CN115942654A - Rivet stacking device for PCB and using method - Google Patents
Rivet stacking device for PCB and using method Download PDFInfo
- Publication number
- CN115942654A CN115942654A CN202211571826.4A CN202211571826A CN115942654A CN 115942654 A CN115942654 A CN 115942654A CN 202211571826 A CN202211571826 A CN 202211571826A CN 115942654 A CN115942654 A CN 115942654A
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- rivet
- plate
- pressing
- pcb
- lifting cylinder
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000003825 pressing Methods 0.000 claims abstract description 47
- 238000007731 hot pressing Methods 0.000 claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 239000002023 wood Substances 0.000 claims description 2
- 230000006978 adaptation Effects 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
Images
Abstract
The invention relates to the technical field of circuit board processing, and provides a rivet stacking device for a PCB (printed circuit board) and a using method thereof, wherein the rivet stacking device comprises a pressing table and a rack, a pressing mechanism and a material sucking mechanism are sequentially arranged on the rack, the pressing mechanism comprises a lifting cylinder and a hot pressing plate, the lifting cylinder is arranged on the rack, and the lower end of the lifting cylinder is fixedly connected with the hot pressing plate; the material suction mechanism comprises a hanging rail, a lifter and an air suction pipe, the air suction pipe is arranged at the front end of the lifter, and the lifter performs plane movement along the hanging rail; the pressing table is provided with a slide rail, the slide rail is connected with a bearing plate in a sliding mode, the bearing plate is connected with a transmission lead screw in a matching mode, and the bearing plate is provided with a positioning frame used for placing a multi-layer plate. The invention can avoid the pressing defect at the rivet position after riveting the plates and simultaneously prevent larger deviation between the laminates.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a rivet stacking device for a PCB and a using method thereof.
Background
Printed Circuit boards (PCBs for short) are important electronic components, and are supporting members for electronic components and providers of electrical connections for electronic components; with the development of the electronic circuit industry towards high density and high refinement, the PCB board also develops from single-sided boards and double-sided boards to multilayer boards and high multilayer boards, the multilayer PCB board is formed by alternately laminating a plurality of inner core boards and a plurality of bonding sheets, respectively arranging copper foils outside the two outermost bonding sheets, and then laminating at one time.
In the production process of the multilayer PCB, a mode that a plurality of core plates and a plurality of bonding sheets form an overlapped structure and are pressed by one time after rivet riveting is usually adopted for production, and in the subsequent hot pressing process of the multilayer plate, the rivet of the multilayer plate is easy to generate the defects of bubbling, wrinkling, pressing deviation, inconsistent pressing thickness, uneven surface and the like, and the rivet is unevenly pressed to form the defects of wrinkling, uneven layer and the like.
Disclosure of Invention
The invention aims to provide a rivet stacking device for a PCB and a using method thereof, which can avoid the stitching defect at the rivet and prevent the larger deviation between laminates.
The embodiment of the invention is realized by the following technical scheme: a rivet stacking device for a PCB comprises a pressing table and a rack, wherein a pressing mechanism and a material sucking mechanism are sequentially arranged on the rack, the pressing mechanism comprises a lifting cylinder and a hot pressing plate, the lifting cylinder is mounted on the rack, and the lower end of the lifting cylinder is fixedly connected with the hot pressing plate; the material suction mechanism comprises a hanging rail, a lifter and an air suction pipe, the air suction pipe is arranged at the front end of the lifter, and the lifter performs plane movement along the hanging rail; the pressing table is provided with a slide rail, the slide rail is connected with a bearing plate in a sliding mode, the bearing plate is connected with a transmission lead screw in a matching mode, and the bearing plate is provided with a positioning frame used for placing a multilayer board.
Further, a first base plate is mounted at the front end of the hot pressing plate, and a first accommodating hole is formed in the first base plate; and a second base plate is arranged in the positioning frame, and second accommodating holes corresponding to the rivet holes one to one are formed in the second base plate.
Furthermore, the overall dimension of the first base plate is matched with the positioning frame, and the first base plate is detachably connected with the hot pressing plate.
Furthermore, the aperture of the first accommodating hole and the aperture of the second accommodating hole are larger than that of the rivet hole, and the depth of the first accommodating hole and the depth of the second accommodating hole are 1mm-1.5mm.
Furthermore, both ends of the sliding rail are provided with limit inductors.
A use method of the rivet stacking device for the PCB comprises the following steps:
s1, stacking plates, namely sequentially placing a plurality of plate surfaces of a copper foil, a core plate and a prepreg into the positioning frame to be stacked and superposed;
s2, presetting rivets, driving the air suction pipes to adsorb the rivets one by one and place the rivets into corresponding rivet holes of the plate surface, and applying certain pressure to the air suction pipes correspondingly to enable the rivets to penetrate through the bottom plate;
and S3, pressing, wherein the lifting cylinder drives the hot pressing plate to move downwards to apply pressure to the multilayer board in a telescopic mode.
Further, the temperature at the time of thermal compression in step S3 is 130 ℃ to 160 ℃.
Further, the hot press plate in step S3 applies slowly distributed pressure to the multilayer plate before the temperature is raised.
Further, the pressing time in the step S3 is 60min-90min.
The technical scheme of the embodiment of the invention at least has the following advantages and beneficial effects: compared with the prior art, the laminated multi-layer board pressing device has the advantages that the plurality of laminated boards are sequentially placed in the positioning frame, the rivets are placed in the rivet holes formed in the board surface one by one through the air suction pipe, the multi-layer boards are laminated under the combined action of the rivets and the positioning frame, the bearing board is moved to the lower side of the hot pressing board through the transmission lead screw, the hot pressing board gradually and slowly presses the multi-layer boards, the multi-layer boards and the rivets are simultaneously subjected to the same pressure, the rivets can be slowly pressed into the boards to be stable, the phenomenon that the rivets incline due to the fact that the riveting machine is pressed too hard once is avoided, the multi-layer boards are stressed more uniformly, and the pressing defects at the rivets are effectively overcome.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic structural diagram of a rivet stacking apparatus for PCB boards according to an embodiment of the present invention;
FIG. 2 is a schematic side view of a rivet stacking apparatus for PCB boards according to the present invention;
fig. 3 is a schematic top view of the platen according to the present invention.
Icon: the device comprises a machine frame 1, a press table 2, a press mechanism 3, a lifting cylinder 31, a hot press plate 32, a first cushion plate 33, a first accommodating hole 331, a hanging rail 4, a lifter 5, an air suction pipe 6, a sliding rail 7, a bearing plate 8, a positioning frame 9, a second cushion plate 10, a second accommodating hole 101, a multilayer plate 11, a transmission screw rod 12 and a limit sensor 13.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention provided herein is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
Examples
Further explanation is provided below with reference to specific embodiments, and as shown in fig. 1 to fig. 3, this embodiment is a rivet stacking device for PCB boards, which includes a pressing table 2 and a rack 1, a pressing mechanism 3 and a material sucking mechanism are sequentially disposed on the rack 1, the pressing mechanism 3 includes a lifting cylinder 31 and a hot pressing board 32, the lifting cylinder 31 is mounted on the rack 1, and the lower end of the lifting cylinder 31 is fixedly connected to the hot pressing board 32; the material suction mechanism comprises a hanging rail 4, a lifter 5 and an air suction pipe 6, the air suction pipe 6 is arranged at the front end of the lifter 5, and the lifter 5 moves in a plane along the hanging rail 4; a slide rail 7 is arranged on the pressing table 2, a bearing plate 8 is connected to the slide rail 7 in a sliding manner, the bearing plate 8 is connected with a transmission screw rod 12 in a matching manner, and a positioning frame 9 for placing a multilayer board 11 is arranged on the bearing plate 8; specifically, in the prior art, before the riveting machine presses the plates, the laminated plates 11 of the multi-layer plate are relatively loose, the rivets are locally pressed, and then other parts of the plates are further pressed in the subsequent pressing process, and the rivets give a reverse acting force to the pressing plates, so that the pressing force at the rivets and the pressing force at other positions of the plate are different, and in the riveting process of the rivets, the multi-layer plate 11 is fixed by pressing and riveting at one time, so that the rivet is easily inclined, and a large deviation occurs between the subsequent plates;
therefore, the invention adopts different using methods, firstly, a sucking disc plate moving mechanism is used for sequentially placing different plate surfaces of a multilayer plate 11 into a positioning frame 9 for superposition, the size of the positioning frame 9 is matched with that of the multilayer plate 11, the height of a riveting hole between every two layers of plates is overlapped, a hanging rail 4 of a material suction mechanism comprises a transverse hanging rail 4 and a longitudinal hanging rail 4 which form a plane to cover above the positioning frame 9, an air suction pipe can move under the matching action of a lifter 5 and the hanging rail 4, the prior art is the prior mature technology, and the description is omitted, so that rivets are placed in the riveting holes of the corresponding multilayer plate 11 in advance by the air suction pipe in sequence, a bearing plate 8 is moved to the lower side of a hot pressing plate 32 by a transmission screw rod 12, the hot pressing plate 32 moves downwards by a lifting cylinder 31 to gradually contact with the multilayer plate 11 and the rivets, the hot pressing plate 32 slowly applies pressure to enable the rivets to be pressed into the riveting holes, the rivets are pressed to be close to the pressure of the rivet and the pressure of the plate surface, and the rivets are close to the problems that the rivets are easy to generate bubbles and wrinkles and the like at the rivet position are solved.
The front end of the hot press plate 32 in this embodiment is provided with a first pad 33, and the first pad 33 is provided with a first accommodating hole 331; a second base plate 10 is arranged in the positioning frame 9, and second accommodating holes 101 corresponding to the rivet holes one by one are formed in the second base plate 10; specifically, the first accommodating hole 331 and the second accommodating hole 101 are used for accommodating a rivet cap and one end of a rivet which blooms, so that perpendicularity of the rivet which is vertically riveted into a rivet hole can be improved to a certain degree, and interlayer offset is improved.
Referring to fig. 2, in the present embodiment, the first pad 33 is matched with the positioning frame 9 in terms of the external dimension, and the first pad 33 is detachably connected to the hot press plate 32; specifically, the hot pressboard 32 side has seted up T type socket groove, according to the multiply wood 11 of pressfitting difference, and first backing plate 33 can be changed, and reuse screw is screwed up along T type socket card income to first backing plate 33.
In the present embodiment, the apertures of the first receiving hole 331 and the second receiving hole 101 are larger than the rivet holes, and the depths of the first receiving hole 331 and the second receiving hole 101 are 1mm to 1.5mm; specifically, the first receiving hole 331 is recessed toward the first shim plate 33 to a depth near the cap and the flared end of the rivet.
In addition, two ends of the sliding rail 7 are provided with limit inductors 13; specifically, the frame 1 is provided with two stations of pressing and stacking, and the limit sensor 13 ensures that the bearing plate 8 just moves to the correct position of the lower sides of the hot pressing plate 32 and the air suction pipe 6.
A use method of the rivet stacking device for the PCB comprises the following steps:
s1, stacking plates, namely sequentially placing a plurality of plate surfaces of a copper foil, a core plate and a prepreg into a positioning frame 9 to be stacked and superposed; gradually putting various different board surfaces such as PP sheets, copper foils, core boards and the like into the positioning frame 9 according to the composition of the multilayer board 11;
s2, rivets are preset, the air suction pipes 6 are driven to adsorb the rivets one by one and are placed into corresponding rivet holes of the plate surface, certain pressure is correspondingly applied to the air suction pipes 6 to enable the rivets to penetrate through the bottom layer plate, the rivets penetrate through the multilayer plate 11, and the effect of primary positioning is achieved;
s3, pressing, namely telescopically driving a hot pressing plate 32 to move downwards by a lifting cylinder 31 to press the multilayer board 11, and slowly pressing the multilayer board 11 by the hot pressing plate 32 before heating, so that rivets are slowly pressed with the board surface, and the rivet is not easy to generate reaction force on the board surface, specifically, 1. Slowly pressing step by step (starting from 5 kilograms, each step is increased by 5 kilograms until the riveting pressure is 5 kilograms higher than the actual pressing pressure) before heating the hot pressing plate 32; 2. after the riveting pressure exceeds 5 kg, the normal pressing step is returned, and the hot pressing plate 32 is subjected to pressing procedures of temperature rise, pressurization, temperature reduction, pressure reduction and the like.
The practical principle is as follows: the rivet is higher than the total thickness of the printed board in the pressing process, can play a role of supporting the hot pressing board 32, can reduce the pressing pressure, can cause the product pressed at a local position to extrude prepreg epoxy resin adhesive because of insufficient pressure, can not level and generate the unqualified phenomenon that the copper foil covered on the surface is uneven and wrinkles, even the adhesion is not firm, and the unqualified phenomena of layering, foaming and uneven thickness occur; therefore, the rivet is pressed and riveted step by step before the temperature is raised, and the final pressure is higher than the pressure of actual pressing, so that the height of the rivet is lower than the thickness of the printed board when the rivet is heated, pressed and pressed, the negative effect of reducing the pressing pressure due to the fact that the pressing board is not supported is achieved, and the unqualified phenomenon cannot occur;
before temperature rise, pressurizing and riveting step by step, based on that a printed board bonding layer is an epoxy resin prepreg, the prepreg starts to soften like flowing liquid at the temperature of about 100 ℃, the friction force of the liquid prepreg is greatly different from that of the solid prepreg, the smaller the friction force, the smaller the pressing force, the printed board is easy to slide and shift, so the pressurizing and riveting before temperature rise, the prepreg is in the solid state, the friction force is large and is not easy to slide, the shift between each layer is naturally reduced, and the pressing and aligning precision of the multilayer board is improved;
as for the requirement of improving pressure riveting step by step, the rivets are all made of softer materials, the rigidity is not enough, the deformation of the rivets caused by instantaneous large pressure is large in a short time, the material characteristics are not strongly fixed around the short-time compression size, the vertical size of the rivets is reduced by deflection to meet the instantaneous change caused by pressure, and the position of each layer is changed due to the slight deflection, so that the phenomenon of misalignment and inaccurate alignment in pressing is caused; the deformation brought by the pressure is small by pressurizing every 5 kilograms step by step, the deflection of the rivet is small, the alignment precision is improved, the compression of the rivet in the vertical direction is increased by multiple times of small pressure until the compression of the rivet is smaller than the thickness of the plate, and the deflection of the rivet does not occur to cause the interlaminar deflection of the printed board.
Preferably, the temperature at the time of thermal pressing in step S3 is 130 ℃ to 160 ℃.
The pressing time in the step S3 is 60-90 min; specifically, the pressure applied by the hot press is constantly changing during the pressing time.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides a rivet stack board device that PCB board was used, includes and presses platform (2) and frame (1), its characterized in that: the pressing mechanism (3) and the material sucking mechanism are sequentially arranged on the rack (1), the pressing mechanism (3) comprises a lifting cylinder (31) and a hot pressing plate (32), the lifting cylinder (31) is installed on the rack (1), and the lower end of the lifting cylinder (31) is fixedly connected with the hot pressing plate (32);
the material suction mechanism comprises a hanging rail (4), a lifter (5) and an air suction pipe (6), the air suction pipe (6) is arranged at the front end of the lifter (5), and the lifter (5) moves in a plane along the hanging rail (4);
be equipped with slide rail (7) on pressure platform (2), sliding connection has bearing plate (8) on slide rail (7), bearing plate (8) cooperation is connected with transmission lead screw (12), just be provided with on bearing plate (8) and be used for putting into the locating frame (9) of multiply wood (11).
2. A rivet stacking apparatus for PCB board according to claim 1, wherein: a first base plate (33) is installed at the front end of the hot pressing plate (32), and a first accommodating hole (331) is formed in the first base plate (33);
and a second base plate (10) is arranged in the positioning frame (9), and second accommodating holes (101) corresponding to the rivet holes one to one are formed in the second base plate (10).
3. A rivet stacking apparatus for PCB board according to claim 2, wherein: first backing plate (33) overall dimension with locating frame (9) looks adaptation, just first backing plate (33) with hot pressboard (32) are detachable connection.
4. A rivet stacking apparatus for PCB board according to claim 2, wherein: the first accommodating hole (331) and the second accommodating hole (101) are larger in aperture than a rivet hole, and the first accommodating hole (331) and the second accommodating hole (101) are 1mm-1.5mm deep.
5. A rivet stacking apparatus for PCB board according to claim 1, wherein: and both ends of the sliding rail (7) are provided with limiting inductors (13).
6. A method of using a rivet stacking apparatus for PCB boards according to any of claims 1-5, comprising the steps of:
s1, stacking plates, namely sequentially placing a plurality of plate surfaces of a copper foil, a core plate and a prepreg into the positioning frame (9) to be stacked and superposed;
s2, rivets are preset, the air suction pipes (6) are driven to adsorb the rivets one by one and are placed into corresponding rivet holes of the plate surface, and certain pressure is correspondingly applied to the air suction pipes (6) to enable the rivets to penetrate through the bottom plate;
and S3, pressing, wherein the lifting cylinder (31) drives the hot pressing plate (32) to move downwards to press the multilayer board (11) in a telescopic mode.
7. The method for using a rivet stacking apparatus for PCB according to claim 6, wherein the temperature of the thermal compression bonding in step S3 is 130-160 ℃.
8. The method of using the rivet stacking apparatus for PCB according to claim 6, wherein the hot press board (32) in step S3 slowly presses the multi-layer board (11) before raising the temperature until the riveting pressure is higher than the actual pressing pressure and stops.
9. The use method of the rivet stacking apparatus for PCB as recited in claim 6, wherein the pressing time in step S3 is 60-90 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211571826.4A CN115942654A (en) | 2022-12-08 | 2022-12-08 | Rivet stacking device for PCB and using method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211571826.4A CN115942654A (en) | 2022-12-08 | 2022-12-08 | Rivet stacking device for PCB and using method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115942654A true CN115942654A (en) | 2023-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211571826.4A Pending CN115942654A (en) | 2022-12-08 | 2022-12-08 | Rivet stacking device for PCB and using method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115942654A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208549072U (en) * | 2018-07-28 | 2019-02-26 | 南京浦江电子有限公司 | A kind of multilayer printed circuit board lamination Simple positioning device |
| CN109501297A (en) * | 2018-12-11 | 2019-03-22 | 昆山敏欣电子有限公司 | A kind of rivet driver riveting device and its operating method for wiring board riveting |
| CN115190708A (en) * | 2022-07-27 | 2022-10-14 | 福建闽威科技股份有限公司 | Press fit technology for preventing inner layer from being lack of glue |
-
2022
- 2022-12-08 CN CN202211571826.4A patent/CN115942654A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208549072U (en) * | 2018-07-28 | 2019-02-26 | 南京浦江电子有限公司 | A kind of multilayer printed circuit board lamination Simple positioning device |
| CN109501297A (en) * | 2018-12-11 | 2019-03-22 | 昆山敏欣电子有限公司 | A kind of rivet driver riveting device and its operating method for wiring board riveting |
| CN115190708A (en) * | 2022-07-27 | 2022-10-14 | 福建闽威科技股份有限公司 | Press fit technology for preventing inner layer from being lack of glue |
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Application publication date: 20230407 |