CN101720174A - Soft-hard printed circuit board combination process - Google Patents

Soft-hard printed circuit board combination process Download PDF

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Publication number
CN101720174A
CN101720174A CN200910112981A CN200910112981A CN101720174A CN 101720174 A CN101720174 A CN 101720174A CN 200910112981 A CN200910112981 A CN 200910112981A CN 200910112981 A CN200910112981 A CN 200910112981A CN 101720174 A CN101720174 A CN 101720174A
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obtains
printed circuit
blind hole
circuit board
side coated
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CN200910112981A
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CN101720174B (en
Inventor
何耀忠
续振林
陈妙芳
郑福建
董志明
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Xiamen Hongxin Electronic Technology Group Co Ltd
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Xiamen Hongxin Electron Tech Co Ltd
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Abstract

The invention discloses soft-hard printed circuit board combination process, including that bonding sheets are firstly packaged between inlayer flexible printed circuit boards, the inlayer flexible printed circuit boards are subject to lamination and curing, and then outer flexible printed circuit board is packaged, thus completing forming of soft-hard printed circuit board. PI copper foil used by flexible printed circuit board is more than FR4 copper foil used by hard printed circuit board, thus the hole depth of outer blind hole can be well controlled, the blind hole depth can be controlled to be 40 Mum if 12 Mum no-glue PI copper foil is used, thus greatly improving blind hole copper depositing and plating yield. Thus, the invention can conveniently control the outer blind hole depth while ensuring rigidity and thickness of four-layer HDI soft-hard printed circuit board and improve blind hole copper depositing and plating quality, PI copper foil and PP bonding sheet are adopted, structure is simple and the soft-hard printed circuit board is easy to make, cost is low, and electric performance of product is improved.

Description

Soft-hard printed circuit board combination process
Technical field
The present invention relates to a kind of circuit board processing method, particularly relate to a kind of soft-hard printed circuit board combination process.
Background technology
Along with development of electronic technology, the especially continuous progress of electronics packaging technology, in many instances, general rigid circuit board has been difficult to satisfy the requirement of electronic product " light, thin, short, little ".And flexible PCB is with the characteristic of its " frivolous " and " flexible ", just can satisfy this kind trend, particularly soft or hard combined circuit plate (circuit board of flexible parent metal and rigid substrate combination) had both had the supporting role of rigid circuit board, the characteristic that flexible PCB is arranged again, therefore its application almost can be used in each class of electronic devices because its significant superiority has prospect more and more widely.At present, the structure of the four-layer soft and hard combined board of commonly using be for flexible PCB FPC at internal layer, hard circuit board PCB is at skin, as shown in Figure 1, the technological process that this four-layer soft and hard combined board of commonly using is made mainly comprises the steps:
(1) blanking: material therefor is cut by making required specification;
(2) copper of etching (FR4 copper-clad plate): FR4 copper-clad plate 6 and 7 is the skin of product, FR4 copper-clad plate (hardboard base material) all is two-sided Copper Foil, the outer hardboard of doing this Rigid Flex only needs single face copper, needs wherein copper of FR4 copper-clad plate 6 and 7 is all etched away.
Pure glue is die-cut: cementation between the layer of pure glue 4 and 5 products and the layer, pure glue 4 and 5 is carried out die-cut, and cut adagio district window, need not to bond herein.
Double face copper boring: double face copper 1 is the internal layer flexible PCB of product, gets out registration holes on double face copper 1, is used for follow-up contraposition and uses.
(3) boring (FR4 copper-clad plate): will get out registration holes in the FR4 copper-clad plate 6 and 7 that obtain in the step (2), for follow-up contraposition is used.
Circuit is made (internal layer): produce the two-sided circuit of required internal layer on the double face copper that obtains in step (2);
(4) die-cut (FR4 copper-clad plate): hardboard corresponding in the adagio district will be removed, but stable in order to guarantee successive process (lamination, heavy copper facing, circuit making etc.), just the hardboard of this part takes down after profile is die-cut.Gu earlier at the cut-off rule that punches out at the place, rigid-flex line of demarcation of FR4 copper-clad plate 6 and 7; hardboard in the adagio district still gives reservation; and with it as adagio district protective layer 8 and 9; as shown in Figure 2; the rigid-flex cut-off rule is protected it thereby make pure glue cover cut-off rule by reducing the window size of pure glue 4 and 5.
(5) cross and to mould (outer hardboard is equipped with glue): the pure glue 4 and 5 that obtains in the step (2) is attached to the FR4 face of the FR4 copper-clad plate 6 that obtains in the step (4) and 7 respectively and crosses to mould and paste the jail.
Lamination solidifies (coverlay): the one side that the coverlay 2 and 3 that step (1) is obtained is coated with glue is affixed on the two sides of the double face copper 1 that obtains in the step (3) respectively, and its lamination is solidified the protection circuit layer.
(6) lamination solidifies (assembling ectonexine): the outer FR4 copper-clad plate 6 and 7 that step (5) is obtained, internal layer double face copper 1 is assembled, wherein internal layer double face copper 1 is assembled between outer FR4 copper-clad plate 6 and 7, and its lamination is solidified, and finishes the combination of Rigid Flex.
(7) boring: the Rigid Flex boring with obtaining in the step (6) gets out the via 10 and 11 that product electrically requires, as shown in Figure 2.
(8) heavy copper facing: via 10 that obtains in step (7) and 11 hole wall last layer sink copper facing 14 and 15, make each layer copper conducting of Rigid Flex, as shown in Figure 2.
(9) circuit is made (skin): produce required outer-layer circuit on the circuit board that obtains through above-mentioned steps;
(10) solder mask is made: produce required solder mask on the circuit board skin that obtains through above-mentioned steps, solder mask is protected the outer-layer circuit conductor part and is windowed so that copper conductor exposes at finger and pad place;
(11) surface-coated: the exposed copper conductive surface that obtains in step (10) is coated with and is covered with noble metal, has both prevented oxidizedly, also can have favorable conductive and wear-resisting effect;
(12) silk-screen character: on product, stamp required character mark by the silk-screen mode;
(13) electrical measurement: electric-examination tests out defective products;
(14) sharp processing: produce required product design by mode such as die-cut;
(15) remove adagio district protective layer: remove adagio district protective layer 8 and 9, the Rigid Flex structure chart (as shown in Figure 3) that obtains at last.
There is following shortcoming in this Rigid Flex manufacture craft of commonly using:
1. protection need be done in the adagio zone of Rigid Flex, but on the make, particularly passes through the DES line, wet flowchart process such as heavy copper facing, and liquid medicine can penetrate into the internal layer adagio, causes that internal layer is unusual.
2. hardboard base material FR4 copper-clad plate is two-sided Copper Foil all, and the outer hardboard of doing this Rigid Flex only needs single face copper, needs a copper is wherein etched away, and wastes a copper, and increases operation, cost height.
3.FR4 copper-clad plate belongs to hard material, usually all thicker, FR4 copper-clad plate minimum thickness is 0.14mm at present, if make outer blind hole on this structure, the blind hole hole depth is more than 150um, and blind hole belongs to semi-closed state, the liquid medicine exchange rate is low, if blind hole is dark excessively, for the blind hole of 0.1mm or littler blind hole, will cause difficult upward copper of blind hole or hole copper extremely thin, not reach performance requirement.
4. after die-cut, also need the window protective layer is removed, increase operation.
Summary of the invention
The hole depth that the object of the present invention is to provide that a kind of technology is simple, cost is low and can the outer blind hole of better controlled is with the soft-hard printed circuit board combination process of the heavy copper facing performance that improves blind hole, when its four layers of HDI Rigid Flex combining structures producing can guarantee the rigidity of Rigid Flex and thickness, control outer blind hole hole depth easily to improve the heavy copper facing performance of blind hole.
For achieving the above object, technical solution of the present invention is:
The present invention is a kind of soft-hard printed circuit board combination process, and it may further comprise the steps:
(1) blanking: material therefor is cut by making required specification;
(2) coverlay is die-cut: punch out corresponding window such as outer-layer circuit finger, pad at coverlay 29,30, so that circuit is connected with extraneous;
Single-side coated copper plate boring: get out registration holes at single-side coated copper plate 21,22,25,26, use for follow-up contraposition as internal layer flexible PCB and outer flexible PCB;
Pure glue boring: get out registration holes at pure glue 23,27,28, use for follow-up contraposition;
Bonding sheet is die-cut: according to the die-cut bonding sheet 24 of the required part in soft or hard land;
(3) cross and to mould: the pure glue 23,27,28 that obtains in the step (2) is affixed on the PI face of single-side coated copper plate 22,25,26 respectively and crosses to mould and paste the jail;
(4) lamination solidifies: the zone is closed in the thin-skinned scleroma of pure glue that the bonding sheet 24 that obtains in the step (2) is affixed on the single-side coated copper plate 22 that obtains in the step (3), the single-side coated copper plate 21 that obtains in the step (2) is gone up in assembling again, then its lamination is solidified, finish the assembling of inner plating 40;
(5) boring: boring on the inner plating 40 that obtains in step (4) forms internal layer buried via hole 31;
(6) heavy copper facing: make and electroplate thickening behind the hole wall deposition last layer copper of the internal layer buried via hole 31 that in step (5), obtains and obtain one deck buried via hole conductting layer 32, single-side coated copper plate 21 and 22 is electrically connected;
(7) circuit is made: produce required internal layer circuit on the inner plating 40 that step (6) obtains;
(8) lamination solidifies: the outer single-side coated copper plate 25,26 that step (3) is obtained, and step (7) obtains inner plating 40 and assembles, wherein inner plating 10 is assembled between the outer single-side coated copper plate 25,26, and its lamination is solidified, and finishes the combination of Rigid Flex 50.
(9) boring: boring on the Rigid Flex 50 that in step (8), obtains, laser gets out outer blind hole 33,34;
(10) plasma treatment: remove residue in the hole of outer blind hole 33,34 with plasma processing method, improve the heavy copper facing quality of blind hole 33,34;
(11) heavy copper facing: electroplate thickening behind the hole wall deposition last layer copper of the outer blind hole 33,34 that in step (10), obtains and obtain one deck blind hole conductting layer 35,36, single-side coated copper plate 25,21, single-side coated copper plate 22,26 are electrically connected;
(12) circuit is made: produce required outer-layer circuit on the Rigid Flex 50 that step (11) obtains;
(13) lamination solidifies: be affixed on respectively on the outer-layer circuit of the Rigid Flex 50 that obtains in the step (12) at the outer coverlay 29,30 that step (2) obtains, and its lamination is solidified, the protection outer-layer circuit;
(14) surface-coated: the exposed copper conductive surface of the outer-layer circuit of the Rigid Flex 50 that obtains in step (13) is coated with and is covered with noble metal, has both prevented oxidizedly, also can have favorable conductive and wear-resisting effect;
(15) silk-screen character: on product, stamp required character mark by the silk-screen mode;
(16) electrical measurement: electric-examination tests out defective products;
(17) sharp processing: produce required product design by mode such as die-cut.
After adopting such scheme, because the present invention's bonding sheet, be rigidity and the thickness that the mobile bonding sheet of epoxy glass fiber fabric base replaces FR4 enhancing Rigid Flex in the FR4 Copper Foil, earlier bonding sheet is assembled between the internal layer flexible PCB, after the operations such as internal layer flexible PCB process lamination curing, assemble outer flexible PCB again, finish the composition of Rigid Flex.The PI copper foil used by flexible printed circuit board FR4 Copper Foil used with respect to hard circuit board approaches a lot, the hole depth of so outer blind hole just can obtain reasonable control, if do not have glue PI Copper Foil with 12um, the blind hole hole depth can be controlled at 40um, improves the heavy copper facing yield of blind hole greatly.So the present invention can control outer blind hole hole depth easily when guaranteeing four layers of HDI Rigid Flex rigidity and thickness, improve the heavy copper facing quality of blind hole, adopts PI Copper Foil and bonding sheet, easy making simple in structure, the electrical property of raising product.
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 commonly uses the process flow diagram that Rigid Flex is made;
Fig. 2 is a removal adagio protective layer section front view of commonly using Rigid Flex;
Fig. 3 is a sectional view of commonly using the Rigid Flex of technology.
Fig. 4 is a process flow diagram of the present invention;
Fig. 5 is the sectional view of the soft or hard combined circuit plate produced of the present invention.
Embodiment
As shown in Figure 1, the present invention is a kind of soft-hard printed circuit board combination process, and it may further comprise the steps:
(1) blanking: material therefor is cut by making required specification;
(2) coverlay is die-cut: coverlay 29,30 is respectively the outer coverlay of product, it need be punched out corresponding window such as outer-layer circuit finger, pad, so that circuit is connected with extraneous;
Single-side coated copper plate boring: single-side coated copper plate 21,22,25,26 is respectively each laminate of product, wherein single-side coated copper plate 21,22 is the internal layer flexible PCB, single-side coated copper plate 25,26 is outer flexible PCB, earlier it is got out registration holes, uses for follow-up contraposition;
Pure glue boring: the layer of 23,27,28 products of pure glue and the cementation between the layer, need get out registration holes, use for follow-up contraposition;
Bonding sheet: bonding sheet 24 is in the soft or hard land of product, and it increases the rigidity and the thickness of product, needs according to the required part in soft or hard land it to be punched out;
(3) cross and to mould: the pure glue 23,27,28 that obtains in the step (2) is affixed on the PI face of single-side coated copper plate 22,25,26 respectively and crosses to mould and paste the jail;
(4) lamination solidifies: the zone is closed in the thin-skinned scleroma of pure glue that the bonding sheet 24 that obtains in the step (2) is affixed on the single-side coated copper plate 22 that obtains in the step (3), the single-side coated copper plate 21 that obtains in the step (2) is gone up in assembling again, then its lamination is solidified, finish the assembling of inner plating 40;
(5) boring: boring on the inner plating 40 that obtains in step (4) forms internal layer buried via hole 31, as shown in Figure 5;
(6) heavy copper facing: make and electroplate thickening behind the hole wall deposition last layer copper of the internal layer buried via hole 31 that in step (5), obtains and obtain the heavy copper plate 32 of one deck, single-side coated copper plate 21,22 is electrically connected, as shown in Figure 5;
(7) circuit is made: produce required internal layer circuit on the inner plating 40 that step (6) obtains;
(8) lamination solidifies (assembling ectonexine): the outer single-side coated copper plate 25,26 that step (3) is obtained, and step (7) obtains inner plating 40 and assembles, wherein inner plating 10 is assembled between the outer single-side coated copper plate 25,26, and its layer is solidified, and finishes the combination of Rigid Flex 50.
(9) boring: boring on the Rigid Flex 50 that in step (8), obtains, laser gets out outer blind hole 33,34, as shown in Figure 5;
(10) plasma treatment: remove residue in the hole of outer blind hole 33,34 with plasma processing method, improve the heavy copper facing quality of blind hole;
(11) heavy copper facing: electroplate thickening behind the hole wall deposition last layer copper of the outer blind hole 33,34 that in step (10), obtains and obtain the heavy copper plate 35,36 of one deck, single-side coated copper plate 25,21, single-side coated copper plate 22,26 are electrically connected, as shown in Figure 5;
(12) circuit is made: produce required outer-layer circuit on the Rigid Flex that step (11) obtains;
(13) lamination solidifies: be affixed on respectively on the outer-layer circuit of the Rigid Flex 50 that obtains in the step (12) at the outer coverlay that step (2) obtains, and its lamination is solidified, the protection outer-layer circuit;
(14) surface-coated: the exposed copper conductive surface of the outer-layer circuit of the Rigid Flex that obtains in step (13) is coated with and is covered with noble metal, has both prevented oxidizedly, also can have favorable conductive and wear-resisting effect;
(15) silk-screen character: on product, stamp required character mark by the silk-screen mode;
(16) electrical measurement: electric-examination tests out defective products;
(17) sharp processing: produce required product design by mode such as die-cut.

Claims (1)

1. soft-hard printed circuit board combination process, it is characterized in that: it may further comprise the steps:
(1) blanking: material therefor is cut by making required specification;
(2) coverlay is die-cut: punch out corresponding window such as outer-layer circuit finger, pad in coverlay (29), (30), so that circuit is connected with extraneous;
Single-side coated copper plate boring: get out registration holes in single-side coated copper plate (21), (22), (25), (26), use for follow-up contraposition as internal layer flexible PCB and outer flexible PCB;
Pure glue boring: get out registration holes in pure glue (23), (27), (28), use for follow-up contraposition;
Bonding sheet is die-cut: according to the die-cut bonding sheet of the required part in soft or hard land (24);
(3) cross and to mould: pure glue (23), (27), (28) that obtain in the step (2) are affixed on the PI face of single-side coated copper plate (22), (25), (26) respectively and cross to mould and paste the jail;
(4) lamination solidifies: the zone is closed in the thin-skinned scleroma of pure glue that the bonding sheet (24) that obtains in the step (2) is affixed on the single-side coated copper plate (22) that obtains in the step (3), the single-side coated copper plate (21) that obtains in the step (2) is gone up in assembling again, then its lamination is solidified, finish the assembling of inner plating (40);
(5) boring: the inner plating (40) that obtains in step (4) is gone up boring, forms internal layer buried via hole (31);
(6) heavy copper facing: make and electroplate thickening behind the hole wall deposition last layer copper of the internal layer buried via hole (31) that in step (5), obtains and obtain buried via hole conductting layer (32), make single-side coated copper plate (21) and (22) electric connection;
(7) circuit is made: produce required internal layer circuit on the inner plating (40) that step (6) obtains;
(8) lamination solidifies: outer single-side coated copper plate (25), (26) that step (3) is obtained, and step (7) obtains inner plating (40) and assembles, wherein inner plating (40) is assembled between outer single-side coated copper plate (25), (26), and, finish the combination of Rigid Flex (50) to its lamination curing.
(9) boring: the Rigid Flex (50) that obtains in step (8) is gone up boring, adopts laser to get out outer blind hole (33), (34);
(10) plasma treatment: remove residue in the hole of outer blind hole (33), (34) with plasma processing method, improve the heavy copper facing quality of blind hole (33), (34);
(11) heavy copper facing: electroplate thickening behind the outer blind hole (33) that in step (10), obtains, the hole wall of (34) the deposition last layer copper and obtain blind hole conductting layer (35), (36), single-side coated copper plate (25), (21), single-side coated copper plate (22), (26) are electrically connected;
(12) circuit is made: produce required outer-layer circuit on the Rigid Flex (50) that step (11) obtains;
(13) lamination solidifies: be affixed on respectively on the outer-layer circuit of the Rigid Flex (50) that obtains in the step (12) in outer coverlay (29), (30) that step (2) obtains, and its lamination is solidified, the protection outer-layer circuit;
(14) surface-coated: the exposed copper conductive surface of the outer-layer circuit of the Rigid Flex (50) that obtains in step (13) is coated with and is covered with noble metal, has both prevented oxidizedly, also can have favorable conductive and wear-resisting effect;
(15) silk-screen character: on product, stamp required character mark by the silk-screen mode;
(16) electrical measurement: electric-examination tests out defective products;
(17) sharp processing: produce required product design by mode such as die-cut.
CN2009101129818A 2009-12-09 2009-12-09 Soft-hard printed circuit board combination process Active CN101720174B (en)

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101917824A (en) * 2010-08-26 2010-12-15 厦门弘信电子科技有限公司 Manufacture method of single-sided flexible circuit board
CN101986773A (en) * 2010-11-03 2011-03-16 东莞红板多层线路板有限公司 Method for manufacturing combined rigid/flexible circuit board
CN102970836A (en) * 2012-11-13 2013-03-13 无锡江南计算技术研究所 Laminating manufacturing method for rigid-flex boards with rigid board areas different in thickness
CN103281859A (en) * 2013-06-07 2013-09-04 厦门弘信电子科技有限公司 Rigid-flex combined circuit board and manufacturing method therefore
CN103732000A (en) * 2012-10-10 2014-04-16 三星电机株式会社 Method of manufacturing rigid-flexible printed circuit board
CN104219898A (en) * 2014-10-09 2014-12-17 博敏电子股份有限公司 Multilayer rigid-flex board plated filled through-hole manufacturing process
CN104363706A (en) * 2014-11-05 2015-02-18 共青城超群科技股份有限公司 Method for manufacturing high-heat-dissipativity organic resin copper-clad plate
CN104363707A (en) * 2014-11-05 2015-02-18 共青城超群科技股份有限公司 Method for manufacturing high-heat-dissipativity LED baseplate
CN104394643A (en) * 2014-11-18 2015-03-04 广州兴森快捷电路科技有限公司 Non-laminated rigid-flexible printed circuit board and manufacturing method thereof
CN105246273A (en) * 2015-10-26 2016-01-13 江苏弘信华印电路科技有限公司 Manufacture technology of flex-rigid joint board having super-strong resilience
CN105491789A (en) * 2016-02-15 2016-04-13 广东欧珀移动通信有限公司 Flexible printed circuit board
CN107106853A (en) * 2014-12-01 2017-08-29 心脏起搏器股份公司 The implantable medical device of circuit unit with stacking
CN109803491A (en) * 2018-12-13 2019-05-24 珠海精路电子有限公司 A kind of unilateral double-deck copper base and its manufacture craft
CN111356306A (en) * 2020-03-24 2020-06-30 苏州福莱盈电子有限公司 Method for processing sinking type camera module board
CN112533368A (en) * 2019-09-18 2021-03-19 庆鼎精密电子(淮安)有限公司 Rigid-flexible circuit board and manufacturing method thereof

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101917824A (en) * 2010-08-26 2010-12-15 厦门弘信电子科技有限公司 Manufacture method of single-sided flexible circuit board
CN101986773A (en) * 2010-11-03 2011-03-16 东莞红板多层线路板有限公司 Method for manufacturing combined rigid/flexible circuit board
CN101986773B (en) * 2010-11-03 2012-07-04 东莞红板多层线路板有限公司 Method for manufacturing combined rigid/flexible circuit board
CN103732000A (en) * 2012-10-10 2014-04-16 三星电机株式会社 Method of manufacturing rigid-flexible printed circuit board
CN102970836A (en) * 2012-11-13 2013-03-13 无锡江南计算技术研究所 Laminating manufacturing method for rigid-flex boards with rigid board areas different in thickness
CN102970836B (en) * 2012-11-13 2015-01-14 无锡江南计算技术研究所 Laminating manufacturing method for rigid-flex boards with rigid board areas different in thickness
CN103281859B (en) * 2013-06-07 2016-01-20 厦门弘信电子科技股份有限公司 A kind of flexible and hard combined circuit board and preparation method thereof
CN103281859A (en) * 2013-06-07 2013-09-04 厦门弘信电子科技有限公司 Rigid-flex combined circuit board and manufacturing method therefore
CN104219898A (en) * 2014-10-09 2014-12-17 博敏电子股份有限公司 Multilayer rigid-flex board plated filled through-hole manufacturing process
CN104363706A (en) * 2014-11-05 2015-02-18 共青城超群科技股份有限公司 Method for manufacturing high-heat-dissipativity organic resin copper-clad plate
CN104363707A (en) * 2014-11-05 2015-02-18 共青城超群科技股份有限公司 Method for manufacturing high-heat-dissipativity LED baseplate
CN104394643A (en) * 2014-11-18 2015-03-04 广州兴森快捷电路科技有限公司 Non-laminated rigid-flexible printed circuit board and manufacturing method thereof
CN107106853A (en) * 2014-12-01 2017-08-29 心脏起搏器股份公司 The implantable medical device of circuit unit with stacking
CN107106853B (en) * 2014-12-01 2022-01-07 心脏起搏器股份公司 Implantable medical device with stacked circuit assemblies
CN105246273A (en) * 2015-10-26 2016-01-13 江苏弘信华印电路科技有限公司 Manufacture technology of flex-rigid joint board having super-strong resilience
CN105246273B (en) * 2015-10-26 2018-08-10 江苏弘信华印电路科技有限公司 A kind of manufacture craft with the rigid-flexible joint plate of restoration
CN105491789A (en) * 2016-02-15 2016-04-13 广东欧珀移动通信有限公司 Flexible printed circuit board
CN109803491A (en) * 2018-12-13 2019-05-24 珠海精路电子有限公司 A kind of unilateral double-deck copper base and its manufacture craft
CN112533368A (en) * 2019-09-18 2021-03-19 庆鼎精密电子(淮安)有限公司 Rigid-flexible circuit board and manufacturing method thereof
CN111356306A (en) * 2020-03-24 2020-06-30 苏州福莱盈电子有限公司 Method for processing sinking type camera module board
CN111356306B (en) * 2020-03-24 2021-04-06 福莱盈电子股份有限公司 Method for processing sinking type camera module board

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