CN105228375B - A kind of production method of flexible and hard combined circuit board filling holes with resin - Google Patents
A kind of production method of flexible and hard combined circuit board filling holes with resin Download PDFInfo
- Publication number
- CN105228375B CN105228375B CN201510520238.1A CN201510520238A CN105228375B CN 105228375 B CN105228375 B CN 105228375B CN 201510520238 A CN201510520238 A CN 201510520238A CN 105228375 B CN105228375 B CN 105228375B
- Authority
- CN
- China
- Prior art keywords
- flexible
- resin
- circuit board
- combined circuit
- hard combined
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of production methods of flexible and hard combined circuit board filling holes with resin, are related to wiring board production technical field.The production method includes：S1：The inner line figure of soft board core plate and hardboard core plate is made respectively, and the corresponding position that drills of the line pattern is equipped with the isolated pad more than required boring aperture；S2：Soft board core plate and hardboard core plate are pressed into flexible and hard combined circuit board with PP；S3：The drilling of filling holes with resin needed for being drilled out on flexible and hard combined circuit board；S4：Heavy copper, plating on drill hole inner wall；S5：Potting resin in drilling after plating, then primary solidification resin；S6：It is polished off by nog plate and overflows the remaining resin of flexible and hard combined circuit board copper face.The present invention isolates pad by retaining bore position internal layer circuit, ensure bore position thickness, it can avoid crossing hole site copper face depression problem caused by NO FLOW PP filler abilities that flexible and hard combined circuit board uses are weak, it is unclean and lead to doing over again for manual grinding to reduce resin nog plate.
Description
Technical field
The present invention relates to wiring board production technical fields, especially design a kind of making of flexible and hard combined circuit board filling holes with resin
Method.
Background technology
In flexible and hard combined circuit board design, because product design wiring space limits, it was equipped with below part surface pad
Hole, to ensure welding quality of the component in surface pads, the via below surface pads needs to be applied to jack process, with
Ensure the planarization of surface pads.
Resin ink plugging is most commonly used in current jack process.Through making inner figure, pressing, drilling, figure
After plated hole, resin ink will be filled up by silk screen or aluminium flake mode of printing in via, abrasive belt grinding polishes off excessive after baking-curing
Go out the resin of copper face and flatten plate face, subsequently heavy copper plate electric again, the plug socket resin of hole site was made to be covered by layers of copper.
There are following defects for existing this way：
As shown in Fig. 2, when making inner figure, the pad that internal layer layers of copper 24 corresponds to via 26 is etched, soft or hard combination
The mobility of NO-FLOW PP glue that wiring board lamination uses is poor, and via 26 corresponds to internal layer layers of copper 24 without copper position quilt after pressing
Adjacent 21 and second base material 22 of the first base material is filled, so as to cause 21 surface the first base copper of the first base material, 23 corresponding position table
Face, 22 surface the second base copper of the second base material, 25 corresponding position recess；The figure plated hole after drilling, figure plated hole can be attached in via 26
Near surface plates certain thickness copper, and copper facing 27 and the depression in the surface on surface form the groove 29 of annular, and groove 29 is difficult
Smooth to be polished, after 28 consent of resin, resin 28 in overflow to groove 29 is difficult to remove by abrasive belt grinding, is needed manually
Polishing expends many artificial and time.
Invention content
Present invention offer is a kind of regarding to the issue above solves the problems, such as that crossing hole site copper face after pressing forms groove and consent
The production method that rearward recess leads to the flexible and hard combined circuit board filling holes with resin of resin residue problem, concrete scheme are as follows：
A kind of production method of flexible and hard combined circuit board filling holes with resin, includes the following steps：
S1：Make the inner line figure of soft board core plate and hardboard core plate respectively, the corresponding drilling position of the line pattern
Equipped with the isolated pad more than required boring aperture；
S2：Soft board core plate and hardboard core plate are pressed into flexible and hard combined circuit board with PP；
S3：The drilling of filling holes with resin needed for being drilled out on flexible and hard combined circuit board；
S4：Heavy copper, plating on drill hole inner wall；
S5：Potting resin in drilling after plating, then primary solidification resin；
S6：It is polished off by nog plate and overflows the remaining resin of flexible and hard combined circuit board copper face.
Preferably, in the step S1, the diameter for isolating pad is bigger more than 0.2mm than required boring aperture, preferably 0.2-
0.5mm。
Preferably, in the step S2, the PP is NO-FLOW PP.
Preferably, in the step S4, heavy copper using electric plating of whole board sink copper, be electroplated.
Preferably, in the step S5, potting resin is using screen printing net plate printing filling in drilling；Preferably, silk printing screen
The mesh aperture of plate is bigger more than 0.2mm than the boring aperture of required plate filling holes with resin, preferably 0.2-0.5mm.The resin is
UV solidified resins.
Preferably, in the step S6, the nog plate uses nonwoven fabric nog plate.
Further, the production method of the flexible and hard combined circuit board filling holes with resin is further comprising the steps of：
S7：It is thick to required surface layer copper that copper is subtracted by etching solution；
S8：Subtract the flexible and hard combined circuit board surface after copper and grind off the tree for drilling position being caused to be protruded because subtracting copper through nonwoven fabric nog plate
Fat；
S9：Flexible and hard combined circuit board is toasted, cures the resin of consent, then heavy copper, plating covering are flexible and hard combined
The resin that road plate surface is exposed.
Preferably, in the step S9, heavy copper, plating sink copper, plating for full plate.
The present invention is designed by changing multilayer flexible and hard combined circuit board internal layer circuit, is retained bore position and is isolated pad, protects
Bore position thickness is demonstrate,proved, can avoid crossing hole site caused by NO-FLOW PP filler abilities that flexible and hard combined circuit board uses are weak
It is unclean and lead to doing over again for manual grinding to reduce resin nog plate for copper face depression problem.
UV solidified resins cure under w light, hardness meet after consent will not blast hole requirement, and only pass through nonwoven fabric
Grinding just can easily clean out the remaining resin of copper face, avoid resin residue problem caused by the groove of copper facing formation.
Electric plating of whole board mode alternative pattern plated hole avoids copper facing from forming groove problem.Surface copper can be met by subtracting copper after consent
Thick problem, subtract the nonwoven fabric after copper grinding can further clean up because subtract copper cause drill position protrusion resin ensure that plate face is put down
It is whole.
Description of the drawings
Fig. 1 is the cross section structure schematic diagram after 1 flexible and hard combined circuit board filling holes with resin of the embodiment of the present invention.
Fig. 2 is the cross section structure schematic diagram after existing flexible and hard combined circuit board filling holes with resin.
Specific embodiment
In order to more fully understand the present invention technology contents, with reference to specific embodiment to technical scheme of the present invention into
One step introduction and explanation.
Embodiment 1
Three layers of flexible and hard combined circuit board as shown in Figure 1, including the first base material 11, the second base material 12, the first base material 11 with
For internal layer circuit copper between second base material 12,11 surface of the first base material is covered with the first base copper 13, and 12 surface of the second base material is covered with the
Diyl copper 15.The filling holes with resin 16 that pad is made available for surface, production method packet need to be made on the flexible and hard combined circuit board
Include following steps：
Inner line figure is made, there are the isolated pads more than 16 aperture of filling holes with resin for the corresponding drilling position of line pattern
14；The diameter of isolated pad is bigger 0.35mm than the aperture of filling holes with resin 16.
Flexible and hard combined circuit board is pressed into NO-FLOW PP, after pressing, the surface of flexible and hard combined circuit board corresponds to internal layer
There are the position protrusions of isolated pad 14.
Corresponding position drills out the drilling of required filling holes with resin on flexible and hard combined circuit board.
The full plate of flexible and hard combined circuit board is sunk into copper, plating, drill hole inner wall and flexible and hard combined circuit board surface is made to adhere to one layer
Electro-coppering 17.
Using screen printing net plate printing UV solidified resin ink, potting resin 18 in the drilling after heavy copper, then UV curings
Resin makes resin primary solidification；The mesh aperture of screen printing net plate is bigger 0.35mm than the boring aperture of required plate filling holes with resin.
The resin of flexible and hard combined circuit board remained on surface is cleaned out by surface nonwoven fabric nog plate, then is lost by subtracting copper
It carves and flexible and hard combined circuit board surface is reduced into required surface layer copper thickness；
Subtracting the flexible and hard combined circuit board surface after copper and being ground off again through nonwoven fabric nog plate leads to the position protrusion that drills when subtracting copper
Resin；
By flexible and hard combined circuit board baking and curing, then full plate sinks copper, plating covering flexible and hard combined circuit board surface and exposes
Resin obtains the filling holes with resin that flexible and hard combined circuit board surface drilling position can be used for making pad.
Embodiment 2
The production method of filling holes with resin using the present invention makes the PCB with following parameter request.
Core material：
0.075mm 0.5/0.5OZ (not cupric) (2)；
The number of plies：8 layers；
Internal layer line width/line-spacing：0.1mm/0.1mm,0.091mm/0.1mm
Outer layer line width/line-spacing：0.1/0.1mm (copper thickness 1.0OZ is completed)；
Plate Tg：≥170°；
Outer layer core plate 0.36mm 0.5/0.5oz (not cupric) (2)：1/2OZ；
Hole copper thickness：18um(min)/20um(ave)；
Surface treatment：Turmeric；
Complete plate thickness：1.6mm ± 10%；
Minimum bit：0.2mm；
Drill radius-thickness ratio：8:1；
Produce PNL sizes：304mm×457mm.
Specific manufacture craft is as follows：
1st, sawing sheet --- the quantity of different-thickness core plate and production plate PNL size 518mm*620mm as required, will be big
The plank of block is cut into the size to produce plate, in order to produce.
2nd, internal layer circuit makes --- with 6-8 lattice exposure series (21 lattice exposure guide rule) complete the exposure of internal layer circuit, development,
Acid etching, take off film method make each level of internal layer circuit, internal layer circuit it is corresponding drilling position be equipped be more than required drilling
The isolated pad in aperture, the diameter for isolating pad are bigger 0.35mm than the aperture of filling holes with resin 16.Due to each level copper thickness of internal layer simultaneously
It is not identical, therefore, it is necessary to which different etching parameters is used to carry out the making of internal layer circuit, copper thickness 0.5/0.5OZ is used
Parameter be：5.7±0.8m/min.
3rd, brown --- by way of chemical reaction, in a kind of brown oxidation layer of layers of copper Surface Creation, make the thick of copper face
Rugosity becomes larger, enhancing pressing when and cover film binding force.
4th, microetch --- erosion layers of copper surface is stung by acid liquid medicine, layers of copper surface oxidation and sundries are understood, when enhancing fast pressure
With the binding force of cover film.
5th, epiphragma is pasted --- by the corresponding No-Flow PP windowings position patch last layer cover film of internal layer soft board core plate, protect
Protect the copper wire of windowed regions.
6th, quick pressing --- -- by way of high temperature and pressure, in the short time by the glue-line (epoxy resin) of cover film with
Soft board core plate is bonded and is cured.Temperature 180+/- 10 DEG C, pressure 80KG, time 120s.
7th, brown --- by way of chemical reaction, in a kind of brown oxidation layer of layers of copper Surface Creation, make the thick of copper face
Rugosity becomes larger, binding force when enhancing pressing with No-flow PP.
8th, press --- by way of high temperature and pressure, by the No-Flow PP of semi-cured state (epoxy resin coating
Glass fabric) reach cured state, thus by the hardboard core plate pressure of the soft board core plate of Rigid Flex internal layer and outer layer
It is combined.This plate pressing parameter is the special pressing parameters of No-Flow PP.
9th, outer layer drilling (only boring the PTH for needing filling holes with resin) --- using the mode of machine drilling, by Rigid Flex
On drill out through-hole for making PTH, PTH can make be connected between each level that needs are connected.
10th, heavy copper --- the mode that the hole wall through-hole of through-hole chemically reacts is deposited into one layer of thin copper, for full plate electricity below
Plating provides basis, and the requirement of backlight series is 9.0 grades.
11st, electric plating of whole board --- according to the mechanism of electrochemical reaction, last layer copper is electroplated on the basis of heavy copper, ensures hole
Copper thickness reaches product requirement, sets electroplating parameter according to hole copper thickness is completed, electroplating parameter is：1.2ASD*75min, hole copper
Thickness is 19-23 μm.
12nd, filling holes with resin --- UV light is consolidated by ink by silk-screen mode and is engraved in the PTH for needing to be clogged by resin, silk-screen
It is big 0.15mm that the mesh of web plate than PTH obtains aperture.
13rd, UV light is consolidated --- and it is irradiated by UV light by resin ink primary solidification in PTH, reaches certain degree of hardness, parameter：
1500mj/cm2, speed：2m/min.
14th, nonwoven fabric nog plate --- it is by nonwoven fabric polish-brush that the resin ink on layers of copper surface is clean.
15th, microetch subtracts copper --- and by acid liquid medicine acid etching, surface copper layer thickness is thinned, is follow-up line map shape
It prepares.
16th, nonwoven fabric nog plate --- the resin ink protruded after surface layers of copper is thinned by nonwoven fabric polish-brush is clear again
Reason is clean, ensures that product surface is smooth.
17th, baking sheet-by high-temperature baking, resin ink is thoroughly cured, reaches certain stable state.Parameter：150+/-
5 DEG C, 30min
18th, heavy copper --- PTH positions plug socket resin surface layer is deposited into one layer of thin copper by way of chemical reaction, for below
Electric plating of whole board provide basis.
19th, electric plating of whole board --- according to the mechanism of electrochemical reaction, last layer copper is electroplated on the basis of heavy copper, is follow-up
Graphic plating provides basis, and electroplating parameter is：1.2ASD*60min copper layer thickness is 15+/- 5um.
20th, outer graphics --- exposure, the development of outer-layer circuit are completed with 6-8 lattice exposure series (21 lattice exposure guide rule).
21st, graphic plating --- electroplating parameter is set according to desired completion copper thickness, figure electro-coppering parameter is 1.25ASD*
90min；Then one layer of tin is plated in circuit surface, electrotinning parameter is set as 1.5ASD*15min, and thickness reaches 5-8 μm.
22nd, outer layer alkali etching --- outer layer dry film is returned using organic film liquid that takes off first, expose should not layers of copper, so
Unwanted layers of copper is etched away using alkaline etching liquid afterwards, and is unaffected above line layer due to there is tin layers protection,
Finally the tin on circuit surface layer is returned using nitric acid, finally obtains the outer-layer circuit of needs.Wherein, PCB crosses the speed for taking off film line
For 1.2m/min, time 3.75min；The speed of overetch line is 3.0m/min, time 1.5min；Cross the speed for moving back solder
Respectively 3.0m/min, time 1.0min.
23rd, outer layer AOI --- using automatic optical detecting system, by the comparison with CAM data, detection outer-layer circuit is
It is no to have the defects of open circuit, notch, not cleaning, short-circuit etching.
24th, welding resistance --- by making green oil layer in PCB outer layers, green oil thickness is：10-50 μm, so as to so that soft or hard
Board can reduce influence of the environmental change to it during subsequent use.
25th, sink that nickel gold --- nickel layer thickness is：3-5μm；Layer gold thickness is：0.05-0.1μm.
26th, the deep gong of molding control --- by the waste material of Rigid Flex windowed regions by deep-controlled gong plate mode from product
Its soft board part is exposed in upper stripping.
27th, laser cutting molding --- by Rigid Flex soft board shape molding by way of laser cutting, cut tolerance
For +/- 0.05mm.
27th, it is molded --- the frame gong of the tooling hole used and other booster actions is fallen, by Rigid Flex hardboard side
Shape molding, and by product gong into the shipment unit of customer requirement, molding tolerance is：±0.1mm.
29th, electrical testing --- the electrically conducting performance of production board is tested, this plate is using test method：Flying probe.
30th, FQC --- check whether the appearance of production board meets the requirement of client.
31st, pack --- according to the manner of packing and packaging quantity of customer requirement, cell board is used into vacuum packaging.
It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (10)
1. a kind of production method of flexible and hard combined circuit board filling holes with resin, which is characterized in that include the following steps：
S1：Make the inner line figure of soft board core plate and hardboard core plate respectively, the corresponding drilling position of the inner line figure
Equipped with the isolated pad more than required boring aperture；
S2：Soft board core plate and hardboard core plate are pressed into flexible and hard combined circuit board with PP；
S3：The drilling of filling holes with resin needed for being drilled out on flexible and hard combined circuit board；
S4：Heavy copper, plating on drill hole inner wall；
S5：Potting resin in drilling after plating, then primary solidification resin；
S6：It is polished off by nog plate and overflows the remaining resin of flexible and hard combined circuit board copper face.
2. the production method of flexible and hard combined circuit board filling holes with resin according to claim 1, which is characterized in that the step
In S1, the diameter for isolating pad is bigger more than 0.2mm than required boring aperture.
3. the production method of flexible and hard combined circuit board filling holes with resin according to claim 1, which is characterized in that the step
In S2, the PP is NO-FLOW PP.
4. the production method of flexible and hard combined circuit board filling holes with resin according to claim 1, which is characterized in that the step
In S4, heavy copper using electric plating of whole board sink copper, be electroplated.
5. the production method of flexible and hard combined circuit board filling holes with resin according to claim 1, which is characterized in that the step
In S5, potting resin is using screen printing net plate printing filling in drilling.
6. the production method of flexible and hard combined circuit board filling holes with resin according to claim 5, which is characterized in that screen printing net plate
Mesh aperture it is bigger more than 0.2mm than the boring aperture of required plate filling holes with resin.
7. the production method of flexible and hard combined circuit board filling holes with resin according to claim 5, which is characterized in that the tree
Fat is UV solidified resins.
8. the production method of flexible and hard combined circuit board filling holes with resin according to claim 1, which is characterized in that the step
In S6, the nog plate uses nonwoven fabric nog plate.
9. the production method of flexible and hard combined circuit board filling holes with resin according to claim 1, which is characterized in that further include with
Lower step：
S7：It is thick to required surface layer copper that copper is subtracted by etching solution；
S8：Subtract the flexible and hard combined circuit board surface after copper and grind off the resin for drilling position being caused to be protruded because subtracting copper through nonwoven fabric nog plate；
S9：Flexible and hard combined circuit board is toasted, cures the resin of consent, then heavy copper, plating covering flexible and hard combined circuit board
The resin that surface is exposed.
10. the production method of flexible and hard combined circuit board filling holes with resin according to claim 9, which is characterized in that the step
In rapid S9, heavy copper, plating sink copper, plating for full plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510520238.1A CN105228375B (en) | 2015-08-21 | 2015-08-21 | A kind of production method of flexible and hard combined circuit board filling holes with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510520238.1A CN105228375B (en) | 2015-08-21 | 2015-08-21 | A kind of production method of flexible and hard combined circuit board filling holes with resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105228375A CN105228375A (en) | 2016-01-06 |
| CN105228375B true CN105228375B (en) | 2018-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510520238.1A Expired - Fee Related CN105228375B (en) | 2015-08-21 | 2015-08-21 | A kind of production method of flexible and hard combined circuit board filling holes with resin |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108040427A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | One kind solves the undesirable method of Rigid Flex filling holes with resin nog plate |
| CN111405758A (en) * | 2019-01-03 | 2020-07-10 | 鸿富锦精密工业(武汉)有限公司 | Circuit board processing method and circuit board |
| CN111343790B (en) * | 2020-03-09 | 2023-01-10 | 四川锐宏电子科技有限公司 | PCB soft and hard combination process |
| CN112752436B (en) * | 2020-11-30 | 2023-08-08 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board |
| CN112770546A (en) * | 2020-12-30 | 2021-05-07 | 深圳市合成快捷电子科技有限公司 | Manufacturing method of high-precision rigid-flexible circuit board |
| CN113109698B (en) * | 2021-04-13 | 2024-08-02 | 深圳市三维电路科技有限公司 | Defect testing method for multilayer soft and hard combined circuit board |
| CN113766751B (en) * | 2021-09-28 | 2023-03-14 | 信利半导体有限公司 | Compound screen plate for plugging holes and manufacturing process thereof |
| CN114603417B (en) * | 2022-03-31 | 2023-01-24 | 生益电子股份有限公司 | PCB grinding method, PCB back grinding device and PCB |
| CN117769160A (en) * | 2023-10-26 | 2024-03-26 | 深圳明阳电路科技股份有限公司 | Electroplating processing method and system for communication backboard and printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1417855A (en) * | 2001-10-31 | 2003-05-14 | 新光电气工业株式会社 | Multilayer substrate for semiconductor device |
| CN1765161A (en) * | 2003-04-18 | 2006-04-26 | 揖斐电株式会社 | Rigid-flex wiring board |
| CN104135814A (en) * | 2013-05-02 | 2014-11-05 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794835A (en) * | 1993-09-21 | 1995-04-07 | Nippon Avionics Co Ltd | Flexible rigid printed wiring board |
| JP3540396B2 (en) * | 1994-11-11 | 2004-07-07 | 株式会社東芝 | Manufacturing method of printed wiring board |
| JP2002290014A (en) * | 2001-03-26 | 2002-10-04 | Toray Eng Co Ltd | Method of forming metallic circuit pattern |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1417855A (en) * | 2001-10-31 | 2003-05-14 | 新光电气工业株式会社 | Multilayer substrate for semiconductor device |
| CN1765161A (en) * | 2003-04-18 | 2006-04-26 | 揖斐电株式会社 | Rigid-flex wiring board |
| CN104135814A (en) * | 2013-05-02 | 2014-11-05 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
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| CN105228375A (en) | 2016-01-06 |
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