CN109561586A - High-frequency microwave multilayer board filling holes with resin method - Google Patents
High-frequency microwave multilayer board filling holes with resin method Download PDFInfo
- Publication number
- CN109561586A CN109561586A CN201710892012.3A CN201710892012A CN109561586A CN 109561586 A CN109561586 A CN 109561586A CN 201710892012 A CN201710892012 A CN 201710892012A CN 109561586 A CN109561586 A CN 109561586A
- Authority
- CN
- China
- Prior art keywords
- resin
- pcb board
- hole
- frequency microwave
- filling holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Abstract
The present invention relates to a kind of high-frequency microwave multilayer board filling holes with resin methods, characterized in that it comprises the following steps: S1, the core plate surface coating prepreg to consent；S2, vacuum lamination formation multi-layer PCB board is carried out to two blocks of core plates using vacuum laminator；Resin is packed into hole on S3, multi-layer PCB board；S4, make multi-layer PCB board resin solidification using the mode of heat baking；S5, the resin for overflowing the hole on multi-layer PCB board is removed.Pcb board bears the ability of external force when the present invention can also improve resin ground while reducing the resin ground time, prevents pcb board stress excessive impaired, improves production efficiency and product yield.
Description
Technical field
The present invention relates to pcb board fields, and in particular to a kind of high-frequency microwave multilayer board filling holes with resin method.
Background technique
PCB (Printed Circuit Board), Chinese is printed wiring board, and abbreviation printed board is electronics industry
One of important component, be the supporter of electronic component, the carrier of electrical connection.It need to usually design buried via hole in PCB, and
PCB then needs to be filled and led up buried via hole with resin to carry out the processes such as subsequent pressing when making, and filling holes with resin is inside PCB industry
Using more and more extensive, it is desirable to use filling holes with resin to solve a series of plugging green oil or pressing to be used to fill out resin institute not
The problem of can solve, currently, when PCB filling holes with resin technique consent needing that the resin at the both ends of the through-hole on core plate will be overflowed
It disposes, is removed using the mode of mechanical lapping, and when mechanical lapping, can make pcb board that harmomegathus deformation occur, it is right
Pcb board causes certain damage.
Summary of the invention
Based on this, it is necessary in view of the above problems, providing a kind of high-frequency microwave multilayer board filling holes with resin method, including following
Step:
S1 including core plate offer hole on the core, first by the inner surface laying prepreg to the core plate of consent；
S2, vacuum lamination formation multi-layer PCB board is carried out to core plate using vacuum laminator；
Resin is packed into hole on S3, multi-layer PCB board；
S4, enable the resin solidification in the hole of the pcb board using the mode of heat baking；
S5, because of filling when part resin will form spilling layer, removed with tool and overflow layer, so that multi-layer PCB board surfacing.
It wherein, is the plate of whole plate plating completion to the core plate of consent, and the thickness of layers of copper reaches customer requirement in hole
Thickness；When two blocks of core plates are laminated, the prepreg between two blocks of core plates can be extruded to the hole of core plate
It is interior, thus plugging hole, and potting resin can guarantee Kong Saiman under vacuum conditions, and avoid in resin with bubble；
In this way, since the one end in the hole on core plate has been blocked, resin only can be another in the step of inserting resin below
One end is overflowed, then is ground when protruding from the resin of pcb board after consent, it is only necessary to grind the one end in the hole on core plate, reduction is ground
Mill amount, to reduce process time, the reduction of amount of grinding also can be reduced the time that multi-layer PCB board bears external force when being ground,
Further play a protective role to multi-layer PCB board；Meanwhile when the external force of grinding is excessive, multi-layer PCB board may be made to deform and damage
Bad multi-layer PCB board, therefore the present invention will carry out again the grinding of resin after two pieces of core plates pressings, so that grinding is multi-layer PCB board
Thickness it is thicker, bigger external force can be born, prevent multi-layer PCB board from deforming in grind resin.
Preferably, the area of prepreg is consistent with the area of the core plate.
Prepreg has certain viscosity, it is available there are many kinds of thickness, can fold reaching to circuit board
Thickness degree is adjusted to achieve the purpose that control impedance while bond core plate, can make to be bonded completely between core plate.
Preferably, the resin filling is filled using screen printing process.
Screen printing process carries out the consent technology that consent is the prior art, and popularity rate is high, therefore the available machine of consent process
Device is more, for example, not being very high product to consent requirement, just can be carried out consent using common screen printer.
Preferably, the S3 step carries out under vacuum conditions.
Potting resin can guarantee that resin fills full hole under vacuum conditions, and avoid in resin with bubble.
Preferably, step S5 overflows the resin in the hole on multi-layer PCB board using the method removal of mechanical polish-brush.
Mechanical polish-brush mode can be needle brush, nonwoven fabric polish-brush, ceramic polish-brush and abrasive belt grinding machine polish-brush, compared to chemistry
Mode not will cause chemical medicinal liquid and caused to other regions of multi-layer PCB board using mechanical polish-brush mode extra resin of going out
The result of damage.
Preferably, further include the steps that core plate brownification is handled, the preposition step that the core plate brownification processing is step S1
Suddenly.
Be chemically treated using layers of copper inside acid medium device to hole, formed one layer it is uniform, have excellent bonds characteristic
Metal-organic complex, the roughness for increasing copper surface avoids copper from being aoxidized for the second time simultaneously, and the increase of copper surface roughness
Resin can be improved in the binding force on copper surface, in case resin and hole wall engaging portion are secured in hole.
Preferably, it is packed into after resin in hole of the step S3 on multi-layer PCB board, it is preliminary into being carried out to the resin
The step of solidification.
For the ease of grinding, resin is ground when resin solidification is fully cured not yet to certain hardness, this
When resin hardness tell somebody what one's real intentions are, therefore its grinding operation is more easier, after having ground, then resin is fully cured, completes plug
Hole.
Further, it is 4H that the resin, which is just cured to hardness,.
Practice have shown that, resin is just cured to hardness when being 4H, and grinding effect is best by a large amount of.
The principle of the present invention, effect are further illustrated below with reference to above-mentioned technical proposal:
The present invention first will carry out again consent after two blocks of core plates and the pressing of pp piece, and pp piece is squeezed into hole when heating pressing,
It only needs that resin is filled in in hole the region for not squeezing into pp piece when consent, compared to single core plate consent, i.e., only needs
The one end in the hole of core plate carries out the grinding of resin, and the amount of resin for needing to grind halves, and amount of grinding, which halves not only save, to be added
Between working hour, but also can be reduced pcb board by the external force time, thus reduce pcb board damage possibility；Meanwhile by two pieces of core
The grinding of resin is carried out after plate pressing again, the thickness of multi-layer PCB board is thicker when can to grind, and can bear bigger pressure.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, below in conjunction with embodiment, the invention will be described in further detail:
Embodiment one
A kind of high-frequency microwave multilayer board filling holes with resin method, characterized in that it comprises the following steps:
S1, brownification processing is carried out to core plate with acid medium；
S2 including core plate offer hole on the core, first by the inner surface laying prepreg to the core plate of consent；
S3, vacuum lamination formation multi-layer PCB board is carried out to core plate using vacuum laminator；
S4, it brushes under vacuum conditions into resin in the hole using wire mark jack process on multi-layer PCB board；
S5, make multi-layer PCB board resin primary solidification to a thickness of 4H using the mode of heat baking；
S6, the resin that the hole on multi-layer PCB board is overflowed after solidifying is removed using ceramic grinding；
S7, the resin in multi-layer PCB plate hole is fully cured using the mode of baking.
Embodiment two
A kind of high-frequency microwave multilayer board filling holes with resin method, characterized in that it comprises the following steps:
S1 including core plate offer hole on the core, first by the inner surface laying prepreg to the core plate of consent；
S2, vacuum lamination formation multi-layer PCB board is carried out to core plate using vacuum laminator；
S3, it is brushed in hole on multi-layer PCB board into resin using wire mark jack process；
S4, make multi-layer PCB board resin primary solidification to hardness 4H using the mode of heat baking；
S5, the resin that the hole on multi-layer PCB board is overflowed after solidifying is removed using ceramic grinding；
S6, the resin in multi-layer PCB plate hole is fully cured using the mode of baking.
Embodiment three
A kind of high-frequency microwave multilayer board filling holes with resin method, characterized in that it comprises the following steps:
S1 including core plate offer hole on the core, first by the inner surface laying prepreg to the core plate of consent；
S2, vacuum lamination formation multi-layer PCB board is carried out to core plate using vacuum laminator；
S3, it is brushed in hole on multi-layer PCB board into resin using wire mark jack process；
S4, make multi-layer PCB board resin primary solidification using the mode of heat baking；
S5, the resin that the hole on multi-layer PCB board is overflowed after solidifying is removed using ceramic grinding；
S6, the resin in multi-layer PCB plate hole is fully cured using the mode of baking.
Example IV
A kind of high-frequency microwave multilayer board filling holes with resin method, characterized in that it comprises the following steps:
S1 including core plate offer hole on the core, first by the inner surface laying prepreg to the core plate of consent；
S2, vacuum lamination formation multi-layer PCB board is carried out to core plate using vacuum laminator；
S3, under vacuum conditions, is packed into resin in the hole on multi-layer PCB board using wire mark jack process；
S4, make multi-layer PCB board resin solidification using the mode of heat baking；
S5, the resin for overflowing the hole on multi-layer PCB board is removed.
Embodiment five
A kind of high-frequency microwave multilayer board filling holes with resin method, characterized in that it comprises the following steps:
S1 including core plate offer hole on the core, first by the inner surface laying prepreg to the core plate of consent；
S2, vacuum lamination formation multi-layer PCB board is carried out to core plate using vacuum laminator；
Resin is packed into hole on S3, multi-layer PCB board；
S4, make multi-layer PCB board resin solidification using the mode of heat baking；
S5, the resin for overflowing the hole on multi-layer PCB board is removed using belt-sanding.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (8)
1. a kind of high-frequency microwave multilayer board filling holes with resin method, characterized in that it comprises the following steps:
S1 including core plate offer hole on the core, first by the inner surface laying prepreg to the core plate of consent；
S2, vacuum lamination formation multi-layer PCB board is carried out to core plate using vacuum laminator；
Resin is packed into hole on S3, multi-layer PCB board；
S4, enable the resin solidification in the hole of the pcb board using the mode of heat baking；
S5, because of filling when part resin will form spilling layer, removed with tool and overflow layer, so that multi-layer PCB board surfacing.
2. high-frequency microwave multilayer board filling holes with resin method according to claim 1, which is characterized in that the prepreg
Area is consistent with the area of the core plate.
3. high-frequency microwave multilayer board filling holes with resin method according to claim 1, which is characterized in that the resin filling is adopted
It is filled with screen printing process.
4. high-frequency microwave multilayer board filling holes with resin method according to claim 1, which is characterized in that the S3 step is true
It is carried out under Altitude.
5. high-frequency microwave multilayer board filling holes with resin method according to claim 1, which is characterized in that step S5 uses mechanical
The resin in the hole on multi-layer PCB board is overflowed in the method removal of polish-brush.
6. high-frequency microwave multilayer board filling holes with resin method according to claim 1, which is characterized in that further include core plate palm fibre
The step of changing processing, the previous step that the core plate brownification processing is step S1.
7. high-frequency microwave multilayer board filling holes with resin method according to claim 1, which is characterized in that step S3 is in multilayer
It is packed into after resin in hole on pcb board, into the step of carrying out primary solidification to the resin.
8. high-frequency microwave multilayer board filling holes with resin method according to claim 7, which is characterized in that the resin just solidifies
It is 4H to hardness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892012.3A CN109561586A (en) | 2017-09-27 | 2017-09-27 | High-frequency microwave multilayer board filling holes with resin method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892012.3A CN109561586A (en) | 2017-09-27 | 2017-09-27 | High-frequency microwave multilayer board filling holes with resin method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109561586A true CN109561586A (en) | 2019-04-02 |
Family
ID=65864064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710892012.3A Pending CN109561586A (en) | 2017-09-27 | 2017-09-27 | High-frequency microwave multilayer board filling holes with resin method |
Country Status (1)
| Country | Link |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101336052A (en) * | 2008-07-30 | 2008-12-31 | 惠州中京电子科技有限公司 | Jack process of printed circuit board |
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN103249265A (en) * | 2013-05-21 | 2013-08-14 | 无锡江南计算技术研究所 | Blind hole filling method |
| CN104349612A (en) * | 2013-08-05 | 2015-02-11 | 北大方正集团有限公司 | Manufacturing method of multi-layer circuit board and circuit board manufactured by manufacturing method |
| CN104661445A (en) * | 2013-11-25 | 2015-05-27 | 深圳崇达多层线路板有限公司 | Resin hole plugging method capable of preventing ink overflow |
| CN205946365U (en) * | 2016-08-24 | 2017-02-08 | 深圳市爱升精密电路科技有限公司 | Battery protection PCB circuit board |
| CN106982513A (en) * | 2017-05-23 | 2017-07-25 | 四会富士电子科技有限公司 | A kind of method of selective resin consent |
-
2017
- 2017-09-27 CN CN201710892012.3A patent/CN109561586A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101336052A (en) * | 2008-07-30 | 2008-12-31 | 惠州中京电子科技有限公司 | Jack process of printed circuit board |
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN103249265A (en) * | 2013-05-21 | 2013-08-14 | 无锡江南计算技术研究所 | Blind hole filling method |
| CN104349612A (en) * | 2013-08-05 | 2015-02-11 | 北大方正集团有限公司 | Manufacturing method of multi-layer circuit board and circuit board manufactured by manufacturing method |
| CN104661445A (en) * | 2013-11-25 | 2015-05-27 | 深圳崇达多层线路板有限公司 | Resin hole plugging method capable of preventing ink overflow |
| CN205946365U (en) * | 2016-08-24 | 2017-02-08 | 深圳市爱升精密电路科技有限公司 | Battery protection PCB circuit board |
| CN106982513A (en) * | 2017-05-23 | 2017-07-25 | 四会富士电子科技有限公司 | A kind of method of selective resin consent |
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Application publication date: 20190402 |