CN102970836B - Laminating manufacturing method for rigid-flex boards with rigid board areas different in thickness - Google Patents
Laminating manufacturing method for rigid-flex boards with rigid board areas different in thickness Download PDFInfo
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Abstract
The invention provides a laminating manufacturing method for rigid-flex boards with rigid board areas different in thickness. The laminating manufacturing method includes: an initial designing step, a secondary rigid board area expanding step, an auxiliary expanding step and a laminating step, wherein the initial designing step is used for finding out the rigid board areas with different thickness from different areas of the rigid-flex boards during designing; the secondary rigid board expanding step is used for enabling a special area to be extended from the periphery of a secondary rigid board thin in board thickness to an external rigid board area to serve as a pressing buffering area; the auxiliary expanding step is used for adjusting and milling rigid board shape of the rigid-flex boards and milling windows in semi-solidifying of sheets; the laminating step is sued for laminating the rigid-flex boards. The laminating manufacturing method for the rigid-flex board with rigid board areas different in thickness is easy and convenient to operate and capable of effectively ensuring effective graphs on the rigid-flex boards to be pressed evenly, and accordingly, the rigid-flex boards in accordance with requirements can be produced.
Description
Technical field
The present invention relates to printed circuit board manufacture field, more particularly, the present invention relates to a kind of hardboard district not uniform thickness design Rigid Flex laminates method.
Background technology
Conventional Rigid Flex hardboard district is generally uniform thickness design, and each hardboard district each floor hardboard monolithic and prepreg when folded structure design are all same stack-design, and thickness is basically identical, and this design is folded structure and made all relatively simple; As shown in Figure 1, hardboard district H11 and H12 of flexible board area W11 both sides designs for uniform thickness.
But the Rigid Flex of some particular/special requirements (such as due to the needs of device assembling) requires that some hardboard variable thickness causes; Usually, by running through maximum level, hardboard district that thickness of slab is the thickest is referred to as main hardboard district, inconsistent hardboard district of the obvious and main hardboard district of remaining thickness is referred to as sub-hardboard district, such Rigid Flex be also referred to as hardboard district not uniform thickness design Rigid Flex, generally there are a Ge Zhu hardboard district and multiple sub-hardboard district, sub-hardboard district Thickness Ratio main hardboard district thickness is little, few 0.1mm, about many reached at 1mm; As shown in Figure 2, a Rigid Flex You Zhu hardboard district H20 and sub-hardboard district H21, H22.Connected by flexible board area W21 between H21 and H20, connected by flexible board area W22 between H22 and H20; As shown in Figure 3, a Rigid Flex You Zhu hardboard district H30 and sub-hardboard district H31.Connected by flexible board area W31 between H31 and H30.
If adopt the printed board that conventional Rigid Flex manufacture craft making hardboard variable thickness causes, then in lamination process, plate face drop can be made larger because hardboard district variable thickness causes, easily cause the problem of lamination process active graphical local decompression, the poor glue in local thus, cause finally obtaining the qualified printed board of electric property.
Furthermore, because sub-hardboard district and main hardboard district variable thickness cause, there is high low head, and Rigid Flex prepreg used is generally and does not flow or low fluidity prepreg, gummosis amount is very little, in lamination process, prepreg pressurized inequality, resin filler cause local decompression not, occur empty lamination.
Specifically, Fig. 4 schematically shows the Rigid Flex lamination diagram of the not uniform thickness design in the uninflated situation of press, and wherein upper pressing disc L21, L22 of press do not pressurize to main hardboard district H40 and upper and lower two the cushioned material layer L11 and L12 of sub-hardboard district H41 lamination.Fig. 5 schematically shows the Rigid Flex lamination diagram of not uniform thickness design when press pressurizes, wherein, as shown by arrows, upper pressing disc L21, L22 of press pressurize to main hardboard district H40 and upper and lower two the cushioned material layer L11 and L12 of sub-hardboard district H41 lamination.Fig. 6 schematically shows the inconsistent local decompression that causes of Rigid Flex hardboard district thickness of slab and illustrates.The connected regions of three hardboard districts H51, H52, H53 causes local decompression because variable thickness causes, label A shows decompression region; And Fig. 7 shows the local decompression diagram of amplification, label A1 and A2 shows decompression region.
Occur that decompression is mainly because hardboard district thickness of slab is inconsistent, has the handover region padded coaming extrusion packing of drop to cause pressure can not evenly be communicated to this region not at thickness of slab, prepreg can not have sufficient pressure extrusion thus to occur empty layering in local.When this thickness of slab drop is larger, the region of decompression is also larger, shown in following Fig. 8, Fig. 9.
At present, the solution for this defect has: 1) select suitable padded coaming according to the thickness of slab extent that falls, padded coaming is fully filled and is expressed to drop region to drop to minimum by decompression region; 2) according to different board thickness designs by each for whole Rigid Flex straton hardboard district graphics decomposition, split into multiple subelement to make respectively, after making the outer graphics (comprising surface treatment) in Ge Zi hardboard district respectively, integral layer forces together again, makes main hardboard district figure.
But, existing two kinds of equal existing defects of technology.First, suitable padded coaming is selected according to the thickness of slab extent that falls, padded coaming is fully filled be expressed to drop region simple to operate so that decompression region is dropped to minimum method, but find out when hardboard district thickness of slab height low head is very large (as even reaching 1mm more than 0.5mm) from Fig. 8, Fig. 9, padded coaming is difficult to reach the effect of fully filling extruding, decompression can hardly be avoided, and therefore the method has certain limitation, only effective to the design comparison that thickness of slab drop is little; Secondly; according to different board thickness designs by each for whole Rigid Flex straton hardboard district graphics decomposition; split into multiple subelement to make respectively; after making the outer graphics (comprising surface treatment) in Ge Zi hardboard district respectively, integral layer forces together again; the method making main hardboard district figure can effectively avoid decompression problem; but Making programme is long; and Ge Zi hardboard district figure will carry out well protection to it after making respectively; solution can not be had when particularly crossing wet process to enter sub-hardboard district figure; otherwise pattern integrity is damaged, serious causing scraps.
Summary of the invention
Technical problem to be solved by this invention be all have some limitations for above-mentioned two kinds of methods, cannot ideally solve hardboard district not uniform thickness design Rigid Flex laminates problem, propose a kind of hardboard district not uniform thickness design Rigid Flex laminates method, the method is both easy and simple to handle, again can effective guarantee Rigid Flex hardboard district active graphical pressurized even, produce satisfactory Rigid Flex thus.
According to the present invention, provide a kind of hardboard district not uniform thickness design Rigid Flex laminates method, it comprises: initial designs step, for when designing, finds out the hardboard district of the different-thickness on Rigid Flex in zones of different; Sub-hardboard district expansion step, for for the partially thin sub-hardboard district of thickness of slab, in sub-hardboard district, peripheral hardboard garbage area externally extends the buffer area of specific region as pressurized; Auxiliary expansion step, for before being laminated, the sub-hardboard district expanded according to utilizing specific region, the milling window when hardboard figure of adjustment milling Rigid Flex and prepreg; Lamination step, for performing lamination to Rigid Flex.
Preferably, in sub-hardboard district expansion step, in sub-hardboard district, peripheral hardboard garbage area externally extends 5-10mm to form specific region.
Preferably, in lamination step, first for the position that sub-hardboard district and flexible board area join, packing on the flexible board area adjacent with sub-hardboard district is filled and led up, make its height consistent with sub-hardboard district, then perform lamination.
Preferably, in lamination step, during laminated stacked plate, buffering strengthened by Rigid Flex padded coaming.
Preferably, described padded coaming at least comprises bi-material, and a kind of material is heated to have the partition that mobile performance fills space, and another kind of material to play the fender of all pressing even temperature effect.
Preferably, described partition adopts PE film, and fender adopts silicagel pad or cushion pad.
Preferably, in lamination step, temperature during lamination is 200-210 DEG C, and pressure during lamination is 400-550Psi, and heating rate during lamination is 1.5-2.5 DEG C/min.
According to the present invention, due to lamination Shi Zi hardboard, district has enough cushion spaces, and therefore periphery, sub-hardboard district can not decompression; In addition, for the position that sub-hardboard district and flexible board area join, packing on the flexible board area adjacent with sub-hardboard district is filled and led up, make its height consistent with sub-hardboard district, then lamination is performed, the region decompression avoiding sub-hardboard district to connect with flexible board area thus has influence on sub-hardboard district, the invention provides thus a kind of hardboard district not uniform thickness design Rigid Flex laminates method, the method is both easy and simple to handle, again can effective guarantee Rigid Flex hardboard district active graphical pressurized even, produce satisfactory Rigid Flex thus.
Accompanying drawing explanation
By reference to the accompanying drawings, and by reference to detailed description below, will more easily there is more complete understanding to the present invention and more easily understand its adjoint advantage and feature, wherein:
Fig. 1 schematically shows the Rigid Flex that hardboard district designs for uniform thickness.
Fig. 2 schematically shows the example that hardboard district is the Rigid Flex of not uniform thickness design.
Fig. 3 schematically shows another example that hardboard district is the Rigid Flex of not uniform thickness design.
Fig. 4 schematically shows the Rigid Flex lamination diagram of the not uniform thickness design in the uninflated situation of press.
Fig. 5 schematically shows the Rigid Flex lamination diagram of not uniform thickness design when press pressurizes.
Fig. 6 schematically shows the inconsistent local decompression that causes of Rigid Flex hardboard district thickness of slab and illustrates.
Fig. 7, Fig. 8 and Fig. 9 schematically show the local decompression diagram of amplification.
Figure 10 schematically shows the flow chart according to the hardboard district of the embodiment of the present invention not Rigid Flex laminates method of uniform thickness design.
Figure 11 schematically shows the sub-hardboard district figure of original design.
Figure 12 schematically shows the figure after the expansion of sub-hardboard district.
Figure 13 schematically shows the schematic diagram after the packing of flexible board area.
Figure 14 schematically shows laminated stacked plate schematic diagram.
It should be noted that, accompanying drawing is for illustration of the present invention, and unrestricted the present invention.Note, represent that the accompanying drawing of structure may not be draw in proportion.Further, in accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention clearly with understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
Figure 10 schematically shows the flow chart according to the hardboard district of the embodiment of the present invention not Rigid Flex laminates method of uniform thickness design.
Specifically, as shown in Figure 10, comprise according to the hardboard district Rigid Flex laminates method that uniform thickness does not design of the embodiment of the present invention:
Initial designs step S1, for carrying out CAM(Computer Aided Manufacturing, computer-aided manufacture) when designing, search the hardboard district of the different-thickness on Rigid Flex in zones of different, so that the sub-hardboard district (the sub-hardboard district H100 of such as Figure 11) partially thin to thickness of slab carries out special processing;
Sub-hardboard district expansion step S2, for for the partially thin sub-hardboard district H100 of thickness of slab, specific region is extended (such as at the peripheral hardboard garbage area H101 externally of sub-hardboard district H100, the first specific region H102 shown in Figure 12 and the second specific region H103), such as, preferably, 5-10mm is extended to form the first specific region H102 and the second specific region H103 at the peripheral hardboard garbage area H101 externally of sub-hardboard district H100, thus expand in fact the scope in sub-hardboard district, to form specific region H102 and H103 as buffering area in periphery, sub-hardboard district, decompression region A10 is made to drop on specific region H102 and H103 of the expansion of H100 periphery, sub-hardboard district like this, thus guarantee that the active graphical energy pressurized of sub-hardboard district H100 is even, as shown in figure 12,
Auxiliary expansion step S3, for before being laminated, the sub-hardboard district expanded according to utilizing specific region H102 and H103, regulate milling window during hardboard figure and the prepreg of milling Rigid Flex, thus by the milling window of prepreg or hardboard figure is expanded, thus sub-hardboard district is expanded to form enough cushion spaces;
Lamination step S4, for performing lamination.
Wherein, in lamination step S4, because sub-hardboard district H100 has enough cushion spaces, i.e. specific region H102 and H103, therefore H100 periphery, sub-hardboard district (that is, between sub-hardboard district H100 and hardboard garbage area H101) can not decompression; And, preferably, for the position that sub-hardboard district (the such as shown in Figure 13 first sub-hardboard district H104 and the second sub-hardboard district H105) and flexible board area W100 join, for the region decompression avoiding sub-hardboard district to connect with flexible board area W100 has influence on sub-hardboard district, packing W101 on the flexible board area W100 adjacent with sub-hardboard district can be filled and led up, make its height consistent with sub-hardboard district, or roughly consistent with sub-hardboard district (the region decompression avoiding sub-hardboard district to connect with flexible board area W100 thus has influence on sub-hardboard district), then lamination is performed, as shown in figure 13;
More particularly, in lamination step S4, during laminated stacked plate, buffering strengthened by Rigid Flex padded coaming, as shown in figure 14, this padded coaming at least comprises bi-material, and a kind of is be heated to have the partition that mobile performance fills space, as PE(polyethylene, polyethylene) film etc., a kind of is can play all to press the fender of even temperature effect as silicagel pad, cushion pad etc.Space is filled mainly through the Heated Flow of partition during lamination, cushion pad itself also has lamination retractility, also can be uneven place in infill panel face, the combination of final bi-material make plate face no matter eminence or lower can equably pressurized (high low head junction pressurized effect can be weaker, but owing to having done buffered, belong to the region finally will discarded, can consider), as shown in Fig. 6 pressurized schematic diagram.
Thus, as shown in figure 14, during lamination, upper pressing disc L21, L22 of press to by the structure example of Rigid Flex HW10(Rigid Flex HW10 as shown in figure 13, but for the reason simplifying diagram and be beneficial to understand, the concrete structure of Rigid Flex HW10 does not specifically represent in fig. 14) upper and lower cushion pad L111, L121 and PE film L112, L122 pressurize.
Like this, in lamination step S4, owing to combining as padded coaming, so make Rigid Flex uniform throughout pressurized with the PE film (or there is other film of similar functions) and cushion pad (or silicagel pad) with Heated Flow during laminated stacked plate.
And preferably, in lamination step S4, during lamination, prepreg pressing parameter as required carries out, and preferably, temperature during lamination is 200-210 DEG C, and pressure during lamination is 400-550Psi, and heating rate during lamination is 1.5-2.5 DEG C/min.
Thus, the above embodiment of the present invention provide a kind of hardboard district not uniform thickness design Rigid Flex laminates method, the method is both easy and simple to handle, again can effective guarantee Rigid Flex hardboard district active graphical pressurized even, produce satisfactory Rigid Flex thus.
It should be noted that, unless otherwise indicated, otherwise the term " first " in specification, " second ", " the 3rd " etc. describe only for distinguishing each assembly, element, step etc. in specification, instead of for representing logical relation between each assembly, element, step or ordinal relation etc.
Be understandable that, although the present invention with preferred embodiment disclose as above, but above-described embodiment and be not used to limit the present invention.For any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the technology contents of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (7)
1. hardboard district not uniform thickness design a Rigid Flex laminates method, it is characterized in that comprising:
Initial designs step, for when designing, finds out the hardboard district of the different-thickness on Rigid Flex in zones of different;
Sub-hardboard district expansion step, for for the partially thin sub-hardboard district of thickness of slab, in sub-hardboard district, peripheral hardboard garbage area externally extends the buffer area of specific region as pressurized;
Auxiliary expansion step, for before being laminated, the sub-hardboard district expanded according to utilizing specific region, the milling window when hardboard figure of adjustment milling Rigid Flex and prepreg;
Lamination step, for performing lamination to Rigid Flex.
2. Rigid Flex laminates method according to claim 1, is characterized in that, in sub-hardboard district expansion step, in sub-hardboard district, peripheral hardboard garbage area externally extends 5-10mm to form specific region.
3. Rigid Flex laminates method according to claim 1 and 2, it is characterized in that, in lamination step, first for the position that sub-hardboard district and flexible board area join, packing on the flexible board area adjacent with sub-hardboard district is filled and led up, make its height consistent with sub-hardboard district, then perform lamination.
4. Rigid Flex laminates method according to claim 1 and 2, is characterized in that, in lamination step, during laminated stacked plate, buffering strengthened by Rigid Flex padded coaming.
5. Rigid Flex laminates method according to claim 4, it is characterized in that, described padded coaming at least comprises bi-material, and a kind of material is heated to have the partition that mobile performance fills space, and another kind of material to play the fender of all pressing even temperature effect.
6. Rigid Flex laminates method according to claim 5, is characterized in that, described partition adopts PE film, and fender adopts silicagel pad and/or cushion pad.
7. Rigid Flex laminates method according to claim 1 and 2, is characterized in that, in lamination step, temperature during lamination is 200-210 DEG C, and pressure during lamination is 400-550Psi, and heating rate during lamination is 1.5-2.5 DEG C/min.
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| CN101720174A (en) * | 2009-12-09 | 2010-06-02 | 厦门弘信电子科技有限公司 | Soft-hard printed circuit board combination process |
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| JP4436714B2 (en) * | 2004-05-21 | 2010-03-24 | 三井金属鉱業株式会社 | Manufacturing method of rigid flexible metal-clad laminate and manufacturing method of rigid flexible printed wiring board |
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| CN101720174A (en) * | 2009-12-09 | 2010-06-02 | 厦门弘信电子科技有限公司 | Soft-hard printed circuit board combination process |
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