CN111343790A - PCB soft and hard combination process - Google Patents
PCB soft and hard combination process Download PDFInfo
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- CN111343790A CN111343790A CN202010158181.6A CN202010158181A CN111343790A CN 111343790 A CN111343790 A CN 111343790A CN 202010158181 A CN202010158181 A CN 202010158181A CN 111343790 A CN111343790 A CN 111343790A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
The invention relates to a PCB board soft and hard combination process, which comprises the steps of hard board cutting and soft board cutting, wherein the hard board drilling adopts a drilling process, the soft board drilling utilizes low-temperature punching for drilling, copper is deposited on the single surface of a hard board, a layer of microstrip line film is deposited on the single surface of a soft board, the non-copper-deposited surface of the hard board and the non-microstrip line film-deposited surface of the soft board are adhered together, a layer of nanometer glue is coated in the middle of the clamping of the hard board and the soft board, and then the whole is placed in a vacuum chamber at 45-60 ℃ for pressing; carrying out pattern transfer on the copper deposition surface by using a film, and etching a microstrip line circuit on the microstrip line film by using an etching process; electroplating a gold nickel or tin layer on the copper-deposited line, removing the anti-electroplating covering film layer by using NaOH solution to expose the non-line copper layer, and corroding the copper layer at the non-line part by using a chemical reaction method; utilize the micro-carving technique to get rid of the microstrip line burr, this scheme combines together soft board and hardboard to make it be applied to different occasions, improved the suitability of PCB board.
Description
Technical Field
The invention relates to the field of PCB preparation, in particular to a PCB soft and hard combination process.
Background
Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. And (3) classifying according to the circuit layer number: it is divided into single-sided boards, double-sided boards and multi-layer boards. Common multilayer boards are generally 4-layer boards or 6-layer boards, and complex multilayer boards can reach dozens of layers.
PCB boards have three main types of divisions:
Single-Sided Boards (Single-Sided Boards) are on the most basic PCB with parts concentrated on one side and wires concentrated on the other side (same side as the wires when the patch elements are present, and the package devices on the other side). Such a PCB is called a Single-sided (Single-sided) board because the conductors are present on only one side thereof. Since single panels have many stringent constraints on the design of the circuitry (since only one side, the wires cannot cross and must be routed around individual paths), only early circuits used such panels.
Double-Sided Boards (Double-Sided Boards) are Boards that have wiring on both sides, but use wires on both sides and require appropriate electrical connections between the sides. Such "bridges" between circuits are called vias (via). The via hole is a small hole filled or coated with metal on the PCB, and can be connected with the wires on both sides. Because the area of the double-sided board is twice larger than that of the single-sided board, the double-sided board solves the difficulty of wiring staggering (conducting to the other side through holes) in the single-sided board, and the double-sided board is more suitable for being used on a circuit which is more complex than the single-sided board.
Multi-Layer Boards (Multi-Layer Boards) to increase the area over which wiring can be routed, more single or double sided wiring Boards are used. A printed circuit board with two inner layers and two outer layers or two inner layers and two outer layers is made up through alternative arrangement of positioning system and insulating adhesive material, and interconnection of conducting patterns according to design requirement. The number of layers of the board does not represent that there are several independent wiring layers, and in special cases, empty layers are added to control the board thickness, and the number of layers is usually even and includes two outermost layers. Most motherboards are 4 to 8-layer structures, but technically, it is theoretically possible to make a PCB with nearly 100 layers. Large supercomputers mostly use rather many layers of motherboards, but since such computers can already be replaced by clusters of many common computers, supercomputers have become increasingly unused. Because the layers in a PCB are closely coupled, the actual number is generally less visible, but it is still visible if the motherboard is carefully viewed.
Regardless of the specifications of the PCB, the components of the PCB are generally divided into a flexible board and a hard board, wherein the flexible board is a common flexible membrane, and the hard board is a common copper board. Generally, the flexible board is mainly used for microstrip line circuits, and the rigid board is mainly used for etching circuits by using an etching process. But the two are different in use occasions, so that the application of the two is limited. The traditional soft and hard combining process is to directly press a soft board and a hard board together by using the principles of viscose and extrusion, and the product performance is influenced because the soft board and the hard board have different hardness and the soft board surface is easily pressed and deformed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a soft and hard combination process of a PCB, which combines a soft board and a hard board together, thereby being applied to different occasions, improving the adaptability of the PCB and effectively avoiding the deformation of the soft board in the pressing process.
The purpose of the invention is realized by the following technical scheme:
a PCB soft-hard combination process comprises the following steps:
1) cutting: cutting plates meeting the requirements of customers on corresponding large plates of a soft plate and a hard plate according to the requirements of the engineering data MI, wherein a circle of excess materials are reserved at the edge of the hard plate;
2) drilling: drilling the required aperture at the corresponding position on the plate according to engineering data, wherein the hard plate is drilled by adopting a drilling process, and the soft plate is drilled by punching at low temperature;
3) plate surface treatment: depositing copper on one side of the hard board, and depositing a layer of microstrip line film on one side of the soft board;
4) plate surface pressing: adhering the non-copper-deposited surface of the hard board and the non-deposited surface of the microstrip line film of the soft board together, coating a layer of nano glue in the middle of the clamping of the hard board and the soft board, and then putting the whole into a vacuum chamber at 45-60 ℃;
5) fixing the hard board as a carrier at the bottom of the vacuum chamber, enabling the soft board to face upwards, continuously pressurizing the vacuum chamber, and keeping the temperature in the chamber constant in the pressurizing process until the soft board and the hard board are completely pressed;
6) cutting off a circle of excess materials reserved in the hard board after pressing is completed to obtain a board rigid-flexible board;
7) pattern transfer: carrying out pattern transfer on the copper deposition surface by using a film, and then drying → blasting → developing → checking; etching a microstrip line circuit on the microstrip line film by using an etching process;
8) and (3) copper deposition surface processing: electroplating a copper layer with the required thickness and a gold nickel or tin layer with the required thickness on the copper sheet or the hole wall exposed on the copper-deposited line pattern, removing the electroplating-resistant covering film layer by using NaOH solution to expose the non-line copper layer, and corroding the copper layer at the non-line part by using a chemical reaction method;
9) processing a microstrip line: and (3) removing the burrs of the microstrip line by using a micro-carving technology, and then cleaning, removing oil and drying.
Further, the method comprises a green oil step, wherein the green oil step is to transfer the pattern of a green oil film to a board to protect the circuit and prevent tin on the circuit during welding of parts, and comprises the steps of grinding the board → printing photosensitive green oil → curium board → exposing → developing; grinding board → printing the first side → baking board → printing the second side → baking board.
Further, the method comprises a forming process, namely, the method for gong the shape required by the customer through die stamping or numerical control gong machine gong comprises mechanical gong, beer board, hand gong and hand cutting.
Furthermore, the method also comprises a testing process, wherein the defects which are difficult to be found visually and affect the functionality, such as open circuit, short circuit and the like, are detected through an electronic 100% test, and the process is upper die → plate placing → test → qualified → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrap.
Further, the temperature of the vacuum chamber is 50 ℃.
Furthermore, the drilling of the soft board is finished in the low-temperature bin, the temperature of the soft board is controlled to be below 5 ℃, and the curling in the drilling process is avoided.
Furthermore, in the drilling process, a protective layer made of the same material is padded below the soft board.
Further, the thickness of the protective layer is not less than 10 mm.
The invention has the beneficial effects that: the original preparation process of the invention not only improves the joint degree of the soft board and the hard board, and enables the technical indexes to exceed the prior art, but also reduces the loss and the cost consumption in the preparation process.
Drawings
FIG. 1 is a schematic view of the inventive vacuum chamber internal pressing.
Detailed Description
The technical solution of the present invention is further described in detail with reference to the following specific examples, but the scope of the present invention is not limited to the following.
Example 1
A PCB soft-hard combination process comprises the following steps:
1) cutting: cutting the corresponding large plates of the soft plate 3 and the hard plate 2 into plates meeting the requirements of customers according to the requirements of the engineering data MI, wherein a circle of excess materials are reserved at the edge of the plate of the hard plate 2;
2) drilling: drilling the required aperture at the corresponding position on the plate according to engineering data, wherein the hard plate 2 is drilled by adopting a drilling process, and the soft plate 3 is drilled by punching at low temperature;
3) plate surface treatment: depositing copper on one side of the hard board 2, and depositing a layer of microstrip line film on one side of the soft board 3;
4) plate surface pressing: the copper-free surface of the hard board 2 and the surface of the soft board 3 on which the microstrip line film is not deposited are adhered together, a layer of nanometer glue is coated in the middle of the clamping of the hard board and the soft board, and then the whole is placed in a vacuum chamber 1 at the temperature of 45 ℃;
5) fixing the hard board 2 as a carrier at the bottom of the vacuum chamber 1 with the soft board 3 facing upwards, continuously pressurizing the vacuum chamber 1, and keeping the temperature in the chamber constant in the pressurizing process until the soft board 3 and the hard board 2 are completely pressed; the pressing process is as shown in fig. 1, the pressure above the soft board 3 is gradually increased to form air pressure, and a non-contact pressure is generated as shown by arrows in the figure, so that the soft board 3 and the hard board 2 are pressed together, and the whole pressing process has no direct contact, thereby ensuring that the soft board is not deformed.
6) Cutting off a circle of excess materials reserved in the hard board 2 after pressing is completed to obtain a board rigid-flexible board;
7) pattern transfer: carrying out pattern transfer on the copper deposition surface by using a film, and then drying → blasting → developing → checking; etching a microstrip line circuit on the microstrip line film by using an etching process;
8) and (3) copper deposition surface processing: electroplating a copper layer with the required thickness and a gold nickel or tin layer with the required thickness on the copper sheet or the hole wall exposed on the copper-deposited line pattern, removing the electroplating-resistant covering film layer by using NaOH solution to expose the non-line copper layer, and corroding the copper layer at the non-line part by using a chemical reaction method;
9) processing a microstrip line: and (3) removing the burrs of the microstrip line by using a micro-carving technology, and then cleaning, removing oil and drying.
The method also comprises a green oil step, wherein the green oil is used for transferring the pattern of a green oil film to the board to play a role in protecting the circuit and preventing tin on the circuit during welding of parts, and the steps are grinding the board → printing photosensitive green oil → curium board → exposure → developing; grinding board → printing the first side → baking board → printing the second side → baking board.
In some embodiments, the method further comprises a forming process, and the method for forming the shape required by the customer by die stamping or a numerical control gong machine comprises mechanical gong, beer board, hand gong and hand cutting.
In some embodiments, the method further comprises a testing process, wherein the defect that the open circuit, the short circuit and the like which are difficult to be found visually and affect the functionality is detected through an electronic 100% test, and the process is upper mold → plate placing → test → qualified → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrap.
Preferably, the pressurizing speed in the step and 5) is 100pa/s, the temperature of the vacuum chamber 1 is 50 ℃, the drilling of the soft plate 3 is completed in the low-temperature chamber, the temperature is controlled below 5 ℃, the curling in the drilling process is avoided, a protective layer made of the same material is padded below the soft plate 3 in the drilling process, and the thickness of the protective layer is not less than 10 mm.
Example 2
A PCB soft-hard combination process comprises the following steps:
1) cutting: cutting a hard board 2 and a soft board 3 into pieces, cutting the pieces into small pieces to produce plates and small pieces meeting the requirements of customers on a large board meeting the requirements according to the requirements of engineering data MI, wherein a circle of excess material is reserved at the edge of the hard board 2;
2) drilling: drilling the required aperture at the corresponding position on the sheet material with the required size according to engineering data, wherein the hard board 2 adopts a drilling process, and the soft board 3 adopts low-temperature punching for drilling;
3) plate surface treatment: depositing copper on one side of the hard board 2, and depositing a layer of microstrip line film on one side of the soft board 3;
4) plate surface pressing: the copper-free surface of the hard board 2 and the surface of the soft board 3 on which the microstrip line film is not deposited are adhered together, a layer of nanometer glue is coated in the middle of the clamping of the hard board and the soft board, and then the whole is placed in a vacuum chamber 1 at 50 ℃;
5) fixing the hard board 2 as a carrier at the bottom of the vacuum chamber 1 with the soft board 3 facing upwards, continuously pressurizing the vacuum chamber 1, and keeping the temperature in the chamber constant in the pressurizing process until the soft board 3 and the hard board 2 are completely pressed;
6) and cutting off a circle of excess material reserved in the hard board 2 after pressing is finished to obtain the board rigid-flexible board.
Example 3
A PCB soft-hard combination process comprises the following steps:
1) cutting: cutting a hard board 2 and a soft board 3 into pieces, cutting the pieces into small pieces to produce plates and small pieces meeting the requirements of customers on a large board meeting the requirements according to the requirements of engineering data MI, wherein a circle of excess material is reserved at the edge of the hard board 2;
2) drilling: drilling the required aperture at the corresponding position on the sheet material with the required size according to engineering data, wherein the hard board 2 adopts a drilling process, and the soft board 3 adopts low-temperature punching for drilling;
3) plate surface treatment: depositing copper on one side of the hard board 2, and depositing a layer of microstrip line film on one side of the soft board 3;
4) plate surface pressing: the copper-free surface of the hard board 2 and the surface of the soft board 3 on which the microstrip line film is not deposited are adhered together, a layer of nanometer glue is coated in the middle of the clamping of the hard board and the soft board, and then the whole is placed in a vacuum chamber 1 at 60 ℃ for pressing; during pressing, the hard board 2 is taken as a carrier and fixed at the bottom of the vacuum chamber 1, the soft board 3 faces upwards, then the vacuum chamber 1 is continuously pressurized, the temperature in the chamber is kept constant in the pressurizing process until the soft board 3 and the hard board 2 are completely pressed, and a circle of excess material reserved in the hard board 2 is cut after pressing is finished, so that the board soft-hard combined board is obtained;
5) pattern transfer: carrying out pattern transfer on the copper deposition surface by using a film, and then drying → blasting → developing → checking; etching a microstrip line circuit on the microstrip line film by using an etching process;
6) and (3) copper deposition surface processing: electroplating a copper layer with the required thickness and a gold nickel or tin layer with the required thickness on the copper sheet or the hole wall exposed on the copper-deposited line pattern, removing the electroplating-resistant covering film layer by using NaOH solution to expose the non-line copper layer, and corroding the copper layer at the non-line part by using a chemical reaction method;
7) processing a microstrip line: and (3) removing the burrs of the microstrip line by using a micro-carving technology, and then cleaning, removing oil and drying.
The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the invention is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A PCB board soft and hard combination process is characterized by comprising the following process steps:
1) cutting: cutting plates meeting the requirements of customers on corresponding large plates of a soft plate and a hard plate according to the requirements of the engineering data MI, wherein a circle of excess materials are reserved at the edge of the hard plate;
2) drilling: drilling the required aperture at the corresponding position on the plate according to engineering data, wherein the hard plate is drilled by adopting a drilling process, and the soft plate is drilled by punching at low temperature;
3) plate surface treatment: depositing copper on one side of the hard board, and depositing a layer of microstrip line film on one side of the soft board;
4) plate surface pressing: adhering the non-copper-deposited surface of the hard board and the non-deposited surface of the microstrip line film of the soft board together, coating a layer of nano glue in the middle of the clamping of the hard board and the soft board, and then putting the whole into a vacuum chamber at 45-60 ℃;
5) fixing the hard board as a carrier at the bottom of the vacuum chamber, enabling the soft board to face upwards, continuously pressurizing the vacuum chamber, and keeping the temperature in the chamber constant in the pressurizing process until the soft board and the hard board are completely pressed;
6) and cutting off a circle of excess material reserved in the hard board after pressing is finished to obtain the board rigid-flexible board.
2. The PCB board soft and hard combination process of claim 1, further comprising a subsequent process treatment, comprising the steps of:
pattern transfer: carrying out pattern transfer on the copper deposition surface by using a film, and then drying → blasting → developing → checking; etching a microstrip line circuit on the microstrip line film by using an etching process;
and (3) copper deposition surface processing: electroplating a copper layer with the required thickness and a gold nickel or tin layer with the required thickness on the copper sheet or the hole wall exposed on the copper-deposited line pattern, removing the electroplating-resistant covering film layer by using NaOH solution to expose the non-line copper layer, and corroding the copper layer at the non-line part by using a chemical reaction method;
processing a microstrip line: and (3) removing the burrs of the microstrip line by using a micro-carving technology, and then cleaning, removing oil and drying.
3. The PCB soft-hard bonding process of claim 2, further comprising a green oil step, wherein the green oil transfers the pattern of the green oil film to the board to protect the circuit and prevent tin on the circuit when welding the parts, and the steps are grinding the board → printing the photosensitive green oil → curium → exposing → developing; grinding board → printing the first side → baking board → printing the second side → baking board.
4. The PCB soft and hard combination process of claim 3, further comprising a forming process, wherein the forming process comprises mechanical gong, beer board, hand gong and hand cutting by a method of gong out the shape required by a customer through die stamping or a numerical control gong machine.
5. The PCB soft and hard bonding process of claim 4, further comprising a testing process, wherein the testing process comprises an upper mold → placing the plate → testing → passing → FQC visual inspection → failing → repairing → returning testing → OK → REJ → scrapping, and the defects such as open circuit and short circuit which are difficult to be found by visual inspection and affect the functionality are detected by an electronic 100% test.
6. The PCB soft and hard combination process of claim 1, wherein the soft board drilling is completed in a low temperature chamber, the temperature of the soft board is controlled below 5 ℃, and curling in the drilling process is avoided.
7. The PCB soft and hard combination process of claim 6, wherein during the drilling process, a protective layer of the same material is padded under the soft board.
8. The PCB soft-hard bonding process of claim 7, wherein the thickness of the protective layer is not less than 10 mm.
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| CN202010158181.6A CN111343790B (en) | 2020-03-09 | 2020-03-09 | PCB soft and hard combination process |
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| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
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| CN111343790B (en) | 2023-01-10 |
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