JP2012104627A5 - - Google Patents
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- JP2012104627A5 JP2012104627A5 JP2010251463A JP2010251463A JP2012104627A5 JP 2012104627 A5 JP2012104627 A5 JP 2012104627A5 JP 2010251463 A JP2010251463 A JP 2010251463A JP 2010251463 A JP2010251463 A JP 2010251463A JP 2012104627 A5 JP2012104627 A5 JP 2012104627A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit board
- printed circuit
- board according
- interposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Description
前記従来の課題を解決するために、本発明のプリント基板は、外部接続端子を備えた電子部品と、外部接続端子を挿通する接続穴を備えた基板と、基板の表面に突出する介装部
材とを含み、介装部材は、電子部品と基板の表面との間に間隙を生ずるように介装され、間隙は接続穴と外部空間とを連通することを特徴とするものである。
In order to solve the above-described conventional problems, a printed circuit board according to the present invention includes an electronic component having an external connection terminal, a board having a connection hole through which the external connection terminal is inserted, and an interposed member protruding from the surface of the board. The interposition member is interposed so as to create a gap between the electronic component and the surface of the substrate, and the gap communicates the connection hole and the external space.
第１の発明は、外部接続端子を備えた電子部品と、前記外部接続端子を挿通する接続穴を備えた基板と、前記基板の表面に突出する介装部材とを含み、前記介装部材は、前記電子部品と前記基板の表面との間に間隙を生ずるように介装され、前記間隙は前記接続穴と外部空間とを連通することを特徴とするプリント基板である。
1st invention contains the electronic component provided with the external connection terminal, the board | substrate provided with the connection hole which penetrates the said external connection terminal, and the interposed member which protrudes on the surface of the said board | substrate, The said interposed member is The printed circuit board is interposed so as to create a gap between the electronic component and the surface of the board, and the gap communicates the connection hole and the external space.
Claims (6)
前記外部接続端子を挿通する接続穴を備えた基板と、
前記基板の表面に突出する介装部材と、を含み、
前記介装部材は、前記電子部品と前記基板の表面との間に間隙を生ずるように介装され、前記間隙は前記接続穴と外部空間とを連通することを特徴とする、
プリント基板。 Electronic components with external connection terminals;
A substrate having a connection hole through which the external connection terminal is inserted;
An interposition member protruding on the surface of the substrate,
The interposed member is interposed so as to create a gap between the electronic component and the surface of the substrate, and the gap communicates the connection hole and the external space.
Printed board.
請求項１に記載のプリント基板。 The intervention member is formed of solder;
The printed circuit board according to claim 1.
請求項１に記載のプリント基板。 The intervention member is composed of a surface mount component,
The printed circuit board according to claim 1.
請求項１に記載のプリント基板。 The intervention member is composed of a jumper wire,
The printed circuit board according to claim 1.
請求項１〜４のいずれか１項に記載のプリント基板。 The interposition member is not electrically connected to a circuit configured on the substrate;
The printed circuit board according to any one of claims 1 to 4.
請求項１〜４のいずれか１項に記載のプリント基板。 The interposed member is electrically connected to a circuit configured on the substrate.
The printed circuit board according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010251463A JP2012104627A (en) | 2010-11-10 | 2010-11-10 | Printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010251463A JP2012104627A (en) | 2010-11-10 | 2010-11-10 | Printed substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012104627A JP2012104627A (en) | 2012-05-31 |
| JP2012104627A5 true JP2012104627A5 (en) | 2013-12-05 |
Family
ID=46394692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010251463A Pending JP2012104627A (en) | 2010-11-10 | 2010-11-10 | Printed substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012104627A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016025220A (en) * | 2014-07-22 | 2016-02-08 | 株式会社日立製作所 | Mounting structure of insertion component, circuit board, and manufacturing method of electronic circuit device |
| JP6092928B2 (en) * | 2015-04-28 | 2017-03-08 | ファナック株式会社 | Mounting structure of electronic components having leads that suppress the occurrence of blowholes |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH098434A (en) * | 1995-06-19 | 1997-01-10 | Nippondenso Co Ltd | Electronic circuit unit and its manufacture |
| JPH09148705A (en) * | 1995-11-17 | 1997-06-06 | Sony Corp | Circuit board mounted with electronic component |
| JP2005302929A (en) * | 2004-04-09 | 2005-10-27 | Matsushita Electric Ind Co Ltd | Degassing printed board |
-
2010
- 2010-11-10 JP JP2010251463A patent/JP2012104627A/en active Pending
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