WO2006030352A3 - Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder - Google Patents

Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder Download PDF

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Publication number
WO2006030352A3
WO2006030352A3 PCT/IB2005/052936 IB2005052936W WO2006030352A3 WO 2006030352 A3 WO2006030352 A3 WO 2006030352A3 IB 2005052936 W IB2005052936 W IB 2005052936W WO 2006030352 A3 WO2006030352 A3 WO 2006030352A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
solder
electronic device
means
printed circuit
circuit board
Prior art date
Application number
PCT/IB2005/052936
Other languages
French (fr)
Other versions
WO2006030352A2 (en )
Inventor
Wouter Maes
Original Assignee
Koninkl Philips Electronics Nv
Wouter Maes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/44Manufacture insulated metal core circuits or other insulated electrically conductive core circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0305Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09554Via connected to metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09563Metal filled via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10977Encapsulated connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections or via connections

Abstract

An electronic device comprises a flexible, printed circuit board having an electrically conductive layer (2) on one side of the flexible board, and a conductive metallic stiffener (8) which is attached to the flexible board. Said conductive layer (2) is conductively connected to the metallic stiffener (8) by means of solder. The flexible board is provided with a through-hole (10), the solder connecting the metallic stiffener (8) with the conductive layer (2) being present in said through-hole (10).
PCT/IB2005/052936 2004-09-13 2005-09-08 Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder WO2006030352A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04104416 2004-09-13
EP04104416.5 2004-09-13

Publications (2)

Publication Number Publication Date
WO2006030352A2 true WO2006030352A2 (en) 2006-03-23
WO2006030352A3 true true WO2006030352A3 (en) 2006-07-27

Family

ID=36060404

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2005/052936 WO2006030352A3 (en) 2004-09-13 2005-09-08 Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder

Country Status (1)

Country Link
WO (1) WO2006030352A3 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9474154B2 (en) 2014-07-18 2016-10-18 Starkey Laboratories, Inc. Reflow solderable flexible circuit board — to — flexible circuit board connector reinforcement

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172307B1 (en) * 1993-03-01 2001-01-09 Motorola, Inc. Feedthrough via connection on solder resistant layer
US20030034174A1 (en) * 2000-05-26 2003-02-20 Zhong-You Shi Circuit board and a method for making the same
US6534848B1 (en) * 2000-09-07 2003-03-18 International Business Machines Corporation Electrical coupling of a stiffener to a chip carrier
EP1376778A2 (en) * 2002-06-25 2004-01-02 Motorola, Inc. Ground connector assembly with substrate strain relief and method of making the same
US6700748B1 (en) * 2000-04-28 2004-03-02 International Business Machines Corporation Methods for creating ground paths for ILS
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172307B1 (en) * 1993-03-01 2001-01-09 Motorola, Inc. Feedthrough via connection on solder resistant layer
US6700748B1 (en) * 2000-04-28 2004-03-02 International Business Machines Corporation Methods for creating ground paths for ILS
US20030034174A1 (en) * 2000-05-26 2003-02-20 Zhong-You Shi Circuit board and a method for making the same
US6534848B1 (en) * 2000-09-07 2003-03-18 International Business Machines Corporation Electrical coupling of a stiffener to a chip carrier
EP1376778A2 (en) * 2002-06-25 2004-01-02 Motorola, Inc. Ground connector assembly with substrate strain relief and method of making the same
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation

Also Published As

Publication number Publication date Type
WO2006030352A2 (en) 2006-03-23 application

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