CN201234402Y - PCB board - Google Patents
PCB board Download PDFInfo
- Publication number
- CN201234402Y CN201234402Y CNU2008200956034U CN200820095603U CN201234402Y CN 201234402 Y CN201234402 Y CN 201234402Y CN U2008200956034 U CNU2008200956034 U CN U2008200956034U CN 200820095603 U CN200820095603 U CN 200820095603U CN 201234402 Y CN201234402 Y CN 201234402Y
- Authority
- CN
- China
- Prior art keywords
- pcb board
- via hole
- pcb
- utility
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model belongs to the field of printed circuit boards and provides a printed circuit board (PCB) which comprises a welding pad for welded elements, and a through hole connected with the welding pad through a wire and used for connecting each layer of the PCB; the surface of the through hole is covered with a solder-resist paint layer, and the surface of the through hole covered with solder-resist paint is covered with an insulating oil layer. The surface of the through hole of the PCB provided by the utility model is covered with the solder-resist paint layer and the insulating oil layer, thereby effectively preventing the short circuit between the PCB and the elements on the PCB.
Description
Technical field
The utility model belongs to art of printed circuit boards, relates in particular to a kind of pcb board.
Background technology
Along with the develop rapidly of electron trade, the trend of electronic product microminiaturization is obvious day by day, and (Printed Circuit Board can place a lot of elements on PCB) for slight printed circuit board (PCB).The function that pcb board is realized is complicated more, and the number of plies of pcb board is also just many more, connect with via hole between every layer of pcb board, in the via hole surface gold-plating to guarantee its connectedness.Because pcb board and the element that carried thereof are more and more littler, the distance between via hole and the via hole, between via hole and the pad is more and more nearer, in the time of may causing element to weld by pad and pcb board be short-circuited.Therefore, at via hole surface coverage one deck green oil to prevent short circuit.Yet the hypotelorism of via hole and pad or other reasons caused hole surface not cover green oil fully sometimes, caused element when welding and pcb board to be short-circuited.
The utility model content
The purpose of this utility model is to provide a kind of pcb board, is intended to solve in the existing pcb board can not cover green oil fully because of crossing hole surface, when causing the element welding and the problem that is short-circuited of pcb board.
The utility model is achieved in that a kind of pcb board, comprising:
The pad of soldered elements;
Be connected with described pad by cabling, connect the via hole of each layer of described pcb board;
Described via hole surface coverage one deck welding resistance lacquer;
The described via hole surface coverage one deck insulating oil that is coated with the welding resistance lacquer.
The hole surface excessively of the pcb board that the utility model embodiment provides also is coated with one deck insulating oil except covering one deck welding resistance lacquer, can prevent effectively that element is short-circuited on pcb board and the plate.
Description of drawings
Fig. 1 is the structural representation of the pcb board that provides of the utility model embodiment.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
The pcb board that the utility model embodiment provides prevents to be short-circuited between the element on pcb board and the plate at via hole surface coverage one deck insulating oil.
Fig. 1 shows the partial structurtes of the pcb board golden finger pad that the utility model embodiment provides, and for convenience of explanation, only shows the part relevant with the utility model.
10 is via hole, and 11 is pad, and 12 are the green oil position of windowing, and wherein, via hole 10 is the surface of connection PCB plate and the hole of bottom, has certain degree of depth, is electrically connected every layer printed circuit board.Pad 11 is the Copper Foil of soldered elements pin.Via hole 10 is connected with pad 11 by cabling, when preventing that element from welding by pad and pcb board be short-circuited, at via hole surface coverage one deck welding resistance lacquer, green oil for example is to prevent short circuit.Be convenient to soldered elements for pad 11 is exposed, offering green oil window 12 between each pad and on the pad.
Because the distance between the pad 11 is closer, via hole is not certain and pairing pad is positioned on the straight line, if some via hole does not cover the welding resistance lacquer fully, as Flexible Printed Circuit (Flexible PrintedCircuit, when FPC) attaching on the pad, the FPC golden finger just may with not corresponding via hole conducting, form short circuit.
In embodiments of the present invention, causing hole surface can not cover the situation that green oil still can cause being short-circuited between the element on pcb board and the plate fully for fear of the hypotelorism of via hole and pad or other reasons occurs, in the via hole surface attachment that is coated with the welding resistance lacquer one deck insulating oil 13 is arranged.
In the utility model embodiment, insulating oil 13 can be white oil, and the mode by silk-screen is attached to via hole 10 surfaces.
The hole surface excessively of the pcb board that the utility model embodiment provides also is coated with one deck insulating oil except covering one deck welding resistance lacquer, can prevent effectively that element is short-circuited on pcb board and the plate.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (4)
1, a kind of pcb board comprises:
The pad of soldered elements;
Be connected with described pad by cabling, connect the via hole of each layer of described pcb board;
Described via hole surface coverage one deck welding resistance lacquer;
It is characterized in that the described via hole surface coverage one deck insulating oil that is coated with the welding resistance lacquer.
2, pcb board as claimed in claim 1 is characterized in that, described insulating oil is a white oil.
3, pcb board as claimed in claim 2 is characterized in that, described white oil is attached to the described hole surface of crossing that is coated with the welding resistance lacquer by the mode of silk-screen.
As claim 1,2 or 3 described pcb boards, it is characterized in that 4, described welding resistance lacquer is green oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200956034U CN201234402Y (en) | 2008-07-14 | 2008-07-14 | PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200956034U CN201234402Y (en) | 2008-07-14 | 2008-07-14 | PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201234402Y true CN201234402Y (en) | 2009-05-06 |
Family
ID=40620789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200956034U Expired - Lifetime CN201234402Y (en) | 2008-07-14 | 2008-07-14 | PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201234402Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079341A (en) * | 2012-12-24 | 2013-05-01 | 广东欧珀移动通信有限公司 | Structure preventing short circuit caused by soldering of PCB (Printed Circuit Board) board and PCB board with structure |
| CN104284513A (en) * | 2013-07-04 | 2015-01-14 | 大陆汽车电子(长春)有限公司 | Printed circuit board |
| CN106061128A (en) * | 2016-08-09 | 2016-10-26 | 深圳市景旺电子股份有限公司 | Printed circuit board and method of coating white oil on surface |
| CN106304671A (en) * | 2016-08-30 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of method for circuit board making soldering-resistance layer |
| CN106783654A (en) * | 2016-11-28 | 2017-05-31 | 西安科锐盛创新科技有限公司 | The preparation method of bare chip test protection structure |
| CN110662351A (en) * | 2019-09-30 | 2020-01-07 | 广西天山电子股份有限公司 | Connect reliable PCB board |
-
2008
- 2008-07-14 CN CNU2008200956034U patent/CN201234402Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079341A (en) * | 2012-12-24 | 2013-05-01 | 广东欧珀移动通信有限公司 | Structure preventing short circuit caused by soldering of PCB (Printed Circuit Board) board and PCB board with structure |
| CN103079341B (en) * | 2012-12-24 | 2016-08-03 | 广东欧珀移动通信有限公司 | The structure of the anti-solder shorts of pcb board and there is the pcb board of this structure |
| CN104284513A (en) * | 2013-07-04 | 2015-01-14 | 大陆汽车电子(长春)有限公司 | Printed circuit board |
| CN104284513B (en) * | 2013-07-04 | 2019-02-12 | 大陆汽车电子(长春)有限公司 | Printed circuit board |
| CN106061128A (en) * | 2016-08-09 | 2016-10-26 | 深圳市景旺电子股份有限公司 | Printed circuit board and method of coating white oil on surface |
| CN106304671A (en) * | 2016-08-30 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of method for circuit board making soldering-resistance layer |
| CN106783654A (en) * | 2016-11-28 | 2017-05-31 | 西安科锐盛创新科技有限公司 | The preparation method of bare chip test protection structure |
| CN106783654B (en) * | 2016-11-28 | 2019-12-13 | 深圳市宏旺微电子有限公司 | Method for manufacturing protection structure for testing bare chip |
| CN110662351A (en) * | 2019-09-30 | 2020-01-07 | 广西天山电子股份有限公司 | Connect reliable PCB board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150902 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150902 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen BYD Electronic Component Co., Ltd. Address before: 518118 Pingshan Road, Pingshan Town, Shenzhen, Guangdong, No. 3001, No. Patentee before: Biyadi Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090506 |