CN105246273B - A kind of manufacture craft with the rigid-flexible joint plate of restoration - Google Patents

A kind of manufacture craft with the rigid-flexible joint plate of restoration Download PDF

Info

Publication number
CN105246273B
CN105246273B CN201510701398.6A CN201510701398A CN105246273B CN 105246273 B CN105246273 B CN 105246273B CN 201510701398 A CN201510701398 A CN 201510701398A CN 105246273 B CN105246273 B CN 105246273B
Authority
CN
China
Prior art keywords
time
rigid
plate
flexible joint
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510701398.6A
Other languages
Chinese (zh)
Other versions
CN105246273A (en
Inventor
李胜伦
钱小进
黎军
郑冬华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Hongxin Flexible Electronic Technology Co.,Ltd.
Original Assignee
Jiangsu Hongxin Huayin Circuit Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Hongxin Huayin Circuit Technology Co Ltd filed Critical Jiangsu Hongxin Huayin Circuit Technology Co Ltd
Priority to CN201510701398.6A priority Critical patent/CN105246273B/en
Publication of CN105246273A publication Critical patent/CN105246273A/en
Application granted granted Critical
Publication of CN105246273B publication Critical patent/CN105246273B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets

Abstract

The present invention relates to a kind of manufacture crafts with the rigid-flexible joint plate of superpower restoration comprising following steps:S1:It is laminated for the first time, S2:X RAY practice shooting, S3:Milling plate side, S4:Outer layer drills, S5:Deburring, S6:De-smear, S7:Heavy copper, S8:Whole plate electrolytic copper, S9:Outer-layer circuit pre-treatment, S10:Outer laminated film, S11:Outer-layer circuit exposes, S12:Outer-layer circuit etches EES, S13:Change gold, S14:Flying probe, S15:Second of lamination, S16:Milling plate, S17:Product inspection FQC, S18:Packaging.The present invention is by using first to the progress of internal layer soft board, Rigid Flex is made in lamination for the first time, then rigid-flexible joint plate is being made to second of lamination of Rigid Flex progress, gap is formed between the polyimide film and center flexing wiring board of outer layer, to play the role of improving rigid-flexible joint plate restoration performance.

Description

A kind of manufacture craft with the rigid-flexible joint plate of restoration
Technical field
The present invention relates to circuit board manufacture field, especially a kind of manufacture craft with the rigid-flexible joint plate of restoration.
Background technology
Rigid-flex combined board is not a kind of ordinary circuit board, as its name suggests, is being combined for soft board and hardboard, is by lamelliform Flexible bottom and rigid bottom combine, then be laminated into a single component, the circuit board of formation.Rigid-flex combined board has both just Property layer and flexible layers, are a kind of multilayer boards.Typically there are one polyamides Asias for (four layers) rigid-flexible combination printed circuit board Amine core, its upper and lower surface, which has, covers copper foil.External rigidity layer is made of the FR4 of single side, they are laminated into flexible core Two sides is assembled into the PCB of multilayer.Rigid-flexible joint plate is also higher and higher with the more and more extensive performance requirement to it used, In particular for its reconstitution properties, but the reconstitution properties of existing rigid-flexible joint plate are not generally high, so designing a kind of tool There is the manufacture craft of the rigid-flexible joint plate of restoration to be just particularly important.
Invention content
The technical purpose of the present invention is then existed using first to the progress of internal layer soft board, Rigid Flex is made in lamination for the first time Second lamination is carried out to Rigid Flex, rigid-flexible joint plate is made, outer layer polyimide film and center flexing wiring board it Between form gap, to play the role of improving rigid-flexible joint plate restoration performance;It provides a kind of with the rigid-flexible engagement of restoration The manufacture craft of plate.
In order to solve the above technical problems, a kind of manufacture craft with the rigid-flexible joint plate of restoration of offer of the invention, It includes the following steps:Step 1:It is laminated for the first time, step 2:X-RAY practices shooting, step 3:Milling plate side, step 4:Outer layer drills, Step 5:Deburring, step 6:De-smear, step 7:Heavy copper, step 8:Whole plate electrolytic copper, step 9:Outer-layer circuit pre-treatment, step 10:Outer laminated film, step 11:Outer-layer circuit exposes, step 12:Outer-layer circuit etching-DES, step 13:Change gold, step 14:Fly Needle is tested, step 15:Second of lamination, step 16:Milling plate, step 17:Product inspection-FQC, step 18:Packaging.
Further:The step step 1:For the first time lamination be by two block lengths be 0.4mm H/0FR4 copper-clad plates, two The first prepreg and internal layer soft board that block thickness is 0.08mm form Rigid Flex by the way of pressing, and the internal layer is soft The both sides of plate are respectively connected with one piece of first prepreg and one piece of H/0FR4 copper-clad plate, the copper face of the H/0FR4 copper-clad plates in turn Towards outside.
Further:The step step 15:Second of lamination is by two blocks of balance plates (0.4mmFR4 is downwards), two The second prepreg and Rigid Flex that block thickness is 0.08mm form rigid-flexible joint plate by the way of pressing, described soft or hard The both sides of board are respectively connected with one piece of second prepreg and one block of balance plate in turn.
Further:The production process of the balance plate is as follows, step 1:(the FR4 light after 0.3mm is made in sawing sheet Plate), step 2:The AD epoxy glue layers of 40mm thickness (are attached in the one side of FR4 tabula rasas) by first time lamination, step 3:Drilling, Step 4:First time milling plate, step 5:Second of lamination (respectively pastes one in the upper and lower surface of the PI polyimide layers of 0.175mm thickness Material after part first time lamination, the upper and lower surface of the PI polyimide layers are connected with AD epoxy glue layers respectively), step 6:Pressing, step 7:Second of milling plate.
Further:The method and step of the pressing is a successively:The power of 1Kg is first used to carry out pressing for the first time to it, the It is primary to press the time for 4min, first time heating, the temperature control of heating for the first time are carried out during pressing for the first time to it At 30 DEG C, duration of heat 3min, b:Then it uses the power of 4Kg to press it for the second time, presses the time for the second time For 9min, second of heating is carried out to it during pressing for the second time, the temperature of second of heating is controlled at 130 DEG C, heating Duration is 8min, c:Then it uses the power of 4Kg to carry out it third time to press, it is 59min, third to press the time for the third time It is secondary press during carry out third time heating to it, the temperature control of third time heating is in 130 DEG C, the duration of heat 18min, d:Then the power of 4KG is used to carry out the 4th time to it and press, it is 89min to press the time for the 4th time, is pressed for the 4th time The 4th heating is carried out to it in the process, the temperature control of the 4th heating is at 185 DEG C, duration of heat 5min, e:So The power of 4Kg is used to carry out the 5th time to it and press afterwards, it is 89min to press the time for the third time, to it during pressing for the 5th time The 5th heating is carried out, the temperature control of the 5th heating is at 185 DEG C, duration of heat 60min, f:Then it is carried out The temperature of 6th heating, the 6th heating controls 185 DEG C, duration of heat 62min, g:Finally it is carried out the 7th time The temperature of heating, the 7th heating controls 20 DEG C, duration of heat 55min.
Further:The step step 4:It needs to use a kind of puncher in outer layer drilling, the puncher Structure includes that pedestal, workbench, lower platen, top board, upper bracket, hydraulic cylinder, hoistable platform, perforating mold item and setting exist The punching syringe needle of perforating mold bottom, the upper bracket are fixedly connected on pedestal, and the workbench is mounted on bottom On seat, the lower platen is mounted on workbench, and the top board is located at the top of lower platen, the top board and Elevating mechanism is connected, and the hoistable platform is connected to the bottom of upper bracket by hydraulic cylinder, and the perforating mold item passes through Translation mechanism is connected to the bottom of hoistable platform, and the position on the top board relative to punching syringe needle offers through-hole, institute Position on the lower platen stated relative to punching syringe needle offers jack.
Further:Positioning column is provided on the lower platen, the bottom of the top board is relative to positioning column Position offers location hole.
Further:The elevating mechanism includes that two the first tracks being vertically arranged on pedestal and two liftings are small The both ends of vehicle, the top board are movably connected in by lift cart on the first track respectively.
Further:The translation mechanism includes two the second tracks for being horizontally set on hoistable platform bottom and translation Trolley, the perforating mold item are movably connected in by translating trolleys on the second track.
With the above structure, the present invention is by using first to the progress of internal layer soft board, soft or hard combination is made in lamination for the first time Then plate is being made rigid-flexible joint plate to second of lamination of Rigid Flex progress, is being scratched in the polyimide film of outer layer and centre Property wiring board between form gap, to play the role of improving rigid-flexible joint plate restoration performance;And upper pressure can be passed through Plate and lower platen are clamped rigid-flex combined board, and perforating mold item and punching syringe needle is then utilized to complete to rigid-flex combined board Drilling operation improves its punching working efficiency.
Description of the drawings
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is the structural schematic diagram of Rigid Flex.
Fig. 2 is the structural schematic diagram of puncher.
Specific implementation mode
The present invention provides a kind of manufacture crafts with the rigid-flexible joint plate of restoration, include the following steps:Step 1:The Primary lamination, step 2:X-RAY practices shooting, step 3:Milling plate side, step 4:Outer layer drills, step 5:Deburring, step 6:Removing glue Slag, step 7:Heavy copper, step 8:Whole plate electrolytic copper, step 9:Outer-layer circuit pre-treatment, step 10:Outer laminated film, step 11:Outer layer Circuit exposes, step 12:Outer-layer circuit etching-DES, step 13:Change gold, step 14:Flying probe, step 15:Second sublevel Pressure, step 16:Milling plate, step 17:Product inspection-FQC, step 18:Packaging.
Step 1 as shown in Figure 1:Lamination for the first time is 18, two pieces of thickness of H/0FR4 copper-clad plates for 0.4mm by two block lengths The first prepreg 17 and internal layer soft board 16 that degree is 0.08mm form Rigid Flex by the way of pressing, and the internal layer is soft The both sides of plate 16 are respectively connected with one piece of first prepreg 17 and one piece of H/0FR4 copper-clad plate 18, the H/0FR4 copper-clad plates in turn 18 copper face is towards outside.
Above-mentioned step 15:Second of lamination is to be by two blocks of balance plates (0.4mmFR4 is downwards), two pieces of thickness The second prepreg and Rigid Flex of 0.08mm forms rigid-flexible joint plate by the way of pressing, the Rigid Flex Both sides are respectively connected with one piece of second prepreg and one block of balance plate in turn.
The production process of above-mentioned balance plate is as follows:Step 1:(the FR4 tabula rasas after 0.3mm are made) in sawing sheet, step 2:The AD epoxy glue layers of 40mm thickness (are attached in the one side of FR4 tabula rasas) by first time lamination, step 3:Drilling, step 4:The Milling plate, step 5:Second of lamination (respectively pastes a first time in the upper and lower surface of the PI polyimide layers of 0.175mm thickness The upper and lower surface of material after lamination, the PI polyimide layers is connected with AD epoxy glue layers respectively), step 6:Pressing, Step 7:Second of milling plate.
The method and step of the pressing used in above-mentioned steps 1 and step 15 is a successively:First the power of 1Kg is used to carry out it Press for the first time, it is 4min to press the time for the first time, carries out first time heating during pressing for the first time to it, adds for the first time The temperature control of heat is at 30 DEG C, duration of heat 3min, b:Then the power of 4Kg is used to press it for the second time, the The secondary compaction time is 9min, and second of heating is carried out to it during pressing for the second time, the temperature control of second of heating At 130 DEG C, duration of heat 8min, c:Then it uses the power of 4Kg to carry out it third time to press, presses the time for the third time For 59min, third time heating is carried out during pressing for the third time to it, the temperature of third time heating is controlled at 130 DEG C, heating Duration is 18min, d:Then the power of 4Kg is used to carry out the 4th time to it and press, it is 89min to press the time for the 4th time, the Carry out the 4th heating during pressing for four times to it, the temperature control of the 4th heating is in 185 DEG C, the duration of heat 5min, e:Then it uses the power of 4Kg to carry out it the 5th time to press, it is 89min, the 5th mistake pressed to press the time for the third time The 5th heating is carried out in journey to it, the temperature control of the 5th heating is at 185 DEG C, duration of heat 60min, f:Then The 6th heating is carried out to it, the temperature of the 6th heating controls 185 DEG C, duration of heat 62min, g:Finally to its into The 7th heating of row, the temperature of the 7th heating control 20 DEG C, duration of heat 55min.
The above method is using first to the progress of internal layer soft board, Rigid Flex is made in lamination for the first time, then to soft or hard combination Plate carries out second of lamination and rigid-flexible joint plate is made, and is formed between the polyimide film and center flexing wiring board of outer layer empty Gap, to play the role of improving rigid-flexible joint plate restoration performance.
Above-mentioned step 4:It needs to use a kind of puncher, the puncher as shown in Figure 2 in outer layer drilling comprising It pedestal 1, workbench 6, lower platen 7, top board 9, upper bracket 2, hydraulic cylinder 10, hoistable platform 11, perforating mold item 14 and sets The punching syringe needle 15 in 14 bottom of perforating mold item is set, the upper bracket 2 is fixedly connected on pedestal 1, and the work is flat Platform 6 is mounted on pedestal 1, and the lower platen 7 is mounted on workbench 6, and the top board 9 is located at the upper of lower platen 7 Side, the top board 9 are connected with elevating mechanism, and the hoistable platform 11 is connected to the bottom of upper bracket 2 by hydraulic cylinder 10 Portion, the perforating mold item 14 are connected to the bottom of hoistable platform 11 by translation mechanism, on the top board 9 relative to The position of punching syringe needle 15 offers through-hole, and the position on the lower platen 7 relative to punching syringe needle 15 offers jack, institute Positioning column 8 is provided on the lower platen 7 stated, the bottom of the top board 9 offers positioning relative to the position of positioning column 8 Hole.When work, the rigid-flexible joint plate that needs punch is placed on lower platen 7, then starting elevating mechanism makes it with upper pressure Plate 9 moves downward, and completes the clamping work to rigid-flexible joint plate using lower platen 7 and top board 9, then starting hydraulic cylinder 10 makes It is moved downward by hoistable platform 11 with perforating mold item 14 and punching syringe needle 15, using punching syringe needle 15 to rigid-flexible engagement Plate is punched, and every dozen of complete secondary aperture, which start translation mechanism, makes it with perforating mold item 14 and punching 15 carry out level shifting of syringe needle It is dynamic, then start hydraulic cylinder 10 again and continues to punch using punching syringe needle 15, it is reciprocal successively to complete to rigid-flexible joint plate Drilling operation.The present invention is clamped rigid-flex combined board by top board and lower platen, then utilize perforating mold item and Syringe needle is punched to complete, to the drilling operation of rigid-flex combined board, to improve its working efficiency.
Elevating mechanism as shown in Figure 2 includes two the first tracks 4 being vertically arranged on pedestal 1 and two lift carts 5, the both ends of the top board 9 are movably connected in by lift cart 5 on the first track 4 respectively.When needing to rigid-flexible joint plate When being clamped, starting lift cart 5 makes it be moved downward along the first track 4 with top board 9, using top board 9 under Pressing plate 7 completes the clamping operation to rigid-flexible joint plate.
Translation mechanism as shown in Figure 2 includes two the second tracks 12 for being horizontally set on 11 bottom of hoistable platform and translation Trolley 13, the perforating mold item 14 are movably connected in by translating trolleys 13 on the second track 12.But it needs to make punching mould When tool item 14 and punching syringe needle 15 are moved horizontally, starting translating trolleys 13 makes it with perforating mold item 14 and punching syringe needle 15 are moved horizontally along the second track 12, have the advantages that simple in structure, easily fabricated and practicality and high efficiency.

Claims (8)

1. a kind of manufacture craft with the rigid-flexible joint plate of restoration, it is characterised in that:Include the following steps:S1:First sublevel Pressure, S2:X-RAY practices shooting, S3:Milling plate side, S4:Outer layer drills, S5:Deburring, S6:De-smear, S7:Heavy copper, S8:Whole plate electricity Copper, S9:Outer-layer circuit pre-treatment, S10:Outer laminated film, S11:Outer-layer circuit exposes, S12:Outer layer DES, S13:Change gold, S14: Flying probe, S15:Second of lamination, S16:Milling plate, S17:FQC product inspections, S18:Packaging;
The step S4:Need to use a kind of puncher in outer layer drilling, the structure of the puncher include pedestal (1), Workbench (6), lower platen (7), top board (9), upper bracket (2), hydraulic cylinder (10), hoistable platform (11), perforating mold item (14) and the punching syringe needle (15) in perforating mold item (14) bottom is set, the upper bracket (2) is fixedly connected on pedestal (1) On, the workbench (6) is mounted on pedestal (1), and the lower platen (7) is mounted on workbench (6), described Top board (9) is located at the top of lower platen (7), and the top board (9) is connected with elevating mechanism, the hoistable platform (11) The bottom of upper bracket (2) is connected to by hydraulic cylinder (10), the perforating mold item (14) is connected to liter by translation mechanism The bottom for dropping platform (11), the position on the top board (9) relative to punching syringe needle (15) offers through-hole, under described Position on pressing plate (7) relative to punching syringe needle (15) offers jack.
2. a kind of manufacture craft with the rigid-flexible joint plate of restoration according to claim 1, it is characterised in that:Described Step S1:It is the first of 0.08mm that lamination for the first time, which is by H/0FR4 copper-clad plates (18) that two pieces of thickness are 0.4mm, two pieces of thickness, Prepreg (17) and internal layer soft board (16) form Rigid Flex, the both sides of the internal layer soft board (16) by the way of pressing Respectively it is connected with one piece of first prepreg (17) and one piece of H/0FR4 copper-clad plate (18) in turn, the H/0FR4 copper-clad plates (18) Copper face is towards outside.
3. a kind of manufacture craft with the rigid-flexible joint plate of restoration according to claim 2, it is characterised in that:Described Step S15:Two blocks of balance plates, two pieces of thickness are adopted for the second prepreg and Rigid Flex of 0.08mm when second of lamination Form rigid-flexible joint plate with the mode of pressing, the both sides of the Rigid Flex be respectively connected in turn one piece of second prepreg and One block of balance plate.
4. a kind of manufacture craft with the rigid-flexible joint plate of restoration according to claim 3, it is characterised in that:It is described flat The production process of weighing apparatus plate is as follows, step 1:The FR4 tabula rasas after 0.3mm, step 2 is made in sawing sheet:First time lamination, will The AD epoxy glue layers of 40mm thickness are attached in the one side of FR4 tabula rasas, step 3:Drilling, step 4:First time milling plate, step 5: Second of lamination, the material after the upper and lower surface of the PI polyimide layers of 0.175mm thickness respectively pastes a first time lamination, institute The upper and lower surface for stating PI polyimide layers is connected with AD epoxy glue layers respectively, step 6:Pressing, step 7:Second of milling plate.
5. a kind of manufacture craft with the rigid-flexible joint plate of restoration according to claim 2, it is characterised in that:The pressure The method and step of conjunction is a successively:First use 1Kg power it is carried out for the first time press, press for the first time the time be 4min, first It is secondary press during carry out first time heating to it, the temperature control of heating for the first time is in 30 DEG C, the duration of heat 3min, b:Then the power of 4Kg is used to press it for the second time, it is 9min, the mistake pressed for the second time to press the time for the second time Second of heating is carried out to it in journey, the temperature control of second heating is at 130 DEG C, duration of heat 8min, c:Then Using the power of 4Kg it is carried out third time press, press for the third time the time be 59min, during pressing for the third time to its into Row third time heats, and the temperature control of third time heating is at 130 DEG C, duration of heat 18min, d:Then use 4Kg's Power carries out it the 4th time and presses, and it is 89min to press the time for the 4th time, it is carried out the 4th time during pressing for the 4th time plus Heat, the temperature control of the 4th heating is at 185 DEG C, duration of heat 5min, e:Then the power of 4Kg is used to carry out the to it Press for five times, it is 89min to press the time for the third time, carries out the 5th heating during pressing for the 5th time to it, the 5th time plus The temperature control of heat is at 185 DEG C, duration of heat 60min, f:Then the 6th heating is carried out to it, the 6th heating Temperature controls 185 DEG C, duration of heat 62min, g:The 7th heating, the temperature control of the 7th heating are finally carried out to it 20 DEG C of system, duration of heat 55min.
6. a kind of manufacture craft with the rigid-flexible joint plate of restoration according to claim 1, it is characterised in that:Described Positioning column (8) is provided on lower platen (7), the bottom of the top board (9) is offered relative to the position of positioning column (8) determines Position hole.
7. a kind of manufacture craft with the rigid-flexible joint plate of restoration according to claim 1, it is characterised in that:Described Elevating mechanism includes two the first tracks (4) being vertically arranged on pedestal (1) and two lift carts (5), the top board (9) both ends are movably connected in by lift cart (5) on the first track (4) respectively.
8. a kind of manufacture craft with the rigid-flexible joint plate of restoration according to claim 1, it is characterised in that:Described Translation mechanism includes two the second tracks (12) and translating trolleys (13) for being horizontally set on hoistable platform (11) bottom, described Perforating mold item (14) is movably connected in by translating trolleys (13) on the second track (12).
CN201510701398.6A 2015-10-26 2015-10-26 A kind of manufacture craft with the rigid-flexible joint plate of restoration Active CN105246273B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510701398.6A CN105246273B (en) 2015-10-26 2015-10-26 A kind of manufacture craft with the rigid-flexible joint plate of restoration

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510701398.6A CN105246273B (en) 2015-10-26 2015-10-26 A kind of manufacture craft with the rigid-flexible joint plate of restoration

Publications (2)

Publication Number Publication Date
CN105246273A CN105246273A (en) 2016-01-13
CN105246273B true CN105246273B (en) 2018-08-10

Family

ID=55043679

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510701398.6A Active CN105246273B (en) 2015-10-26 2015-10-26 A kind of manufacture craft with the rigid-flexible joint plate of restoration

Country Status (1)

Country Link
CN (1) CN105246273B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101720174A (en) * 2009-12-09 2010-06-02 厦门弘信电子科技有限公司 Soft-hard printed circuit board combination process
CN203027593U (en) * 2012-12-04 2013-06-26 苏州市新广益电子有限公司 Special reinforcement plate for FPC (flexible printed circuit)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590756A (en) * 1991-09-28 1993-04-09 Ibiden Co Ltd Production of rigid/flexible board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101720174A (en) * 2009-12-09 2010-06-02 厦门弘信电子科技有限公司 Soft-hard printed circuit board combination process
CN203027593U (en) * 2012-12-04 2013-06-26 苏州市新广益电子有限公司 Special reinforcement plate for FPC (flexible printed circuit)

Also Published As

Publication number Publication date
CN105246273A (en) 2016-01-13

Similar Documents

Publication Publication Date Title
CN105246272B (en) A kind of outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol
CN106455293B (en) A kind of production method having a size of 500mm*800mm or more multilayer large scale High speed rear panel
CN105228370B (en) A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare
CN114055911B (en) Cooperative processing method of multilayer PCB
CN109219273A (en) A kind of laminate structure and compression method of the PCB pressing based on padded coaming
CN107182170B (en) A kind of printed wiring board manufacture craft of the nut containing extruding
CN105246271A (en) Island type hard board rigid-flex combination board
CN112218430A (en) Manufacturing method of copper block-embedded circuit board of new energy automobile
CN105246273B (en) A kind of manufacture craft with the rigid-flexible joint plate of restoration
CN105246274B (en) A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method
CN109287080A (en) The compression method of asymmetric core plate and asymmetric core plate
CN109451668B (en) Process applied to power supply printed circuit board
CN202019499U (en) Riveting die for multilayer printed circuit board
CN104023485B (en) A kind of high-accuracy stepped multilayer printed circuit board process
CN112235937A (en) Press-fit connection structure between circuit boards and press-fit connection method thereof
CN204836771U (en) Multilayer microwave digit composite substrate
KR20080012390A (en) A pres-adhesive method for multi board
CN104812181B (en) The photoresistance film of rigid-flex combined board with flexible structure outer layer keeps away infiltration technique
CN206533603U (en) A kind of thickening type MULTILAYER COMPOSITE circuit board
CN110740591A (en) blind hole processing method of multilayer printed board
CN106961787A (en) A kind of preparation technology of the thick copper foil circuit plate of high heat conduction
CN115942654A (en) Rivet stacking device for PCB and using method
JP2014150250A (en) Wiring board manufacturing method and laminate with support material
CN202617499U (en) PCB multi-layer precise circuit board capable of preventing layer deviation
KR100206377B1 (en) Lay up method of multi-layer printed circuit board capable of reducing fabricating process

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20210526

Address after: 335000 No.2 Zhilian Avenue, high tech Industrial Development Zone, Yingtan City, Jiangxi Province

Patentee after: Jiangxi Hongxin Flexible Electronic Technology Co.,Ltd.

Address before: 212000 no.308-1, Nanxu Avenue, Runzhou District, Zhenjiang City, Jiangsu Province

Patentee before: JIANGSU HONGXIN HUAYIN CIRCUIT TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right