CN107809856A - A kind of multi-layer PCB board press fit device - Google Patents
A kind of multi-layer PCB board press fit device Download PDFInfo
- Publication number
- CN107809856A CN107809856A CN201711173772.5A CN201711173772A CN107809856A CN 107809856 A CN107809856 A CN 107809856A CN 201711173772 A CN201711173772 A CN 201711173772A CN 107809856 A CN107809856 A CN 107809856A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- upper bolster
- die shoe
- layer pcb
- track plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Press Drives And Press Lines (AREA)
Abstract
The invention discloses a kind of multi-layer PCB board press fit device, including bottom plate, track plates, support frame, die shoe, on-gauge plate, servo cylinder, push pedal, guide rod, pusher cylinder, upper bolster, electric heating tube, the raw material for forming multi-layer PCB board is overlayed into push pedal upper end successively, then, pusher cylinder promotes upper bolster to be moved into place along track plates, the axis of upper bolster overlaps with the axis of die shoe, electric heating tube work is heated to upper bolster, then, servo cylinder promotes push pedal to move up, multi-layer PCB board compresses in the case where push pedal acts on upper bolster, heat melts the glue between forming multi-layer PCB board raw material caused by electric heating tube work, so as to auto-stitching together.Step groove is spacing for being carried out to multi-layer PCB board, coordinates the pcb board of different-thickness by increasing the quantity of on-gauge plate, prevents pcb board from shifting.The apparatus structure is simple, can carry out the auto-stitching of multi-layer PCB board, and die shoe upper end is unobstructed, is easy to automatic loading/unloading, automatic glue application etc..
Description
Technical field
The present invention relates to a kind of mechanical device, more particularly to a kind of multi-layer PCB board press fit device.
Background technology
PCB multilayer board refers to that it is fixed usually to pass through single sided board or dual platen for the multilayer circuit board in electric equipment products
Position system and adhesive material are alternately together and the printed substrate that is interconnected by design requirement of conductive pattern, such as four
Layer, six-layer printed circuit board, it is necessary to which surface of the glue coated in raw material plate will be bonded in PCB multilayer board manufacturing process, and will
Raw material plate stacks be positioned on forcing press in order, is then applied the multilayer raw material plate stacked in order using forcing press
Pressure so that raw material plate presses together, and because conventional press is mostly vertical structure, the upper end of raw material plate is provided with some behaviour more
Make mechanism, blocked most of space, cause to be difficult to set automatic charging, blanking and rubber-coated mechanism etc., greatly reduce production effect
Rate.In view of disadvantages described above, is necessary to design a kind of multi-layer PCB board press fit device in fact.
The content of the invention
It is an object of the invention to provide a kind of multi-layer PCB board press fit device, the multi-layer PCB board press fit device can carry out more
The auto-stitching of layer pcb board, and die shoe upper end is unobstructed, is easy to automatic loading/unloading, automatic glue application etc..
In order to solve the above technical problems, the technical scheme is that：A kind of multi-layer PCB board press fit device, including bottom plate,
Track plates, support frame, die shoe, on-gauge plate, servo cylinder, push pedal, guide rod, pusher cylinder, upper bolster, electric heating tube, institute
The track plates quantity stated is 2, is symmetrically arranged in bottom plate upper end, and described support frame be located at bottom plate upper end and to be located at two pieces symmetrical
On the inside of the track plates of arrangement, described support frame is connected with bottom plate by screw thread, and described die shoe is located at support frame upper end, institute
The die shoe stated is connected with support frame by screw thread, and described on-gauge plate is located at die shoe upper end, described on-gauge plate and lower mould
Plate is connected by bolt, and described servo cylinder is located at bottom plate upper end, and described servo cylinder is connected with bottom plate by bolt, institute
The push pedal stated is located at servo cylinder upper end and on the inside of die shoe, and described push pedal is connected with servomotor screw thread, described
Guide rod is through die shoe and is located at push pedal lower end, and described guide rod is connected with push pedal screw thread and can slided along die shoe,
Described pusher cylinder is located at bottom plate upper end, and described pusher cylinder is connected with bottom plate by screw thread, and described upper bolster is located at
Track plates upper end and it is located at pusher cylinder side, described upper bolster is connected and can slided along track plates with pusher cylinder screw thread
Dynamic, described electric heating tube one end is stretched into upper bolster, and described electric heating tube is connected with upper bolster by bolt.
Further improvement of the invention is as follows：
Further, described electric heating tube quantity is no less than 3, is distributed in upper bolster.
Further, described track plates are additionally provided with slide rail, and described slide rail is located at the top of track plates, described slide rail with
Track plates are connected by bolt.
Further, described die shoe is additionally provided with step groove, and described step groove is located at die shoe center,
Described step groove runs through die shoe.
Further, described upper bolster is additionally provided with sliding block, and described sliding block is located at upper bolster lower end and on slide rail
End, described sliding block are connected by bolt with upper bolster and can slided along slide rail.
Further, described upper bolster is additionally provided with locating slot, and described locating slot is located at upper bolster lower end, and described determines
Position groove is not through upper bolster.
Compared with prior art, the multi-layer PCB board press fit device, during work, the raw material for forming multi-layer PCB board is folded successively
Push pedal upper end is placed on, then, pusher cylinder promotes upper bolster to be moved into place along track plates, now, the axis of upper bolster and lower mould
The axis of seat is overlapped, and electric heating tube work is heated to upper bolster, and then, servo cylinder promotes push pedal to move up, multi-layer PCB board
Compressed in the case where push pedal acts on upper bolster, heat caused by electric heating tube work melts the glue between forming multi-layer PCB board raw material
Change, so as to auto-stitching together.Step groove is spacing for being carried out to multi-layer PCB board, is matched somebody with somebody by increasing the quantity of on-gauge plate
The pcb board of different-thickness is closed, prevents pcb board from shifting.The apparatus structure is simple, can carry out the auto-stitching of multi-layer PCB board,
And die shoe upper end is unobstructed, it is easy to automatic loading/unloading, automatic glue application etc..
Brief description of the drawings
Fig. 1 shows front view of the present invention
Fig. 2 shows upper bolster upward view of the present invention
In figure：Bottom plate 1, track plates 2, support frame 3, die shoe 4, on-gauge plate 5, servo cylinder 6, push pedal 7, guide rod 8, push away
Expect cylinder 9, upper bolster 10, electric heating tube 11, slide rail 201, step groove 401, sliding block 1001, locating slot 1002.
Embodiment
As shown in Figure 1 and Figure 2, a kind of multi-layer PCB board press fit device, including bottom plate 1, track plates 2, support frame 3, die shoe
4th, on-gauge plate 5, servo cylinder 6, push pedal 7, guide rod 8, pusher cylinder 9, upper bolster 10, electric heating tube 11, described track plates 2
Quantity is 2, is symmetrically arranged in the upper end of bottom plate 1, what described support frame 3 was located at the upper end of bottom plate 1 and was arranged symmetrically positioned at two pieces
The inner side of track plates 2, described support frame 3 are connected with bottom plate 1 by screw thread, and described die shoe 4 is located at the upper end of support frame 3, institute
The die shoe 4 stated is connected with support frame 3 by screw thread, and described on-gauge plate 5 is located at the upper end of die shoe 4, described on-gauge plate 5 with
Lower template 4 is connected by bolt, and described servo cylinder 6 is located at the upper end of bottom plate 1, and described servo cylinder 6 passes through spiral shell with bottom plate 1
Bolt is connected, and described push pedal 7 is located at the upper end of servo cylinder 6 and positioned at the inner side of die shoe 4, described push pedal 7 and the spiral shell of servomotor 6
Line is connected, and described guide rod 8 is through die shoe 4 and is located at the lower end of push pedal 7, described guide rod 8 be connected with the screw thread of push pedal 7 and
It can be slided along die shoe 4, described pusher cylinder 9 is located at the upper end of bottom plate 1, and described pusher cylinder 9 passes through screw thread with bottom plate 1
It is connected, described upper bolster 10 is located at the upper end of track plates 2 and is located at the side of pusher cylinder 9, described upper bolster 10 and pusher gas
The screw thread of cylinder 9 is connected and can slided along track plates 2, and described one end of electric heating tube 11 is stretched into upper bolster 10, and described electricity adds
Heat pipe 11 is connected with upper bolster 10 by bolt, and the described quantity of electric heating tube 11 is no less than 3, is distributed in upper bolster 10, institute
The track plates 2 stated are additionally provided with slide rail 201, and described slide rail 201 is located at the top of track plates 2, described slide rail 201 and track plates 2
It is connected by bolt, described die shoe 4 is additionally provided with step groove 401, and described step groove 401 is located in die shoe 4
At the heart, described step groove 401 runs through die shoe 4, and described upper bolster 10 is additionally provided with sliding block 1001, described sliding block 1001
In the lower end of upper bolster 10 and it is located at the upper end of slide rail 201, described sliding block 1001 is connected by bolt with upper bolster 10 and can edge
Slide rail 201 slides, and described upper bolster 10 is additionally provided with locating slot 1002, and described locating slot 1002 is located at the lower end of upper bolster 10,
Described locating slot 1002 is not through upper bolster 10, the multi-layer PCB board press fit device, during work, will form the original of multi-layer PCB board
Material overlays the upper end of push pedal 7 successively, and then, pusher cylinder 9 promotes upper bolster 10 to be moved into place along track plates 2, now, upper bolster
10 axis is overlapped with the axis of die shoe 4, and electric heating tube 11 works to be heated to upper bolster 10, and then, servo cylinder 6 pushes away
Dynamic push pedal 7 moves up, and multi-layer PCB board compresses in the case where push pedal 7 and upper bolster 10 act on, and electric heating tube 11 works caused heat by group
Into the glue fusing between multi-layer PCB board raw material, so that auto-stitching is together.Step groove 401 is used to limit multi-layer PCB board
Position, coordinates the pcb board of different-thickness by increasing the quantity of on-gauge plate 5, prevents pcb board from shifting.Apparatus structure letter
It is single, the auto-stitching of multi-layer PCB board can be carried out, and the upper end of die shoe 4 is unobstructed, is easy to automatic loading/unloading, automatic glue application etc..
The present invention is not limited to above-mentioned specific embodiment, one of ordinary skill in the art from above-mentioned design,
Without performing creative labour, a variety of conversion made, it is within the scope of the present invention.
Claims (6)
1. a kind of multi-layer PCB board press fit device, it is characterised in that including bottom plate, track plates, support frame, die shoe, on-gauge plate, watch
Convinced cylinder, push pedal, guide rod, pusher cylinder, upper bolster, electric heating tube, described track plates quantity are 2, are symmetrically arranged in
Bottom plate upper end, described support frame are located at bottom plate upper end and on the inside of the track plates that two pieces is arranged symmetrically, described support frame
It is connected with bottom plate by screw thread, described die shoe is located at support frame upper end, and described die shoe passes through screw thread phase with support frame
Even, described on-gauge plate is located at die shoe upper end, and described on-gauge plate is connected with lower template by bolt, described servo cylinder
Positioned at bottom plate upper end, described servo cylinder is connected with bottom plate by bolt, and described push pedal is located at servo cylinder upper end and position
On the inside of die shoe, described push pedal is connected with servomotor screw thread, and described guide rod is through die shoe and under push pedal
End, described guide rod are connected with push pedal screw thread and can slided along die shoe, and described pusher cylinder is located at bottom plate upper end, institute
The pusher cylinder stated is connected with bottom plate by screw thread, and described upper bolster is located at track plates upper end and is located at pusher cylinder side,
Described upper bolster is connected and can slided along track plates with pusher cylinder screw thread, and upper bolster is stretched into described electric heating tube one end
Interior, described electric heating tube is connected with upper bolster by bolt.
2. multi-layer PCB board press fit device as claimed in claim 1, it is characterised in that described electric heating tube quantity is no less than 3
Part, it is distributed in upper bolster.
3. multi-layer PCB board press fit device as claimed in claim 1, it is characterised in that described track plates are additionally provided with slide rail, institute
The slide rail stated is located at the top of track plates, and described slide rail is connected with track plates by bolt.
4. multi-layer PCB board press fit device as claimed in claim 1, it is characterised in that described die shoe is additionally provided with platform
Rank groove, described step groove are located at die shoe center, and described step groove runs through die shoe.
5. the multi-layer PCB board press fit device as described in claim 1 and 3, it is characterised in that described upper bolster is additionally provided with sliding block,
Described sliding block is located at upper bolster lower end and is located at slide rail upper end, and described sliding block is connected by bolt with upper bolster and can edge
Slide rail slides.
6. multi-layer PCB board press fit device as claimed in claim 1, it is characterised in that described upper bolster is additionally provided with locating slot,
Described locating slot is located at upper bolster lower end, and described locating slot is not through upper bolster.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711173772.5A CN107809856B (en) | 2017-11-22 | 2017-11-22 | Multilayer PCB board lamination device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711173772.5A CN107809856B (en) | 2017-11-22 | 2017-11-22 | Multilayer PCB board lamination device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107809856A true CN107809856A (en) | 2018-03-16 |
| CN107809856B CN107809856B (en) | 2023-08-01 |
Family
ID=61580687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711173772.5A Active CN107809856B (en) | 2017-11-22 | 2017-11-22 | Multilayer PCB board lamination device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107809856B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541151A (en) * | 2018-07-16 | 2018-09-14 | 湖北荣宝电子科技有限公司 | A kind of printed circuit board pressing device |
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|---|---|---|---|---|
| JP2002232139A (en) * | 2001-02-07 | 2002-08-16 | Seiko Precision Inc | Manufacturing method of multilayer printed-wiring board |
| KR100860117B1 (en) * | 2007-07-11 | 2008-09-25 | 오재진 | Hot press device |
| JP2009290012A (en) * | 2008-05-29 | 2009-12-10 | Denso Corp | Vacuum heat press equipment for forming multilayered circuit board |
| CN202344425U (en) * | 2011-10-11 | 2012-07-25 | 深圳麦逊电子有限公司 | Automatic pressing mechanism |
| CN102729572A (en) * | 2012-06-28 | 2012-10-17 | 特新电路材料（东莞）有限公司 | Circuit board laminating machine |
| KR101288098B1 (en) * | 2012-10-19 | 2013-07-19 | 구미숙 | Apparatus for reinforcement using drawer type for panel |
| CN204090316U (en) * | 2014-08-05 | 2015-01-07 | 苏州恒迈精密机械有限公司 | A kind of Flexible Printed Circuit pressing PSA film device |
| TWM512280U (en) * | 2015-06-09 | 2015-11-11 | Vigor Machinery Co Ltd | Lithographic type flexible printed circuit board pressing machine |
| CN205946379U (en) * | 2016-08-05 | 2017-02-08 | 苏州鑫富力劲自动化设备有限公司 | Circuit board pressfitting machine |
| CN206323657U (en) * | 2016-12-28 | 2017-07-11 | 昆山欧贝达电子科技有限公司 | A kind of pressing machine of wiring board |
| CN207802545U (en) * | 2017-11-22 | 2018-08-31 | 苏州市亿利华电子有限公司 | A kind of multi-layer PCB board pressing device |
-
2017
- 2017-11-22 CN CN201711173772.5A patent/CN107809856B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232139A (en) * | 2001-02-07 | 2002-08-16 | Seiko Precision Inc | Manufacturing method of multilayer printed-wiring board |
| KR100860117B1 (en) * | 2007-07-11 | 2008-09-25 | 오재진 | Hot press device |
| JP2009290012A (en) * | 2008-05-29 | 2009-12-10 | Denso Corp | Vacuum heat press equipment for forming multilayered circuit board |
| CN202344425U (en) * | 2011-10-11 | 2012-07-25 | 深圳麦逊电子有限公司 | Automatic pressing mechanism |
| CN102729572A (en) * | 2012-06-28 | 2012-10-17 | 特新电路材料（东莞）有限公司 | Circuit board laminating machine |
| KR101288098B1 (en) * | 2012-10-19 | 2013-07-19 | 구미숙 | Apparatus for reinforcement using drawer type for panel |
| CN204090316U (en) * | 2014-08-05 | 2015-01-07 | 苏州恒迈精密机械有限公司 | A kind of Flexible Printed Circuit pressing PSA film device |
| TWM512280U (en) * | 2015-06-09 | 2015-11-11 | Vigor Machinery Co Ltd | Lithographic type flexible printed circuit board pressing machine |
| CN205946379U (en) * | 2016-08-05 | 2017-02-08 | 苏州鑫富力劲自动化设备有限公司 | Circuit board pressfitting machine |
| CN206323657U (en) * | 2016-12-28 | 2017-07-11 | 昆山欧贝达电子科技有限公司 | A kind of pressing machine of wiring board |
| CN207802545U (en) * | 2017-11-22 | 2018-08-31 | 苏州市亿利华电子有限公司 | A kind of multi-layer PCB board pressing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541151A (en) * | 2018-07-16 | 2018-09-14 | 湖北荣宝电子科技有限公司 | A kind of printed circuit board pressing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107809856B (en) | 2023-08-01 |
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