CN106982513A - A kind of method of selective resin consent - Google Patents
A kind of method of selective resin consent Download PDFInfo
- Publication number
- CN106982513A CN106982513A CN201710370108.3A CN201710370108A CN106982513A CN 106982513 A CN106982513 A CN 106982513A CN 201710370108 A CN201710370108 A CN 201710370108A CN 106982513 A CN106982513 A CN 106982513A
- Authority
- CN
- China
- Prior art keywords
- substrate
- aluminium flake
- resin
- hole
- lamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Abstract
A kind of method of selective resin consent, the step of realizing be：When A, substrate drilling, retain aluminium flake and used to lamination, being drilled with aluminium flake needs the hole of filling holes with resin；B, heavy copper normal to substrate progress, whole plate plating are processed；C, to substrate carry out OSP processing；D, the aluminium flake that step A is retained are directed at riveted on substrate；E, using prepreg vacuum lamination, resin filling is carried out to the hole of substrate；F, the aluminium flake on substrate and the PP pieces after solidification are peeled off together；G, mechanical polish-brush is used to remove the unnecessary resin of substrate surface.The present invention use drilling aluminium flake as template, and substrate surface is using OSP surface treatments, vacuum lamination filling holes with resin, then stripping aluminium flake and PP pieces, and this method is simple to operate, reliable in quality, cost are low, with short production cycle.
Description
Technical field
The invention belongs to wiring board manufacture technology field, and in particular to be a kind of method of selective resin consent.
Background technology
Wiring board has disk endoporus in manufacturing process（via in pad）, the filling of blind buried via hole resin or welding resistance consent
It is required that when filling up the requirement of bubble-free, the method to use filling holes with resin.
Filling holes with resin method ripe at present is vacuum wire mark method for plugging, it is necessary to use special rabbet ink, special
Half tone instrument, special vacuum grid printing apparatus and milling apparatus, have the shortcomings that cost is high, the time is long.
Using the method for vacuum lamination filling holes with resin, there are several ways：1st, the oxide-film on surface is ground away after brown, then
The surface of substrate is coated in using mould release, vacuum lamination potting resin is finally carried out, this mode can be all Kong Dousai
On, it is impossible to selective consent；2nd, it is attached to using PET film or other materials on substrate, then to needing filling holes with resin
The film of position is opened a window by the way of laser, finally carries out vacuum lamination filling holes with resin, and this method needs to carry out laser windowing
And pad pasting, it is limited to laser ablation aperture smaller, it is impossible to clog larger hole and thicker plate, the cost of laser ablation is higher.
3rd, then vacuum lamination filling holes with resin is carried out, this mode aluminium flake and resin are bonded to base as template using drilling aluminium flake
On plate, it is very difficult to remove.
Develop a kind of simple and easy to do, cost is low, the method for selective resin consent that can produce in batches is wiring board
What producer was badly in need of.
The content of the invention
To realize easy-to-use selective resin consent, the present invention is realized using following steps：
When A, substrate drilling, retain aluminium flake and used to lamination, being drilled with aluminium flake needs the hole of filling holes with resin；
B, heavy copper normal to substrate progress, whole plate plating are processed；
C, to substrate carry out OSP processing；
D, the aluminium flake that step A is retained are directed at riveted on substrate；
E, using prepreg vacuum lamination, resin filling is carried out to the hole of substrate；
F, the aluminium flake on substrate and the PP pieces after solidification are peeled off together；
G, mechanical polish-brush is used to remove the unnecessary resin of substrate surface；
Step A explanations：Aluminium flake was accomplished by originally in drilling, the aluminium flake of drilling should not be abandoned, needing the hole of consent in aluminium flake
On together drilled with substrate, and remain into lamination and use.
Carry out substrate surface OSP processing purpose be in order to allow aluminium flake stripping when easily from substrate surface separation,
Aluminium flake will not be produced and be bonded at situation about being peeled off to get off on substrate.
The one side configuration aluminium flake and PP pieces of substrate, another side configuration mould release membrance during lamination, allow it is resin melting after from the one of hole
End flows to the other end, reduces gas bubbles left in hole.
Vacuum must be used during lamination, to ensure that bubble is not present in hole.
The laminating parameters directly provided during lamination using PP material suppliers, it is not necessary to carry out low temperature lamination or others
Special parameter.
Mechanical polish-brush removes the resin on surface, can use adhesive-bonded fabric polish-brush, ceramic polish-brush or abrasive belt grinding machine.
Brief description of the drawings：
Configuration structure schematic diagram when Fig. 1 is lamination of the invention.
Embodiment：
To illustrate the specific implementation method of the present invention, the present invention is described in further detail below in conjunction with the accompanying drawings：
A, drilling, substrate thickness 1.6mm are, it is necessary to which the pore size of consent is 0.3mm, and when substrate drills, every block of plate configures one
Aluminium flake, aluminium flake thickness 0.15mm is ground flash removed after aluminium flake drilling using 400 mesh adhesive-bonded fabric polish-brushes.
It is 25um that B, substrate, which carry out plating copper thickness in normal electroless copper plating and whole plate plating, hole,.
C, plating metacoxal plate carry out OSP processing, and OSP liquid medicine uses F2 (LX) PLUS that four countries are melted into.
D, aluminium flake be aligned riveted on substrate, rivet hole drilling when get out together, rivet hole boring aperture is
3.175mm, rivet diameter is 3.10mm.
E, the PP pieces SP175M raw benefit（Resin content 92%, thickness 0.2mm）One be placed on aluminium flake homonymy carry out group
A mould release membrance is respectively put on plate, outermost two sides, using progress resin filling in device to hole by the way of vacuum lamination.
After the completion of F, lamination, aluminium flake is peeled off together with the PP pieces after solidification.
G, the resin for removing using abrasive belt grinding machine plate face, the granularity of abrasive band abrasive material is 400#, nog plate speed 1.5m/min,
Anyhow to each grinding twice, so far the process of selective resin consent is fully completed.
After the completion of consent, heavy copper plating can be carried out on plug socket resin as needed；If not needing plug socket resin
Upper plating, that is just directly entered circuit making, completes circuit board manufacturing process flow below.
Invention uses vacuum laminator and PP materials, OSP using existing drilling aluminium flake in wiring board manufacturing process, increase
Line, it is not necessary in addition special filling holes with resin machine, also without special rabbet ink and half tone instrument, can produce in batches.
This method merely add the PP pieces for providing plug socket resin and the OSP films for providing release effect on material, use
General vacuum laminator and grinder, cost are relatively low.
This method is due to being that the direct PP pieces resin using wiring board carries out consent, without other external materials, consent
Reliable in quality.
This method need not make the special instrument such as half tone and special process, while adapting to a small amount of and substantial amounts of
Production, the production time is shorter.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, and any technology done according to the present invention extends or recreated, by this
The protection of invention.
Claims (5)
1. a kind of technique of selective resin consent, its feature comprises the following steps：
When A, substrate drilling, retain aluminium flake and used to lamination, being drilled with aluminium flake needs the hole of filling holes with resin；
B, heavy copper normal to substrate progress, whole plate plating are processed；
C, to substrate carry out OSP processing；
D, the aluminium flake that step A is retained are directed at riveted on substrate；
E, using prepreg vacuum lamination, resin filling is carried out to the hole of substrate；
F, the aluminium flake on substrate and the PP pieces after solidification are peeled off together；
G, mechanical polish-brush is used to remove the unnecessary resin of substrate surface；
Making programme according to claim 1, it is characterised in that being got out in step A on aluminium flake needs filling holes with resin
Hole, aluminum flake surface is used by grinding, and retaining aluminium flake into step D.
2. carrying out OSP processing using substrate surface in step C according to claim 1, one layer of barrier film is formed, in favor of
The stripping of aluminium flake after consent.
3. step E according to claim 1, combining structure during vacuum lamination is followed successively by from top to bottom：Mould release membrance, PP
Piece, aluminium flake, substrate, mould release membrance.
4. step F according to claim 1, peels off aluminium flake from substrate surface together with PP pieces.
5. step G according to claim 1, the resin that substrate surface and hole side are remained is removed using mechanical polish-brush.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710370108.3A CN106982513A (en) | 2017-05-23 | 2017-05-23 | A kind of method of selective resin consent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710370108.3A CN106982513A (en) | 2017-05-23 | 2017-05-23 | A kind of method of selective resin consent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106982513A true CN106982513A (en) | 2017-07-25 |
Family
ID=59342853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710370108.3A Pending CN106982513A (en) | 2017-05-23 | 2017-05-23 | A kind of method of selective resin consent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106982513A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561586A (en) * | 2017-09-27 | 2019-04-02 | 深圳市博敏电子有限公司 | High-frequency microwave multilayer board filling holes with resin method |
| CN109561582A (en) * | 2017-09-25 | 2019-04-02 | 北大方正集团有限公司 | The method of circuit board resin consent |
| CN111885833A (en) * | 2020-07-28 | 2020-11-03 | 深圳市迅捷兴科技股份有限公司 | Through hole blind hole pressing glue filling method |
| CN112512213A (en) * | 2019-09-16 | 2021-03-16 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6264862B1 (en) * | 1998-12-31 | 2001-07-24 | World Wiser Electronics Inc. | Method for manufacturing a plug |
| CN102548251A (en) * | 2011-12-12 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Printed circuit board (PCB) vacuum lamination hole-plugging process |
| CN105188278A (en) * | 2015-10-16 | 2015-12-23 | 深圳市迅捷兴电路技术有限公司 | Resin plug hole stitching structure and resin plug hole technology |
| CN105792528A (en) * | 2016-04-07 | 2016-07-20 | 奥士康科技股份有限公司 | Replaced blind hole plate resin hole plugging process method |
-
2017
- 2017-05-23 CN CN201710370108.3A patent/CN106982513A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6264862B1 (en) * | 1998-12-31 | 2001-07-24 | World Wiser Electronics Inc. | Method for manufacturing a plug |
| CN102548251A (en) * | 2011-12-12 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Printed circuit board (PCB) vacuum lamination hole-plugging process |
| CN105188278A (en) * | 2015-10-16 | 2015-12-23 | 深圳市迅捷兴电路技术有限公司 | Resin plug hole stitching structure and resin plug hole technology |
| CN105792528A (en) * | 2016-04-07 | 2016-07-20 | 奥士康科技股份有限公司 | Replaced blind hole plate resin hole plugging process method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561582A (en) * | 2017-09-25 | 2019-04-02 | 北大方正集团有限公司 | The method of circuit board resin consent |
| CN109561582B (en) * | 2017-09-25 | 2020-09-04 | 北大方正集团有限公司 | Method for plugging hole with circuit board resin |
| CN109561586A (en) * | 2017-09-27 | 2019-04-02 | 深圳市博敏电子有限公司 | High-frequency microwave multilayer board filling holes with resin method |
| CN112512213A (en) * | 2019-09-16 | 2021-03-16 | 深南电路股份有限公司 | Circuit board manufacturing method and circuit board |
| CN111885833A (en) * | 2020-07-28 | 2020-11-03 | 深圳市迅捷兴科技股份有限公司 | Through hole blind hole pressing glue filling method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 526236 Sihui Electronics Industry Base No. 3, Xiamen Town, Fourth Meeting, Zhaoqing City, Guangdong Province Applicant after: Sihui Fu Shi electronic Polytron Technologies Inc Address before: 526236 Electronics Industry Base No. 3, Xiamen Town, Sihui City, Zhaoqing City, Guangdong Province Applicant before: Sihui Fuji Electronics Technology Co.,Ltd. |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170725 |