JP3111226B2 - Manufacturing method of laminated chip type parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated integrated circuit (hereinafter, referred to as "laminated integrated circuit") in which a plurality of insulating layers provided with conductive patterns are laminated and predetermined conductive patterns are electrically connected to form a component body. The present invention relates to a method for manufacturing a multilayer chip type electronic component such as a C network, a chip capacitor, a chip inductor, and an LC filter, and a multilayer chip type component including a ceramic multilayer substrate.

[0002]

2. Description of the Related Art Conventionally, as a laminated chip type electronic component, an inductance element formed by a printing method has been known (Japanese Patent Publication No. 50331/1985).

In the method of manufacturing the inductance element,
A first raw sheet is formed by using an insulating paint, and a conductive pattern for forming a coil is formed on the sheet surface of the raw sheet for about a half pattern by the conductive paint. Next, an opening exposing one end of the conductive pattern is provided, a second green sheet is formed of an insulating paint, and a half of the second green sheet corresponding to the remaining portion for forming a coil is formed on the sheet surface. A conductive pattern corresponding to the pattern is formed of a conductive paint, and one end of the conductive pattern is connected to one end of a lower conductive pattern exposed from an opening provided in the second raw sheet to form a conductive pattern for one turn. Form as

[0004] From the same process, the third and fourth raw sheets are repeatedly laminated, and the ends of the conductive patterns formed for about half a pattern are alternately connected to each sheet through openings. The sheet laminate is fired to produce a component body having a series of continuous coils therein.

[0005] This is conventionally performed in such a manner that a raw sheet of an insulating material having a predetermined conductive pattern formed on a sheet surface is formed in advance, the raw sheets are stacked, and the predetermined conductive patterns are electrically connected to each other. According to the sheet method, the electrical connection between the conductive patterns is very difficult.

However, according to the printing method described above, in order to connect the conductive patterns of the upper and lower layers, an opening is provided at the time of printing a raw sheet of the upper layer to expose an end of the conductive pattern of the lower layer, and the conductive pattern is exposed. At the end of the sheet, printing is performed so that the end of the conductive pattern to be formed next comes into contact with the end of the raw sheet through the thickness of the raw sheet, and dripping is likely to occur at the hole of the opening.

In addition, since the conductive patterns to be sequentially connected are printed by hanging the ends of the conductive patterns on the lower layer side, the electrical connection between the conductive patterns must be maintained exclusively by printing precision. No. Also,
Unless the difference in printing thickness between the general portion of the conductive pattern formed on the sheet surface of the raw sheet and the end formed at the opening position of the raw sheet is accurately managed, reliable and desirable electrical connection cannot be achieved. is there.

[0008] Compared with the printing method, the sheet method can shorten the lead time and improve productivity, and with the advance of image processing technology and mechanical control technology, the thinning of the sheet and the improvement of the lamination accuracy can be improved. It is suitable for manufacturing a laminated chip-type component because it can prevent bleeding or blurring when forming a conductive pattern or occurrence of pinholes.

However, in the sheet method, not only is it necessary to devise a method of reliably connecting the conductive patterns of each layer electrically, but also, in addition to the end electrodes such as the MHC, C network, and ceramic multilayer substrate, a connecting conductive portion is used. It is necessary to form the connection portion on the outer surface of the component body, and the formation of the connection portion is a great obstacle to improving the productivity.

[0010]

SUMMARY OF THE INVENTION In the present invention, a sheet method is applied. In addition to the electrical connection between the conductive patterns formed for each layer, the conductive portion for connection extending to the outer surface of the component body is also electrically reliable. It is an object of the present invention to provide a method of manufacturing a laminated chip type component which can be easily connected to a component.

[0011]

According to a first aspect of the present invention, there is provided a method for manufacturing a laminated chip component, wherein a raw sheet made of an insulating material is formed on a film surface of a band-shaped film, and a conductive pattern made of a conductive material is formed. It is formed on the sheet surface of the raw sheet, and further, through holes are formed by laser irradiation on predetermined surfaces of the raw sheet including the surface on which the conductive pattern is formed and the sheet surface deviating from the conductive pattern. After forming the conductive portion for connection with the conductive material embedded in the sheet, the raw sheet is peeled off from the strip film, the predetermined conductive portions for connection are aligned with each other, and a plurality of green sheets are laminated, and To electrically connect the conductive parts to each other, a through hole is formed on the predetermined surface of the raw sheet by laser irradiation, and a through hole reaching the film surface of the strip film. Or a concave recess is formed, and a conductive material embedded in the through-hole is filled up to the through-hole or the concave recess of the strip-shaped film, and the end is exposed outside the through-hole. The conductive portion is formed by a through hole or a concave portion of the strip film.

In the method for manufacturing a laminated chip component according to a second aspect of the present invention, a conductive material embedded in a hole of a through hole is filled into a through hole or a concave portion of a strip film, and a raw sheet is formed. The conductive pattern is also exposed on the sheet surface side on which the conductive pattern is formed, and the conductive portion for connection is formed such that the end is exposed to the outside of the hole above and below the through hole.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, FIG. 1 schematically shows an internal structure of an LC composite component as an example of a laminated chip component manufactured by the method according to the present invention. Shows a perspective view of the internal structure of FIG. In each figure, reference numeral 1 denotes an inductor unit (L), and 2 denotes a capacitor unit (C).

The inductor section 1 includes a plurality of insulating layers 10.
And a conductive pattern 11 of a conductive material formed on a predetermined insulating layer 10 and a predetermined layer portion including a surface on which the conductive pattern 11 is formed and a layer position of the insulating layer 10 deviating from the conductive pattern 11. Through-holes 12 formed through ...
And a connection conductive portion 13 made of a conductive material which is embedded in the hole of the through hole 12 and is exposed to the outside of the hole to be connected and fixed to another.

The capacitor section 2 has the same configuration as the inductor section 1 and includes a plurality of insulating layers 20.
The conductive patterns 21 made of a conductive material formed at 0.
A through-hole 22 formed through a predetermined layer portion including a surface on which the conductive pattern 21 is formed, and a layer position of the insulating layer 20 deviating from the conductive pattern 21.
And a connection conductive portion 23 made of a conductive material connected and fixed to another by being embedded in the hole and exposed to the outside of the hole.

In the LC composite component, the connecting conductive portion 13
, 23 ... are embedded in the holes of the through holes 12 ..., 22 ... and are connected and fixed to each other at the ends exposed to the outside of the holes. Thereby, at least the predetermined insulating layer 10
, 20 ... conductive patterns 11 ..., 2 formed between layers
Are electrically connected to each other with certainty.

The inductor portion 1 and the capacitor portion 2 are connected to each other by connecting conductive portions 13, 23 through through holes 12, 22 provided in the other insulating layers 10, 20.
By pulling out the lower surface and the upper surface of the first member to connect and fix the end portions, the integrally laminated portions are also electrically connected to each other.

The connecting conductive portions 13, 23 which fill the holes of the through holes 12, 22... Formed by laser irradiation and are exposed outside the upper and lower holes as described later.
, The connecting conductive parts 13, 23, 23... Are mechanically connected and fixed to each other with the lamination of the insulating layers 10, 20. Can connect.

3 to 15 show the steps of manufacturing the laminated chip component according to the present invention. Of these, FIGS. 3, 5, 7, 9,
Numerals 11 to 14 indicate a raw sheet made of an insulating material formed in each step and work contents to be performed on the raw sheet in each step. The same reference numerals are used. FIGS. 4, 6, 8, 10 and 15 show manufacturing apparatuses used in the respective steps, and the manufacturing apparatuses are shown in correspondence with the respective drawings showing the production and work contents of the raw sheet.

FIG. 3 shows a raw sheet 10 in which a plastic film or paper is used as a base film 3 and a film of an insulating material is formed on the film surface. The base film 3 has a continuous band shape and is provided to carry the raw sheet 10 from the formation of the raw sheet 10 to a substantially final stage of a series of steps.

The raw sheet 10 is formed by using an insulating paint mainly composed of a dielectric material and a magnetic material according to the function of the component. The raw sheet 10 is formed by coating to a thickness of about 5 to 150 μm, and as shown in FIG. 4, an unwinder 30 for continuously feeding the belt-shaped film 3 and an unwinder 30.
It can be formed using a coater 31 that applies an insulating paint to the film surface of the belt-shaped film 3 fed from the apparatus.

FIG. 5 shows a state in which a conductive pattern 11 of a predetermined shape made of a conductive material is formed on a sheet surface of a raw sheet continuously from the previous step. As this conductive material, a low-viscosity conductive paint or a thin-film electrode can be used. The conductive paint can be printed and formed as the conductive pattern 11 by running a squeegee 42 on a screen plate 41 of a screen printer 40 as shown in FIG.

Along with the conductive pattern 11, although not particularly shown, a positioning mark used for forming a through hole in a later step or printing a conductive portion for connection can be formed by printing. This positioning mark is used for the conductive pattern 1
Unlike the first forming material, it can be formed using a magnetic material.

FIG. 7 shows a raw sheet 10 on which a conductive pattern 11 is printed, in which a through hole 12 is formed. The formation location of the through hole 12 is formed on the surface of the conductive pattern 11 and the conductive pattern 1 because of the necessity of the circuit configuration.
1 includes a predetermined surface portion of the raw sheet deviating from 1. This through hole 12 is formed by laser irradiation.

As the irradiation laser, the use conditions differ depending on the material of the raw sheet 10, but a YAG-CW laser, a YAG-CW laser,
An AG pulse laser or an excimer laser can be used. As a YAG-CW laser, Q-sw frequency 1 ~
30 kHz is used. According to this laser irradiation, the through hole 12 can be formed to have a hole diameter of about 60 to 300 μm, which is 1/2 to 1 /
It can be formed as small as about four. In the case of laser irradiation, a large number of through holes 12 can be formed simultaneously by branching the light source into a plurality.

When the through hole 12 is formed, a through hole or a concave depression 4 reaching the film surface of the strip film 3 is formed. This through hole or depression 4 is
It is used to form the connection conductive portion 13 in a later step.
FIG. 8 shows a laser irradiator 50, which can position an irradiation point by automatic alignment by image processing using the above-described printing and positioning marks such as through holes.

FIG. 9 shows that the raw sheet 1 continues from the previous process.
0 formed through hole 12 and strip film 3
The step of forming the connecting conductive portion 13 with a conductive material filling the through hole or the recessed portion 4 formed in FIG. The connecting conductive portion 13 fills the inside of the through hole 12 with a conductive material, further fills the conductive material at least into the through hole or the recessed portion 4 of the strip film 3, and forms the conductive material of the raw sheet 10. It is also formed in a bar shape so as to be exposed on the sheet surface side on which the pattern 11 is formed.

As the conductive material, it is preferable to use a conductive paint having a viscosity of 600 Poise or more, since it is necessary to ensure the connection with another conductive portion for connection. FIG. 10 shows a screen printing machine 60 that forms the conductive portion 13 for connection. In this screen printing, the position of the screen plate 62 is controlled while the positioning mark or the through hole 12 is detected by the image processing device 61, so that the conductive paint is applied. The squeegee 63 can accurately fill the through hole 12.

FIG. 11 shows a step of peeling the strip film 3 supporting the raw sheet 10 in the steps up to now. FIG.
1 shows a raw sheet 10 from which the strip film 3 has been peeled, and FIG.
3 shows a step of stacking a plurality of raw sheets 10 by bringing necessary connecting conductive parts 13 into contact between the ends exposed from the through holes 12, and FIG. Indicates the status.

Each of the steps can be performed by using a laminating machine 70 shown in FIG. 15, and after forming the conductive portion 13 for connection, the raw sheet 10 once wound up is unwound from an unwinder 71, and on this way, the band-shaped film 3 is wound by a winder 72. The strip film 3 is peeled off from the raw sheet 10 by winding. Next, the raw sheet 10 of one layer is cut into a card shape by a cutting machine 73 and is sequentially conveyed by a vacuum suction machine 74 to a stacker table 75 of a press machine subsequent to a post-process.

The stacker table 75 is an image processing device 76 for X,
Positioning control is performed in the Y and θ directions, and a plurality of the raw sheets 10 stacked and conveyed by the vacuum suction machine 74 are aligned with an accuracy of 10 μm or less, and a plurality of sheets can be stacked. At the time of this lamination, it is also possible to sequentially laminate one by one, or to laminate and pool 4 to 10 or more sheets, and then to laminate in units of each laminate.

After a temporary press is applied to the sheet laminate with a presser die 77 heated to an appropriate temperature, a main press treatment is performed by the same heat and pressure bonding. The pressure and temperature at this time differ depending on the material of the raw sheet 10, but the pressure is 0.3 kg by a temporary press.
/ Cm @ 2 and a temperature of about 50 to 100 DEG C. This press can be carried out at a pressure of 300 to 1000 kg / cm @ 2 and a temperature of about 50 to 100 DEG C.

Each of the connecting conductive parts 1
3 can be connected and fixed by being densely compressed between the upper and lower ends exposed from the through hole 12, and each green sheet 10 is also integrally formed by sandwiching the conductive pattern 11 between layers and making close surface contact. it can. At this time, although not particularly shown, the raw sheet 10 laminated on the front and back sides of the component body can also be laminated so that the end of the connection conductive portion 13 is drawn out to the external surface through the through hole.

FIG. 16 shows a process of forming a component body from a raw sheet having a plurality of conductive patterns. In this step, if a necessary number of functions such as feeding, peeling, and cutting are provided by a necessary number in a laminating machine 70 similar to that shown in FIG. 15, different conductive patterns can be laminated in parallel. Also,
Even when multiple types of parts are manufactured on the same sheet, such as LC composite parts, mixed production can be performed by instructing the number of layers, order, and the like for each part by using a computer function.

After the above-described laminating process, the device can be packed as a product by performing a characteristic measurement inspection finally through a process of forming an end electrode necessary for obtaining the product as a subsequent product.

[0036]

As described above, according to the method for manufacturing a laminated chip type component according to the first aspect of the present invention, together with the through hole formed on a predetermined surface of the raw sheet by laser irradiation,
Form a through hole or a concave depression reaching the film surface of the strip film, fill the through hole or the concave depression of the strip film with the conductive material embedded in the hole of the through hole, and fill the end with a through hole. By forming the connection conductive portion exposed outside the hole through the through hole or the concave portion of the strip-shaped film, the end portion of the conductive film through the connection conductive portion exposed outside the through hole is also formed. It can be easily formed of a conductive material embedded in the hole of the hole, and the conductive pattern for each layer should be electrically connected to each other, and the conductive part for connection that extends to the external surface of the component body should also be securely connected. Can be.

According to the method of manufacturing a laminated chip component according to the second aspect of the present invention, the conductive material embedded in the through-hole is filled into the through-hole or the concave recess of the strip-like film. The raw sheet is also exposed to the sheet surface side on which the conductive pattern is formed, and the end portion is formed to be exposed to the outside of the through hole above and below the through hole. The connecting conductive portion exposed to the outside of the upper and lower holes can be easily formed by a conductive material embedded in the hole of the through hole. The connection conductive portion that extends to the outer surface can also be electrically and easily connected.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view schematically showing an internal structure of a laminated chip component manufactured by a method according to the present invention.

FIG. 2 is a perspective view showing the same parts as in FIG.

FIG. 3 is an explanatory view showing a step of forming a conductive pattern using a conductive material.

FIG. 4 is a perspective view showing an apparatus used in the process of FIG.

FIG. 5 is an explanatory view showing a step of forming a conductive pattern using a conductive material.

FIG. 6 is a perspective view showing an apparatus used in the process of FIG.

FIG. 7 is an explanatory view showing a step of forming a through hole by laser irradiation.

FIG. 8 is a perspective view showing an apparatus used in the step of FIG. 7;

FIG. 9 is an explanatory view showing a step of forming a connection conductive portion using a conductive material.

FIG. 10 is a perspective view showing an apparatus used in the process of FIG.

FIG. 11 is an explanatory view showing a step of peeling a strip film from an insulating raw sheet.

FIG. 12 is an explanatory view showing the structure of an insulating raw sheet from which a strip film has been peeled off.

FIG. 13 is an explanatory view showing a step of laminating a plurality of insulating raw sheets of FIG. 12;

FIG. 14 is an explanatory diagram showing a step of heating and pressing the laminate of FIG. 13;

FIG. 15 is a perspective view showing an apparatus including the processing steps of FIGS. 11, 12, 13, and 14;

FIG. 16 is a perspective view showing an apparatus used for laminating raw sheets of different conductive patterns and components in the same process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Insulating layer (insulating raw sheet) 11 Conductive pattern 12 Through hole 13 Conductive part for connection 3 Strip film 4 Through hole or dent

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-74792 (JP, A) JP-A-1-281795 (JP, A) Jpn. Field (Int.Cl. ⁷ , DB name) H01F 17/00 H01F 27/00 H01F 41/04 H01G 4/30 H01G 13/00 H03H 7/075 H05K 3/46

Claims (2)

(57) [Claims] 1. A raw sheet made of an insulating material is formed on a film surface of a strip film, a conductive pattern made of a conductive material is formed on the sheet surface of the raw sheet, and a through hole is formed by irradiating a laser beam with the laser. After forming the connecting portion with a conductive material to be formed in a predetermined surface portion of the raw sheet including the forming surface and the sheet surface deviating from the conductive pattern and burying the through-hole in the raw sheet, the raw sheet is peeled from the strip film. A method of manufacturing a laminated chip type component in which a plurality of raw sheets are laminated by aligning predetermined conductive portions for connection with each other and electrically connecting the predetermined conductive portions to each other, Along with the through-hole formed on the predetermined surface of the raw sheet, a through-hole or concave recessed part reaching the film surface of the band-shaped film is formed, and the inside of the through-hole is formed. The conductive material to be embedded is filled up to the through hole or the concave depression of the strip film, and the connection conductive part whose end is located outside the hole of the through hole is filled with the through hole or the concave depression of the strip film. A method for manufacturing a laminated chip-type component, characterized by being formed. 2. A conductive material embedded in the holes of the through holes is filled up to the through holes or the concave depressions of the strip film, and is also exposed to the sheet surface side on which the conductive patterns of the raw sheet are formed. 2. The method according to claim 1, wherein the conductive portion for connection is formed such that the end is exposed to the outside of the upper and lower holes.