CN107809856B - Multilayer PCB board lamination device - Google Patents

Multilayer PCB board lamination device Download PDF

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Publication number
CN107809856B
CN107809856B CN201711173772.5A CN201711173772A CN107809856B CN 107809856 B CN107809856 B CN 107809856B CN 201711173772 A CN201711173772 A CN 201711173772A CN 107809856 B CN107809856 B CN 107809856B
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China
Prior art keywords
die holder
plate
upper die
lower die
pcb
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Active
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CN201711173772.5A
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Chinese (zh)
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CN107809856A (en
Inventor
蒋华芳
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Suzhou Yilihua Electronic Co ltd
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Suzhou Yilihua Electronic Co ltd
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Priority to CN201711173772.5A priority Critical patent/CN107809856B/en
Publication of CN107809856A publication Critical patent/CN107809856A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Press Drives And Press Lines (AREA)

Abstract

The invention discloses a multilayer PCB plate pressing device which comprises a bottom plate, a track plate, a support frame, a lower die holder, a standard plate, a servo cylinder, a push plate, a guide rod, a pushing cylinder, an upper die holder and an electric heating pipe, wherein raw materials for forming the multilayer PCB plate are sequentially stacked at the upper end of the push plate, then the pushing cylinder pushes the upper die holder to move in place along the track plate, the axis of the upper die holder coincides with the axis of the lower die holder, the electric heating pipe works to heat the upper die holder, then the servo cylinder pushes the push plate to move upwards, the multilayer PCB plate is pressed under the action of the push plate and the upper die holder, and glue among the raw materials for forming the multilayer PCB plate is melted by heat generated by the work of the electric heating pipe, so that the raw materials are automatically pressed together. The step groove is used for limiting the multi-layer PCB, and the number of the standard boards is increased to match with the PCB with different thicknesses, so that the PCB is prevented from shifting. The device simple structure can carry out the automatic pressfitting of multilayer PCB board, and the die holder upper end does not sheltered from moreover, is convenient for go up unloading, automatic rubber coating etc. automatically.

Description

Multilayer PCB board lamination device
Technical Field
The present disclosure relates to mechanical devices, and particularly to a multilayer PCB board pressing device.
Background
The PCB multilayer board refers to a multilayer circuit board used in an electrical product, generally, single-sided boards or double-sided boards are alternately connected together through a positioning system and insulating bonding materials, conductive patterns are interconnected according to design requirements, such as four-layer and six-layer printed circuit boards, in the manufacturing process of the PCB multilayer board, bonding glue solution is required to be coated on the surface of a raw material board, the raw material boards are sequentially stacked and placed on a press machine, and then the press machine is used for applying pressure to the sequentially stacked multilayer raw material boards, so that the raw material boards are pressed together. In view of the above drawbacks, it is necessary to design a multi-layer PCB board bonding apparatus.
Disclosure of Invention
The invention aims to provide a multi-layer PCB board pressing device which can automatically press the multi-layer PCB boards, and the upper end of a lower die holder is free from shielding, so that automatic feeding and discharging, automatic gluing and the like are facilitated.
In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a multilayer PCB board closing device, includes bottom plate, track board, support frame, die holder, standard board, servo cylinder, push pedal, guide bar, pushing cylinder, upper die base, electric heating pipe, track board quantity be 2, the symmetrical arrangement is in the bottom plate upper end, the support frame be located the bottom plate upper end and be located two symmetrical arrangement's track inboard, support frame and bottom plate link to each other through the screw thread, the die holder be located the support frame upper end, the die holder link to each other through the screw thread with the support frame, the standard board be located the die holder upper end, standard board and die plate link to each other through the bolt, the servo cylinder be located the bottom plate upper end, servo cylinder and the bottom plate link to each other through the bolt, the push pedal be located servo cylinder upper end and be located the die holder inboard, push pedal and servo motor screw thread link to each other, the guide bar run through the die holder and be located the push pedal lower extreme, the guide bar link to each other and can slide along the die holder screw thread, the pushing cylinder be located the bottom plate upper end, the pushing cylinder link to each other through the screw thread with the bottom plate, the upper die holder passes through the upper die holder upper die base and the upper die holder and is located one side of the electric heating pipe, and reaches through the upper die holder.
The invention is further improved as follows:
furthermore, the number of the electric heating pipes is not less than 3, and the electric heating pipes are uniformly distributed on the upper die holder.
Further, the track board still be equipped with the slide rail, the slide rail be located track board top, slide rail and track board pass through the bolt and link to each other.
Furthermore, the lower die holder is also provided with a step groove, the step groove is positioned at the center of the lower die holder, and the step groove penetrates through the lower die holder.
Further, the upper die holder also be equipped with the slider, the slider be located the upper die holder lower extreme and be located the slide rail upper end, slider and upper die holder pass through the bolt and link to each other and can follow the slide rail and slide.
Furthermore, the upper die holder is also provided with a positioning groove, the positioning groove is positioned at the lower end of the upper die holder, and the positioning groove does not penetrate through the upper die holder.
Compared with the prior art, the multilayer PCB board laminating device is characterized in that when the multilayer PCB board laminating device works, raw materials forming the multilayer PCB board are sequentially stacked at the upper end of the push plate, then, the pushing cylinder pushes the upper die holder to move along the track plate to be in place, at the moment, the axis of the upper die holder coincides with the axis of the lower die holder, the electric heating tube works to heat the upper die holder, then, the servo cylinder pushes the push plate to move upwards, the multilayer PCB board is pressed under the action of the push plate and the upper die holder, and glue between the raw materials forming the multilayer PCB board is melted by heat generated by the electric heating tube work, so that the multilayer PCB board laminating device is automatically laminated together. The step groove is used for limiting the multi-layer PCB, and the number of the standard boards is increased to match with the PCB with different thicknesses, so that the PCB is prevented from shifting. The device simple structure can carry out the automatic pressfitting of multilayer PCB board, and the die holder upper end does not sheltered from moreover, is convenient for go up unloading, automatic rubber coating etc. automatically.
Drawings
FIG. 1 shows a front view of the present invention
FIG. 2 shows a bottom view of the upper die holder of the invention
In the figure: the device comprises a bottom plate 1, a track plate 2, a support frame 3, a lower die holder 4, a standard plate 5, a servo cylinder 6, a push plate 7, a guide rod 8, a pushing cylinder 9, an upper die holder 10, an electric heating pipe 11, a sliding rail 201, a step groove 401, a sliding block 1001 and a positioning groove 1002.
Detailed Description
As shown in fig. 1 and 2, the multi-layer PCB board pressing device comprises a bottom plate 1, a track board 2, a supporting frame 3, a lower die holder 4, a standard board 5, a servo cylinder 6, a push plate 7, a guide rod 8, a pushing cylinder 9, an upper die holder 10 and an electric heating pipe 11, wherein the number of the track boards 2 is 2, the track boards are symmetrically arranged at the upper end of the bottom plate 1, the supporting frame 3 is positioned at the upper end of the bottom plate 1 and at the inner sides of the two symmetrically arranged track boards 2, the supporting frame 3 is connected with the bottom plate 1 through threads, the lower die holder 4 is positioned at the upper end of the supporting frame 3, the lower die holder 4 is connected with the supporting frame 3 through threads, the standard board 5 is positioned at the upper end of the lower die holder 4, the standard board 5 is connected with the lower die holder 4 through bolts, the servo cylinder 6 is positioned at the upper end of the bottom plate 1, the servo cylinder 6 is connected with the bottom plate 1 through bolts, the push plate 7 is positioned at the upper end of the servo cylinder 6 and positioned at the inner side of the lower die holder 4, the push plate 7 is connected with the servo motor 6 by screw threads, the guide rod 8 penetrates through the lower die holder 4 and is positioned at the lower end of the push plate 7, the guide rod 8 is connected with the push plate 7 by screw threads and can slide along the lower die holder 4, the push cylinder 9 is positioned at the upper end of the bottom plate 1, the push cylinder 9 is connected with the bottom plate 1 by screw threads, the upper die holder 10 is positioned at the upper end of the track plate 2 and positioned at one side of the push cylinder 9, the upper die holder 10 is connected with the push cylinder 9 by screw threads and can slide along the track plate 2, one end of the electric heating tube 11 extends into the upper die holder 10, the electric heating tube 11 is connected with the upper die holder 10 by bolts, the number of the electric heating tube 11 is not less than 3 and is uniformly distributed on the upper die holder 10, the track plate 2 is also provided with a slide rail 201, the slide rail 201 is positioned at the top of the track plate 2, the slide rail 201 and the track board 2 pass through the bolt and link to each other, die holder 4 still be equipped with step groove 401, step groove 401 be located die holder 4 center department, step groove 401 run through die holder 4, die holder 10 still be equipped with slider 1001, slider 1001 be located die holder 10 lower extreme and be located slide rail 201 upper end, slider 1001 pass through the bolt with die holder 10 and link to each other and can follow slide rail 201, die holder 10 still be equipped with constant head tank 1002, constant head tank 1002 be located die holder 10 lower extreme, constant head tank 1002 not run through die holder 10, this multilayer PCB board closing device, during operation stacks the raw materials that constitute the multilayer PCB board in proper order in push pedal 7 upper end, then, push away material cylinder 9 and promote die holder 10 and move in place along track board 2, at this moment, the axis coincidence of die holder 10 and die holder 4, then, servo cylinder 6 promotes push pedal 7 and moves up, the multilayer PCB board is in the effect of die holder 10 and is pressed down to produce the heat of multilayer PCB board under the effect and is pressed together to the automatic heat that constitutes the heat between the multilayer PCB board that will melt the heat, thereby the raw materials of the multilayer PCB board. The step groove 401 is used for limiting the multi-layer PCB, and the number of the standard boards 5 is increased to match with the PCB with different thicknesses, so that the PCB is prevented from shifting. The device simple structure can carry out the automatic pressfitting of multilayer PCB board, and die holder 4 upper end does not have to shelter from moreover, is convenient for go up unloading, automatic rubber coating etc. automatically.
The present invention is not limited to the above-described specific embodiments, and various modifications may be made by those skilled in the art without inventive effort from the above-described concepts, and are within the scope of the present invention.

Claims (4)

1. The multilayer PCB plate pressing device is characterized by comprising a bottom plate, a track plate, a support frame, a lower die holder, a standard plate, a servo cylinder, a push plate, a guide rod, a pushing cylinder, an upper die holder and an electric heating pipe, wherein the number of the track plates is 2, the track plates are symmetrically arranged at the upper end of the bottom plate, the support frame is positioned at the upper end of the bottom plate and positioned at the inner sides of the two track plates which are symmetrically arranged, the support frame is connected with the bottom plate through threads, the lower die holder is positioned at the upper end of the support frame, the lower die holder is connected with the support frame through threads, the standard plate is positioned at the upper end of the lower die holder, the standard plate is connected with the lower die holder through bolts, the servo cylinder is positioned at the upper end of the bottom plate through bolts, the push plate is positioned at the inner side of the lower die holder, the guide rod penetrates through the lower die holder and is positioned at the lower end of the push plate, the guide rod is connected with the push plate through threads and slides along the lower die holder, the pushing cylinder is positioned at the upper end of the upper die holder through bolts, and the upper die holder is connected with one side of the electric heating pipe through bolts, and is connected with one side of the upper die holder through bolts;
the lower die holder is also provided with a step groove, the step groove is positioned at the center of the lower die holder, and the step groove penetrates through the lower die holder;
the upper die holder is also provided with a positioning groove, the positioning groove is positioned at the lower end of the upper die holder, and the positioning groove does not penetrate through the upper die holder;
when the automatic pressing machine works, raw materials forming the multilayer PCB are sequentially stacked at the upper end of the push plate, then the upper die holder is pushed by the pushing cylinder to move along the track plate to a proper position, at the moment, the axis of the upper die holder coincides with the axis of the lower die holder, the upper die holder is heated by the electric heating pipe, then the push plate is pushed by the servo cylinder to move upwards, the multilayer PCB is pressed by the push plate and the upper die holder, and glue among the raw materials forming the multilayer PCB is melted by heat generated by the electric heating pipe working, so that the automatic pressing machine is automatically pressed together; the step groove is used for limiting the multi-layer PCB, and the number of the standard boards is increased to match with the PCB with different thicknesses, so that the PCB is prevented from shifting.
2. The multi-layer PCB board pressing apparatus of claim 1, wherein the number of the electric heating pipes is not less than 3, and the electric heating pipes are uniformly distributed on the upper die holder.
3. The multi-layer PCB board pressing apparatus of claim 1, wherein the rail board is further provided with a slide rail, the slide rail is located at the top of the rail board, and the slide rail is connected with the rail board by bolts.
4. The multi-layer PCB panel pressing apparatus as claimed in claim 1 or 3, wherein the upper mold base is further provided with a slider, the slider is located at the lower end of the upper mold base and located at the upper end of the slide rail, and the slider is connected with the upper mold base by a bolt and slides along the slide rail.
CN201711173772.5A 2017-11-22 2017-11-22 Multilayer PCB board lamination device Active CN107809856B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711173772.5A CN107809856B (en) 2017-11-22 2017-11-22 Multilayer PCB board lamination device

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Application Number Priority Date Filing Date Title
CN201711173772.5A CN107809856B (en) 2017-11-22 2017-11-22 Multilayer PCB board lamination device

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CN107809856A CN107809856A (en) 2018-03-16
CN107809856B true CN107809856B (en) 2023-08-01

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108541151A (en) * 2018-07-16 2018-09-14 湖北荣宝电子科技有限公司 A kind of printed circuit board pressing device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002232139A (en) * 2001-02-07 2002-08-16 Seiko Precision Inc Manufacturing method of multilayer printed-wiring board
KR100860117B1 (en) * 2007-07-11 2008-09-25 오재진 Hot press device
JP2009290012A (en) * 2008-05-29 2009-12-10 Denso Corp Vacuum heat press equipment for forming multilayered circuit board
CN202344425U (en) * 2011-10-11 2012-07-25 深圳麦逊电子有限公司 Automatic pressing mechanism
CN102729572A (en) * 2012-06-28 2012-10-17 特新电路材料(东莞)有限公司 Circuit board laminating machine
KR101288098B1 (en) * 2012-10-19 2013-07-19 구미숙 Apparatus for reinforcement using drawer type for panel
CN204090316U (en) * 2014-08-05 2015-01-07 苏州恒迈精密机械有限公司 A kind of Flexible Printed Circuit pressing PSA film device
TWM512280U (en) * 2015-06-09 2015-11-11 Vigor Machinery Co Ltd Lithographic type flexible printed circuit board pressing machine
CN205946379U (en) * 2016-08-05 2017-02-08 苏州鑫富力劲自动化设备有限公司 Circuit board pressfitting machine
CN206323657U (en) * 2016-12-28 2017-07-11 昆山欧贝达电子科技有限公司 A kind of pressing machine of wiring board
CN207802545U (en) * 2017-11-22 2018-08-31 苏州市亿利华电子有限公司 A kind of multi-layer PCB board pressing device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002232139A (en) * 2001-02-07 2002-08-16 Seiko Precision Inc Manufacturing method of multilayer printed-wiring board
KR100860117B1 (en) * 2007-07-11 2008-09-25 오재진 Hot press device
JP2009290012A (en) * 2008-05-29 2009-12-10 Denso Corp Vacuum heat press equipment for forming multilayered circuit board
CN202344425U (en) * 2011-10-11 2012-07-25 深圳麦逊电子有限公司 Automatic pressing mechanism
CN102729572A (en) * 2012-06-28 2012-10-17 特新电路材料(东莞)有限公司 Circuit board laminating machine
KR101288098B1 (en) * 2012-10-19 2013-07-19 구미숙 Apparatus for reinforcement using drawer type for panel
CN204090316U (en) * 2014-08-05 2015-01-07 苏州恒迈精密机械有限公司 A kind of Flexible Printed Circuit pressing PSA film device
TWM512280U (en) * 2015-06-09 2015-11-11 Vigor Machinery Co Ltd Lithographic type flexible printed circuit board pressing machine
CN205946379U (en) * 2016-08-05 2017-02-08 苏州鑫富力劲自动化设备有限公司 Circuit board pressfitting machine
CN206323657U (en) * 2016-12-28 2017-07-11 昆山欧贝达电子科技有限公司 A kind of pressing machine of wiring board
CN207802545U (en) * 2017-11-22 2018-08-31 苏州市亿利华电子有限公司 A kind of multi-layer PCB board pressing device

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