing catalysis agent alcohols is 10%, and injection molding temperature is 100 DEG C；
Step 2：The trace arrangements pattern that the laser beam for being 1200nm with wavelength is irradiated on the surface of component, in component surface
The time of irradiation is 10s；
Step 3：It is 5 nickel chloride and the mixed solution of silver nitrate that pH value is immersed under 25 DEG C of temperature environments, and soak time is
10min；
Step 4：Component is taken out from the mixed solution of nickel chloride and silver nitrate, and cleaned with distilled water；
Step 5：Component after cleaning is put into the solution containing reducing agent of PH=5 and soaked, soak time is 20min, is made
Obtain component surface and generate corresponding metal core；
Step 6：Electroless copper is carried out, plating copper thickness is 12mm.
Described non-metal optical inducing catalysis agent aldehydes is solid-state or liquid or gaseous trihydroxylic alcohol.
Described thermoplasticity loading material is polyvinyl chloride, makrolon and polybutylene terephthalate (PBT).
Laser Modulation frequency in the step 2 is 3000Hz, and pulse width is 50ns.
Average laser power in the step 2 is 100W.
The temperature of the distilled water is 50 DEG C.
Reducing agent in the step 5 is one kind or several in ferrous sulfate, sodium borohydride, potassium borohydride and stannous oxide
Kind.
The copper plating bath of electroless copper in the step 7 includes according to parts by weight, 15 parts of anhydrous cupric sulfate, ferrocyanide
7 parts of potassium, 7 parts of bipyridyl, 1.5 parts of sodium potassium tartrate tetrahydrate.
The pH value of the copper plating bath is 11, and temperature is 55 DEG C.
Embodiment 3
A kind of preparation method of three dimensional integrated circuits plate, comprises the following steps：
Step 1：Non-metal optical inducing catalysis agent aldehydes is added in thermoplasticity loading material, is structure with injection machine injection molding
Part, wherein, the content of non-metal optical inducing catalysis agent alcohols is 15%, and injection molding temperature is 150 DEG C；
Step 2：The trace arrangements pattern that the laser beam for being 1500nm with wavelength is irradiated on the surface of component, in component surface
The time of irradiation is 15s；
Step 3：It is 6 nickel chloride and the mixed solution of silver nitrate that pH value is immersed under 30 DEG C of temperature environments, and soak time is
15min；
Step 4：Component is taken out from the mixed solution of nickel chloride and silver nitrate, and cleaned with distilled water；
Step 5：Component after cleaning is put into the solution containing reducing agent of PH=6 and soaked, soak time is 30min, is made
Obtain component surface and generate corresponding metal core；
Step 6：Electroless copper is carried out, plating copper thickness is 16mm.
Described non-metal optical inducing catalysis agent aldehydes is solid-state or liquid or gaseous trihydroxylic alcohol.
Described thermoplasticity loading material is polyvinyl chloride, makrolon and polybutylene terephthalate (PBT).
Laser Modulation frequency in the step 2 is 5000Hz, and pulse width is 150ns.
Average laser power in the step 2 is 200W.
The temperature of the distilled water is 60 DEG C.
Reducing agent in the step 5 is one kind or several in ferrous sulfate, sodium borohydride, potassium borohydride and stannous oxide
Kind.
The copper plating bath of electroless copper in the step 7 includes according to parts by weight, 20 parts of anhydrous cupric sulfate, ferrocyanide
10 parts of potassium, 9 parts of bipyridyl, 2.5 parts of sodium potassium tartrate tetrahydrate.
The pH value of the copper plating bath is 12, and temperature is 60 DEG C.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, although with reference to foregoing reality
Apply example the present invention is described in detail, for those skilled in the art, it still can be to foregoing each implementation
Technical scheme described in example is modified, or carries out equivalent substitution to which part technical characteristic.All essences in the present invention
God is with principle, and any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (9)
1. a kind of preparation method of three dimensional integrated circuits plate, it is characterised in that comprise the following steps：
Step 1：Non-metal optical inducing catalysis agent aldehydes is added in thermoplasticity loading material, is structure with injection machine injection molding
Part, wherein, the content of non-metal optical inducing catalysis agent alcohols is 5 ~ 15%, and injection molding temperature is 80 ~ 150 DEG C；
Step 2：The trace arrangements pattern irradiated with wavelength for 1000 ~ 1500nm laser beam on the surface of component, in structure
The time of part surface irradiation is 5 ~ 15s；
Step 3：It is 4 ~ 6 nickel chloride and the mixed solution of silver nitrate, soak time that pH value is immersed under 20 ~ 30 DEG C of temperature environments
For 5 ~ 15min；
Step 4：Component is taken out from the mixed solution of nickel chloride and silver nitrate, and cleaned with distilled water；
Step 5：By the component after cleaning be put into the solution containing reducing agent of PH=5 ~ 6 soak, soak time be 10 ~
30min so that component surface generates corresponding metal core；
Step 6：Electroless copper is carried out, plating copper thickness is 8 ~ 16mm.
2. the preparation method of a kind of three dimensional integrated circuits plate according to claim 1, it is characterised in that described is nonmetallic
Photocatalysis agent aldehydes is solid-state or liquid or gaseous trihydroxylic alcohol.
3. a kind of preparation method of three dimensional integrated circuits plate according to claim 1, it is characterised in that described thermoplasticity
Loading material is polyvinyl chloride, makrolon and polybutylene terephthalate (PBT).
4. the preparation method of a kind of three dimensional integrated circuits plate according to claim 1, it is characterised in that in the step 2
Laser Modulation frequency be 1000 ~ 5000Hz, pulse width be 5 ~ 150ns.
5. the preparation method of a kind of three dimensional integrated circuits plate according to claim 1, it is characterised in that in the step 2
Average laser power be 10 ~ 200W.
6. the preparation method of a kind of three dimensional integrated circuits plate according to claim 1, it is characterised in that the distilled water
Temperature is 40 ~ 60 DEG C.
7. the preparation method of a kind of three dimensional integrated circuits plate according to claim 1, it is characterised in that in the step 5
Reducing agent be ferrous sulfate, sodium borohydride, potassium borohydride and stannous oxide in one or more.
8. the preparation method of a kind of three dimensional integrated circuits plate according to claim 1, it is characterised in that in the step 7
The copper plating bath of electroless copper include according to parts by weight, 10 ~ 20 parts of anhydrous cupric sulfate, 5 ~ 10 parts of potassium ferrocyanide, bipyridyl 6
~ 9 parts, 0.5 ~ 2.5 part of sodium potassium tartrate tetrahydrate.
9. the preparation method of a kind of three dimensional integrated circuits plate according to claim 1, it is characterised in that the copper plating bath
PH value is 10 ~ 12, and temperature is 50 ~ 60 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710476960.9A CN107148155A (en) | 2017-06-21 | 2017-06-21 | A kind of preparation method of three dimensional integrated circuits plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710476960.9A CN107148155A (en) | 2017-06-21 | 2017-06-21 | A kind of preparation method of three dimensional integrated circuits plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012421A (en) * | 2017-11-09 | 2018-05-08 | 建业科技电子（惠州）有限公司 | Control separate wells aperture and independent lines thickness production method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110127070A1 (en) * | 2009-11-30 | 2011-06-02 | Lg Innotek Co., Ltd. | Embedded printed circuit board, multi-layer printed circuit board and manufacturing method thereof |
| CN102421256A (en) * | 2010-09-24 | 2012-04-18 | 光宏精密股份有限公司 | Manufacturing method for forming circuit structure on non-conductive carrier |
| CN102543855A (en) * | 2012-01-19 | 2012-07-04 | 讯创(天津)电子有限公司 | Manufacture method of three-dimensional integrated circuit structure and material |
-
2017
- 2017-06-21 CN CN201710476960.9A patent/CN107148155A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110127070A1 (en) * | 2009-11-30 | 2011-06-02 | Lg Innotek Co., Ltd. | Embedded printed circuit board, multi-layer printed circuit board and manufacturing method thereof |
| CN102421256A (en) * | 2010-09-24 | 2012-04-18 | 光宏精密股份有限公司 | Manufacturing method for forming circuit structure on non-conductive carrier |
| CN102543855A (en) * | 2012-01-19 | 2012-07-04 | 讯创(天津)电子有限公司 | Manufacture method of three-dimensional integrated circuit structure and material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012421A (en) * | 2017-11-09 | 2018-05-08 | 建业科技电子（惠州）有限公司 | Control separate wells aperture and independent lines thickness production method |
| WO2019090859A1 (en) * | 2017-11-09 | 2019-05-16 | 建业科技电子（惠州）有限公司 | Manufacturing method for controlling independent pore size and independent wire thickness |
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Application publication date: 20170908 |
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