JP3104897B2 - Copper foil and mirror plate transfer and superposition equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial applications]

[0001] The present invention relates to an apparatus for transferring and superimposing a copper foil and a mirror surface plate, and performs these steps in a shorter time than a conventional apparatus.

[0002]

2. Description of the Related Art Generally, a thermosetting resin laminate used for a printed circuit board or the like is prepared by impregnating a base material such as paper or glass fiber with a thermosetting resin varnish such as a phenol resin or an epoxy resin and drying the prepreg. Then, this is cut into a predetermined size, and a plurality of the sheets are overlapped with a metal foil such as a copper foil on one or both sides thereof as necessary, sandwiched between sharp plates, and heated and pressed by a multi-stage laminating press. It can be obtained by:

[0003] In the production of a thermosetting resin laminate, a process of stacking a plurality of prepregs or a metal foil on the prepreg, sandwiching the prepreg between mirror plates, and transporting the prepreg to a press device (hereinafter referred to as a setting process) is performed in all manufacturing processes. It takes a long time and is the rate-determining stage.

In the case of a double-sided copper-clad laminate using copper foils on both sides, the setting step is conventionally performed as follows. On the set table (21), a mirror plate (22) and a copper foil layered thereon (copper foil constituting the lower surface of the laminate)
(23) A set (24) and a plurality of prepregs (2
5) and a set (27) of copper foil (copper foil constituting the upper surface of the laminate) (26) superimposed thereon are alternately stacked. Copper-mirror plate set (24) is to transfer the copper foil by a copper foil transport device (28) at the position of X ₁ obtained by superimposing on the mirror plate (22). On the other hand, a set of prepreg and copper foil (27) is provided with a copper foil transport device (2
9) and obtained by being superimposed on the prepreg (25).

[0005] These superimposed products are connected to a hoist (3
0) and to transfer onto the set table by the hoist (31), each position from X ₁ to X _2, is moved by the conveyor from the Y ₁ to Y _2. Subsequently, they are alternately transferred onto the set table by the hoists (30) and the hoists (31) and overlapped.

[0006] The load thus obtained is sent to a press device. In such a setting process, it takes time to transport copper foil and a set of copper foil / mirror plate, transfer of a set of prepreg / copper foil, and when a floating substance adheres to a set of prepreg / copper foil. There are defects such as scratches or dents on the surface copper foil of the formed laminate, resulting in defective products.

In order to improve such a defect, a method of forming a set of a copper foil, a mirror plate, and a copper foil in advance and alternately overlapping the set with a plurality of prepregs is considered. That is, one copper foil used on the upper surface of the laminate (the copper foil located on the lower surface of the mirror plate) is drawn from the stack and placed on the copper foil transport table. Next, one set of the mirror plate and the copper foil (used on the lower surface of the laminate) superimposed thereon is superimposed on the copper foil on the copper foil transport table. One set of the copper foil / mirror plate / copper foil thus obtained is alternately superimposed on a set table in the next setting step with a set of a predetermined number of prepregs. However, this method can improve the failure of the laminate due to the adhesion of suspended matter,
On the contrary, the time required for the setting step is long.

[0008]

The above-mentioned step of laminating the copper foil and the mirror-finished plate is a time-consuming step like the above-described setting step, and shortening the time required is an important issue. I have. The present invention prevents the floating substances from adhering to the copper foil surface, which is the surface of the laminate, and shortens the time required for this process by about half, thereby reducing the time of the entire laminate manufacturing process and reducing the production time. It is intended to improve the performance.

[0009]

SUMMARY OF THE INVENTION The present invention relates to a method for receiving two pieces of copper foil, on which a set of a copper foil and another copper foil and a mirror plate is superimposed. Having a table, the two copper foil transfer tables are configured to alternately reciprocate between a position for receiving the copper foil and a position where a pair of copper foil / mirror plate is superimposed on the copper foil, and Copper foil·
A transfer device for moving one set of mirror plates to a copper foil transfer table,
And a transfer device for transferring a set of the superposed copper foil / mirror plate / copper foil to a position where the set is superimposed on the prepreg.

A specific example (one example) of each device constituting the present invention will be described below with reference to FIGS.
The copper foil transfer devices (1) and (2) suck one copper foil (10) from the stacked copper foils (11) and transfer them to a predetermined position on the copper foil transfer table (3) or (4). It is a device to do. The copper foil transfer table moves from the position A on which the copper foil is placed to a predetermined overlapping position B. At the position B, the mirror plate and the copper on the copper foil (10) are placed on the transfer table at the position on the transfer table. One set (5) with the foil is laminated in the order of copper foil, mirror plate, and copper foil.

There are two copper foil transfer tables, one (3)
Does not move up and down and reciprocates between the positions A and B. The other one (4) moves up and down at the overlapping position B of the copper foil and the mirror surface plate, and reciprocates between the two positions A and B. These are located on the opposite side when stationary, and alternately move simultaneously and change positions. Next, there are two hoists as transfer devices, and the hoist (6) is a transfer device for transferring a set (5) of a mirror plate and a copper foil thereover onto a copper foil transfer table. (8) is a transfer device for transferring a set (7) of copper foil / mirror plate / copper foil on the copper foil transfer table onto the set table (9), and these and the prepreg alternately on the set table. It is transported and superimposed and sent to a press for the next molding step.

Next, a description will be given of a process of superimposing a copper foil and a mirror surface plate using these apparatuses. 1. At the copper foil receiving position A, the copper foil transport table (3) receives one copper foil (10) transferred by the copper foil transport devices (1) and (2). At the same time, at the overlapping position B, the other copper foil transport table (4) is raised, and is placed at the same height as the copper foil transport table (3) on the placed copper foil (10). The copper foil / mirror plate (5) is overlaid using a hoist (6). The hoist (8) superimposes the copper foil, mirror plate, and copper foil (7) on the prepreg on the set table (9) (FIG. 1).

2. The empty hoist (6) returns to the copper foil / mirror plate (5), and the empty hoist (8) removes the copper foil / mirror plate / copper foil (7) on the transfer table (4) in B. Return to the bird (Fig. 2).

3. The copper foil transfer table (3) starts moving to the overlapping position B, the empty copper foil transfer table (4) lowers its position, and starts returning to the copper foil receiving position A. The hoist (6) takes the copper foil / mirror plate (5) and transfers it above the position B. The hoist (8) is the copper foil / mirror plate / copper foil (7).
And transfer it to above the set table (FIG. 3).

4. In the copper foil transport table (3), the copper foil / mirror plate / copper foil is superimposed on the position B by the hoist (6), and the copper foil transport table (4) receives the copper foil at the position A. On the set table, copper foil, mirror plate, and copper foil are superimposed on the prepreg by the hoist (8) (FIG. 4).

The copper foil transport table (4) is located at the position A
It is preferable that the height rises at the same level as that of the other copper foil transport table (3).

As described above, by installing two copper foil transport tables, the time required for superposing a set of copper foil, mirror surface plate and copper foil can be reduced to about half. By reducing the total required time, the laminated plate forming process can be greatly reduced.

[0018]

By using the apparatus of the present invention, it is possible to prevent floating substances from adhering to the copper foil surface, which is the surface of the laminate, and to streamline the process of laminating the copper foil / mirror plate / copper foil. As a result, the productivity of the laminate can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a state where a copper foil transport table receives copper foil from a copper foil transport device.

FIG. 2 is a schematic perspective view of a state where a copper foil transport table that has received a copper foil starts moving to a superposition position B;

FIG. 3 is a schematic perspective view of a state where two copper foil transfer tables start to change positions.

FIG. 4 is a schematic perspective view showing a state where another copper foil transport table comes to a predetermined position and receives copper foil there.

FIG. 5 is a schematic perspective view of a conventional apparatus for superposing a copper foil and a mirror plate.

[Explanation of symbols]

 1, 2 Copper foil transport device 3, 4 Copper foil transport table 5 A set of copper foil / mirror plate 6 Hoist 7 A set of copper foil / mirror plate / copper foil 8 Hoist 9 Set table 10 Copper foil 11 Stacked copper Foil 21 Set table 22 Mirror surface plate 23 Copper foil 24 One set of copper foil / mirror surface plate 25 Pre-preg 26 Copper foil 27 One set of copper foil / prepreg 28, 29 Copper foil transport device 30, 31 Hoist

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B32B 35/00 B32B 15/08 B65H 5/04 H05K 3/00

Claims (1)

(57) [Claims] 1. A copper foil transfer table on which a copper foil is received, and then a pair of another copper foil and a mirror surface plate are superimposed on the copper foil. The copper foil transfer table has a copper foil receiving position and a copper foil
A transfer device configured to alternately reciprocate with a position at which one set of mirror plates is superimposed, and a transfer device for moving one set of copper foil and mirror plates to a copper foil transfer table, and
An apparatus for superimposing a copper foil and a mirror surface plate, comprising a transfer device for transferring a set of a mirror surface plate and a copper foil to a position where the mirror surface plate and the copper foil are superimposed on the prepreg.