CN105228375A - A kind of manufacture method of flexible and hard combined circuit board filling holes with resin - Google Patents
A kind of manufacture method of flexible and hard combined circuit board filling holes with resin Download PDFInfo
- Publication number
- CN105228375A CN105228375A CN201510520238.1A CN201510520238A CN105228375A CN 105228375 A CN105228375 A CN 105228375A CN 201510520238 A CN201510520238 A CN 201510520238A CN 105228375 A CN105228375 A CN 105228375A
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- China
- Prior art keywords
- resin
- flexible
- circuit board
- combined circuit
- hard combined
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of manufacture method of flexible and hard combined circuit board filling holes with resin, relate to wiring board production technical field.Described manufacture method comprises: S1: the inner line figure making soft board central layer and hardboard central layer respectively, and the boring position that described line pattern is corresponding is provided with the isolated pad being greater than required boring aperture; S2: soft board central layer and hardboard central layer PP are pressed into flexible and hard combined circuit board; S3: the boring getting out required filling holes with resin on flexible and hard combined circuit board; S4: heavy copper, plating on drill hole inner wall; S5: potting resin in boring after plating, then primary solidification resin; S6: polished off by nog plate and overflow the residual resin of flexible and hard combined circuit board copper face.The present invention isolates pad by retaining bore position internal layer circuit, ensure bore position thickness, can the NO-FLOW because flexible and hard combined circuit board uses be avoided? the weak hole site copper face depression problem excessively caused of PP filler ability, decreases resin nog plate and does not totally cause doing over again of manual grinding.
Description
Technical field
The present invention relates to wiring board production technical field, especially design a kind of manufacture method of flexible and hard combined circuit board filling holes with resin.
Background technology
In flexible and hard combined circuit board design, because of the restriction of product design wiring space, below part surface pad, be provided with via hole, for ensureing the welding quality of components and parts in surface pads, via hole below surface pads needs to be applied to jack process, to ensure the planarization of surface pads.
Resin ink plugging is the most frequently used in current jack process arriving.After making inner figure, pressing, boring, figure plated hole, resin ink will be filled up in via hole by silk screen or aluminium flake mode of printing, after baking-curing, abrasive belt grinding polishes off the resin screed face that overflow copper face, and follow-up heavy copper plate electric again, made the plug socket resin of hole site be covered by layers of copper.
There is following defect in existing this way:
As shown in Figure 2, when making inner figure, the pad of the corresponding via hole of internal layer layers of copper 24 26 is etched, the mobility of the NO-FLOWPP glue that flexible and hard combined circuit board lamination uses is poor, after pressing, via hole 26 corresponding internal layer layers of copper 24 is filled by the first adjacent base material 21 and the second base material 22 without copper position, thus causes the surperficial first base copper 23 correspondence position surface of the first base material 21, the surperficial second base copper 25 correspondence position depression of the second base material 22; Figure plated hole after boring, figure plated hole can near via hole 26 certain thickness copper on plated surface, copper facing 27 and the depression in the surface on surface form the groove 29 of annular, and groove 29 is difficult to be polished smooth, after resin 28 consent, overflow is difficult to remove to the resin 28 in groove 29 by abrasive belt grinding, needs hand sand, expends the many artificial and time.
Summary of the invention
Cross hole site copper face after the invention provides a kind of solution pressing for the problems referred to above and form groove problem, and consent rearward recess causes the manufacture method of the flexible and hard combined circuit board filling holes with resin of resin residue problem, concrete scheme is as follows:
A manufacture method for flexible and hard combined circuit board filling holes with resin, comprises the following steps:
S1: the inner line figure making soft board central layer and hardboard central layer respectively, the boring position that described line pattern is corresponding is provided with the isolated pad being greater than required boring aperture;
S2: soft board central layer and hardboard central layer PP are pressed into flexible and hard combined circuit board;
S3: the boring getting out required filling holes with resin on flexible and hard combined circuit board;
S4: heavy copper, plating on drill hole inner wall;
S5: potting resin in boring after plating, then primary solidification resin;
S6: polished off by nog plate and overflow the residual resin of flexible and hard combined circuit board copper face.
Preferably, in described step S1, the diameter 0.2mm more than larger than required boring aperture of isolated pad, preferred 0.2-0.5mm.
Preferably, in described step S2, described PP is NO-FLOWPP.
Preferably, in described step S4, heavy copper adopts electric plating of whole board to sink copper, plating.
Preferably, in described step S5, in boring, potting resin adopts screen printing net plate printing to fill; Preferably, the mesh aperture 0.2mm more than larger than the boring aperture of required plate filling holes with resin of screen printing net plate, preferred 0.2-0.5mm.Described resin is UV cured resin.
Preferably, in described step S6, described nog plate adopts adhesive-bonded fabric nog plate.
Further, the manufacture method of described flexible and hard combined circuit board filling holes with resin is further comprising the steps of:
S7: subtract copper by etching solution thick to required top layer copper;
S8: subtract the surface of the flexible and hard combined circuit board after copper and grind off the resin causing boring position to be protruded because subtracting copper through adhesive-bonded fabric nog plate;
S9: flexible and hard combined circuit board is toasted, the resin of solidification consent, more heavy copper, the surperficial resin exposed of plating covering flexible and hard combined circuit board.
Preferably, in described step S9, heavy copper, plating sink copper, plating for full plate.
The present invention is by the design of amendment multilayer flexible and hard combined circuit board internal layer circuit, retain bore position and isolate pad, ensure bore position thickness, the weak hole site copper face depression problem excessively caused of NO-FLOWPP filler ability because flexible and hard combined circuit board uses can be avoided, decrease resin nog plate and totally do not cause doing over again of manual grinding.
UV cured resin solidifies under w light, and its hardness meets after consent can not the requirement of blast hole, and just can be cleaned out by the resin that copper face remains easily by means of only adhesive-bonded fabric grinding, the resin residue problem that the groove avoiding copper facing to be formed causes.
Electric plating of whole board mode alternative pattern plated hole, avoids copper facing to form groove problem.Subtract copper after consent and can meet the thick problem of surface copper, subtract the grinding of the adhesive-bonded fabric after copper and can clean out because subtracting the copper outstanding resin guarantee plate face, position that causes holing smooth further.
Accompanying drawing explanation
Fig. 1 is the cross section structure schematic diagram after the embodiment of the present invention 1 flexible and hard combined circuit board filling holes with resin.
Fig. 2 is the cross section structure schematic diagram after existing flexible and hard combined circuit board filling holes with resin.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment technical scheme of the present invention being introduced further and illustrating.
Embodiment 1
Three layers of flexible and hard combined circuit board as shown in Figure 1, comprising between the first base material 11, second base material 12, first base material 11 and the second base material 12 is internal layer circuit copper, and the first base material 11 surface is covered with the first base copper 13, the second base material 12 surface and is covered with the first base copper 15.Need make on this flexible and hard combined circuit board and can be used for the filling holes with resin 16 that surface makes pad, manufacture method comprises the following steps:
Make inner line figure, the isolated pad 14 being greater than filling holes with resin 16 aperture is left in the boring position that line pattern is corresponding; The diameter 0.35mm larger than the aperture of filling holes with resin 16 of isolated pad.
Be pressed into flexible and hard combined circuit board with NO-FLOWPP, after pressing, the corresponding internal layer in surface of flexible and hard combined circuit board leaves the position projection of isolated pad 14.
On flexible and hard combined circuit board, correspondence position gets out the boring of required filling holes with resin.
Complete for flexible and hard combined circuit board plate is sunk copper, plating, make drill hole inner wall and flexible and hard combined circuit board surface attachment one deck electro-coppering 17.
Adopt screen printing net plate printing UV cured resin ink, potting resin 18 in the boring after heavy copper, then UV cured resin, make resin primary solidification; The mesh aperture 0.35mm larger than the boring aperture of required plate filling holes with resin of screen printing net plate.
By surperficial adhesive-bonded fabric nog plate, the resin of flexible and hard combined circuit board remained on surface is cleaned out, then that flexible and hard combined circuit board surface is reduced to required top layer copper is thick by subtracting copper etching;
Subtract the surface of the flexible and hard combined circuit board after copper and grind off the resin causing boring position to be protruded because subtracting copper again through adhesive-bonded fabric nog plate;
By flexible and hard combined circuit board baking and curing, more full plate sinks copper, plating and covers the resin that flexible and hard combined circuit board surface is exposed, and obtains the filling holes with resin that flexible and hard combined circuit board surface drilling position can be used for making pad.
Embodiment 2
The manufacture method of filling holes with resin of the present invention is adopted to make the PCB with following parameter request.
Core material:
0.075mm0.5/0.5OZ (not cupric) (2);
The number of plies: 8 layers;
Internal layer live width/line-spacing: 0.1mm/0.1mm, 0.091mm/0.1mm
Outer live width/line-spacing: 0.1/0.1mm (completing the thick 1.0OZ of copper);
Plate Tg: >=170 °;
Outer central layer 0.36mm0.5/0.5oz (not cupric) (2): 1/2OZ;
Hole copper thickness: 18um (min)/20um (ave);
Surface treatment: turmeric;
Complete thickness of slab: 1.6mm ± 10%;
Minimum bit: 0.2mm;
Boring radius-thickness ratio: 8:1;
Produce PNL size: 304mm × 457mm.
Concrete manufacture craft is as follows:
1, sawing sheet---as required different-thickness central layer quantity and produce plate PNL size 518mm*620mm, the sheet material of bulk is cut into the size into producing plate, so that produce.
2, internal layer circuit makes---with the circuit that 6-8 lattice exposure progression (21 lattice exposure guide rule) complete the exposure of internal layer circuit, development, acid etching, the method that takes off film make each level of internal layer, the boring position that internal layer circuit is corresponding is provided with the isolated pad being greater than required boring aperture, the diameter 0.35mm larger than the aperture of filling holes with resin 16 of isolated pad.Be not identical because internal layer each level copper is thick, therefore, need to use different etching parameters to carry out the making of internal layer circuit, the parameter that the thick 0.5/0.5OZ of copper uses is: 5.7 ± 0.8m/min.
3, brown---by the mode of chemical reaction, at a kind of brown oxidation layer of layers of copper Surface Creation, make the roughness of copper face become large, when strengthening pressing and the adhesion of coverlay.
4, microetch---sting erosion layers of copper surface by acid liquid medicine, know layers of copper surface oxidation and foreign material, strengthen when pressing soon and the adhesion of coverlay.
5, epiphragma is pasted---one deck coverlay is sticked in position of being windowed by No-FlowPP corresponding for internal layer soft board central layer, the copper cash of protection windowed regions.
The glue-line (epoxy resin) of coverlay and soft board central layer, by the mode of HTHP, bond and solidify in the short time by 6, quick pressing-----.Temperature 180+/-10 DEG C, pressure 80KG, time 120s.
7, brown---by the mode of chemical reaction, at a kind of brown oxidation layer of layers of copper Surface Creation, make the roughness of copper face become large, when strengthening pressing and the adhesion of No-flowPP.
8, pressing---by the mode of HTHP, the No-FlowPP (glass fabric of epoxy resin coating) of semi-cured state is reached the state of solidification, thus the soft board central layer of Rigid Flex internal layer and outer field hardboard central layer are pressed together.This plate pressing parameter is the special pressing parameter of No-FlowPP.
9, outer boring (only boring the PTH needing filling holes with resin)---using the mode of machine drilling, Rigid Flex getting out the through hole for making PTH, PTH can make to need can conducting between each level of conducting.
10, heavy copper---the mode of the hole wall through hole chemical reaction of through hole is deposited the thin copper of one deck, and for electric plating of whole board below provides basis, it is 9.0 grades that backlight progression requires.
11, electric plating of whole board---according to the mechanism of electrochemical reaction, power on the basis of heavy copper and plate one deck copper, ensure that hole copper thickness reaches product requirement, according to completing hole copper thickness setting electroplating parameter, electroplating parameter is: 1.2ASD*75min, and hole copper thickness is 19-23 μm.
12, filling holes with resin---to be engraved on by solid for UV light ink by silk-screen mode in the PTH needing to be clogged by resin, the mesh of screen printing net plate obtains the large 0.15mm in aperture than PTH.
13, UV light is solid---and penetrated resin ink primary solidification in PTH by UV illumination, reach certain degree of hardness, parameter: 1500mj/cm
2, speed: 2m/min.
14, adhesive-bonded fabric nog plate---by adhesive-bonded fabric polish-brush by clean for the resin ink on layers of copper surface clean.
15, microetch subtracts copper---by acid liquid medicine acid etching, by thinning for surface copper layer thickness, prepare for follow-up line pattern makes.
16, adhesive-bonded fabric nog plate---by adhesive-bonded fabric polish-brush, the resin ink protruded after thinning for surperficial layers of copper is cleaned out again, ensure that product surface is smooth.
17, baking sheet-by high-temperature baking, resin ink is thoroughly solidified, reaches certain stable state.Parameter: 150+/-5 DEG C, 30min
18, heavy copper---plug socket resin top layer, PTH position is deposited the thin copper of one deck by the mode of chemical reaction, for electric plating of whole board below provides basis.
19, electric plating of whole board---according to the mechanism of electrochemical reaction, power on plate one deck copper on the basis of heavy copper, for subsequent diagram plating provides basis, electroplating parameter is: 1.2ASD*60min, and copper layer thickness is 15+/-5um.
20, outer graphics---exposure, the development of outer-layer circuit is completed with 6-8 lattice exposure progression (21 lattice exposure guide rule).
21, graphic plating---as requested complete the thick setting electroplating parameter of copper, figure electro-coppering parameter is 1.25ASD*90min; Then online road surfaces plates one deck tin, and electrotinning parameter is all set as 1.5ASD*15min, and thickness reaches 5-8 μm.
22, outer alkali etching---first use organic film liquid that takes off to be returned by outer dry film; expose layers of copper not; then alkaline etching liquid is used unwanted layers of copper to be etched away; and owing to there being tin layers to protect above line layer; can not be affected; finally use nitric acid to be returned by the tin on circuit top layer, finally obtain the outer-layer circuit needed.Wherein, it is 1.2m/min that PCB crosses the speed taking off film line, and the time is 3.75min; The speed crossing etching line is 3.0m/min, and the time is 1.5min; Cross the speed of moving back solder and be respectively 3.0m/min, the time is 1.0min.
23, outer AOI---use automatic optical detecting system, whether by the contrast with CAM data, detecting outer-layer circuit has the defects such as open circuit, breach, etching are unclean, short circuit.
24, welding resistance---by making green oil layer at PCB skin, green oil thickness is: 10-50 μm, thus Rigid Flex can be made in follow-up use procedure can to reduce the impact of environmental change on it.
25, heavy nickel gold---nickel layer thickness is: 3-5 μm; Layer gold thickness is: 0.05-0.1 μm.
26, the dark gong of shaping control---the waste material of Rigid Flex windowed regions is peeled off from product by severity control gong plate mode, exposes its soft board part.
27, laser cutting is shaping---and by the mode of laser cutting by Rigid Flex soft board shape molding, cutting tolerance is +/-0.05mm.
27, shaping---fallen by the frame gong of the tooling hole of use and other booster actions, by Rigid Flex hardboard limit shape molding, and product gong is become the shipment unit of customer requirement, shaping tolerance is: ± 0.1mm.
The electrically conducting performance of 29, electrical testing---test product plate, this plate use test method is: flying probe.
30, FQC---check whether the outward appearance of production board meets the requirement of client.
31, pack---according to manner of packing and the packaging quantity of customer requirement, cell board is used vacuum packaging.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (10)
1. a manufacture method for flexible and hard combined circuit board filling holes with resin, is characterized in that, comprises the following steps:
S1: the inner line figure making soft board central layer and hardboard central layer respectively, the boring position that described line pattern is corresponding is provided with the isolated pad being greater than required boring aperture;
S2: soft board central layer and hardboard central layer PP are pressed into flexible and hard combined circuit board;
S3: the boring getting out required filling holes with resin on flexible and hard combined circuit board;
S4: heavy copper, plating on drill hole inner wall;
S5: potting resin in boring after plating, then primary solidification resin;
S6: polished off by nog plate and overflow the residual resin of flexible and hard combined circuit board copper face.
2. the manufacture method of flexible and hard combined circuit board filling holes with resin according to claim 1, is characterized in that, in described step S1, and the diameter 0.2mm more than larger than required boring aperture of isolated pad.
3. the manufacture method of flexible and hard combined circuit board filling holes with resin according to claim 1, is characterized in that, in described step S2, described PP is NO-FLOWPP.
4. the manufacture method of flexible and hard combined circuit board filling holes with resin according to claim 1, is characterized in that, in described step S4, heavy copper adopts electric plating of whole board to sink copper, plating.
5. the manufacture method of flexible and hard combined circuit board filling holes with resin according to claim 1, is characterized in that, in described step S5, in boring, potting resin adopts screen printing net plate printing to fill.
6. the manufacture method of flexible and hard combined circuit board filling holes with resin according to claim 5, is characterized in that, the mesh aperture 0.2mm more than larger than the boring aperture of required plate filling holes with resin of screen printing net plate.
7. the manufacture method of flexible and hard combined circuit board filling holes with resin according to claim 5, is characterized in that, described resin is UV cured resin.
8. the manufacture method of flexible and hard combined circuit board filling holes with resin according to claim 1, is characterized in that, in described step S6, described nog plate adopts adhesive-bonded fabric nog plate.
9. the manufacture method of flexible and hard combined circuit board filling holes with resin according to claim 1, is characterized in that, further comprising the steps of:
S7: subtract copper by etching solution thick to required top layer copper;
S8: subtract the surface of the flexible and hard combined circuit board after copper and grind off the resin causing boring position to be protruded because subtracting copper through adhesive-bonded fabric nog plate;
S9: flexible and hard combined circuit board is toasted, the resin of solidification consent, more heavy copper, the surperficial resin exposed of plating covering flexible and hard combined circuit board.
10. the manufacture method of flexible and hard combined circuit board filling holes with resin according to claim 1, is characterized in that, in described step S9, heavy copper, plating sink copper, plating for full plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510520238.1A CN105228375B (en) | 2015-08-21 | 2015-08-21 | A kind of production method of flexible and hard combined circuit board filling holes with resin |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510520238.1A CN105228375B (en) | 2015-08-21 | 2015-08-21 | A kind of production method of flexible and hard combined circuit board filling holes with resin |
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| CN105228375A true CN105228375A (en) | 2016-01-06 |
| CN105228375B CN105228375B (en) | 2018-06-15 |
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| CN201510520238.1A Expired - Fee Related CN105228375B (en) | 2015-08-21 | 2015-08-21 | A kind of production method of flexible and hard combined circuit board filling holes with resin |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108040427A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | One kind solves the undesirable method of Rigid Flex filling holes with resin nog plate |
| CN111343790A (en) * | 2020-03-09 | 2020-06-26 | 四川锐宏电子科技有限公司 | PCB soft and hard combination process |
| CN111405758A (en) * | 2019-01-03 | 2020-07-10 | 鸿富锦精密工业(武汉)有限公司 | Circuit board processing method and circuit board |
| CN112752436A (en) * | 2020-11-30 | 2021-05-04 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board |
| CN112770546A (en) * | 2020-12-30 | 2021-05-07 | 深圳市合成快捷电子科技有限公司 | Manufacturing method of high-precision rigid-flexible circuit board |
| CN113109698A (en) * | 2021-04-13 | 2021-07-13 | 深圳市三维电路科技有限公司 | Defect testing method for multi-layer soft and hard combined circuit board |
| CN113766751A (en) * | 2021-09-28 | 2021-12-07 | 信利半导体有限公司 | Compound screen plate for plugging holes and manufacturing process thereof |
| WO2023184727A1 (en) * | 2022-03-31 | 2023-10-05 | 生益电子股份有限公司 | Pcb grinding method, pcb regrinding device, and pcb |
| CN117769160A (en) * | 2023-10-26 | 2024-03-26 | 深圳明阳电路科技股份有限公司 | Electroplating processing method and system for communication backboard and printed circuit board |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108040427A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | One kind solves the undesirable method of Rigid Flex filling holes with resin nog plate |
| CN111405758A (en) * | 2019-01-03 | 2020-07-10 | 鸿富锦精密工业(武汉)有限公司 | Circuit board processing method and circuit board |
| CN111343790A (en) * | 2020-03-09 | 2020-06-26 | 四川锐宏电子科技有限公司 | PCB soft and hard combination process |
| CN112752436A (en) * | 2020-11-30 | 2021-05-04 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board |
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| CN112770546A (en) * | 2020-12-30 | 2021-05-07 | 深圳市合成快捷电子科技有限公司 | Manufacturing method of high-precision rigid-flexible circuit board |
| CN113109698A (en) * | 2021-04-13 | 2021-07-13 | 深圳市三维电路科技有限公司 | Defect testing method for multi-layer soft and hard combined circuit board |
| CN113766751A (en) * | 2021-09-28 | 2021-12-07 | 信利半导体有限公司 | Compound screen plate for plugging holes and manufacturing process thereof |
| WO2023184727A1 (en) * | 2022-03-31 | 2023-10-05 | 生益电子股份有限公司 | Pcb grinding method, pcb regrinding device, and pcb |
| CN117769160A (en) * | 2023-10-26 | 2024-03-26 | 深圳明阳电路科技股份有限公司 | Electroplating processing method and system for communication backboard and printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN105228375B (en) | 2018-06-15 |
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