CN105228370A - A kind of two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large - Google Patents
A kind of two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large Download PDFInfo
- Publication number
- CN105228370A CN105228370A CN201510702188.9A CN201510702188A CN105228370A CN 105228370 A CN105228370 A CN 105228370A CN 201510702188 A CN201510702188 A CN 201510702188A CN 105228370 A CN105228370 A CN 105228370A
- Authority
- CN
- China
- Prior art keywords
- time
- rigid
- heating
- pressing
- sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The present invention relates to a kind of two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large, it comprises the steps: S1: lamination, S2:X-RAY practices shooting, S3: milling edges of boards, S4: outer boring, S5: deburring, S6: de-smear, S7: heavy copper, S8: whole plate electrolytic copper, S9: outer-layer circuit pre-treatment, S10: outer laminated film, S11: outer-layer circuit exposes, S12: outer-layer circuit etching-DES, S13: outer AOI detects, S14: welding resistance pre-treatment, S15: welding resistance printing, S16: pre-baked, S17: welding resistance exposes, S18: welding resistance is developed, S19: first time baking, S20: take off lid, S21: change gold, S22: silk-screen, S23: second time baking, S24: milling plate, S25: finished product cleans, S26: electric performance test, S27: radium-shine profile, S28: pressing, S29: third time baking, S30: product inspection-FQC, S31: packaging, S32: warehouse-in.The present invention has advantage simple to operate, to be easy to implementation and practicality and high efficiency.
Description
Technical field
The present invention relates to circuit board manufacture field, particularly a kind of two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large.
Background technology
Along with electronic product is towards frivolous, short and small, multifunction development, Rigid Flex, because the durability of its excellence is with flexible, is more and more applied on industry, Medical Devices, mobile phone, LCD TV and other consumer electronics product.Along with the identification of the mobile phone lines of the hand is prevailing, because mobile phone volume is little, normal rigid-flex combined board cannot be installed.Need lines of the hand identification components and parts one side large, another side needs little.The one side that normal production is large cannot ensure evenness, is difficult to be separated with hardboard overlap simultaneously.
Summary of the invention
The present invention, in order to tackle the problems referred to above, by designing a kind of two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large, produces the rigid-flex combined board that two sides rigid plate area is different, serves the effect increasing rigid-flex combined board Practical Performance.
For solving above-mentioned technical problem, of the present inventionly provide a kind of two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large, it comprises the steps: S1: lamination, S2:X-RAY practices shooting, S3: milling edges of boards, S4: outer boring, S5: deburring, S6: de-smear, S7: heavy copper, S8: whole plate electrolytic copper, S9: outer-layer circuit pre-treatment, S10: outer laminated film, S11: outer-layer circuit exposes, S12: outer-layer circuit etching-DES, S13: outer AOI detects, S14: welding resistance pre-treatment, S15: welding resistance printing, S16: pre-baked, S17: welding resistance exposes, S18: welding resistance is developed, S19: first time baking, S20: take off lid, S21: change gold, S22: silk-screen, S23: second time baking, S24: milling plate, S25: finished product cleans, S26: electric performance test, S27: radium-shine profile, S28: pressing, S29: third time baking, S30: product inspection-FQC, S31: packaging, S32: warehouse-in.
Further: described step S1: lamination carries out hot-forming from top to bottom by KY3001 release film, soft board (thickness 119um), prepreg (thickness 80um), fine copper plate (thickness 18um), release film, filling film and release film successively by upper and lower two block plates.
Further again: the Making programme of described soft board (thickness 119um) is as follows: step 1: internal layer sawing sheet, step 2: boring, step 3: circuit pre-treatment, step 4: interior laminated film, step 5: inner side circuit exposes, step 6: internal layer circuit etching-DES, step 7: internal layer AOI detects, step 8: alligatoring, step 9: lamination coverlay, step 10: pressing, step 11: baking.
Further again: the Making programme of described prepreg (thickness 80um) is as follows: step 1: sawing sheet, step 2: processing (High temperature-resistanadhesive adhesive tape of the low viscose glue of band is attached on PP sheet), step 3: boring (boring lamination location hole and die-cut location hole), step 4: the adhesive tape pasted on the PP of soft board region (is stayed on PP sheet by hemisection by stamp, the adhesive tape in other place all tears), step 5: lamination.
Further again: described hot-forming method step is a successively: first to adopt the power of 1KG to carry out first time to it and press, it is 3min that first time presses the time, in the process that first time presses, first time heating is carried out to it, the temperature that first time heats controls at 130 DEG C, the duration of heat is 3min, b: then adopt the power of 2KG to carry out second time to it and press, the temperature of second time heating controls at 130 DEG C, the duration of heat is 15min, c: then adopt the power of 2KG to carry out third time to it and press, it is 22min that third time presses the time, in the process that third time presses, third time heating is carried out to it, the temperature that third time heats controls at 180 DEG C, the duration of heat is 5min, d: then adopt the power of 3KG to carry out the 4th time to it and press, the temperature of the 4th heating controls at 180 DEG C, the duration of heat is 60min, e: then adopt the power of 3KG to carry out the 5th time to it and press, pressing the time for 5th time is 70min, in the process of pressing for the 5th time, the 5th heating is carried out to it, the temperature of the 5th heating controls at 180 DEG C, the duration of heat is 72min, f: then adopt the power of 3KG to carry out the 6th heating to it, pressing the time for 6th time is 60min, the temperature of the 6th heating controls 180 DEG C, the duration of heat is 55min, g: then adopt the power of 3KG to carry out the 7th time to it and press, pressing the time for 7th time is 50min, in the process of pressing for the 7th time, the 7th heating is carried out to it, the temperature of the 7th heating controls at 20 DEG C, h: finally adopt the power of 1KG to carry out the 8th time to it and press, pressing the time for 8th time is 5min.
Further again: described step S1: lamination needs to adopt a kind of hot press in operation, the structure of described hot press comprises base, workbench, the valency of liter platform, pressing plate and heater, described workbench is movably connected on base by translation mechanism, the described valency that rises platform is movably connected on base by elevating mechanism, described pressing plate is made up of top board and lower platen, described top board is arranged on the bottom rising valency platform, described lower platen is arranged on workbench, described heater is arranged in top board, four angles of described lower platen are respectively provided with a reference column, the bottom of described top board offers location hole relative to the position of reference column.
Further again: described heater is heating tube, and described heating tube has four, four described heating tubes are successively set in top board.
Further again: described translation mechanism comprises two and is horizontally set on the first track on base and translating trolleys, and described workbench is movably connected on two the first tracks by translating trolleys.
Further again: described elevating mechanism comprises two the second tracks and lift cart that vertically arrange, and two described the second tracks are vertically arranged on base, and the described valency that rises platform is movably connected on two the second tracks by two lift carts.
After adopting said structure, the present invention, by a kind of two sides of design rigid plate area rigid-flex combined board manufacture craft that sample is not large, produces the rigid-flex combined board that two sides rigid plate area is different, serves the effect increasing rigid-flex combined board Practical Performance.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is step S1: structural representation during lamination.
Fig. 2 is the structural representation of hot press.
Embodiment
The invention provides a kind of two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large, it comprises the steps: S1: lamination, S2:X-RAY practices shooting, S3: milling edges of boards, S4: outer boring, S5: deburring, S6: de-smear, S7: heavy copper, S8: whole plate electrolytic copper, S9: outer-layer circuit pre-treatment, S10: outer laminated film, S11: outer-layer circuit exposes, S12: outer-layer circuit etching-DES, S13: outer AOI detects, S14: welding resistance pre-treatment, S15: welding resistance printing, S16: pre-baked, S17: welding resistance exposes, S18: welding resistance is developed, S19: first time baking, S20: take off lid, S21: change gold, S22: silk-screen, S23: second time baking, S24: milling plate, S25: finished product cleans, S26: electric performance test, S27: radium-shine profile, S28: pressing, S29: third time baking, S30: product inspection-FQC, S31: packaging, S32: warehouse-in.
As shown in Figure 1, described step S1: lamination carries out hot-forming from top to bottom by KY3001 release film 11, soft board 12 (thickness 119um), prepreg 13 (thickness 80um), fine copper plate 14 (thickness 18um), release film 15, filling film 16 and release film 15 successively by upper and lower two block plates.
The Making programme of above-mentioned soft board (thickness 119um) is as follows: step 1: internal layer sawing sheet, step 2: boring, step 3: circuit pre-treatment, step 4: interior laminated film, step 5: inner side circuit exposes, step 6: internal layer circuit etching-DES, step 7: internal layer AOI detects, step 8: alligatoring, step 9: lamination coverlay, step 10: pressing, step 11: baking.
The Making programme of above-mentioned prepreg (thickness 80um) is as follows: step 1: sawing sheet, step 2: processing (High temperature-resistanadhesive adhesive tape of the low viscose glue of band is attached on PP sheet), step 3: boring (boring lamination location hole and die-cut location hole), step 4: the adhesive tape pasted on the PP of soft board region (is stayed on PP sheet by hemisection by stamp, the adhesive tape in other place all tears), step 5: lamination.
Above-mentioned hot-forming method step is a successively: first adopt the power of 1KG to carry out first time to it and press, it is 3min that first time presses the time, in the process that first time presses, first time heating is carried out to it, the temperature that first time heats controls at 130 DEG C, the duration of heat is 3min, b: then adopt the power of 2KG to carry out second time to it and press, the temperature of second time heating controls at 130 DEG C, the duration of heat is 15min, c: then adopt the power of 2KG to carry out third time to it and press, it is 22min that third time presses the time, in the process that third time presses, third time heating is carried out to it, the temperature that third time heats controls at 180 DEG C, the duration of heat is 5min, d: then adopt the power of 3KG to carry out the 4th time to it and press, the temperature of the 4th heating controls at 180 DEG C, the duration of heat is 60min, e: then adopt the power of 3KG to carry out the 5th time to it and press, pressing the time for 5th time is 70min, in the process of pressing for the 5th time, the 5th heating is carried out to it, the temperature of the 5th heating controls at 180 DEG C, the duration of heat is 72min, f: then adopt the power of 3KG to carry out the 6th heating to it, pressing the time for 6th time is 60min, the temperature of the 6th heating controls 180 DEG C, the duration of heat is 55min, g: then adopt the power of 3KG to carry out the 7th time to it and press, pressing the time for 7th time is 50min, in the process of pressing for the 7th time, the 7th heating is carried out to it, the temperature of the 7th heating controls at 20 DEG C, h: finally adopt the power of 1KG to carry out the 8th time to it and press, pressing the time for 8th time is 5min.
Said method, by a kind of two sides of design rigid plate area rigid-flex combined board manufacture craft that sample is not large, is produced the rigid-flex combined board that two sides rigid plate area is different, is served the effect increasing rigid-flex combined board Practical Performance.
Above-mentioned step S1: lamination needs to adopt a kind of hot press in operation, the structure of described hot press as shown in Figure 2, it comprises base 1, workbench 8, the valency of liter platform 2, pressing plate and heater 6, described workbench 8 is movably connected on base 1 by translation mechanism, the described valency that rises platform 2 is movably connected on base 1 by elevating mechanism, described pressing plate is made up of top board 5 and lower platen 9, described top board 5 is arranged on the bottom rising valency platform 2, described lower platen 9 is arranged on workbench 8, described heater 6 is arranged in top board 5, four angles of described lower platen 9 are respectively provided with a reference column 10, the bottom of described top board 5 offers location hole relative to the position of reference column 10, described heater 6 is heating tube, described heating tube has four, four described heating tubes are successively set in top board 5.First needing the rigid-flexible fish plate of hot pressing to be placed on lower platen 9 during work, the reference column 10 on four angles is utilized to be fixed rigid-flexible fish plate, then starting translation mechanism is transported to top board 5 and rigid-flexible fish plate immediately below top board 5, then be energized to heating tube, heating tube is utilized to heat top board 5, after the temperature of top board 5 meets the demands, start elevating mechanism to make it pass through to rise valency platform 2 to move downward with top board 5, the cooperation of top board 5 and lower platen 9 is utilized to complete hot pressing to rigid-flexible fish plate, finally start translation mechanism the rigid-flexible fish plate after hot pressing is transferred out.The design, by heating top board, by heating top board, utilizing the cooperation of top board and lower platen to complete hot pressing to rigid-flexible fish plate, improve its operating efficiency and the accuracy of interlayer alignment.
Translation mechanism as shown in Figure 2 comprises two and is horizontally set on the first track 7 on base 1 and translating trolleys 8, and described workbench 8 is movably connected on two the first tracks 7 by translating trolleys 8.During work, make it do horizontal movement with lower platen 9 along the first track by workbench 8, thus lower platen 9 is transported to immediately below top board 5 by starting translating trolleys 8, it has the advantage that structure is simple, be easy to manufacture and practicality and high efficiency.
Elevating mechanism as shown in Figure 2 comprises two the second tracks 3 and lift cart 4 that vertically arrange, and two described the second tracks 3 are vertically arranged on base 1, and the described valency that rises platform 2 is movably connected on two the second tracks 3 by two lift carts 4.Start lift cart 4 to make it pass through to rise valency platform 2 to do vertical motion with top board 5 along the second track 3 when needs hot pressing, thus complete the hot pressing to rigid-flexible fish plate by the cooperation of top board 5 and lower platen 9.
Claims (9)
1. the two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large, it is characterized in that: comprise the steps: S1: lamination, S2:X-RAY practices shooting, S3: milling edges of boards, S4: outer boring, S5: deburring, S6: de-smear, S7: heavy copper, S8: whole plate electrolytic copper, S9: outer-layer circuit pre-treatment, S10: outer laminated film, S11: outer-layer circuit exposes, S12: outer-layer circuit etching-DES, S13: outer AOI detects, S14: welding resistance pre-treatment, S15: welding resistance printing, S16: pre-baked, S17: welding resistance exposes, S18: welding resistance is developed, S19: first time baking, S20: take off lid, S21: change gold, S22: silk-screen, S23: second time baking, S24: milling plate, S25: finished product cleans, S26: electric performance test, S27: radium-shine profile, S28: pressing, S29: third time baking, S30: product inspection-FQC, S31: packaging, S32: warehouse-in.
2. a kind of two sides according to claim 1 rigid plate area rigid-flex combined board manufacture craft that sample is not large, is characterized in that: described step S1: lamination carries out hot-forming from top to bottom by KY3001 release film (11), soft board (12) (thickness 119um), prepreg (13) (thickness 80um), fine copper plate (14) (thickness 18um), release film (15), filling film (16) and release film (15) successively by upper and lower two block plates.
3. a kind of two sides according to claim 2 rigid plate area rigid-flex combined board manufacture craft that sample is not large, it is characterized in that: the Making programme of described soft board (thickness 119um) is as follows: step 1: internal layer sawing sheet, step 2: boring, step 3: circuit pre-treatment, step 4: interior laminated film, step 5: inner side circuit exposes, step 6: internal layer circuit etching-DES, step 7: internal layer AOI detects, step 8: alligatoring, step 9: lamination coverlay, step 10: pressing, step 11: baking.
4. a kind of two sides according to claim 2 rigid plate area rigid-flex combined board manufacture craft that sample is not large, it is characterized in that: the Making programme of described prepreg (thickness 80um) is as follows: step 1: sawing sheet, step 2: processing (High temperature-resistanadhesive adhesive tape of the low viscose glue of band is attached on PP sheet), step 3: boring (boring lamination location hole and die-cut location hole), step 4: the adhesive tape pasted on the PP of soft board region (is stayed on PP sheet by hemisection by stamp, the adhesive tape in other place all tears), step 5: lamination.
5. a kind of two sides according to claim 2 rigid plate area rigid-flex combined board manufacture craft that sample is not large, it is characterized in that: described hot-forming method step is a successively: first adopt the power of 1KG to carry out first time to it and press, it is 3min that first time presses the time, in the process that first time presses, first time heating is carried out to it, the temperature that first time heats controls at 130 DEG C, the duration of heat is 3min, b: then adopt the power of 2KG to carry out second time to it and press, the temperature of second time heating controls at 130 DEG C, the duration of heat is 15min, c: then adopt the power of 2KG to carry out third time to it and press, it is 22min that third time presses the time, in the process that third time presses, third time heating is carried out to it, the temperature that third time heats controls at 180 DEG C, the duration of heat is 5min, d: then adopt the power of 3KG to carry out the 4th time to it and press, the temperature of the 4th heating controls at 180 DEG C, the duration of heat is 60min, e: then adopt the power of 3KG to carry out the 5th time to it and press, pressing the time for 5th time is 70min, in the process of pressing for the 5th time, the 5th heating is carried out to it, the temperature of the 5th heating controls at 180 DEG C, the duration of heat is 72min, f: then adopt the power of 3KG to carry out the 6th heating to it, pressing the time for 6th time is 60min, the temperature of the 6th heating controls 180 DEG C, the duration of heat is 55min, g: then adopt the power of 3KG to carry out the 7th time to it and press, pressing the time for 7th time is 50min, in the process of pressing for the 7th time, the 7th heating is carried out to it, the temperature of the 7th heating controls at 20 DEG C, h: finally adopt the power of 1KG to carry out the 8th time to it and press, pressing the time for 8th time is 5min.
6. a kind of two sides according to claim 1 rigid plate area rigid-flex combined board manufacture craft that sample is not large, it is characterized in that: described step S1: lamination needs to adopt a kind of hot press in operation, the structure of described hot press comprises base (1), workbench (8), rise valency platform (2), pressing plate and heater (6), described workbench (8) is movably connected on base (1) by translation mechanism, the described valency that rises platform (2) is movably connected on base (1) by elevating mechanism, described pressing plate is made up of top board (5) and lower platen (9), described top board (5) is arranged on the bottom rising valency platform (2), described lower platen (9) is arranged on workbench (8), described heater (6) is arranged in top board (5), four angles of described lower platen (9) are respectively provided with a reference column (10), the bottom of described top board (5) offers location hole relative to the position of reference column (10).
7. a kind of two sides according to claim 6 rigid plate area rigid-flex combined board manufacture craft that sample is not large, it is characterized in that: described heater (6) is heating tube, described heating tube has four, and four described heating tubes are successively set in top board (5).
8. a kind of two sides according to claim 6 rigid plate area rigid-flex combined board manufacture craft that sample is not large, it is characterized in that: described translation mechanism comprises two and is horizontally set on the first track (7) on base (1) and translating trolleys (8), and described workbench (8) is movably connected on two the first tracks (7) by translating trolleys (8).
9. a kind of two sides according to claim 6 rigid plate area rigid-flex combined board manufacture craft that sample is not large, it is characterized in that: described elevating mechanism comprises two the second tracks (3) and lift cart (4) that vertically arrange, two described the second tracks (3) are vertically arranged on base (1), and the described valency that rises platform (2) is movably connected on two the second tracks (3) by two lift carts (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510702188.9A CN105228370B (en) | 2015-10-26 | 2015-10-26 | A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510702188.9A CN105228370B (en) | 2015-10-26 | 2015-10-26 | A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105228370A true CN105228370A (en) | 2016-01-06 |
| CN105228370B CN105228370B (en) | 2018-08-10 |
Family
ID=54996960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510702188.9A Active CN105228370B (en) | 2015-10-26 | 2015-10-26 | A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105228370B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455352A (en) * | 2016-08-30 | 2017-02-22 | 淮安华泰电子科技有限公司 | Novel laminating machine |
| CN107683031A (en) * | 2017-11-07 | 2018-02-09 | 珠海杰赛科技有限公司 | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film |
| CN107708331A (en) * | 2017-10-16 | 2018-02-16 | 伟创力电子技术(苏州)有限公司 | A kind of plate joggling apparatus for being used to splice circuit board |
| CN112654178A (en) * | 2020-11-09 | 2021-04-13 | 广东科翔电子科技股份有限公司 | Process method of embedded pad type rigid-flex printed circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590756A (en) * | 1991-09-28 | 1993-04-09 | Ibiden Co Ltd | Production of rigid/flexible board |
| CN103281859A (en) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | Rigid-flex combined circuit board and manufacturing method therefore |
| CN103747633A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB locating stroke-limiting hot-pressing table clamping jig |
| CN104470214A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board |
-
2015
- 2015-10-26 CN CN201510702188.9A patent/CN105228370B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590756A (en) * | 1991-09-28 | 1993-04-09 | Ibiden Co Ltd | Production of rigid/flexible board |
| CN103281859A (en) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | Rigid-flex combined circuit board and manufacturing method therefore |
| CN103747633A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB locating stroke-limiting hot-pressing table clamping jig |
| CN104470214A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455352A (en) * | 2016-08-30 | 2017-02-22 | 淮安华泰电子科技有限公司 | Novel laminating machine |
| CN107708331A (en) * | 2017-10-16 | 2018-02-16 | 伟创力电子技术(苏州)有限公司 | A kind of plate joggling apparatus for being used to splice circuit board |
| CN107683031A (en) * | 2017-11-07 | 2018-02-09 | 珠海杰赛科技有限公司 | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film |
| CN112654178A (en) * | 2020-11-09 | 2021-04-13 | 广东科翔电子科技股份有限公司 | Process method of embedded pad type rigid-flex printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105228370B (en) | 2018-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105228370A (en) | A kind of two sides rigid plate area rigid-flex combined board manufacture craft that sample is not large | |
| CN105246271B (en) | A kind of manufacturing method for the rigid-flex combined board for having an isolated island formula hardboard | |
| CN105246272B (en) | A kind of outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol | |
| CN1970291A (en) | Production method and device of sheet lamination | |
| CN104125727A (en) | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards | |
| CN107041082A (en) | The PCB process for pressing of dissymmetrical structure | |
| CN205160944U (en) | Hot press of joint plate processing usefulness has just been scratched | |
| CN108377618B (en) | Laminating method for preventing false floor layer from deflecting | |
| CN103813652A (en) | Processing method of blind hole | |
| CN105246274B (en) | A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method | |
| CN109451668B (en) | Process applied to power supply printed circuit board | |
| CN203645911U (en) | Inner-layer core plate of improving hole arranging area flat layering and multi-layer printed circuit board (PCB) | |
| CN204180377U (en) | The pressing structure of cavity circuit plate | |
| CN202374556U (en) | Multi-layer printed circuit board | |
| CN104159397A (en) | Pressing structure and method of cavity PCB | |
| CN105246273A (en) | Manufacture technology of flex-rigid joint board having super-strong resilience | |
| CN112235937A (en) | Press-fit connection structure between circuit boards and press-fit connection method thereof | |
| CN204180376U (en) | The pressing structure of cavity PCB plate | |
| CN102307439B (en) | Foolproof method for layer misplacement of multilayer PCB | |
| CN107809856B (en) | Multilayer PCB board lamination device | |
| CN207802545U (en) | A kind of multi-layer PCB board pressing device | |
| CN102510670A (en) | Method and tool for manufacturing flexible PCB (printed circuit board) | |
| CN102333416B (en) | Unidirectional reinforcement material laminating system and method | |
| CN205160948U (en) | Cooling device of joint plate processing usefulness has just been scratched | |
| CN206452594U (en) | A kind of use liquid photosensitive PI flexible electric circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221230 Address after: 335000 No.2 Zhilian Avenue, high tech Industrial Development Zone, Yingtan City, Jiangxi Province Patentee after: Jiangxi Hongxin Flexible Electronic Technology Co.,Ltd. Address before: 212000 no.308-1, Nanxu Avenue, Runzhou District, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU HONGXIN HUAYIN CIRCUIT TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |