CN219999718U - High-efficiency laminating device for multi-layer circuit board - Google Patents
High-efficiency laminating device for multi-layer circuit board Download PDFInfo
- Publication number
- CN219999718U CN219999718U CN202321255117.5U CN202321255117U CN219999718U CN 219999718 U CN219999718 U CN 219999718U CN 202321255117 U CN202321255117 U CN 202321255117U CN 219999718 U CN219999718 U CN 219999718U
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- lifting
- frame
- pressing
- assembly
- circuit board
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- 238000010030 laminating Methods 0.000 title description 4
- 238000003475 lamination Methods 0.000 claims abstract description 43
- 238000003825 pressing Methods 0.000 claims abstract description 38
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000926 separation method Methods 0.000 abstract description 6
- 238000007599 discharging Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Abstract
A high-efficiency lamination device of a multi-layer circuit board comprises a processing table, a bearing platform, a supporting frame, a pressing assembly and a separating assembly; the processing table is provided with a bearing groove, and the bearing Ping Taika is combined in the bearing groove and can be lifted and lowered movably; the support frame is erected on the processing table, the pressing assembly is arranged on the support frame and is positioned above the bearing platform, and the processing table is also provided with a first sliding rail; the separating assembly comprises a first lifting frame and a separating knife, the first lifting frame is clamped in the first sliding rail and can slide left and right along the first sliding rail, a first lifting chute is further arranged on the first lifting frame, and the separating knife is clamped in the first lifting chute and can lift along the first lifting chute; the blade of the separating knife is in a wedge-shaped design. According to the utility model, the circuit board is rapidly separated from the bearing platform by designing the separation assembly, so that the circuit board is conveniently discharged from the bearing platform; the utility model has strong practicability and has stronger popularization significance.
Description
Technical Field
The present utility model relates to a circuit board processing device, and more particularly, to a high-efficiency lamination device for a multi-layer circuit board.
Background
The circuit boards are classified into three major categories, namely single-sided boards, double-sided boards and multi-layer circuit boards, according to the number of layers. The double panel is an extension of a single panel, and is used when a single wiring layer cannot meet the needs of the electronic product. The copper-clad wiring is arranged on both sides, and the wiring between the two layers can be conducted through the via hole so as to form the required network connection. The multi-layer board is a printed board having three or more conductive pattern layers laminated with insulating materials therebetween at a distance, and conductive patterns therebetween being interconnected as required. Multilayer circuit boards are products of electronic information technology that are evolving into high-speed, multifunctional, large-capacity, small-volume, thin, lightweight applications.
When the circuit board is pressed, the circuit board often causes close fit between the lower layer plate and the lower pressure plate due to pressure born by the circuit board during pressing, so that the pressed circuit board cannot be quickly taken down, and the processing efficiency is affected.
Disclosure of Invention
Based on this, it is necessary to provide an efficient lamination device for multilayer circuit boards in view of the shortcomings in the prior art.
A high-efficiency laminating device for a multi-layer circuit board comprises a processing table, a bearing platform, a supporting frame, a pressing assembly and a separating assembly. The processing table is provided with a bearing groove, and the bearing Ping Taika is combined in the bearing groove and can be lifted and lowered movably. The support stand stands on the processing table, the pressing assembly is arranged on the support stand and is located above the bearing platform, and the processing table is further provided with a first sliding rail. The separation assembly comprises a first lifting frame and a separation knife, wherein the first lifting frame is clamped in the first sliding rail and can slide left and right along the first sliding rail, a first lifting chute is further formed in the first lifting frame, and the separation knife is clamped in the first lifting chute and can lift along the first lifting chute. The blade of the separating knife is in a wedge-shaped design.
Further, the pressing assembly comprises a pressing cylinder, a mounting plate, a pressing plate and a plurality of fixing nuts. The pressing cylinder is arranged on the supporting frame, the mounting plate is fixedly arranged at the lower end of the pressing cylinder, a plurality of mounting through holes are formed in the mounting plate, a plurality of mounting studs are correspondingly arranged on the pressing plate, the mounting studs are respectively arranged in the mounting through holes in a penetrating mode from bottom to top, and the fixing nuts are sleeved on the mounting studs from top to bottom.
Furthermore, the efficient lamination device of the multilayer circuit board further comprises a fixing component, and the fixing component comprises a fixing frame and two limiting blocks. The fixing frame is fixedly arranged on the supporting frame and positioned between the bearing platform and the pressing assembly, and a fixing groove is formed in the upper end of the fixing frame. The two sides of the fixed groove are provided with second sliding rails, the bottom of the fixed groove is provided with a pressing through hole, the two limiting blocks are respectively clamped on the second sliding rails and can slide left and right, and the bearing platform can pass through the pressing through hole.
Further, the efficient lamination device of the multilayer circuit board further comprises two groups of conveying components, the processing table is further provided with a conveying groove, and the two groups of conveying components are arranged in the conveying groove and are respectively located at the left side and the right side of the bearing platform. The conveying assembly comprises a driving roller and a conveying belt, and the driving roller can drive the conveying belt to rotate left and right.
Further, the efficient lamination device of the multi-layer circuit board further comprises a pushing component, wherein the pushing component is positioned on the left side of the separating component and comprises a second lifting frame and a pushing plate. The second lifting frame is clamped in the first sliding rail and can slide left and right along the first sliding rail, a second lifting sliding chute is further arranged on the second lifting frame, and the push plate is clamped in the second lifting sliding chute and can movably lift along the second lifting sliding chute.
In summary, the efficient laminating device for the multi-layer circuit board has the following beneficial effects: the circuit board is rapidly separated from the bearing platform after the lamination and lamination processing of the multi-layer circuit board by the design separation assembly, so that the circuit board is conveniently discharged from the bearing platform, and the lamination and lamination efficiency is greatly improved; the lamination plates of the lamination assembly are designed to be assembled and disassembled, so that lamination processing can be finished by selecting lamination plates with different sizes according to circuit boards with different specifications during lamination; the fixing component is designed to fix and limit the circuit board, so that the influence of deviation of the circuit board on the processing effect during lamination is avoided; the conveying assembly and the pushing assembly are designed to realize automatic loading and unloading of the circuit board, so that the efficiency of lamination processing is further improved; the utility model has strong practicability and has stronger popularization significance.
Drawings
FIG. 1 is a schematic diagram of a high-efficiency lamination device for a multi-layer circuit board according to the present utility model;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a schematic view of the processing station of FIG. 2;
FIG. 4 is an exploded view of the compression assembly of FIG. 2;
FIG. 5 is an exploded view of the separation assembly of FIG. 2;
FIG. 6 is an exploded view of the securing assembly of FIG. 2;
FIG. 7 is an exploded view of the conveyor assembly of FIG. 2;
fig. 8 is an exploded view of the pusher assembly of fig. 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be described in further detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1 to 8, the present utility model provides a high-efficiency lamination device 100 for multi-layer circuit boards, which includes a processing table 10, a carrying platform 20, a supporting frame 30, a pressing assembly 40 and a separating assembly 50. The processing table 10 is provided with a carrying groove 11, and the carrying platform 20 is clamped in the carrying groove 11 and can be lifted up and down movably. The support frame 30 stands on the processing table 10, the pressing assembly 40 is mounted on the support frame 30 and located above the carrying platform 20, and the processing table 10 is further provided with a first sliding rail 12.
The separating assembly 50 includes a first lifting frame 51 and a separating blade 52, the first lifting frame 51 is engaged in the first slide rail 12 and can slide left and right along the first slide rail 12, the first lifting frame 51 is further provided with a first lifting chute 511, and the separating blade 52 is engaged in the first lifting chute 511 and can lift along the first lifting chute 511. The blade edge of the separating blade 52 is of wedge-shaped design. The first lifting frame 51 drives the separating knife 52 which slides from right to left, and the wedge-shaped knife edge of the separating knife can easily divide the circuit board adhered to the surface of the bearing platform 20 due to lamination, so that the problem that the machining efficiency is affected because the laminated circuit board cannot be quickly taken down is avoided.
The pressing assembly 40 includes a pressing cylinder 41, a mounting plate 42, a pressing plate 43, and a plurality of fixing nuts 44. The pressing cylinder 41 is mounted on the support frame 30, the mounting plate 42 is fixedly mounted at the lower end of the pressing cylinder 41, a plurality of mounting through holes 421 are formed in the mounting plate 42, a plurality of mounting studs 431 are correspondingly formed in the pressing plate 43, the mounting studs 431 are respectively arranged in the mounting through holes 421 in a penetrating manner from bottom to top, and the fixing nuts 44 are sleeved on the mounting studs 431 from top to bottom. The lamination plates 43 assembled on the mounting plate 42 through the mounting studs 431 and the fixing nuts 44 are more convenient to replace at any time, so that lamination plates 43 with different sizes can be selected for lamination processing according to circuit boards with different specifications.
The efficient lamination device 100 for multi-layer circuit boards further comprises a fixing component 60, wherein the fixing component 60 comprises a fixing frame 61 and two limiting blocks 62. The fixing frame 61 is fixedly mounted on the supporting frame 30 and located between the carrying platform 20 and the pressing assembly 40, and a fixing groove 611 is formed at an upper end of the fixing frame 61. The two sides of the fixing groove 611 are provided with second sliding rails 612, the bottom of the fixing groove 611 is provided with a pressing through hole 613, the two limiting blocks 62 are respectively clamped on the second sliding rails 612 and can slide left and right, and the bearing platform 20 can pass through the pressing through hole 613. When the carrying platform 20 drives the circuit board to rise into the fixing groove 611, the limiting block 62 can clamp and fix the left and right ends of the circuit board through left and right sliding, so that the problem of deviation of the circuit board caused by vibration and other factors in the processing process is avoided.
The efficient lamination device 100 for multi-layer circuit boards further comprises two groups of conveying assemblies 70, the processing table 10 is further provided with a conveying groove 13, and the two groups of conveying assemblies 70 are respectively arranged in the conveying groove 13 and are respectively positioned at the left side and the right side of the bearing platform 20. The conveying assembly 70 comprises a driving roller 71 and a conveying belt 72, and the driving roller 71 can drive the conveying belt 72 to rotate left and right. The conveying components 70 at the left side and the right side can respectively control the automatic feeding and discharging of the circuit board, so that the efficiency is higher, and the automatic feeding and discharging device is stable and reliable compared with manual feeding and discharging.
The efficient lamination device 100 for multi-layer circuit boards further comprises a pushing assembly 80, wherein the pushing assembly 80 is positioned at the left side of the separating assembly 50, and comprises a second lifting frame 81 and a pushing plate 82. The second lifting frame 81 is engaged in the first sliding rail 12 and can slide left and right along the first sliding rail 12, a second lifting chute 811 is further provided on the second lifting frame 81, and the push plate 82 is engaged in the second lifting chute 811 and can be lifted and lowered along the second lifting chute 811. The pushing assembly 80 can push the processed circuit board from the bearing platform 20 to the conveying assembly 70 by sliding from left to right, and the processing efficiency is further improved without manually taking the board.
When the utility model works, firstly, the circuit board can be automatically loaded onto the bearing platform 20 under the cooperation of the left conveying component 70 and the pushing component 80. Then, the carrying platform 20 drives the circuit board to rise to just enter the fixing groove 611 of the fixing assembly 60, and the limiting blocks 62 on the left side and the right side of the fixing frame 61 slide towards the middle to clamp and fix the circuit board. After the pressing cylinder 41 pushes the pressing plate 43 to press down to laminate the circuit boards, the fixing assembly 60 releases the limit fixing of the circuit boards, and the bearing platform 20 drives the circuit boards to descend again. Then, the separating assembly 50 is attached to the surface of the carrying platform 20 and slides from right to left, so as to separate the circuit board adhered to the carrying platform 20. Finally, the pushing assembly 80 slides rightward again to push the circuit board to fall on the conveying assembly 70 on the right side, and the conveying assembly 70 automatically drives the circuit board to be discharged.
In summary, the efficient lamination device 100 for multi-layer circuit board of the present utility model has the following advantages: the design of the separating assembly 50 can rapidly separate the circuit board from the bearing platform 20 after the lamination and lamination processing of the multi-layer circuit board, thereby facilitating the blanking of the circuit board from the bearing platform 20 and greatly improving the lamination and lamination efficiency; the lamination plate 43 of the lamination assembly 40 is designed to be assembled and disassembled, so that lamination processing can be finished by selecting lamination plates 43 with different sizes according to circuit boards with different specifications during lamination; the fixing assembly 60 is designed to fix and limit the circuit board, so that the influence of deviation of the circuit board on the processing effect during lamination is avoided; the conveying assembly 70 and the pushing assembly 80 are designed to realize automatic loading and unloading of the circuit board, so that the efficiency of lamination processing is further improved; the utility model has strong practicability and has stronger popularization significance.
The above examples illustrate only one embodiment of the utility model, which is described in more detail and is not to be construed as limiting the scope of the utility model. It should be noted that variations and modifications can be made by those skilled in the art without departing from the inventive concept, which fall within the scope of the utility model. Accordingly, the scope of the utility model should be determined from the following claims.
Claims (5)
1. An efficient lamination device for a multi-layer circuit board, which is characterized in that: comprises a processing table, a bearing platform, a supporting frame, a pressing component and a separating component; the processing table is provided with a bearing groove, and the bearing Ping Taika is combined in the bearing groove and can be lifted and lowered movably; the support frame is erected on the processing table, the pressing assembly is arranged on the support frame and is positioned above the bearing platform, and the processing table is also provided with a first sliding rail; the separating assembly comprises a first lifting frame and a separating knife, the first lifting frame is clamped in the first sliding rail and can slide left and right along the first sliding rail, a first lifting chute is further arranged on the first lifting frame, and the separating knife is clamped in the first lifting chute and can lift along the first lifting chute; the blade of the separating knife is in a wedge-shaped design.
2. The efficient lamination device for multi-layer circuit boards as defined in claim 1, wherein: the pressing assembly comprises a pressing cylinder, a mounting plate, a pressing plate and a plurality of fixing nuts; the pressing cylinder is arranged on the supporting frame, the mounting plate is fixedly arranged at the lower end of the pressing cylinder, a plurality of mounting through holes are formed in the mounting plate, a plurality of mounting studs are correspondingly arranged on the pressing plate, the mounting studs are respectively arranged in the mounting through holes in a penetrating mode from bottom to top, and the fixing nuts are sleeved on the mounting studs from top to bottom.
3. The efficient lamination device for multi-layer circuit boards as defined in claim 1, wherein: the fixing assembly comprises a fixing frame and two limiting blocks; the fixing frame is fixedly arranged on the supporting frame and positioned between the bearing platform and the pressing assembly, and a fixing groove is formed in the upper end of the fixing frame; the two sides of the fixed groove are provided with second sliding rails, the bottom of the fixed groove is provided with a pressing through hole, the two limiting blocks are respectively clamped on the second sliding rails and can slide left and right, and the bearing platform can pass through the pressing through hole.
4. The efficient lamination device for multi-layer circuit boards as defined in claim 1, wherein: the processing platform is characterized by further comprising two groups of conveying components, wherein the processing platform is further provided with a conveying groove, and the two groups of conveying components are arranged in the conveying groove and are respectively positioned at the left side and the right side of the bearing platform; the conveying assembly comprises a driving roller and a conveying belt, and the driving roller can drive the conveying belt to rotate left and right.
5. The efficient lamination device for multi-layer circuit boards as defined in claim 1, wherein: the pushing assembly is positioned at the left side of the separating assembly and comprises a second lifting frame and a pushing plate; the second lifting frame is clamped in the first sliding rail and can slide left and right along the first sliding rail, a second lifting sliding chute is further arranged on the second lifting frame, and the push plate is clamped in the second lifting sliding chute and can movably lift along the second lifting sliding chute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321255117.5U CN219999718U (en) | 2023-05-23 | 2023-05-23 | High-efficiency laminating device for multi-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321255117.5U CN219999718U (en) | 2023-05-23 | 2023-05-23 | High-efficiency laminating device for multi-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219999718U true CN219999718U (en) | 2023-11-10 |
Family
ID=88619250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321255117.5U Active CN219999718U (en) | 2023-05-23 | 2023-05-23 | High-efficiency laminating device for multi-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219999718U (en) |
-
2023
- 2023-05-23 CN CN202321255117.5U patent/CN219999718U/en active Active
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