CN113556881A - PCB solder mask white oil photoetching process capable of eliminating pencil marks - Google Patents
PCB solder mask white oil photoetching process capable of eliminating pencil marks Download PDFInfo
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- CN113556881A CN113556881A CN202110830711.1A CN202110830711A CN113556881A CN 113556881 A CN113556881 A CN 113556881A CN 202110830711 A CN202110830711 A CN 202110830711A CN 113556881 A CN113556881 A CN 113556881A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000001259 photo etching Methods 0.000 title claims abstract description 49
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 54
- 238000001035 drying Methods 0.000 claims abstract description 52
- 238000011161 development Methods 0.000 claims abstract description 47
- 238000001816 cooling Methods 0.000 claims abstract description 33
- 239000011261 inert gas Substances 0.000 claims abstract description 32
- 238000003384 imaging method Methods 0.000 claims abstract description 27
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 27
- 239000011248 coating agent Substances 0.000 claims abstract description 24
- 238000000576 coating method Methods 0.000 claims abstract description 24
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims abstract description 18
- 230000005571 horizontal transmission Effects 0.000 claims abstract description 17
- 238000005406 washing Methods 0.000 claims description 76
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 52
- 239000007789 gas Substances 0.000 claims description 48
- 230000001680 brushing effect Effects 0.000 claims description 19
- 239000002253 acid Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000002791 soaking Methods 0.000 claims description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 10
- 238000005498 polishing Methods 0.000 claims description 9
- 239000004677 Nylon Substances 0.000 claims description 8
- 229920001778 nylon Polymers 0.000 claims description 8
- 238000005554 pickling Methods 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 8
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 239000001569 carbon dioxide Substances 0.000 claims description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 5
- 238000003672 processing method Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000002203 pretreatment Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 14
- 239000000203 mixture Substances 0.000 description 13
- 238000002310 reflectometry Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000003085 diluting agent Substances 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 3
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a PCB solder mask white oil photoetching process capable of eliminating pencil marks, which comprises the following steps of: (1) pre-treating; (2) oil is boiled; (3) coating line photosensitive ink, wherein the thickness of the line photosensitive ink is controlled to be 12-15 microns; (4) standing for 1 minute by a horizontal transmission belt; (5) primary drying; (6) primary cooling, cooling to normal temperature; (7) primary laser imaging; (8) carrying out primary development, and finishing a circuit pattern in a potassium carbonate solution; (9) performing intermediate treatment; (10) coating solder resist oil, and controlling the thickness of the dry film surface to be 20-25 micrometers; (11) standing for the second time; (12) secondary drying; (13) secondary cooling; (14) photoetching is carried out under the protection of nitrogen or inert gas; (15) secondary laser imaging (16) secondary development, and completing solder mask development in a potassium carbonate solution; (17) and (5) baking at a high temperature. The invention can eliminate the pencil mark of the laser imaging solder resist white oil process.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a PCB solder mask white oil photoetching process capable of eliminating pencil marks.
Background
Marking with a pencil: the metal can be rubbed off by an eraser, and the trace similar to a pencil print is left on the surface of the white oil after the metal collides or rubs on the surface of the ink.
Inert gas: it is a gas with inactive chemical property, and is tasteless, non-toxic and pollution-free.
The solder resist oil of the PCB can prevent short circuit of an electric appliance element and a circuit board due to corrosion of moisture, chemicals and the like, and plays roles of insulating and protecting the circuit board. With the development of the led, the market occupation ratio of the solder-resisting white oil metal-based circuit board is larger and larger, the requirements on the heat conduction of the PCB and the reflectivity of the solder-resisting oil are higher and higher, and the reflectivity of the solder-resisting white oil surface of the circuit board for the led is related to the material, the thickness and the curing mode of the printing ink. The conventional solder resist white oil imaging is exposed by an led uv exposure machine, but the accuracy is not high due to the fact that the conventional solder resist white oil imaging relates to a secondary transfer technology, and a film print exists due to the fact that the surface is squeezed by a film when the vacuum is absorbed, so that the surface smoothness is affected, and the requirements of a high-end white oil plate cannot be met. The precision of the product can be well improved by using a laser imaging process, but because the metal-based circuit board needs to perform forming processes such as stamping, V-cutting and the like after completing solder resistance and characters, and a user needs to mount an SMT (surface mount technology) chip, the surface of solder resist oil often needs to be rubbed with a metal base, and the bad process of the solder resist oil can cause the black pencil mark after the white oil surface is rubbed with the metal base, thereby seriously affecting the reflectivity of the product. Although some defects can be reduced by polishing and brushing, the method is labor-consuming and time-consuming and has poor effect.
In the process of photoetching solder resist white oil by a large-format photoetching machine, because the solder resist white oil ink covering layer is thicker (more than 0.025 mm), the photoetching image exposure treatment is carried out by using higher energy at present, the processing speed is very low, and the productivity is seriously insufficient; after pattern exposure treatment is carried out on the solder resist white ink by using a photoetching machine, only partial solder resist ink is left after development treatment, and then the whole curing is obtained after high-temperature curing; however, under the condition that products on the surface of the white ink rub or scratch mutually, black scratches appear, and for a circuit board with high reflectivity requirement, the circuit board becomes a defective product due to the existence of the black scratches; the back-end processing can only protect the interlayer cushion rubber film, and the picking and placing process needs to be careful, so that the cost is increased, the production efficiency is reduced, and the occurrence of black scratches cannot be avoided when the back-end processing is used by customers.
The conventional approach to solve the above problems is to find an ink suitable for laser imaging process. But at present, no suitable ink manufacturer is found at home and abroad. 2. The energy density of photoetching is greatly improved, but the requirement on equipment and the cost are too high, and the cost performance is not high. 3. The protection film is covered in the PCB process, but the method is troublesome and labor-consuming, and the problem still exists in the follow-up SMT.
Meanwhile, 1, because the exposure energy of the photoetching machine in unit time can not be changed, the exposure retention time in a unit area can only be increased, and the exposure energy in unit area is increased in an equal proportion to improve the exposure energy, although the requirements of high precision and exposure process of a product are met, the shortage of productivity is caused; to increase the productivity, the exposure energy per unit area must be reduced, and the requirements of the exposure process can be met. 2. The problem of black scratches on the surface of the ink after exposure is fundamentally solved to reduce the cost and improve the product quality.
Therefore, the problem of solder resist white oil pencil printing for laser photoetching imaging is a technical problem which needs to be solved urgently in the industry.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a PCB solder mask white oil photoetching process capable of eliminating pencil marks, which can eliminate the pencil marks of a laser imaging solder mask white oil process.
The technical scheme adopted by the invention for solving the technical problems is as follows: a PCB solder mask white oil photoetching process capable of eliminating pencil marks comprises the following steps: (1) pre-treatment, which is used for removing an oxide layer on the surface of the PCB; (2) starting oil, namely not adding oil-starting water to the line photosensitive ink, controlling the viscosity to be 140-; (3) coating line photosensitive ink, wherein the thickness of the line photosensitive ink is controlled to be 12-15 microns; (4) standing for 1 minute by a horizontal transmission belt; (5) primary drying; (6) primary cooling, cooling to normal temperature; (7) primary laser imaging is carried out, the laser density is 60mj, and the speed is 200 MM/s; (8) carrying out primary development, and finishing a circuit pattern in a potassium carbonate solution; (9) performing intermediate treatment; (10) coating solder resist oil, and controlling the thickness of the dry film surface to be 20-25 micrometers; (11) standing for the second time, and standing for 1 minute through a horizontal transmission line; (12) secondary drying; (13) secondary cooling, conveying the temporary storage machine to cool for 10 minutes to normal temperature; (14) photoetching is carried out under the protection of nitrogen or inert gas; (15) secondary laser imaging is carried out, the laser density is 220mj, and the speed is 54 mm/S; (16) secondary development, wherein the solder resist development is completed in a potassium carbonate solution; (17) baking at high temperature in a tunnel furnace at 100/150/150/150/150/120/100 deg.C and 0.2 m/min.
Preferably, the method comprises the following steps: the specific treatment method for the pretreatment in the step (1) comprises the following steps: soaking the copper-clad plate in dilute acid, and then washing, pickling, washing, brushing and brushing 320-mesh and 500-mesh nylon, washing in water in the market and drying.
Preferably, the method comprises the following steps: the specific treatment method for one-time drying in the step (5) comprises the following steps: heating and drying by a horizontal tunnel furnace, wherein the temperature zone is 100/120/120/120/120/105/100 ℃, and the speed is 7 meters per minute.
Preferably, the method comprises the following steps: the specific processing method in the step (9) comprises the following steps: the process is completed according to the procedures of water washing, acid washing, water washing, 500-mesh polishing and brushing, water washing, commercial water washing and drying.
Preferably, the method comprises the following steps: the specific treatment method for secondary drying in the step (12) comprises the following steps: heating and baking the mixture by a horizontal tunnel furnace, wherein the temperature zones are 110/145/150/160/160/160/150/120 ℃.
Preferably, the method comprises the following steps: the specific processing method in the step (14) comprises the following steps: nitrogen or inert gas is sprayed out during exposure, and the protection of the gas is kept in the exposure area; the gas purity of nitrogen or inert gas is 99 percent, the gas flow is 4 cubic meters per hour, and the gas pressure is 0.7 MPa.
Preferably, the method comprises the following steps: the inert gas is argon (Ar) or carbon dioxide.
The invention has the beneficial effects that:
1. by adopting the photoetching imaging white oil solder mask, the energy and photoetching speed of laser, the ink viscosity of the solder mask oil, the thickness of the coated ink, the temperature and speed of standing time prebaking and the purity and flow of nitrogen protection, the hardness and reflectivity of the white oil PCB are improved, and the strength of insulation protection is improved.
2. The inert gas or the nitrogen is used as the protective gas, so that the influence of water vapor and oxygen on the free radicals of the photoetching ink during photoetching is avoided. The speed of photo-etching white oil imaging and the smoothness and hardness of the cured white oil surface are ensured, the phenomenon of pencil marks generated by the friction between metal and the white oil surface is eliminated, the reflectivity is ensured, and the influence of ozone on the hardness and smoothness of the printing ink caused by the generation of ozone during ultraviolet photo-etching can be prevented by using nitrogen or inert gas as protective gas.
3. The technology is designed by self and uses the protection of nitrogen spraying or inert gas for photoetching production, thereby not only protecting the energy in the curing process of laser photoetching ink, but also avoiding the pollution of ozone to the atmosphere, greatly reducing the unit exposure intensity, further improving the exposure speed by more than 300 percent, greatly improving the yield of products, simultaneously solving the problem of blackening and scratching after the white oil surface is carved, and greatly improving the hardness and the reflectivity of the white oil PCB.
4. The exposure speed of the photoetching machine is greatly improved after the gas protection technology is applied, the exposure speed is only 35 mm/s when the gas protection is not available, and the exposure speed reaches 140 mm/s after the gas protection is available. The product has 1) high precision. And (3) performing pattern exposure treatment by using a photoetching machine, wherein the edge of the pattern is flat and smooth, and the superposition of the solder mask and the circuit is accurate. 2) The light reflection rate is greatly improved. After the protection of gas, free radicals in the printing ink are not lost, the glossiness of the printing ink is improved, and the light reflection rate is ensured.
5. When the protective gas adopts nitrogen, the nitrogen is convenient to manufacture, low in price and safe.
6. The production efficiency is improved by several times, the glossiness of the ink is good, the light reflection rate is good, the firmness is good, and the phenomenon that pencil marks are blackened is avoided. Can be widely applied to the fields of illumination, household appliances, automotive electronics, war industry and the like.
Detailed Description
In the invention, the protection of the printing ink and the light energy is carried out by independently researching the isolation of oxygen and water vapor in the area where the photoetching belt of the photoetching machine is located by using nitrogen or inert gas and the like. Therefore, the surface hardness and the reflectivity of the white oil solder mask are greatly reduced, the generation of blackening scratches is eliminated, and the hardness and the glossiness of the white oil PCB are improved.
Wherein, a simple protective gas spraying device can be designed and installed in a large-breadth photoetching machine with the width of 1.25m by 1.25m, and the protection of nitrogen or inert gas is kept in the exposure area all the time. The device is linked with the photoetching machine, protective gas is sprayed out only during exposure, and only the light band irradiation area is covered, so that the mode of saving the cost the most is achieved. The inert gas is sprayed out only during exposure, and only the light band irradiation area is covered, so that the good photoetching exposure quality is achieved, and the consumption of the protective gas is saved to the maximum extent.
The technology can be applied to 1.25m by 1.25m large-size PCB photoetching equipment and is also suitable for 1.56m2The following processing requirements for different specifications of PCBs.
The energy grids show 4 grids, the glossiness of the ink after exposure is good, the firmness of the ink after high-temperature curing is good, and the problem that the ink is blackened is solved.
The principle of exposure is that free radicals in the ink and ultraviolet light undergo a photoreaction, so that the exposed part is polymerized and cured. Oxygen and water vapor in the air consume a large amount of light energy and free radicals in the ink, resulting in insufficient energy reaching the ink surface upon exposure and greatly reducing the hardness and gloss of the ink surface. Therefore, to remove oxygen and water vapor from the ink sites being exposed, an inert gas blanket is optimally used. The research of the project discovers that the nitrogen or inert gas used as the protective gas for the large-format photoetching machine to photoetch the white oil solder mask can well solve the problems of photoetching the white oil board speed and blackening and scratching the surface of the white oil board. A device for spraying protective gas is designed to keep the gas protection of the exposure area. The device only sprays protective gas such as inert gas, nitrogen and the like during laser photoetching, and only covers a light band irradiation area, thereby achieving the mode of saving the cost the most. The exposure speed is improved by more than 300%, and the yield of products is greatly improved. Solves the problem that the white oil surface has black scratches due to friction, and greatly improves the hardness and the glossiness of the ink.
The first embodiment is as follows:
the embodiment comprises the following steps: (1) and (3) pretreatment, namely removing the surface oxide layer of the PCB, specifically soaking the copper-clad plate in dilute acid to remove the surface oxide layer, and facilitating coating of the line photosensitive ink. Wherein the soaking step further comprises washing, pickling, washing, brushing, washing, drying, washing with water in the market and drying, wherein the washing is carried out by a nylon brush with 320 meshes or 500 meshes. (2) Starting oil, namely adding no oil-starting water into the line photosensitive ink, controlling the viscosity to be 150dg alpha s, and adding 10% of diluent into the solder resist oil; (3) coating line photosensitive ink, wherein the thickness of the line photosensitive ink is controlled to be 13 microns; (4) standing for 1 minute by a horizontal transmission belt; (5) primary drying, namely heating and drying the mixture by a horizontal tunnel furnace, wherein the temperature zone is 100/120/120/120/120/105/100 ℃, and the speed is 7 meters per minute; (6) primary cooling, cooling to normal temperature; (7) primary laser imaging is carried out, the laser density is 60mj, and the speed is 200 MM/s; (8) carrying out primary development, and finishing a circuit pattern in a potassium carbonate solution, wherein the circuit pattern is finished in a conventional existing manner and a manner commonly used by a person in the field; (9) the intermediate treatment is completed according to the procedures of water washing, acid washing, water washing, 500-mesh polishing and brushing, water washing, city water washing and drying; (10) coating solder resist oil, and controlling the thickness of the dry film surface to be 23 micrometers; (11) standing for the second time, and standing for 1 minute through a horizontal transmission line; (12) secondary drying, namely heating and baking the mixture by a horizontal tunnel furnace, wherein the temperature areas are 110/145/150/160/160/160/150/120 ℃; (13) secondary cooling, wherein the secondary cooling is carried out for 10 minutes to normal temperature through a conveying temporary storage machine; (14) carrying out photoetching under the protection of nitrogen, ejecting nitrogen during exposure, and keeping the exposure area always protected by the gas; the gas purity of nitrogen is 99 percent, the gas flow is 4 cubic meters per hour, and the gas pressure is 0.7MP alpha; (15) secondary laser imaging is carried out, the laser density is 220mj, and the speed is 54 mm/S; (16) and (3) secondary development, namely completing the solder mask development in a potassium carbonate solution, wherein the solder mask development (17) is completed by high-temperature baking according to the conventional existing development mode commonly used by persons in the field, and the solder mask development is baked in a high-temperature tunnel furnace, wherein the temperature zone is 100/150/150/150/150/120/100, and the speed is 0.2 m/min.
Example two:
the embodiment comprises the following steps: (1) and (3) pretreatment, namely removing the surface oxide layer of the PCB, specifically soaking the copper-clad plate in dilute acid to remove the surface oxide layer, and facilitating coating of the line photosensitive ink. Wherein the soaking step further comprises washing, pickling, washing, brushing, washing, drying, washing with water in the market and drying, wherein the washing is carried out by a nylon brush with 320 meshes or 500 meshes. (2) Starting oil, namely adding no oil-starting water into the line photosensitive ink, controlling the viscosity to be 140 dga.s, and adding 10% of diluent into the solder resist oil; (3) coating line photosensitive ink, wherein the thickness of the line photosensitive ink is controlled to be 12 microns; (4) standing for 1 minute by a horizontal transmission belt; (5) primary drying, namely heating and drying the mixture by a horizontal tunnel furnace, wherein the temperature zone is 100/120/120/120/120/105/100 ℃, and the speed is 7 meters per minute; (6) primary cooling, cooling to normal temperature; (7) primary laser imaging is carried out, the laser density is 60mj, and the speed is 200 MM/s; (8) carrying out primary development, and finishing a circuit pattern in a potassium carbonate solution, wherein the circuit pattern is finished in a conventional existing manner and a manner commonly used by a person in the field; (9) the intermediate treatment is completed according to the procedures of water washing, acid washing, water washing, 500-mesh polishing and brushing, water washing, city water washing and drying; (10) coating solder resist oil, and controlling the thickness of the surface of the dry film to be 20 micrometers; (11) standing for the second time, and standing for 1 minute through a horizontal transmission line; (12) secondary drying, namely heating and baking the mixture by a horizontal tunnel furnace, wherein the temperature areas are 110/145/150/160/160/160/150/120 ℃; (13) secondary cooling, wherein the secondary cooling is carried out for 10 minutes to normal temperature through a conveying temporary storage machine; (14) carrying out photoetching under the protection of nitrogen, ejecting nitrogen during exposure, and keeping the exposure area always protected by the gas; the gas purity of the nitrogen is 99 percent, the gas flow is 4 cubic meters per hour, and the gas pressure is 0.7 MPa; (15) secondary laser imaging is carried out, the laser density is 220mj, and the speed is 54 mm/S; (16) and (3) secondary development, namely completing the solder mask development in a potassium carbonate solution, wherein the solder mask development (17) is completed by high-temperature baking according to the conventional existing development mode commonly used by persons in the field, and the solder mask development is baked in a high-temperature tunnel furnace, wherein the temperature zone is 100/150/150/150/150/120/100, and the speed is 0.2 m/min.
Example three:
the embodiment comprises the following steps: (1) and (3) pretreatment, namely removing the surface oxide layer of the PCB, specifically soaking the copper-clad plate in dilute acid to remove the surface oxide layer, and facilitating coating of the line photosensitive ink. Wherein the soaking step further comprises washing, pickling, washing, brushing, washing, drying, washing with water in the market and drying, wherein the washing is carried out by a nylon brush with 320 meshes or 500 meshes. (2) Starting oil, namely adding no oil-starting water into the line photosensitive ink, controlling the viscosity to be 170dga & s, and adding 10% of diluent into the solder resist oil; (3) coating line photosensitive ink, wherein the thickness of the line photosensitive ink is controlled to be 15 microns; (4) standing for 1 minute by a horizontal transmission belt; (5) primary drying, namely heating and drying the mixture by a horizontal tunnel furnace, wherein the temperature zone is 100/120/120/120/120/105/100 ℃, and the speed is 7 meters per minute; (6) primary cooling, cooling to normal temperature; (7) primary laser imaging is carried out, the laser density is 60mj, and the speed is 200 MM/s; (8) carrying out primary development, and finishing a circuit pattern in a potassium carbonate solution, wherein the circuit pattern is finished in a conventional existing manner and a manner commonly used by a person in the field; (9) the intermediate treatment is completed according to the procedures of water washing, acid washing, water washing, 500-mesh polishing and brushing, water washing, city water washing and drying; (10) coating solder resist oil, and controlling the thickness of the dry film surface to be 25 micrometers; (11) standing for the second time, and standing for 1 minute through a horizontal transmission line; (12) secondary drying, namely heating and baking the mixture by a horizontal tunnel furnace, wherein the temperature areas are 110/145/150/160/160/160/150/120 ℃; (13) secondary cooling, wherein the secondary cooling is carried out for 10 minutes to normal temperature through a conveying temporary storage machine; (14) carrying out photoetching under the protection of nitrogen, ejecting nitrogen during exposure, and keeping the exposure area always protected by the gas; the gas purity of nitrogen is 99 percent, the gas flow is 4 cubic meters per hour, and the gas pressure is 0.7MP alpha; (15) secondary laser imaging is carried out, the laser density is 220mj, and the speed is 54 mm/S; (16) and (3) secondary development, namely completing the solder mask development in a potassium carbonate solution, wherein the solder mask development (17) is completed by high-temperature baking according to the conventional existing development mode commonly used by persons in the field, and the solder mask development is baked in a high-temperature tunnel furnace, wherein the temperature zone is 100/150/150/150/150/120/100, and the speed is 0.2 m/min.
Example four:
the embodiment comprises the following steps: (1) and (3) pretreatment, namely removing the surface oxide layer of the PCB, specifically soaking the copper-clad plate in dilute acid to remove the surface oxide layer, and facilitating coating of the line photosensitive ink. Wherein the soaking step further comprises washing, pickling, washing, brushing, washing, drying, washing with water in the market and drying, wherein the washing is carried out by a nylon brush with 320 meshes or 500 meshes. (2) Starting oil, namely adding no oil-starting water into the line photosensitive ink, controlling the viscosity to be 150dga & s, and adding 10% of diluent into the solder resist oil; (3) coating line photosensitive ink, wherein the thickness of the line photosensitive ink is controlled to be 13 microns; (4) standing for 1 minute by a horizontal transmission belt; (5) primary drying, namely heating and drying the mixture by a horizontal tunnel furnace, wherein the temperature zone is 100/120/120/120/120/105/100 ℃, and the speed is 7 meters per minute; (6) primary cooling, cooling to normal temperature; (7) primary laser imaging is carried out, the laser density is 60mj, and the speed is 200 MM/s; (8) carrying out primary development, and finishing a circuit pattern in a potassium carbonate solution, wherein the circuit pattern is finished in a conventional existing manner and a manner commonly used by a person in the field; (9) the intermediate treatment is completed according to the procedures of water washing, acid washing, water washing, 500-mesh polishing and brushing, water washing, city water washing and drying; (10) coating solder resist oil, and controlling the thickness of the dry film surface to be 23 micrometers; (11) standing for the second time, and standing for 1 minute through a horizontal transmission line; (12) secondary drying, namely heating and baking the mixture by a horizontal tunnel furnace, wherein the temperature areas are 110/145/150/160/160/160/150/120 ℃; (13) secondary cooling, wherein the secondary cooling is carried out for 10 minutes to normal temperature through a conveying temporary storage machine; (14) carrying out photoetching under the protection of inert gas, ejecting the inert gas during exposure, and keeping the exposure area always protected by the gas; the gas purity of the inert gas is 99 percent, the gas flow is 4 cubic meters per hour, and the gas pressure is 0.7MP alpha; (15) secondary laser imaging is carried out, the laser density is 220mj, and the speed is 54 mm/S; (16) and (3) secondary development, namely completing the solder mask development in a potassium carbonate solution, wherein the solder mask development (17) is completed by high-temperature baking according to the conventional existing development mode commonly used by persons in the field, and the solder mask development is baked in a high-temperature tunnel furnace, wherein the temperature zone is 100/150/150/150/150/120/100, and the speed is 0.2 m/min.
Wherein the inert gas can be argon or carbon dioxide.
Example five:
the embodiment comprises the following steps: (1) and (3) pretreatment, namely removing the surface oxide layer of the PCB, specifically soaking the copper-clad plate in dilute acid to remove the surface oxide layer, and facilitating coating of the line photosensitive ink. Wherein the soaking step further comprises washing, pickling, washing, brushing, washing, drying, washing with water in the market and drying, wherein the washing is carried out by a nylon brush with 320 meshes or 500 meshes. (2) Starting oil, namely adding no oil-starting water into the line photosensitive ink, controlling the viscosity to be 140 dga.s, and adding 10% of diluent into the solder resist oil; (3) coating line photosensitive ink, wherein the thickness of the line photosensitive ink is controlled to be 12 microns; (4) standing for 1 minute by a horizontal transmission belt; (5) primary drying, namely heating and drying the mixture by a horizontal tunnel furnace, wherein the temperature zone is 100/120/120/120/120/105/100 ℃, and the speed is 7 meters per minute; (6) primary cooling, cooling to normal temperature; (7) primary laser imaging is carried out, the laser density is 60mj, and the speed is 200 MM/s; (8) carrying out primary development, and finishing a circuit pattern in a potassium carbonate solution, wherein the circuit pattern is finished in a conventional existing manner and a manner commonly used by a person in the field; (9) the intermediate treatment is completed according to the procedures of water washing, acid washing, water washing, 500-mesh polishing and brushing, water washing, city water washing and drying; (10) coating solder resist oil, and controlling the thickness of the surface of the dry film to be 20 micrometers; (11) standing for the second time, and standing for 1 minute through a horizontal transmission line; (12) secondary drying, namely heating and baking the mixture by a horizontal tunnel furnace, wherein the temperature areas are 110/145/150/160/160/160/150/120 ℃; (13) secondary cooling, wherein the secondary cooling is carried out for 10 minutes to normal temperature through a conveying temporary storage machine; (14) carrying out photoetching under the protection of inert gas, ejecting the inert gas during exposure, and keeping the exposure area always protected by the gas; the gas purity of the inert gas is 99 percent, the gas flow is 4 cubic meters per hour, and the gas pressure is 0.7MP alpha; (15) secondary laser imaging is carried out, the laser density is 220mj, and the speed is 54 mm/S; (16) and (3) secondary development, namely completing the solder mask development in a potassium carbonate solution, wherein the solder mask development (17) is completed by high-temperature baking according to the conventional existing development mode commonly used by persons in the field, and the solder mask development is baked in a high-temperature tunnel furnace, wherein the temperature zone is 100/150/150/150/150/120/100, and the speed is 0.2 m/min.
Wherein the inert gas can be argon or carbon dioxide.
Example six:
the embodiment comprises the following steps: (1) and (3) pretreatment, namely removing the surface oxide layer of the PCB, specifically soaking the copper-clad plate in dilute acid to remove the surface oxide layer, and facilitating coating of the line photosensitive ink. Wherein the soaking step further comprises washing, pickling, washing, brushing, washing, drying, washing with water in the market and drying, wherein the washing is carried out by a nylon brush with 320 meshes or 500 meshes. (2) Starting oil, namely adding no oil-starting water into the line photosensitive ink, controlling the viscosity to be 170dga & s, and adding 10% of diluent into the solder resist oil; (3) coating line photosensitive ink, wherein the thickness of the line photosensitive ink is controlled to be 15 microns; (4) standing for 1 minute by a horizontal transmission belt; (5) primary drying, namely heating and drying the mixture by a horizontal tunnel furnace, wherein the temperature zone is 100/120/120/120/120/105/100 ℃, and the speed is 7 meters per minute; (6) primary cooling, cooling to normal temperature; (7) primary laser imaging is carried out, the laser density is 60mj, and the speed is 200 MM/s; (8) carrying out primary development, and finishing a circuit pattern in a potassium carbonate solution, wherein the circuit pattern is finished in a conventional existing manner and a manner commonly used by a person in the field; (9) the intermediate treatment is completed according to the procedures of water washing, acid washing, water washing, 500-mesh polishing and brushing, water washing, city water washing and drying; (10) coating solder resist oil, and controlling the thickness of the dry film surface to be 25 micrometers; (11) standing for the second time, and standing for 1 minute through a horizontal transmission line; (12) secondary drying, namely heating and baking the mixture by a horizontal tunnel furnace, wherein the temperature areas are 110/145/150/160/160/160/150/120 ℃; (13) secondary cooling, wherein the secondary cooling is carried out for 10 minutes to normal temperature through a conveying temporary storage machine; (14) carrying out photoetching under the protection of inert gas, ejecting the inert gas during exposure, and keeping the exposure area always protected by the gas; the gas purity of the inert gas is 99 percent, the gas flow is 4 cubic meters per hour, and the gas pressure is 0.7 MPa; (15) secondary laser imaging is carried out, the laser density is 220mj, and the speed is 54 mm/S; (16) and (3) secondary development, namely completing the solder mask development in a potassium carbonate solution, wherein the solder mask development (17) is completed by high-temperature baking according to the conventional existing development mode commonly used by persons in the field, and the solder mask development is baked in a high-temperature tunnel furnace, wherein the temperature zone is 100/150/150/150/150/120/100, and the speed is 0.2 m/min.
Wherein the inert gas can be argon or carbon dioxide.
The above embodiments are illustrative of the present invention, and are not intended to limit the present invention, and any simple modifications of the present invention are within the scope of the present invention.
Claims (7)
1. A PCB solder mask white oil photoetching process capable of eliminating pencil marks is characterized by comprising the following steps:
(1) pre-treatment, which is used for removing an oxide layer on the surface of the PCB;
(2) starting oil, namely not adding oil-starting water to the line photosensitive ink, controlling the viscosity to be 140-;
(3) coating line photosensitive ink, wherein the thickness of the line photosensitive ink is controlled to be 12-15 microns;
(4) standing for 1 minute by a horizontal transmission belt;
(5) primary drying;
(6) primary cooling, cooling to normal temperature;
(7) primary laser imaging is carried out, the laser density is 60mj, and the speed is 200 MM/s;
(8) carrying out primary development, and finishing a circuit pattern in a potassium carbonate solution;
(9) performing intermediate treatment;
(10) coating solder resist oil, and controlling the thickness of the dry film surface to be 20-25 micrometers;
(11) standing for the second time, and standing for 1 minute through a horizontal transmission line;
(12) secondary drying;
(13) secondary cooling, conveying the temporary storage machine to cool for 10 minutes to normal temperature;
(14) carrying out photoetching under the protection of nitrogen or inert gas, spraying the nitrogen or inert gas as protective gas when a photoetching machine carries out exposure, and covering a light band irradiation area;
(15) secondary laser imaging is carried out, the laser density is 220mj, and the speed is 54 mm/S;
(16) secondary development, namely completing solder resist development in potassium carbonate solution;
(17) baking at high temperature in a high-temperature vertical tunnel furnace at 100/150/150/150/150/120/100 deg.C and 0.2 m/min.
2. The PCB solder mask white oil photoetching process capable of eliminating pencil marks as claimed in claim 1, wherein: the specific treatment method for the pretreatment in the step (1) comprises the following steps: soaking the copper-clad plate in dilute acid, and then washing, pickling, washing, brushing and brushing 320-mesh and 500-mesh nylon, washing in water in the market and drying.
3. The PCB solder mask white oil photoetching process capable of eliminating pencil marks as claimed in claim 1, wherein: the specific treatment method for one-time drying in the step (5) comprises the following steps: heating and drying by a horizontal tunnel furnace, wherein the temperature zone is 100/120/120/120/120/105/100 ℃, and the speed is 7 meters per minute.
4. The PCB solder mask white oil photoetching process capable of eliminating pencil marks as claimed in claim 1, wherein: the specific processing method in the step (9) comprises the following steps: the process is completed according to the procedures of water washing, acid washing, water washing, 500-mesh polishing and brushing, water washing, commercial water washing and drying.
5. The PCB solder mask white oil photoetching process capable of eliminating pencil marks as claimed in claim 1, wherein: the specific treatment method for secondary drying in the step (12) comprises the following steps: heating and baking in a horizontal tunnel furnace, wherein the temperature zones are 110/145/150/160/160/160/150/120 ℃ respectively, and the speed is 7 m/min.
6. The PCB solder mask white oil photoetching process capable of eliminating pencil marks as claimed in claim 1, wherein: the specific processing method in the step (14) comprises the following steps: nitrogen or inert gas is sprayed out during exposure, and the protection of the gas is kept in the exposure area; the gas purity of nitrogen or inert gas is 99 percent, the gas flow is 4 cubic meters per hour, and the gas pressure is 0.7 MPa.
7. The PCB solder mask white oil photoetching process capable of eliminating pencil marks as claimed in claim 1 or 6, wherein: the inert gas is argon (Ar) or carbon dioxide.
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| JPH03256856A (en) * | 1990-02-22 | 1991-11-15 | Matsushita Electric Ind Co Ltd | Wiring circuit base packaged body and wiring circuit take-out method from wiring circuit base packaged body |
| CN106304671A (en) * | 2016-08-30 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of method for circuit board making soldering-resistance layer |
| CN106502056A (en) * | 2015-09-03 | 2017-03-15 | 旭东机械工业股份有限公司 | laser direct exposure apparatus and method |
| CN109041439A (en) * | 2018-08-21 | 2018-12-18 | 浙江罗奇泰克电子有限公司 | A kind of laser lithography PCB welding resistance pattern transfer and moulding process |
| CN109819599A (en) * | 2019-03-15 | 2019-05-28 | 景旺电子科技(龙川)有限公司 | A method of solving the photosensitive white oil pencil print of welding resistance |
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2021
- 2021-07-22 CN CN202110830711.1A patent/CN113556881A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03256856A (en) * | 1990-02-22 | 1991-11-15 | Matsushita Electric Ind Co Ltd | Wiring circuit base packaged body and wiring circuit take-out method from wiring circuit base packaged body |
| CN106502056A (en) * | 2015-09-03 | 2017-03-15 | 旭东机械工业股份有限公司 | laser direct exposure apparatus and method |
| CN106304671A (en) * | 2016-08-30 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of method for circuit board making soldering-resistance layer |
| CN109041439A (en) * | 2018-08-21 | 2018-12-18 | 浙江罗奇泰克电子有限公司 | A kind of laser lithography PCB welding resistance pattern transfer and moulding process |
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