CN114603417B - PCB grinding method, PCB back grinding device and PCB - Google Patents
PCB grinding method, PCB back grinding device and PCB Download PDFInfo
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- CN114603417B CN114603417B CN202210335135.8A CN202210335135A CN114603417B CN 114603417 B CN114603417 B CN 114603417B CN 202210335135 A CN202210335135 A CN 202210335135A CN 114603417 B CN114603417 B CN 114603417B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention relates to the technical field of PCBs, and discloses a PCB grinding method, a PCB return grinding device and a PCB. The PCB grinding method comprises the following steps: establishing a plate thickness data model; the plate thickness data model includes: after copper is plated in the holes and before resin is plugged, the thickness of the plug hole front plate of each plug hole area on the PCB is thick; after resin hole plugging and coarse grinding are carried out on the PCB, detecting the thickness of each hole plugging area after coarse grinding; screening target plug hole areas with overproof residual resin from all plug hole areas at least according to the corresponding thickness of the coarse ground board and the thickness of the plug hole front board; automatically performing a backgrinding operation for the target jack region. The embodiment of the invention can accurately identify the target plug hole areas with the overproof residual resin, and carry out automatic back grinding operation aiming at the target plug hole areas, and the whole back grinding process is automatically realized, thereby improving the back grinding efficiency, reducing the labor cost and improving the back grinding quality.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a PCB grinding method and a PCB re-grinding device.
Background
In the PCB hole metallization process, in order to copper plating in the protection hole, a resin hole plugging technology is adopted: drilling → electroplating → resin plugging → grinding board → outer layer circuit fabrication (exposure, etching).
Wherein, the plate grinding process has two functions:
1. and the resin for plugging the holes on the board surface is removed, so that the residual resin is prevented from damaging the etching forming of the outer-layer precise circuit.
2. The surface of the copper foil is roughened, the binding force of the copper foil and the dry film is improved, and poor etching caused by falling of the dry film is avoided.
At present, the commonly used plate grinding device is: the straight grinding rollers are arranged from top to bottom, and the PCB is conveyed through the gaps between the upper grinding rollers and the lower grinding rollers in a horizontal transmission mode, so that the grinding operation of the straight grinding rollers on the PCB is realized.
In the plate grinding operation, different plate grinding effects are obtained by adjusting plate grinding parameters (such as upper and lower grinding wheel gap values, grinding wheel rotating speed and plate moving speed) according to the plate thickness.
Due to iterative updating of product requirements, the phenomenon of uneven PCB thickness is gradually serious, so that a local sunken area (the thickness of the area is thin) is difficult to polish by a straight grinding roller, and resin is easy to remain.
Therefore, a large amount of manual work is often consumed for returning grinding, the manual work returning grinding mode is low in working efficiency, large labor cost is consumed, the health of personnel is affected due to much dust, the controllability of the precision of the grinding plate is weak, and the consistency of the effect of the grinding plate is poor easily.
Disclosure of Invention
The invention aims to provide a PCB grinding method and a PCB back grinding device, which overcome the defects of low manual back grinding efficiency, high cost, poor consistency of the quality of the ground board and the like in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a PCB grinding method comprises the following steps:
establishing a plate thickness data model; the plate thickness data model includes: after copper is plated in the holes and before resin is plugged, the thickness of the plug hole front plate of each plug hole area on the PCB is thick;
after resin hole plugging and coarse grinding are carried out on the PCB, detecting the thickness of the board after coarse grinding in each hole plugging area; screening target plug hole areas with overproof residual resin from all plug hole areas at least according to the corresponding thickness of the coarse ground board and the thickness of the plug hole front board; a backgrinding operation is automatically performed for the target tap hole area.
Optionally, the screening out a target plug hole region with excessive residual resin from each plug hole region includes: for each of said regions of the tap hole,
determining the thickness of the plate before plugging the current plug hole area according to the coordinate position of the current plug hole area and the plate thickness data model, and calculating the plate thickness difference value of the plate before plugging the current plug hole area and the plate thickness after rough grinding;
and if the plate thickness difference exceeds a preset standard range, acquiring a scanning image of the current hole plugging area, judging whether residual resin exists in the current hole plugging area or not through image analysis, and if so, marking the current hole plugging area as the target hole plugging area.
Optionally, the PCB grinding method further includes: collecting optical scanning images or historical image data of the sample after rough grinding, wherein the optical scanning images or historical image data comprise normal reference images with residual resin not exceeding the standard and/or abnormal reference images with residual resin exceeding the standard, and establishing a standard image library;
the image analysis for judging whether residual resin exists in the current plug hole area comprises the following steps: the scanned image of the current tap hole region is compared to the normal reference image and/or the abnormal reference image for analysis to determine whether residual resin is present in the current tap hole region.
Optionally, the PCB grinding method further includes: and according to the comparison and analysis result, storing the scanned image of the current hole plugging region as a normal reference image or an abnormal reference image into the standard image library.
Optionally, the PCB grinding method further includes: calculating the plate thickness difference between the plate thickness before plugging and the plate thickness after rough grinding of the current target plugging region aiming at each target plugging region, and determining the plate thickness difference as the residual resin thickness of the current target plugging region;
before the back grinding operation is automatically executed aiming at the target plug hole region, the back grinding working parameters of the current target plug hole region are set according to the residual resin thickness:
respectively setting corresponding back grinding working parameters aiming at a first stage that the grinding and brushing head descends from an initial position until the grinding and brushing head contacts the top end of the residual resin, a second stage that the grinding and brushing head descends from the top end of the residual resin for a first distance, and a third stage that the grinding and brushing head continues to descend from the end position of the second stage for a second distance;
wherein the first distance is less than the residual resin thickness, the second distance = the residual resin thickness-the first distance.
Optionally, the back-grinding working parameters include a grinding and brushing rotation speed and a falling speed; the back grinding work parameter value of the third stage is smaller than the back grinding work parameter values of the second stage and the first stage.
Optionally, the thickness of the front plug hole plate and the thickness of the front plug hole plate are measured in a laser ranging mode.
Optionally, after the back grinding operation is automatically performed on the target plug hole region, a scanned image of the back ground target plug hole region is collected, whether the residual resin in the target plug hole region exceeds the standard is determined through image analysis, and if the residual resin still exceeds the standard, the back grinding operation is performed again.
A PCB backgrinding apparatus comprising:
the target positioning device is used for identifying the target on the PCB and determining the coordinate position of each plug hole area on the PCB according to the target;
a plate thickness measuring device for measuring the plate thickness of each tap hole region;
the image scanning device is used for acquiring a scanning image of each hole plugging area;
the back grinding device is used for grinding and brushing the target hole plugging area;
the control system is used for controlling and operating the target positioning device, the plate thickness measuring device, the image scanning device and the back grinding device according to the PCB grinding method.
A PCB manufactured according to the PCB grinding method of any one of the above.
Compared with the prior art, the invention has the beneficial effects that:
the embodiment of the invention can accurately identify the target plug hole areas with the overproof residual resin, and carry out automatic back grinding operation aiming at the target plug hole areas, and the whole back grinding process is automatically realized, thereby improving the back grinding efficiency, reducing the labor cost and improving the back grinding quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a flowchart of a PCB grinding method according to an embodiment of the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to overcome various defects of manual backgrinding, the embodiment of the invention provides a PCB grinding method and a PCB grinding device, which can carry out intelligent automatic backgrinding on a PCB subjected to coarse grinding, can effectively improve the working efficiency, reduce the labor cost and also can effectively improve the backgrinding quality.
Specifically, referring to fig. 1, a method for grinding a PCB according to an embodiment of the present invention includes:
It should be noted that, for different PCBs, corresponding plate thickness data models may be established respectively. The reason is that the number of the via holes needing resin plugging, the arrangement mode of the via holes, the thickness of the board and the like are different among different PCBs.
And 102, after resin hole plugging and rough grinding are carried out on the PCB, detecting the thickness of each hole plugging area after rough grinding.
In the above steps, a target on the PCB can be identified, the target is used as an origin to determine the coordinate position of each hole plugging region, and then the pre-hole plugging plate thickness and the pre-hole plugging plate thickness of each hole plugging region are measured by a laser ranging method, and data recording of the target position and the corresponding plate thickness information is performed for subsequent query.
And 103, screening out target plug hole areas with excessive residual resin from each plug hole area at least according to the corresponding thickness of the plate after rough grinding and the corresponding thickness of the plate before plug hole.
It can be understood that, under the condition that the board surface flatness of the PCB is poor and a part of the jack regions have recesses, the rough grinding effect of different jack regions after rough grinding may have differences, that is, the residual resin amount of each jack region may have differences, which results in the residual resin amount of a part of the jack regions exceeding the standard, and the part of the jack regions needs to be subjected to back grinding operation to meet the standard.
Therefore, in the step, the target plug hole area needing to be subjected to back grinding is judged according to the rough grinding of the plate thickness after the rough grinding and the plate thickness before the plug hole. Because the residual resin amount is an important influence factor influencing the thickness of the plate after rough grinding, and the thickness of the plate before plugging is the optimal ideal thickness which can be achieved by the plate grinding area after the plate grinding, the embodiment of the invention can accurately identify the target plugging area according to the two information, and lays a foundation for ensuring the precision of the next back grinding operation.
And step 104, automatically performing back grinding operation aiming at the target hole plugging area.
According to the embodiment of the invention, the target hole plugging areas with excessive residual resin can be accurately identified, automatic grinding return operation is carried out on the target hole plugging areas, the whole grinding return process is automatically realized, the grinding return efficiency is improved, and the grinding return quality is improved.
In an alternative embodiment, in order to further improve the identification accuracy of the target plug hole region, the method for screening out the target plug hole region with excessive residual resin from each plug hole region in the step 103 includes: for each of the regions of the tap hole,
determining the thickness of the plate before plugging the current plug hole area according to the coordinate position and the plate thickness data model of the current plug hole area, and calculating the plate thickness difference value of the plate before plugging the current plug hole area and the plate thickness after rough grinding;
and if the plate thickness difference exceeds a preset standard range, acquiring a scanning image of the current hole plugging region, judging whether residual resin exists in the current hole plugging region through image analysis, and if so, marking the current hole plugging region as the target hole plugging region.
The screening method comprises the steps of judging whether the plate thickness difference between the plate thickness before plugging and the plate thickness after rough grinding exceeds a preset standard range, and if so, further judging through image analysis.
It can be understood that the preset standard range may be specifically determined according to the machining precision in an actual scene, and the embodiment of the present invention does not limit this.
When an image analysis mode is adopted, in order to further improve the analysis rate and accuracy, the embodiment of the invention further comprises the following steps: collecting a plurality of optical scanning images or historical image data of a sample after rough grinding in advance, wherein the data comprises normal reference images of residual resin which does not exceed the standard and/or abnormal reference images of residual resin which exceeds the standard, and establishing a standard image library;
based on this, whether residual resin exists in the current plug hole area is judged through image analysis, and the method comprises the following steps: the scanned image of the current tap hole region is compared to a normal reference image and/or an abnormal reference image for analysis to determine whether residual resin is present in the current tap hole region.
According to the image analysis method, the reference sample is collected in advance, and the reference sample contains various favorable characteristic information such as size, color and shape, so that whether the covering of the target hole plugging area is residual resin can be quickly and accurately identified in a comparison mode during analysis, and the adverse effects of some possibly existing interference factors are reduced.
Furthermore, according to the comparison and analysis result, the scanned image of the current taphole area can be stored into a standard image library as a normal reference image or an abnormal reference image so as to completely expand the stored information of the standard image library.
In step 104, specific return grinding operation parameters may be set based on the thickness after rough grinding and the thickness before plugging obtained in the previous step.
Specifically, for each target tap hole region, a difference in plate thickness between the pre-tap hole plate thickness and the post-rough-grinding plate thickness of the current target tap hole region is calculated, and the difference in plate thickness is determined as the residual resin thickness of the current target tap hole region.
Before the back grinding operation is automatically executed aiming at the target plug hole region, the back grinding working parameters of the current target plug hole region are set according to the thickness of the residual resin: and respectively setting corresponding back grinding working parameters aiming at a first stage that the grinding and brushing head descends from the initial position until the grinding and brushing head contacts with the top end of the residual resin, a second stage that the grinding and brushing head descends from the top end of the residual resin for a first distance, and a third stage that the grinding and brushing head continues descending for a second distance from the end position of the second stage. Wherein the first distance is less than the residual resin thickness, and the second distance = the residual resin thickness-the first distance.
This back grind control operation divides the whole down process of mill brush head into three stages, can be referred to for short: a non-brushing stage (stage in which the brush head is not yet in contact with the residual resin), an early brushing stage (stage in which the brush head brushes an upper layer portion of the residual resin), and a late brushing stage (stage in which the brush head brushes a lower layer portion of the residual resin). Because actual requirements of different stages on the grinding brush head may be different, the embodiment of the invention reasonably divides the whole descending process to respectively set working parameters of the grinding brush in each stage so as to meet different requirements of different stages.
Typically, the return grind operating parameters include the brush speed and the drop speed. For example, in order to improve the brushing efficiency and simultaneously avoid the damage of the board copper layer on the lower layer of the residual resin caused by brushing, a larger brushing rotation speed and a falling speed can be set in the first stage and the second stage far away from the board copper layer, and a smaller brushing rotation speed and a falling speed can be set in the third stage close to the board copper layer.
In practical applications, the number of times of performing the backgrinding operation may not be limited. After the back grinding operation is automatically executed for the target hole plugging area, the scanned image of the back ground target hole plugging area can be collected again, whether the residual resin in the target hole plugging area exceeds the standard or not is judged through image analysis, and if the residual resin still exceeds the standard, the back grinding operation can be executed again until the detection result meets the standard.
The embodiment of the invention also provides a PCB back grinding device, which comprises:
the target positioning device is used for identifying the target on the PCB and determining the coordinate position of each plug hole area on the PCB according to the target;
a plate thickness measuring device for measuring the plate thickness of each tap hole region;
the image scanning device is used for acquiring a scanning image of each hole plugging area;
the back grinding device is used for grinding and brushing the target hole plugging area;
and the control system is used for controlling and operating the target positioning device, the plate thickness measuring device, the image scanning device and the back grinding device according to the PCB grinding method.
It should be noted that the arrangement position and the number of the components in the PCB regrinding device may be set according to the regrinding process.
On the other hand, the embodiment of the invention also provides a PCB, and the PCB is manufactured according to any one of the PCB grinding methods. Due to the adoption of the automatic back grinding technology, the residual resin amount on the surface of each hole plugging area of the manufactured PCB can be effectively and accurately controlled, and the processing quality is greatly improved.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A PCB grinding method is characterized by comprising the following steps:
establishing a plate thickness data model; the plate thickness data model includes: after copper is plated in the holes and before resin is plugged, the thickness of the plug hole front plate of each plug hole area on the PCB is thick;
after resin hole plugging and coarse grinding are carried out on the PCB, detecting the thickness of each hole plugging area after coarse grinding; screening out target plug hole areas with overproof residual resin from all plug hole areas at least according to the corresponding thickness of the coarse ground plate and the thickness of the plug hole front plate; automatically performing a backgrinding operation for the target jack region;
the step of screening out target plug hole areas with overproof residual resin from all the plug hole areas comprises the following steps: for each of said regions of the tap hole,
determining the thickness of the plate before plugging the current plug hole area according to the coordinate position of the current plug hole area and the plate thickness data model, and calculating the plate thickness difference value of the plate before plugging the current plug hole area and the plate thickness after rough grinding;
and if the plate thickness difference exceeds a preset standard range, acquiring a scanning image of the current hole plugging region, judging whether residual resin exists in the current hole plugging region through image analysis, and if so, marking the current hole plugging region as the target hole plugging region.
2. The PCB board grinding method according to claim 1, further comprising: collecting optical scanning images or historical image data of the sample after rough grinding, wherein the optical scanning images or historical image data comprise normal reference images with residual resin not exceeding the standard and/or abnormal reference images with residual resin exceeding the standard, and establishing a standard image library;
the step of judging whether residual resin exists in the current hole plugging area through image analysis comprises the following steps: the scanned image of the current tap hole region is compared to the normal reference image and/or the abnormal reference image for analysis to determine whether residual resin is present in the current tap hole region.
3. The PCB board grinding method according to claim 2, further comprising: and according to the comparison and analysis result, storing the scanned image of the current hole plugging region as a normal reference image or an abnormal reference image into the standard image library.
4. The PCB board grinding method according to claim 1, further comprising: calculating the plate thickness difference between the plate thickness before plugging and the plate thickness after rough grinding of the current target plugging region aiming at each target plugging region, and determining the plate thickness difference as the residual resin thickness of the current target plugging region;
before the back grinding operation is automatically executed aiming at the target plug hole region, the back grinding working parameters of the current target plug hole region are set according to the residual resin thickness:
respectively setting corresponding back grinding working parameters aiming at a first stage that the grinding and brushing head descends from an initial position until the grinding and brushing head contacts the top end of the residual resin, a second stage that the grinding and brushing head descends from the top end of the residual resin for a first distance, and a third stage that the grinding and brushing head continues to descend from the end position of the second stage for a second distance;
wherein the first distance is less than the residual resin thickness, the second distance = the residual resin thickness-the first distance.
5. The PCB board grinding method according to claim 4, wherein the back grinding working parameters comprise a grinding brush rotating speed and a falling speed; the back grinding work parameter value of the third stage is smaller than the back grinding work parameter values of the second stage and the first stage.
6. The PCB lapping method of claim 1, wherein the pre-tap plate thickness and the pre-tap plate thickness are measured by a laser ranging method.
7. The PCB board grinding method according to claim 1, characterized in that after the back grinding operation is automatically performed on the target plug hole area, a scanned image of the target plug hole area after the back grinding is collected, whether the residual resin in the target plug hole area exceeds the standard is judged through image analysis, and if the residual resin still exceeds the standard, the back grinding operation is performed again.
8. A PCB regrinding device is characterized by comprising:
the target positioning device is used for identifying the target on the PCB and determining the coordinate position of each plug hole area on the PCB according to the target;
a plate thickness measuring device for measuring the plate thickness of each tap hole region;
the image scanning device is used for acquiring a scanning image of each hole plugging area;
the back grinding device is used for grinding and brushing the target hole plugging area;
a control system for controlling the target positioning device, the plate thickness measuring device, the image scanning device and the back grinding device according to the PCB grinding method of any one of claims 1 to 7.
9. A PCB manufactured by the PCB grinding method of any one of claims 1 to 7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210335135.8A CN114603417B (en) | 2022-03-31 | 2022-03-31 | PCB grinding method, PCB back grinding device and PCB |
| PCT/CN2022/099834 WO2023184727A1 (en) | 2022-03-31 | 2022-06-20 | Pcb grinding method, pcb regrinding device, and pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210335135.8A CN114603417B (en) | 2022-03-31 | 2022-03-31 | PCB grinding method, PCB back grinding device and PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114603417A CN114603417A (en) | 2022-06-10 |
| CN114603417B true CN114603417B (en) | 2023-01-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210335135.8A Active CN114603417B (en) | 2022-03-31 | 2022-03-31 | PCB grinding method, PCB back grinding device and PCB |
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| Country | Link |
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| CN (1) | CN114603417B (en) |
| WO (1) | WO2023184727A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN114603417A (en) | 2022-06-10 |
| WO2023184727A1 (en) | 2023-10-05 |
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