CN101917824B - Manufacture method of single-sided flexible circuit board - Google Patents
Manufacture method of single-sided flexible circuit board Download PDFInfo
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- CN101917824B CN101917824B CN2010102671040A CN201010267104A CN101917824B CN 101917824 B CN101917824 B CN 101917824B CN 2010102671040 A CN2010102671040 A CN 2010102671040A CN 201010267104 A CN201010267104 A CN 201010267104A CN 101917824 B CN101917824 B CN 101917824B
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- flexible circuit
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Abstract
The invention relates to a manufacture method of a single-sided flexible circuit board. The method comprises the following steps of: baiting; then, making a circuit and a laser alignment cross target on a copper foil layer of an S-CCL (Single-sided Copper Clad Laminate); attaching a cover film drilled with cover film alignment holes and other auxiliary holes onto the circuit surface to laminate and solidify; adopting laser to cut a bottom substrate opening at a copper-exposed part on a substrate layer of the S-CCL; then, removing residues of the copper-exposed part through plasma treatment; and finally obtaining a single-sided flexible circuit board through the processes of surface treatment, surface coating, electrical measurement, punching and molding. The finger region substrate can be fully removed through laser cutting to avoid the influence of an overflowing adhesive of the cover film on golden fingers; since the accuracy of laser cutting and alignment is high, the accuracy of the opening size of the bottom substrate is improved so as to ensure the welding and splicing areas of the golden fingers; in addition, since the golden fingers ar protected by the surrounding substrate, the antistripping strength of the golden fingers is improved so as to improve the manufacture yield rate of the single-sided flexible circuit board product.
Description
Technical field
The invention relates to a kind of FPC, be meant a kind of manufacture method of single-sided flexible circuit board especially.
Background technology
FPC has gently, approaches, the characteristics of high flexible; And be widely used in each electronic product; Especially single-sided flexible circuit board has the characteristics of high flexible, thereby single-sided flexible circuit board has the meaning of particular importance to needing the crooked particular job occasion of wiring board.Continuous development along with electronic product; Single-sided flexible circuit board has also been proposed increasingly high requirement; For example; Current market demands electronic product has better reliability and longer useful life, and therefore, the single-sided flexible circuit board that requires in electronic product, to use can have stronger welding and patch ability under the prerequisite that guarantees superperformance.
At present, the structure of the single-sided flexible circuit board of commonly using is like Fig. 1, shown in 2, and it is made up of substrate layer 4, copper foil layer 3, coverlay glue-line 2 and coverlay PI layer 1 successively.Cooperate shown in Figure 3; This concrete manufacture method of commonly using single-sided flexible circuit board is: first blanking; Afterwards after directly making circuit on the copper foil layer 3 of single-side coated copper plate; The coverlay of holing successively and punch out the coverlay opening is affixed on circuit surface and lamination solidifies, then carry out surface treatment, surface-coated, silk-screen character, electrical measurement operation successively after, carrying out sharp processing at last just must single-sided flexible circuit board.
But this coverlay glue-line 2 of commonly using single-sided flexible circuit board has when the incision lamination and produces overflow glue 5 and excessive glue 5 no regularity, makes the welding of its golden finger and patches the surface-coated that area reduces and influence golden finger; Golden finger has only an end to have coverlay to push down, and when welding, might peel off base material by golden finger; The making of coverlay opening is general adopt die-cut, cut mode such as film, its dimensional accuracy is not very high; Manual, the tool contraposition of general employing when coverlay is fitted, its aligning accuracy neither be very high, and these all can influence the production of products yield.
Summary of the invention
The object of the invention provides a kind of and improves the peel strength of golden finger and make the manufacture method that is easy to single-sided flexible circuit board.
For realizing above-mentioned purpose, solution of the present invention is:
A kind of manufacture method of single-sided flexible circuit board; Its concrete steps are: first blanking; After making circuit and laser contraposition cross target on the copper foil layer of single-side coated copper plate, the coverlay that gets out coverlay registration holes and other via hole is affixed on circuit surface and lamination curing afterwards, on the substrate layer of single-side coated copper plate, needs the exposed copper place afterwards; Adopt laser cutting bottom substrate opening, then remove the residue at exposed copper place through plasma treatment; Again through just getting single-sided flexible circuit board after surface treatment, surface-coated, electrical measurement, the punching molding operation.
The concrete size of cutting in the step of said laser cutting is according to the requirement of actual product.
Said surface treatment is to adopt brush board or chemical cleaning processing mode to remove the oxide on the product exposed copper.
Said surface-coated is that the exposed copper conductive surface at single-sided flexible circuit board is coated with and is covered with noble metal.
On product, stamp required character mark through the silk-screen mode after the said surface-coated operation.
The FPC that adopts above-mentioned manufacture method to make is simple in structure; Because single-sided flexible circuit board of the present invention is made up of substrate layer, copper foil layer and covering rete; Described substrate layer and copper foil layer are altogether for single face covers Copper Foil, and coverlay need not die-cut coverlay opening, only need boring; On the copper-clad surface of single-side coated copper plate, make circuit and laser contraposition cross target; Sticking coverlay and lamination solidifies; With the contraposition of cross target, laser cutting bottom substrate opening on substrate surface; Laser cutting can be disposed the finger areas base material fully, avoids the influence of the excessive glue of coverlay to golden finger, and laser cutting and aligning accuracy are high; Improve the precision of bottom substrate opening size, remove the residue at product exposed copper place, the welding of guarantee fund's finger and patch area through plasma treatment; Improve the aligning accuracy of bottom substrate opening and golden finger; The golden finger periphery has base protection, improves the peel strength of golden finger, thereby improves single-sided flexible circuit board production of products yield.
Description of drawings
Fig. 1 is a structure chart of commonly using single-sided flexible circuit board;
Fig. 2 is a front plan view of commonly using single-sided flexible circuit board;
Fig. 3 is a main technique flow chart of commonly using single-sided flexible circuit board;
Fig. 4 is the structure chart of single-sided flexible circuit board of the present invention;
Fig. 5 is the back side vertical view of single-sided flexible circuit board of the present invention;
Fig. 6 is the main technique flow chart of single-sided flexible circuit board of the present invention.
Embodiment
Like Fig. 4, shown in 5, single-sided flexible circuit board of the present invention is made up of substrate layer 30, copper foil layer 20 and covering rete 10, and described substrate layer 30 covers Copper Foil for single face altogether with copper foil layer 20.Cooperate shown in Figure 6ly again, the manufacture method of single-sided flexible circuit board of the present invention specifically may further comprise the steps:
(1) blanking: material therefor is cut by making required specification;
(2) coverlay 10 borings: coverlay 10 is the top layer coverlay of product, need get out coverlay registration holes and other via hole;
Circuit is made: on the copper foil layer 20 of single-side coated copper plate, make circuit and laser contraposition cross target;
(3) lamination solidifies: the coverlay 10 that obtains in the step (2) is affixed on the top line that obtains in the step (2), then its lamination is solidified;
(4) laser cutting bottom substrate opening 40: on the substrate layer 30 of single-side coated copper plate, need exposed copper conductor place, adopt laser cutting bottom substrate opening 40, concrete size is according to the requirement of actual product.
(5) plasma treatment: remove the residue on the product exposed copper with plasma processing method, improve the quality of surface-coated;
(6) surface treatment: remove oxide on the product exposed copper etc. with surface treatment modes such as brush board, chemical cleaning, improve the quality of surface-coated;
(7) surface-coated: the exposed copper conductive surface of the single-sided flexible circuit board that in step (6), obtains is coated with and is covered with noble metal, has both prevented oxidizedly, also can have favorable conductive and wear-resisting effect;
(8) silk-screen character: on product, stamp required character mark through the silk-screen mode;
(9) electrical measurement: electric-examination tests out qualified product;
(10) sharp processing: produce required product design through mode such as die-cut.
Coverlay need not die-cut coverlay opening in the above-mentioned manufacture method, only needs boring; And on the copper-clad surface of single-side coated copper plate, make circuit and laser contraposition cross target; Sticking coverlay and lamination solidifies; With the contraposition of cross target, laser cutting bottom substrate opening on substrate surface; Laser cutting can be disposed the finger areas base material fully, avoids the influence of the excessive glue of coverlay to golden finger, and laser cutting and aligning accuracy are high; Improve the precision of bottom substrate opening size, remove the residue at product exposed copper place, the welding of guarantee fund's finger and patch area through plasma treatment; Improve the aligning accuracy of bottom substrate opening and golden finger; The golden finger periphery has base protection, improves the peel strength of golden finger, thereby improves single-sided flexible circuit board production of products yield.
Claims (5)
1. the manufacture method of a single-sided flexible circuit board; Its concrete steps are: first blanking, after making circuit and laser contraposition cross target on the copper foil layer of single-side coated copper plate, after the blanking coverlay is holed afterwards; The coverlay that gets out coverlay registration holes and other via hole is affixed on the circuit surface lamination to be solidified; On the substrate layer of single-side coated copper plate, need the exposed copper place afterwards, adopt laser cutting finger areas opening, then remove the residue at exposed copper place through plasma treatment; Again through just getting single-sided flexible circuit board after surface treatment, surface-coated, silk-screen character, electrical measurement, the punching molding operation.
2. the manufacture method of a kind of single-sided flexible circuit board as claimed in claim 1, it is characterized in that: the concrete size of the cutting in the step of laser cutting is according to the requirement of actual product.
3. the manufacture method of a kind of single-sided flexible circuit board as claimed in claim 1 is characterized in that: surface treatment is to adopt brush board or chemical cleaning processing mode to remove the oxide on the product exposed copper.
4. the manufacture method of a kind of single-sided flexible circuit board as claimed in claim 1 is characterized in that: surface-coated is that the exposed copper conductive surface at single-sided flexible circuit board is coated with and is covered with noble metal.
5. the manufacture method of a kind of single-sided flexible circuit board as claimed in claim 1 is characterized in that: on product, stamp required character mark through the silk-screen mode after the said surface-coated operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102671040A CN101917824B (en) | 2010-08-26 | 2010-08-26 | Manufacture method of single-sided flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102671040A CN101917824B (en) | 2010-08-26 | 2010-08-26 | Manufacture method of single-sided flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN101917824A CN101917824A (en) | 2010-12-15 |
| CN101917824B true CN101917824B (en) | 2012-06-27 |
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| CN2010102671040A Active CN101917824B (en) | 2010-08-26 | 2010-08-26 | Manufacture method of single-sided flexible circuit board |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421253A (en) * | 2011-08-12 | 2012-04-18 | 东莞康源电子有限公司 | Method for manufacturing flexible circuit board |
| CN102427680B (en) * | 2011-11-16 | 2013-12-18 | 博罗县精汇电子科技有限公司 | Manufacturing process of single panel gold finger |
| CN102883539B (en) * | 2012-10-17 | 2015-04-08 | 厦门爱谱生电子科技有限公司 | Manufacturing process improvement method for pluggable flexible printed circuit (FPC) |
| CN107231755A (en) * | 2017-07-21 | 2017-10-03 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof, mobile terminal |
| CN107820364A (en) * | 2017-12-11 | 2018-03-20 | 苏州广林达电子科技有限公司 | Flexible PCB |
| CN108076590A (en) * | 2018-01-24 | 2018-05-25 | 深圳光韵达激光应用技术有限公司 | A kind of single-faced double-contact wiring board realizes the laser-induced thermal etching processing technology of two sides contact |
| CN108788944B (en) * | 2018-07-19 | 2020-05-19 | 东莞市光志光电有限公司 | Cutting and polishing process of light guide film |
| CN110139496A (en) * | 2019-05-07 | 2019-08-16 | 深圳市新宇腾跃电子有限公司 | A kind of cover film windowing process |
| CN111660014A (en) * | 2020-06-09 | 2020-09-15 | 上海申和热磁电子有限公司 | Method for improving laser cutting precision of DBC substrate from back side |
| CN114025499A (en) * | 2021-10-28 | 2022-02-08 | 广州安博新能源科技有限公司 | Single-sided flexible circuit board and preparation method and application thereof |
| CN116583024A (en) * | 2023-05-26 | 2023-08-11 | 珠海超群电子科技有限公司 | Manufacturing method of loudspeaker flexible circuit board and loudspeaker flexible circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1972560B (en) * | 2005-11-25 | 2010-09-29 | 比亚迪股份有限公司 | A flexible printed circuit board and its manufacturing method |
| CN101742820B (en) * | 2008-11-12 | 2011-10-12 | 厦门弘信电子科技有限公司 | Productive technology of flexible printed circuit board |
| CN101720174B (en) * | 2009-12-09 | 2012-04-11 | 厦门弘信电子科技有限公司 | Soft-hard printed circuit board combination process |
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Effective date of registration: 20220705 Address after: 361000 Xiamen Torch High-tech Zone (Xiangan) Industrial Zone, Fujian Province, 2nd Floor, Building No. 21, 19 Xianghai Road Patentee after: Xiamen Hongxin Intelligent Technology Co.,Ltd. Address before: 361000 2 / F, No.19 Xianghai Road, industrial zone, torch hi tech Zone (Xiang'an), Xiamen City, Fujian Province Patentee before: Xiamen Hongxin Electronic Technology Group Co.,Ltd. |