JP2013162295A5 - - Google Patents
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- JP2013162295A5 JP2013162295A5 JP2012022061A JP2012022061A JP2013162295A5 JP 2013162295 A5 JP2013162295 A5 JP 2013162295A5 JP 2012022061 A JP2012022061 A JP 2012022061A JP 2012022061 A JP2012022061 A JP 2012022061A JP 2013162295 A5 JP2013162295 A5 JP 2013162295A5
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- JP
- Japan
- Prior art keywords
- mounting surface
- base substrate
- electrode
- hole
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 36
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 3
- 239000007772 electrode material Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 2
- 239000011810 insulating material Substances 0.000 description 1
Description
本発明は、上述の課題の少なくとも一部を解決するためになされたものであり、以下の形態、または適用例として実現することが可能である。
第１の形態に係るベース基板は、電子部品が搭載される搭載面と、前記搭載面の裏面となる実装面と、前記搭載面と前記実装面との間で貫通する貫通孔とを有する基板と、前記貫通孔に配置されていて、かつ、前記搭載面側に凹部を有する貫通電極と、を備えていることを特徴とする。
第２の形態に係るベース基板は、第１の形態に係るベース基板において、前記貫通孔は、前記基板の厚み方向の少なくとも一部において、その幅が前記搭載面側よりも前記実装面側の方が小さい内壁を有し、前記凹部は、その内側の幅が前記搭載面側から前記実装面側に向かって減少していることを特徴とする。
第３の形態に係るベース基板は、第２の形態に係るベース基板において、前記貫通電極は、前記実装面側に第２の凹部を有することを特徴とする。
第４の形態に係るベース基板は、第１の形態乃至第３の形態のいずれか１の形態に係るベース基板において、前記実装面に、前記貫通電極と一体の外部電極を備えていることを特徴とする。
第５の形態に係るベース基板は、第１の形態乃至第４の形態のいずれか１の形態に係るベース基板において、前記搭載面に、前記貫通電極と一体の接続電極を備えていることを特徴とする。
本形態に係る電子デバイスは、第５の形態に係るベース基板の接続電極に電子部品を接続し、前記ベース基板に接合され、前記ベース基板と共に前記電子部品を収容するキャップを備えていることを特徴とする。
本形態に係るベース基板の製造方法は、基板に、前記基板の厚み方向において幅が減少するように貫通孔を形成する工程と、メッキにより前記貫通孔の内壁に電極材料を成長させて、前記基板の前記貫通孔の幅が大きい方の面側に凹部を有する貫通電極を形成する工程と、を含むことを特徴とする。
本形態に係る電子デバイスの製造方法は、本形態のベース基板の製造方法により形成した前記ベース基板の、前記貫通電極と接続している接続電極に電子部品を接続する工程と、キャップを前記ベース基板に接合して、前記電子部品を収容する工程と、を含むことを特徴とする。
［適用例１］電子部品が搭載される搭載面と、前記搭載面の裏面となる実装面と、前記搭載面と前記実装面との間で貫通する貫通孔とを有して絶縁材料からなる基板と、前記貫通孔に埋め込まれていて、かつ、前記搭載面側に凹部を有する貫通電極と、を備えていることを特徴とするベース基板。
SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
A base substrate according to a first embodiment includes a mounting surface on which an electronic component is mounted, a mounting surface that is a back surface of the mounting surface, and a through hole that penetrates between the mounting surface and the mounting surface. And a through electrode disposed in the through hole and having a recess on the mounting surface side.
The base substrate according to a second aspect is the base substrate according to the first aspect, wherein the through-hole is at least partly in the thickness direction of the substrate, the width of which is closer to the mounting surface side than the mounting surface side. The recess has a smaller inner wall, and the recess has an inner width that decreases from the mounting surface side toward the mounting surface side.
A base substrate according to a third aspect is the base substrate according to the second aspect, wherein the through electrode has a second recess on the mounting surface side.
A base substrate according to a fourth aspect is the base substrate according to any one of the first to third aspects, wherein the mounting surface includes an external electrode integrated with the through electrode. Features.
A base substrate according to a fifth aspect is the base substrate according to any one of the first to fourth aspects, wherein the mounting surface includes a connection electrode integral with the through electrode. Features.
The electronic device according to this embodiment includes a cap that connects an electronic component to the connection electrode of the base substrate according to the fifth embodiment, is joined to the base substrate, and accommodates the electronic component together with the base substrate. Features.
The base substrate manufacturing method according to the present embodiment includes a step of forming a through hole in the substrate so that the width decreases in the thickness direction of the substrate, and growing an electrode material on the inner wall of the through hole by plating, Forming a through electrode having a recess on the surface side of the substrate where the width of the through hole is larger.
An electronic device manufacturing method according to the present embodiment includes a step of connecting an electronic component to a connection electrode connected to the through electrode of the base substrate formed by the base substrate manufacturing method of the present embodiment; And a step of accommodating the electronic component by bonding to a substrate.
Application Example 1 An insulating material having a mounting surface on which an electronic component is mounted, a mounting surface serving as a back surface of the mounting surface, and a through hole penetrating between the mounting surface and the mounting surface. A base substrate comprising: a substrate; and a through electrode embedded in the through hole and having a recess on the mounting surface side.
Claims (8)
前記貫通孔に配置されていて、かつ、前記搭載面側に凹部を有する貫通電極と、
を備えていることを特徴とするベース基板。 A substrate for chromatic and mounting surface on which an electronic component is to be mounted, the mounting surface of the back side of the mounting surface, and a through hole penetrating between the mounting surface and the mounting surface,
A through electrode disposed in the through hole and having a recess on the mounting surface side; and
A base substrate comprising:
前記基板の厚み方向の少なくとも一部において、その幅が前記搭載面側よりも前記実装面側の方が小さい内壁を有し、
前記凹部は、その内側の幅が前記搭載面側から前記実装面側に向かって減少していることを特徴とする請求項１に記載のベース基板。 The through hole is
In at least a portion of the thickness direction before Symbol substrate, has an inner wall the smaller of the mounting surface than its width the mounting surface,
The base substrate according to claim 1, wherein an inner width of the concave portion decreases from the mounting surface side toward the mounting surface side.
前記ベース基板に接合され、前記ベース基板と共に前記電子部品を収容するキャップを備えていることを特徴とする電子デバイス。 An electronic component is connected to the connection electrode according to claim 5,
The bonded to the base substrate, an electronic device, characterized in that it comprises a cap for accommodating the electronic component with the base substrate.
メッキにより前記貫通孔の内壁に電極材料を成長させて、前記基板の前記貫通孔の幅が大きい方の面側に凹部を有する貫通電極を形成する工程と、
を含むことを特徴とするベース基板の製造方法。 The board, forming a through hole so that the width in the thickness direction of the substrate is reduced,
And an electrode material is grown on the inner wall of the through hole by plating, forming a through electrode having a concave portion on the side towards the width of the through hole of the base plate is large,
A method for manufacturing a base substrate, comprising:
キャップを前記ベース基板に接合して、前記電子部品を収容する工程と、
を含むことを特徴とする電子デバイスの製造方法。 Connecting the electronic component to the connection electrode connected to the through electrode of the base substrate formed by the method for manufacturing the base substrate according to claim 7;
The caps are bonded to the base substrate, a step of accommodating the electronic component,
The manufacturing method of the electronic device characterized by the above-mentioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012022061A JP2013162295A (en) | 2012-02-03 | 2012-02-03 | Base substrate, electronic device, manufacturing method of base substrate, and manufacturing method of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012022061A JP2013162295A (en) | 2012-02-03 | 2012-02-03 | Base substrate, electronic device, manufacturing method of base substrate, and manufacturing method of electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013162295A JP2013162295A (en) | 2013-08-19 |
| JP2013162295A5 true JP2013162295A5 (en) | 2015-03-26 |
Family
ID=49174220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012022061A Withdrawn JP2013162295A (en) | 2012-02-03 | 2012-02-03 | Base substrate, electronic device, manufacturing method of base substrate, and manufacturing method of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013162295A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6591747B2 (en) * | 2014-12-26 | 2019-10-16 | 京セラ株式会社 | Method for manufacturing piezoelectric device |
| JP6852569B2 (en) * | 2017-05-30 | 2021-03-31 | セイコーエプソン株式会社 | MEMS elements, electronics and mobiles |
| CN113228256B (en) * | 2018-12-27 | 2024-03-22 | 株式会社大真空 | Piezoelectric vibration device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009225218A (en) * | 2008-03-18 | 2009-10-01 | Citizen Holdings Co Ltd | Electrode structure, electronic device, and method of manufacturing electrode structure |
| JP5108579B2 (en) * | 2008-03-21 | 2012-12-26 | シチズンファインテックミヨタ株式会社 | Electronic component package manufacturing method and electronic component package |
| JP5447379B2 (en) * | 2008-08-05 | 2014-03-19 | 株式会社大真空 | Piezoelectric vibration device sealing member and manufacturing method thereof |
| JP2011124752A (en) * | 2009-12-10 | 2011-06-23 | Seiko Epson Corp | Piezoelectric device and sealing method thereof |
-
2012
- 2012-02-03 JP JP2012022061A patent/JP2013162295A/en not_active Withdrawn
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