CN105513973B - A kind of production method of blind hole - Google Patents
A kind of production method of blind hole Download PDFInfo
- Publication number
- CN105513973B CN105513973B CN201610094996.6A CN201610094996A CN105513973B CN 105513973 B CN105513973 B CN 105513973B CN 201610094996 A CN201610094996 A CN 201610094996A CN 105513973 B CN105513973 B CN 105513973B
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- blind hole
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- mask layer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 118
- 238000005530 etching Methods 0.000 claims abstract description 41
- 239000011800 void material Substances 0.000 claims abstract description 29
- 239000010410 layer Substances 0.000 claims description 31
- 229920002120 photoresistant polymer Polymers 0.000 claims description 24
- 239000003153 chemical reaction reagent Substances 0.000 claims description 20
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical group F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 18
- 230000001413 cellular effect Effects 0.000 claims description 17
- 238000010276 construction Methods 0.000 claims description 17
- 239000011241 protective layer Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000011161 development Methods 0.000 claims description 6
- 238000003486 chemical etching Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000018109 developmental process Effects 0.000 description 5
- 238000005496 tempering Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910003638 H2SiF6 Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- ZEFWRWWINDLIIV-UHFFFAOYSA-N tetrafluorosilane;dihydrofluoride Chemical compound F.F.F[Si](F)(F)F ZEFWRWWINDLIIV-UHFFFAOYSA-N 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012372 quality testing Methods 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000003426 chemical strengthening reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
A kind of production method of blind hole provided by the invention, the production method of the blind hole include：A substrate is provided, the substrate includes：The first surface and second surface being oppositely arranged；Mask layer is formed in the first surface；The mask layer includes：It is used to form the void region of blind hole；The void region is etched, forms blind hole；After the completion of etching, the mask layer is removed.The production method of the blind hole can solve the problems, such as that the substrate causes intensity not high due to mechanical external force causes damage.
Description
Technical field
The present invention relates to technical field of chemistry, more specifically to a kind of production method of blind hole.
Background technology
With the development of science and technology, fingerprint detection is widely used in daily life and work, is
Daily life and work bring huge facility, become weight indispensable in people's daily life and work
Want tool.
It is provided on the glass substrate of through-hole generally, fingerprint detection module is mounted on, but is formed and set on glass substrate
The mechanical strength of glass substrate can be influenced by putting the through-hole of fingerprint detection module.
Invention content
To solve the above problems, the present invention provides a kind of production method of blind hole, the production method of the blind hole can solve
The problem of certainly described substrate causes intensity not high due to mechanical external force causes damage.
To achieve the above object, the present invention provides following technical solution：
A kind of production method of blind hole, the production method of the blind hole include：
A substrate is provided, the substrate includes：The first surface and second surface being oppositely arranged；
Mask layer is formed in the first surface, protective layer is formed in the second surface；Wherein, the mask layer packet
It includes：It is used to form the void region of blind hole；
The void region is etched, forms blind hole；Wherein, the blind hole is less than the basic thickness for depth
Groove；
After the completion of etching, the mask layer is removed.
Preferably, it is described to form mask layer in the first surface in the production method of above-mentioned blind hole, described second
Surface forms protective layer and includes：Anti-etching oil reservoir is coated in the second surface.
In the first surface and the anti-etching oil reservoir surface coating photoresist；
Photoresist to being located at the first surface and positioned at the anti-etching oil reservoir surface is exposed, wherein, position
It is exposed in the photoresist of the first surface using setting mold；
After carrying out curing process to the photoresist layer, then development treatment is carried out, washed corresponding on the first surface
The photoresist of the void region.
Preferably, in the production method of above-mentioned blind hole, it is described be etched including：
The substrate is put into setting time in etching reagent, the substrate is etched, institute is corresponded in the substrate
The position for stating void region forms the groove of predetermined depth, and to form the blind hole, the predetermined depth is less than the substrate
Thickness.
Preferably, in the production method of above-mentioned blind hole, when the substrate area is more than pre-set dimension, the mask layer
Including multiple void regions；
The described substrate is put into before setting time is etched in etching reagent includes：
The substrate is divided into the cellular construction of multiple setting areas, the mask layer of each cellular construction has extremely
A few void region；
The cellular construction is etched using the etching reagent, forms the panel with blind hole.
Preferably, in the production method of above-mentioned blind hole, when the substrate area is less than preset range, the mask layer
Including multiple void regions；The void region is etched including：
The substrate is etched, forms blind hole；
Substrate after etching is divided into multiple at least tools, and there are one the panels of the blind hole.
Preferably, it in the production method of above-mentioned blind hole, further includes：Tempering is carried out to the panel.
Preferably, in the production method of above-mentioned blind hole, the substrate is：Glass plate.
Preferably, in the production method of above-mentioned blind hole, the etching reagent is hydrofluoric acid.
Preferably, it in the production method of above-mentioned blind hole, further includes：A polishing is carried out to the blind hole.
The present invention also provides a kind of cover board, which includes：Substrate and the blind hole for being arranged on the substrate surface, institute
State the groove that blind hole is less than the substrate thickness for depth.
The present invention also provides a kind of fingerprint detection panel, which includes：Cover board, the cover board include：
Substrate and the blind hole for being arranged on the substrate surface, the blind hole are less than the groove of the substrate thickness for depth；The finger
Line detection module is arranged in the blind hole.
The present invention also provides a kind of electronic equipment, which includes：Fingerprint detection module panel described above.
By foregoing description it is found that a kind of production method of blind hole provided by the invention, the production method of the blind hole include：
A substrate is provided, the substrate includes：The first surface and second surface being oppositely arranged；Mask is formed in the first surface
Layer；The mask layer includes：It is used to form the void region of blind hole；The void region is etched, forms blind hole；Work as erosion
After the completion of quarter, the mask layer is removed.The production method of the blind hole can solve the substrate due to mechanical external force causes damage
The problem of causing intensity not high.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention, for those of ordinary skill in the art, without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of flow diagram of the production method of blind hole provided by the embodiments of the present application；
Fig. 2 is the flow diagram of the production method of another blind hole provided by the embodiments of the present application；
Fig. 3 is the flow diagram of the production method of another blind hole provided by the embodiments of the present application；
Fig. 4 is a kind of structure diagram of cover board provided by the embodiments of the present application；
Fig. 5 is a kind of structure diagram of fingerprint detection panel provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall within the protection scope of the present invention..
As described in the background art, generally, fingerprint detection module be mounted on be provided on the glass substrate of through-hole, but
It is that the mechanical strength for setting the through-hole of fingerprint detection module that can influence glass substrate is formed on glass substrate.
In order to solve this problem, the embodiment of the present application provides a kind of production method of blind hole, the production method of the blind hole
It can solve the problems, such as that the substrate causes intensity not high due to mechanical external force causes damage.
With reference to figure 1, Fig. 1 is a kind of flow diagram of the production method of blind hole provided by the embodiments of the present application.The blind hole
Production method include：
S11：One substrate is provided；
The substrate includes：The first surface and second surface being oppositely arranged.The substrate is glass plate.
S12：Mask layer is formed in the first surface, protective layer is formed in the second surface；
The mask layer includes：It is used to form the void region of blind hole.
S13：The void region is etched, forms blind hole；
The substrate is put into setting time in etching reagent, the substrate is etched, institute is corresponded in the substrate
The position for stating void region forms the groove of predetermined depth, to form the blind hole；Wherein, the depth of the groove is less than described
The thickness of substrate.
The glass substrate is etched, etching reagent used is hydrofluoric acid, the hydrofluoric acid and the glass base
The corrosiveness occurred between plate is：SiO2+ 6HF=H2SiF6+2H2O.After the blind hole is formed to blind hole its described into
Row point polishing.
S14：After the completion of etching, the mask layer is removed；
Finally, it needs to carry out tempering to the substrate of formed blind hole.
It follows that the production method of this blind hole provided by the embodiments of the present application, by the way of chemical etching, avoids
Substrate intensity caused by the damage of mechanical external force is not high.Traditional mechanical processing mode is in appearance and strength character
All do not have clear superiority, by way of chemical etching, the appearance of the blind hole can be accomplished to perfection, performance reaches best.
The technological process for making the blind hole includes：Substrate is provided first, to the substrate carry out quality testing see whether
It meets the requirements, reaches requirement and the substrate is cleaned later.Preparation all to make blind hole above.Due to the application
The production method for the blind hole that embodiment provides is chemical etching, and blind hole is connects the substrate surface layer and internal layer without penetrating through
The via hole of entire substrate, therefore when being processed to the substrate, not etch the second surface of blind hole in the substrate
The anti-etching oil of silk-screen.The substrate is cured later, later resist coating, the first surface and second surface of the substrate
Resist coating is required for, substrate is cleaned before resist coating, preliminary drying next is carried out to the substrate for being painted with photoresist,
It is exposed, when being exposed operation, chromium plate on the substrate first surface cover hides reserved blind hole position later
Light carries out post bake operation again later, and the post bake is also a kind of cured mode, is next washed with developer solution described pre-
The photoresist that blind hole position is stayed to chemically react, this operation are development.
Wherein, since positive photoresist is insoluble to some solvents, become to dissolve in the substance of developer solution after illumination.And
Negative photoresist becomes insoluble material after illumination, insoluble in developer solution.Therefore, the photoresist is selected as negative photoresist.
By taking negative photoresist as an example, after the second surface coats the anti-etching oil reservoir, the first surface with
And the anti-etching oil reservoir surface is required for coating the negative photoresist, later to the substrate first surface and the second table
Two side of face is exposed processing, and before exposure, side increases a chromium plate device, the chromium plate device on the first surface
For the void region shading to the substrate, remaining region is normal.Processing is exposed to the substrate later, at exposure
After the completion of reason, the first surface photoresist is cured as the mask layer, and the second surface photoresist is cured as the protection
Layer, washes the negative photoresist that the void region is reserved later.
Anti-etching oil described above is a kind of black ink, and silk-screen is avoided in exposure in the second surface of the substrate,
Because described two surfaces of substrate apply negative photoresist, light shines the reserved blind hole position from the second surface, causes to expose
Unevenness, development be not clean.Primarily serve a light blocking effect.
After the completion of development operation is carried out, it is necessary to the important operation that chemical etching forms blind hole is carried out to the substrate,
The substrate is put into etching reagent, is put into the time of setting to be etched, and then forms blind hole.Due to described in selection
The area of substrate varies, for operation order of the relatively small substrate of the big substrate of area and area when being etched not
Equally.Therefore according to the facility for realizing this technique, it may be determined that the size value of a size carries out the size of the substrate
Judge.
With reference to figure 2, Fig. 2 is the flow diagram of the production method of another blind hole provided by the embodiments of the present application；Work as institute
When stating the area of substrate more than pre-set dimension value, the production process of the blind hole of the substrate is as follows：
S21：One substrate is provided；
The substrate includes：The first surface and second surface being oppositely arranged.The substrate is glass plate.
S22：Mask layer is formed in the first surface, protective layer is formed in the second surface；
The mask layer includes：It is used to form the void region of blind hole.
S23：Cutting is carried out to the substrate and forms cellular construction；
The size of the cellular construction is set according to actual needs, and the mask layer of each cellular construction
With at least one void region.
S24：The cellular construction is etched；
The cellular construction is put into the time set in the etching reagent, the cellular construction is etched,
The cellular construction corresponds to the groove of the position formation predetermined depth of the void region, to form the face with the blind hole
Plate；Wherein, the depth of the groove is less than the thickness of the substrate..
The glass substrate is etched, etching reagent used is hydrofluoric acid, the hydrofluoric acid and the glass base
The corrosiveness occurred between plate is：SiO2+ 6HF=H2SiF6+2H2O.After the blind hole is formed to blind hole its described into
Row point polishing.
S25：After the completion of etching, the mask layer is removed；
Tempering finally is carried out to the panel.
It is when being more than pre-set dimension to the area of the substrate, first to be cut the operation being etched again above.As general
The cellular construction later by the way of being inserted vertically into, is put into the erosion by the substrate cut into after the cellular construction
Carve the etching that setting time is carried out in reagent.It can once multiple cellular constructions or the base by the way of being inserted vertically into
Plate is etched, and improves efficiency, and the etching reagent of demand can be less.
With reference to figure 3, Fig. 3 is the flow diagram of the production method of another blind hole provided by the embodiments of the present application；Work as institute
When stating the area of substrate less than pre-set dimension value, the production process of the blind hole of the substrate is as follows：
S31：One substrate is provided；
The substrate includes：The first surface and second surface being oppositely arranged.The substrate is glass plate.
S32：Mask layer is formed in the first surface, protective layer is formed in the second surface；
The mask layer includes：It is used to form the void region of blind hole.
S33：The substrate is etched；
The substrate is put into setting time in etching reagent, the substrate is etched, institute is corresponded in the substrate
The position for stating void region forms the groove of predetermined depth, to form the panel with the blind hole；Wherein, the depth of the groove
Degree is less than the thickness of the substrate.
The glass substrate is etched, etching reagent used is hydrofluoric acid, the hydrofluoric acid and the glass base
The corrosiveness occurred between plate is：SiO2+ 6HF=H2SiF6+2H2O.After the blind hole is formed to blind hole its described into
Row point polishing.
S34：The substrate is cut；
Substrate after etching is divided into multiple at least tools, and there are one the panels of the blind hole.
S35：After the completion of etching, the mask layer is removed；
Tempering finally is carried out to the panel.
It follows that when the substrate area be less than pre-set dimension when, there is no need to before the etch to the substrate into
Row segmentation directly by the substrate by the way of being inserted vertically into, is put into the etching that setting time is carried out in the etching reagent,
And then form the panel with blind hole.Panel its described is split according to the required size of final technique later.Segmentation
Panel afterwards at least has there are one the blind hole.
Above-mentioned use is inserted vertically into mode, can once multiple cellular constructions or the substrate be etched, carry
High efficiency, and the etching reagent of demand can be less.
After blind hole is formed, need to it is described formed blind hole panel carry out mechanically actuated, to the blind hole panel into
Row edging later washes the photoresist on the panel with blind hole with anti-etching oil, and blind hole point is polished
Machine is polished.Chemical strengthening, i.e. tempering finally are carried out to the blind hole panel.The panel with blind hole is carried out later
Silk-screen or bat printing, the step are the formation mimeograph patterns in the blind hole.Such as the home buttons of mobile phone, make blind hole
Afterwards, white ink is formed in the blind hole, with as home buttons.The ink of the blind hole position by the way of bat printing into
Row, the bat printing pressure head is silica gel material and its hardness is 60 degree.Quality testing finally is carried out to its panel, completes all journeys
Sequence operates, and has produced finished product.
In above-mentioned post bake and soft-bake step, main parameter is temperature value, has optimum temperature value, and its temperature parameter
Material with the photoresist has relationship, and there is no determining temperature range values.
In the embodiment of the present application, the etching reagent is hydrofluoric acid.The substrate is glass plate.
It follows that the production method of this blind hole provided by the embodiments of the present application, can solve the substrate because of machinery
The problem of external force causes to damage and cause intensity not high.
With reference to figure 4, in the embodiment of the present application, the present invention also provides a kind of cover boards.Fig. 4 is provided for the embodiment of the present application
A kind of cover board structure diagram.
Wherein, the cover board 41 includes：Substrate 42 and the blind hole 43 for being arranged on 41 surface of substrate, the blind hole are
Depth is less than the groove of 42 thickness of substrate.Since the depth of the groove that 42 surface of substrate is formed is less than the base
The thickness of plate 42, therefore the cover board 41 is relative to the cover board of setting through-hole is firmer on substrate in the prior art.
With reference to figure 5, in the embodiment of the present application, the present invention also provides a kind of fingerprint detection panels.Fig. 5 is real for the application
A kind of structure diagram of fingerprint detection panel of example offer is provided.
Wherein, the fingerprint detection panel 51 includes：Cover board 41, the cover board 41 include：It substrate and is arranged on described
The blind hole of substrate surface, the blind hole are less than the groove of the substrate thickness for depth；Fingerprint detection module 52 is arranged on described
In blind hole.Protective layer 53 is set above the fingerprint detection module 52, and the protective layer 53 is with the substrate surface same
Plane.
In the embodiment of the present application, the present invention also provides a kind of electronic equipment, which includes：Mobile phone, computer
Wait electronic equipments.The electronic equipment all has the function of fingerprint detection panel 51 described above.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications of these embodiments will be apparent for those skilled in the art, it is as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide range caused.
Claims (7)
1. a kind of production method of blind hole, which is characterized in that including：
A substrate is provided, the substrate includes：The first surface and second surface being oppositely arranged；
Mask layer is formed in the first surface, protective layer is formed in the second surface；The mask layer includes：It is used to form
The void region of blind hole；
Chemical etching is carried out to the void region, forms blind hole；Wherein, the etching reagent is hydrofluoric acid, and the blind hole is
Depth is less than the groove of the substrate thickness；
After the completion of etching, the mask layer is removed；
Wherein, it is described to form mask layer in the first surface, it forms protective layer in the second surface and includes：Described second
Surface coats anti-etching oil reservoir；
In the first surface and the anti-etching oil reservoir surface coating photoresist；
Photoresist to being located at the first surface and positioned at the anti-etching oil reservoir surface is exposed, wherein, positioned at institute
The photoresist for stating first surface is exposed using setting mold；
After carrying out curing process to the photoresist layer, then development treatment is carried out, washed described in being corresponded on the first surface
The photoresist of void region.
2. the production method of blind hole according to claim 1, which is characterized in that it is described be etched including：
The substrate is put into setting time in etching reagent, the substrate is etched, is engraved described in substrate correspondence
The position of empty region forms the groove of predetermined depth, and to form the blind hole, the predetermined depth is less than the thickness of the substrate.
3. the production method of blind hole according to claim 2, which is characterized in that the substrate area is more than pre-set dimension,
The mask layer includes multiple void regions；
The described substrate is put into before setting time is etched in etching reagent includes：
The substrate is divided into the cellular construction of multiple setting areas, the mask layer of each cellular construction has at least one
The void region；
The cellular construction is etched using the etching reagent, forms the panel with blind hole.
4. the production method of blind hole according to claim 2, which is characterized in that the substrate area is less than preset range,
The mask layer includes multiple void regions；
The void region is etched including：
The substrate is etched, forms blind hole；
Substrate after etching is divided into multiple at least tools, and there are one the panels of the blind hole.
5. the production method of blind hole according to claim 3 or 4, which is characterized in that further include：Steel is carried out to the panel
Change.
6. the production method of blind hole according to claim 2, which is characterized in that the substrate is glass plate.
7. the production method of blind hole according to claim 1, which is characterized in that further include：A throwing is carried out to the blind hole
Light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610094996.6A CN105513973B (en) | 2016-02-19 | 2016-02-19 | A kind of production method of blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610094996.6A CN105513973B (en) | 2016-02-19 | 2016-02-19 | A kind of production method of blind hole |
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| Publication Number | Publication Date |
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| CN105513973A CN105513973A (en) | 2016-04-20 |
| CN105513973B true CN105513973B (en) | 2018-06-08 |
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| CN201610094996.6A Active CN105513973B (en) | 2016-02-19 | 2016-02-19 | A kind of production method of blind hole |
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| CN105948520A (en) * | 2016-05-23 | 2016-09-21 | 信利光电股份有限公司 | 3D (three-dimensional) glass cover plate and method for manufacturing same |
| CN106396422A (en) * | 2016-09-05 | 2017-02-15 | 信利光电股份有限公司 | Manufacturing method of glass blind hole applied to fingerprint recognition function |
| CN106277813A (en) * | 2016-09-05 | 2017-01-04 | 信利光电股份有限公司 | A kind of manufacture method of pattern cover plate |
| CN110923714A (en) * | 2019-09-26 | 2020-03-27 | 宁波福至新材料有限公司 | Etching solution and etching method for titanium foil micropore pattern |
| CN111333342A (en) * | 2020-02-18 | 2020-06-26 | 清远南玻节能新材料有限公司 | Preparation method of three-dimensional pattern in glass hole |
| CN113582552B (en) * | 2021-07-15 | 2023-10-10 | Oppo广东移动通信有限公司 | Manufacturing method of texture substrate, texture substrate and electronic equipment |
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