CN115334781A - Press-fit equipment for processing anti-dislocation multilayer circuit board - Google Patents
Press-fit equipment for processing anti-dislocation multilayer circuit board Download PDFInfo
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- CN115334781A CN115334781A CN202210866152.4A CN202210866152A CN115334781A CN 115334781 A CN115334781 A CN 115334781A CN 202210866152 A CN202210866152 A CN 202210866152A CN 115334781 A CN115334781 A CN 115334781A
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- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Microelectronics & Electronic Packaging (AREA)
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a press-fit device for processing a dislocation-preventing type multilayer circuit board, which comprises a case with a heating cavity, a bearing plate and a laminated assembly, wherein the bearing plate and the laminated assembly are rotatably connected in the case, a placing groove for limiting the movement of the lowest steel plate in the multilayer circuit board is formed in the laminated assembly, the laminated assembly is slidably mounted at the top of the bearing plate, a pressing assembly is arranged right above the laminated assembly and is used for applying downward pressure to the uppermost steel plate in the multilayer circuit board, the middle parts of the laminated assembly, the pressing assembly and the bearing plate are hollow structures, the hollow regions are arranged between a steel plate region and an inner core plate region, the hollow structures do not interfere with the heat and directly conduct the heat with the steel plate, and the assembly is turned over.
Description
Technical Field
The invention relates to the technical field of multilayer circuit board processing, in particular to a pressing device for processing a dislocation-preventing multilayer circuit board.
Background
With the development of electronic circuit technology and the update of electronic products, a single-sided PCB is difficult to meet the requirements of the current high-end circuit board, the requirements of multilayer circuit boards are gradually increased, the circuit wiring can meet more advanced fields, and the circuit is widely applied to the fields of aviation, communication, computers and the like.
In the lamination process of the multilayer PCB, a copper foil, a PP sheet and an inner core board are required to be laminated according to a specified sequence, the PP prepreg is melted at a high temperature through hot pressing and cold pressing, and the copper foil and the inner core board are required to be adhered.
But among present lamination equipment, the hot plate through built-in heater heats the folded plate, and through the transmission of temperature, utilize the press to compress tightly the circuit board that folds well simultaneously, at this in-process, the heat through the hot plate transmission has increased a heat transfer in other words, leads to the prepreg can't be thermally equivalent simultaneously, needs reach the expectation through long-time heating, influences production efficiency.
Disclosure of Invention
The invention aims to provide a lamination device for processing a dislocation-preventing type multilayer circuit board, which has the advantages that the time for converting prepregs into a molten state is the same, the flowing property of resin is improved, meanwhile, the resin can be better filled on the two sides of an inner core board by overturning the multilayer circuit board, the lamination quality is improved, and the problems in the background art are solved.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a pressfitting equipment is used in processing of anti-dislocation formula multilayer circuit board, includes the quick-witted case that possesses the heating chamber, including the loading board of rotation connection in quick-witted incasement portion.
The laminated plate assembly is provided with a placing groove for limiting the activity of the steel plate at the lowest part in the multilayer circuit board, and the laminated plate assembly is slidably mounted at the top of the bearing plate.
And the pressing assembly is positioned right above the plate stacking assembly and is used for applying downward pressure to the uppermost steel plate in the multilayer circuit board.
The middle parts of the laminated plate assembly, the pressing assembly and the bearing plate are all hollow structures, the hollow area ranges between the steel plate area and the inner core plate area, and the hollow structures do not interfere heat conduction of heat and the steel plate directly.
And the overturning assembly can enable the compressed multilayer circuit board to be overturned for half a cycle in the hot pressing process, is used for balancing the pressure of the molten resin on the inner core board and improving the flowability of the resin.
Preferably, the plate stacking assembly comprises two trays which are slidably connected to the top of the bearing plate, the placing grooves are symmetrically formed in the tops of the two trays, and the placing grooves are square grooves.
Comprises a transmission rod for controlling the relative movement of the two trays.
Preferably, the compressing assembly comprises two limiting columns fixedly connected to the top of the tray, two outer walls of the limiting columns are connected with a pressing plate in a sliding mode, the hollow structure is arranged at the top of the pressing plate, a top plate is fixedly mounted at the top of the bearing plate, and an air cushion assembly for controlling the pressing plate to compress the uppermost steel plate downwards is mounted below the top plate.
Preferably, the depth of the placing groove is smaller than the thickness of the multi-layer circuit board after pre-stacking, and the bottom of the pressing plate can press the top of the steel plate downwards.
Preferably, the air cushion assembly comprises two heat-resisting air cushions fixedly mounted between the top of the pressure plate and the bottom of the top plate, and the two heat-resisting air cushions can be matched with the limit of the limit column to control the downward displacement of the pressure plate after being expanded.
The external mounting of machine case has intelligent air pump, the output fixedly connected with input tube of intelligence air pump, input tube is through two reposition of redundant personnel pipelines and the inside intercommunication of heat-resisting air cushion, just the upset that compresses tightly subassembly and folded plate subassembly can not interfere the circuit distribution and the normal use of input tube and reposition of redundant personnel pipeline.
Preferably, compress tightly the subassembly and include to rotate and install the second pivot at the tray top, a plurality of pressure arms are installed to the outer wall array of second pivot, the standing groove can be opened in the rotation of pressure arm, the one end of pressure arm can rotate and compress tightly the steel sheet of the superiors in the standing groove.
The device comprises a transmission assembly with a self-locking function and capable of adjusting rotation of a pressure arm.
Preferably, the depth of the placing groove is higher than the thickness of the multilayer circuit board after being pre-stacked, and the pressing arm can rotate into the placing groove to press the top of the steel plate in a butting mode.
Preferably, the transmission assembly comprises a first bevel gear fixedly connected to the outer wall of the second rotating shaft, the top of the tray is rotatably connected with a third rotating shaft and a second worm through a bearing seat, the outer wall of the third rotating shaft is fixedly connected with a second bevel gear meshed with the first bevel gear, and the outer wall of the third rotating shaft is fixedly connected with a second worm gear meshed with the second worm.
Preferably, the turnover assembly comprises a first rotating shaft rotatably connected inside the case, one end of the first rotating shaft is fixedly connected with the outer wall of the bearing plate, the other end of the first rotating shaft penetrates out of the outer wall of the case and is fixedly connected with a first worm wheel, the outer wall of the case is rotatably connected with a first worm meshed with the first worm wheel through a bearing seat, and a servo motor for controlling the rotation of the first worm is installed on the outer wall of the case.
Preferably, the lamination assembly and the compression assembly form a pressing station, a plurality of pressing stations can be arranged in the case, the rotation of the pressing stations is synchronously controlled by the turnover assembly, the pressing stations are fixedly connected through the connecting piece, and the turnover assembly can turn over the pressing stations synchronously by controlling one pressing station.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, through the arrangement of the hollow structure, the temperature of the heating cavity in the case can be directly contacted with the two steel plates at the upper part and the lower part, so that the part of the steel plate exposed in the heating cavity can be uniformly heated, and then the heat is uniformly transferred to the prepreg through the copper foil, so that the prepreg is converted into a molten resin at a high temperature and has better fluidity, the core plate can be better filled, and the hot pressing efficiency is improved.
2. According to the invention, the turnover assembly is arranged, so that the circuit board locked by the pressing assembly can be turned over for half a cycle, the molten resin can obtain flow assistance, the pressure of the molten resin on the inner core plate can be changed, the pressure of the resin above and below the inner core plate can be changed, the pressure of the resin on the inner core plate is balanced, the two sides of the inner core plate can be better filled with the resin, the core plate patterns can be filled in a flowing manner, and the pasting quality is improved.
Drawings
FIG. 1 is a schematic view of the present invention with the front cover removed;
FIG. 2 is a schematic left side view of FIG. 1 in accordance with the present invention;
FIG. 3 isbase:Sub>A schematic cross-sectional view taken along line A-A of FIG. 2 in accordance with the present invention;
FIG. 4 is a schematic structural diagram of a first embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a second embodiment of the present invention;
FIG. 6 is a schematic structural view of the transmission assembly of the present invention;
fig. 7 is a schematic structural diagram of the flip assembly of the present invention.
In the figure: 1. a chassis; 2. an intelligent air pump; 3. carrying a plate; 4. pressing a plate; 5. a top plate; 6. a heat-resistant air cushion; 7. a tray; 8. a first rotating shaft; 9. a first worm gear; 10. a first worm; 11. a servo motor; 12. an input pipe; 13. a diversion pipeline; 14. a transmission rod; 15. a chute; 16. a slider; 17. a second rotating shaft; 18. pressing the arm; 19. a first bevel gear; 20. a third rotating shaft; 21. a second bevel gear; 22. a second worm gear; 23. a second worm; 24. a limiting column.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 7, the present invention provides a technical solution: the utility model provides a pressfitting equipment is used in processing of anti-dislocation formula multilayer circuit board, includes the quick-witted case 1 that possesses the heating chamber, including rotating the loading board 3 of connection in quick-witted case 1 inside.
The laminated plate assembly is provided with a placing groove for limiting the activity of the steel plate at the lowest part in the multilayer circuit board, and the laminated plate assembly is slidably mounted at the top of the bearing plate 3.
And the pressing assembly is positioned right above the plate stacking assembly and is used for applying downward pressure to the uppermost steel plate in the multilayer circuit board.
The middle parts of the laminated plate assembly, the pressing assembly and the bearing plate 3 are all hollow structures, the hollow area ranges between the steel plate area and the inner core plate area, and the hollow structures do not interfere heat conduction of heat and the steel plate directly.
The turnover assembly can enable the compressed multilayer circuit board to turn over for half a cycle in the hot pressing process, is used for balancing the pressure of the molten resin on the inner core board, and improves the fluidity of the resin.
The cabinet 1 also comprises means for inputting heat, means for applying pressure to the steel plates, not shown in the figures.
The following is a four-layer board as an example.
The four-layer board comprises an inner layer and a lower layer, wherein a double-sided board is used as a core board, medium prepregs or PP are used on the upper layer and the lower layer, copper foils are used on the upper layer and the lower layer, a steel plate is required to be placed below a copper foil on the lowest layer in the pressing process, and the steel plate is covered on the uppermost layer.
According to the invention, through arranging the hollow structure, the temperature of the heating cavity in the case 1 can be directly contacted with the two steel plates at the upper part and the lower part, so that the part of the steel plate exposed in the heating cavity can be uniformly heated, and then the heat is uniformly transferred to the prepreg through the copper foil, so that the prepreg is converted into a molten resin at a high temperature and has more fluidity, the prepreg can be better filled with a core plate, and the hot pressing efficiency is improved.
Secondly, the hollow structure can provide space for the pressing process of the press, and normal use of the press cannot be interfered.
Secondly, the middle hollow structure of the invention can not interfere the normal work of the plate stacking assembly and the pressing assembly.
According to the invention, the turnover assembly is arranged, so that the circuit board locked by the pressing assembly can be turned over for half a cycle, the molten resin can obtain flow assistance, the pressure of the molten resin on the inner core plate can be changed, the pressure of the resin above and below the inner core plate can be changed, the pressure of the resin on the inner core plate is balanced, the two sides of the inner core plate can be better filled with the resin, the core plate patterns can be filled in a flowing manner, and the pasting quality is improved.
Wherein, the folded plate subassembly can carry out spacing fixed to the steel sheet of bottommost layer and the steel sheet of topmost layer respectively with compressing tightly the subassembly to guarantee spacing to the multilayer circuit board in the upset in-process.
In a preferred embodiment of the plate stacking assembly, the plate stacking assembly includes two trays 7 slidably connected to the top of the supporting plate 3, the placing grooves are symmetrically formed on the top of the two trays 7, and the placing grooves are square grooves.
Comprising a transmission bar 14 controlling the relative movement of the two trays 7.
As shown in fig. 1, 3 and 4, during stacking, the steel plate is placed into the placing grooves formed in the two trays 7, the two trays 7 are controlled to be relatively close to each other through the transmission rod 14, so that the steel plate is limited and aligned, after the process, the copper foil, the prepreg and the inner core board need to be stacked in the stacking sequence, finally, the steel plate is covered on the upper surface of the copper foil on the uppermost layer, and the stacked multilayer circuit board is compressed and limited through the compressing assembly.
The area of steel sheet is greater than the inlayer core board, consequently can be covered by the fretwork area completely in order to control the surface of inlayer core board, needs select appropriate steel sheet, secondly, guarantees that the inlayer core board can be located the center of fretwork area and still leaves the clearance apart from the border department of fretwork area to guarantee that the steel sheet has sufficient area and the heat in the heating chamber to contact.
As shown in fig. 4, the transmission rod 14 extends through the outer walls of the two pallets 7 and is pivotally connected to the carrier plate 3.
The transmission rod 14 is configured as a lead screw composed of two opposite reciprocating lead screws, and the penetration portion of the tray 7 is in threaded connection with the outer wall of the transmission rod 14, so that when the transmission rod 14 rotates, the two trays 7 can be moved close to or away from each other.
Secondly, a sliding block 16 is arranged at the bottom of the tray 7, and a sliding groove 15 is formed in the bearing plate 3, so that the tray 7 and the bearing plate 3 form a limited sliding connection relationship through the sliding block 16. Meanwhile, the steel plate and the multilayer circuit board can be better supported.
A hollowed-out area of a larger space can be formed between the two trays 7.
On the basis of the embodiment of the laminated plate assembly, two embodiments of the pressing assembly are provided.
The first embodiment is as follows:
compress tightly the subassembly and include two spacing posts 24 of fixed connection at 7 tops of tray, the common sliding connection of outer wall of two spacing posts 24 has clamp plate 4, and hollow out construction sets up at the top of clamp plate 4, and fixed mounting has roof 5 at the top of loading board 3, and the below of roof 5 is installed and is controlled the air cushion subassembly that clamp plate 4 compressed tightly to the superiors' steel sheet downwards.
As shown in fig. 4, the top of the pressing plate 4 is provided with a through groove, the through groove forms a hollow structure of the pressing assembly, the air cushion assembly is arranged on two sides of the through groove, secondly, the top plate 5 and the bearing plate 3 are of an integrated structure, the pressing plate 4 can downwards press the steel plate in the placing groove due to the up-down movement, and the locking of the laminated state of the multilayer circuit board is realized.
On the basis of the first embodiment, the depth of the placing groove is lower than the thickness of the multilayer circuit board after pre-stacking, the bottom of the pressing plate 4 can press the top of the steel plate downwards, and due to the limiting of the limiting column 24, the pressing plate 4 can vertically move downwards, so that the pressure can be stably applied to the steel plate on the uppermost layer, and the steel plate can be prevented from shifting.
On the basis of the first embodiment, the air cushion assembly comprises two heat-resisting air cushions 6 fixedly installed between the top of the pressing plate 4 and the bottom of the top plate 5, and the two heat-resisting air cushions 6 can cooperate with the limit posts 24 to limit and control the downward displacement of the pressing plate 4 after being expanded.
The externally mounted of quick-witted case 1 has intelligent air pump 2, and the output fixedly connected with input tube 12 of intelligent air pump 2, input tube 12 are through two reposition of redundant personnel pipelines 13 and the inside intercommunication of heat-resisting air cushion 6, and the upset that compresses tightly subassembly and folded plate subassembly can not interfere input tube 12 and reposition of redundant personnel pipeline 13's line distribution and normal use.
After the multilayer circuit board is stacked, the insides of the two heat-resisting air cushions 6 are filled with gas through the input pipeline 12 and the shunt pipeline 13, so that the heat-resisting air cushions 6 expand, and due to the integrated structure of the top plate 5 and the bearing plate 3, the pressing plate 4 can move downwards under the limiting effect of the limiting columns 24, so that downward pressure is applied to the steel plate on the uppermost layer, and limiting locking of the stacked board is completed.
Example two:
the pressing assembly comprises a second rotating shaft 17 rotatably mounted at the top of the tray 7, a plurality of pressing arms 18 are mounted on the outer wall array of the second rotating shaft 17, the placing groove can be opened by the rotation of the pressing arms 18, and one end of each pressing arm 18 can be rotated to the placing groove to press the uppermost steel plate.
Comprises a transmission component with self-locking function and capable of adjusting the rotation of the pressure arm 18.
As shown in fig. 5, when the second rotating shaft 17 rotates, one end of the pressing arm 18 can be inserted into the placing groove, so that a downward pressure is applied to the steel plate in the placing groove, and the multilayer circuit board in a laminated state is locked.
The stability of locking can be guaranteed through the transmission assembly.
On the basis of embodiment two, the degree of depth of standing groove is higher than the thickness after multilayer circuit board is folded in advance, presses arm 18 to rotate and to contradict to the steel sheet top in the standing groove and compress tightly, consequently, the standing groove can hold into two equal steel sheets simultaneously, protects the multilayer circuit board between them, can prevent to press the steel sheet skew that causes when arm 18 rotates simultaneously.
On the basis of the second embodiment, the transmission assembly comprises a first bevel gear 19 fixedly connected to the outer wall of the second rotating shaft 17, the top of the tray 7 is rotatably connected with a third rotating shaft 20 and a second worm 23 through a bearing seat, the outer wall of the third rotating shaft 20 is fixedly connected with a second bevel gear 21 meshed with the first bevel gear 19, and the outer wall of the third rotating shaft 20 is fixedly connected with a second worm gear 22 meshed with the second worm 23.
As shown in fig. 6, for the installation and connection of the transmission assembly of the present invention, when the second worm 23 is rotated, the third rotating shaft 20 can be rotated by the second worm wheel 22, and the rotation of the third rotating shaft 20 can be transmitted to the first bevel gear 19 through the second bevel gear 21, so that the second rotating shaft 17 and the pressing arm 18 can be rotated, and when the locking of the circuit board in the stacked state is completed, the third rotating shaft 20 can be prevented from rotating by the self-locking property of the second worm wheel 22 and the second worm 23, thereby enhancing the operation stability of the pressing arm 18.
Further, the upset subassembly is including rotating the first pivot 8 of connection in quick-witted case 1 inside, the outer wall fixed connection of the one end of first pivot 8 and loading board 3, and the first worm wheel 9 of quick-witted case 1 outer wall and fixedly connected with is worn out to the other end of first pivot 8, and the outer wall of quick-witted case 1 rotates through the bearing frame and is connected with the first worm 10 with first worm wheel 9 meshing, and the outer wall of quick-witted case 1 is installed and is controlled first worm 10 pivoted servo motor 11.
When the servo motor 11 drives the first worm 10 to rotate, the first rotating shaft 8 can be rotated through the meshing relation between the first worm wheel 9 and the first worm 10, the first rotating shaft 8 is rotated for a half cycle, the pressing assembly and the laminated assembly on the top of the bearing plate 3 can be synchronously rotated, the molten resin originally located above the bearing plate can be transferred to the lower part, the inner core plate can be subjected to different pressures of the molten resin to the inner core plate, the molten resin located below the bearing plate can be transferred to the upper part, the resin can be better filled and flowed, the resin can be uniformly filled in the two sides of the inner core plate, the adhesion reliability is improved, and cavities are reduced.
Furthermore, the laminating assembly and the compressing assembly form a pressing station, a plurality of pressing stations can be arranged in the case 1, the plurality of pressing stations are synchronously controlled to rotate by the overturning assembly, the plurality of pressing stations are fixedly connected through the connecting piece, and the overturning assembly can realize synchronous overturning of the plurality of pressing stations by controlling one pressing station to overturn.
The invention can improve the output efficiency of hot pressing and simultaneously operate.
In conclusion, the prepreg can be converted into the molten state in the same time, the flowing property of the resin is improved, and meanwhile, the double surfaces of the inner core board can be better filled with the resin by overturning the multilayer circuit board, so that the laminating quality is improved.
The standard parts used in the present embodiment may be purchased directly from the market, and the non-standard structural components described in the specification and drawings may be obtained by processing without any doubt according to the common general knowledge in the art, and the connection manner of the respective parts is by the conventional means developed in the art, and the machines, parts and equipment are of the conventional type in the art, so that the detailed description thereof is omitted.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a pressfitting equipment is used in processing of mistake proofing formula multilayer circuit board, includes quick-witted case (1) that possesses the heating chamber, its characterized in that: comprises a bearing plate (3) which is rotatably connected with the inside of a case (1);
the laminated plate assembly is provided with a placing groove for limiting the movement of the steel plate at the lowest part in the multilayer circuit board, and the laminated plate assembly is slidably mounted at the top of the bearing plate (3);
the pressing assembly is positioned right above the plate stacking assembly and is used for applying downward pressure to the uppermost steel plate in the multilayer circuit board;
the middle parts of the laminated plate assembly, the pressing assembly and the bearing plate (3) are all hollow structures, the hollow area range is between the steel plate area and the inner core plate area, and the hollow structures do not interfere heat conduction with the steel plate directly;
and the overturning assembly can enable the compressed multilayer circuit board to be overturned for half a cycle in the hot pressing process, is used for balancing the pressure of the molten resin on the inner core board and improving the flowability of the resin.
2. The press-fit equipment for processing the dislocation-preventing type multilayer circuit board as claimed in claim 1, wherein: the plate stacking assembly comprises two trays (7) connected to the top of the bearing plate (3) in a sliding mode, the placing grooves are symmetrically formed in the tops of the two trays (7), and the placing grooves are square grooves;
comprises a transmission rod (14) for controlling the relative movement of the two trays (7).
3. The press-fit equipment for processing the dislocation-preventing type multilayer circuit board as claimed in claim 2, wherein: compress tightly the subassembly and include two spacing post (24), two of fixed connection at tray (7) top the common sliding connection of outer wall of spacing post (24) has clamp plate (4), hollow out construction sets up the top at clamp plate (4), fixed mounting has roof (5) at the top of loading board (3), the below of roof (5) is installed control clamp plate (4) and is carried out the air cushion subassembly that compresses tightly to the superiors steel sheet downwards.
4. The press-fit equipment for processing the dislocation-preventing type multilayer circuit board as claimed in claim 3, wherein: the depth of the placing groove is smaller than the thickness of the multi-layer circuit board after pre-stacking, and the bottom of the pressing plate (4) can downwards press the top of the steel plate.
5. The press-fit equipment for processing the dislocation-preventing type multilayer circuit board as claimed in claim 3, wherein: the air cushion assembly comprises two heat-resisting air cushions (6) fixedly arranged between the top of the pressure plate (4) and the bottom of the top plate (5), and the two heat-resisting air cushions (6) can be matched with the limit columns (24) to control the downward displacement of the pressure plate (4) after being expanded;
the externally mounted of quick-witted case (1) has intelligent air pump (2), the output fixedly connected with input tube (12) of intelligence air pump (2), input tube (12) are through two reposition of redundant personnel pipelines (13) and the inside intercommunication of heat-resisting air cushion (6), just the upset that compresses tightly subassembly and folded plate subassembly can not interfere the line distribution and the normal use of input tube (12) and reposition of redundant personnel pipeline (13).
6. The press-fit equipment for processing the dislocation-preventing type multilayer circuit board as claimed in claim 2, wherein: the pressing assembly comprises a second rotating shaft (17) rotatably mounted at the top of the tray (7), a plurality of pressing arms (18) are mounted on the outer wall array of the second rotating shaft (17), the placing grooves can be opened through rotation of the pressing arms (18), and one ends of the pressing arms (18) can rotate into the placing grooves to press the uppermost steel plate;
comprises a transmission component with a self-locking function and capable of adjusting the rotation of a pressure arm (18).
7. The press-fit equipment for processing the dislocation-preventing type multilayer circuit board as claimed in claim 6, wherein: the depth of the placing groove is higher than the thickness of the multilayer circuit board after pre-stacking, and the pressing arm (18) can rotate into the placing groove to press the top of the steel plate in a collision mode.
8. The press-fit equipment for processing the dislocation-preventing type multilayer circuit board as claimed in claim 6, wherein: the transmission assembly comprises a first bevel gear (19) fixedly connected to the outer wall of a second rotating shaft (17), the top of the tray (7) is rotatably connected with a third rotating shaft (20) and a second worm (23) through a bearing seat, the outer wall of the third rotating shaft (20) is fixedly connected with a second bevel gear (21) meshed with the first bevel gear (19), and the outer wall of the third rotating shaft (20) is fixedly connected with a second worm gear (22) meshed with the second worm (23).
9. The press-fit equipment for processing the dislocation-preventing type multilayer circuit board according to any one of claims 1 to 8, wherein: the turnover assembly comprises a first rotating shaft (8) which is rotatably connected inside the case (1), one end of the first rotating shaft (8) is fixedly connected with the outer wall of the bearing plate (3), the other end of the first rotating shaft (8) penetrates out of the outer wall of the case (1) and is fixedly connected with a first worm wheel (9), the outer wall of the case (1) is rotatably connected with a first worm (10) meshed with the first worm wheel (9) through a bearing seat, and a servo motor (11) for controlling the rotation of the first worm (10) is installed on the outer wall of the case (1).
10. The press-fit equipment for processing the dislocation-preventing type multilayer circuit board as claimed in claim 9, wherein: the stacking assembly and the pressing assembly form a pressing station, a plurality of pressing stations can be arranged in the case (1), the pressing stations are rotated and synchronously controlled by the overturning assembly, the pressing stations are fixedly connected through the connecting piece, and the overturning assembly can realize synchronous overturning of the pressing stations by controlling one pressing station to overturn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210866152.4A CN115334781A (en) | 2022-07-22 | 2022-07-22 | Press-fit equipment for processing anti-dislocation multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210866152.4A CN115334781A (en) | 2022-07-22 | 2022-07-22 | Press-fit equipment for processing anti-dislocation multilayer circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN115334781A true CN115334781A (en) | 2022-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210866152.4A Pending CN115334781A (en) | 2022-07-22 | 2022-07-22 | Press-fit equipment for processing anti-dislocation multilayer circuit board |
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| CN (1) | CN115334781A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116939978A (en) * | 2023-09-14 | 2023-10-24 | 南通华隆微电子股份有限公司 | Leveling device for PCB processing |
-
2022
- 2022-07-22 CN CN202210866152.4A patent/CN115334781A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116939978A (en) * | 2023-09-14 | 2023-10-24 | 南通华隆微电子股份有限公司 | Leveling device for PCB processing |
| CN116939978B (en) * | 2023-09-14 | 2023-11-28 | 南通华隆微电子股份有限公司 | Leveling device for PCB processing |
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