CN205830133U - A kind of composing structure of wiring board - Google Patents
A kind of composing structure of wiring board Download PDFInfo
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- CN205830133U CN205830133U CN201620530051.XU CN201620530051U CN205830133U CN 205830133 U CN205830133 U CN 205830133U CN 201620530051 U CN201620530051 U CN 201620530051U CN 205830133 U CN205830133 U CN 205830133U
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- wiring board
- steel plate
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Abstract
A kind of composing structure of wiring board, including carrier, kraft paper, wiring board typesetting district and steel plate, the top of carrier is sequentially provided with kraft paper, steel plate, wiring board typesetting district, steel plate, kraft paper and cover plate, described wiring board typesetting district is provided with ten sandwich circuit flaggies, is separated by steel plate between pcb layer and pcb layer；It is equipped with four pieces of wiring board units on described each sandwich circuit flaggy, and the position being arranged on four pieces of wiring board units of different pcb layer is identical；Wiring board unit between the different pcb layers of same position revolves turnback respectively；Described wiring board unit is the M shell wiring board that depletion region is bigger.This utility model improves the production efficiency in bonding processes, after avoiding typesetting in bonding processes stress and the be heated uneven M shell wiring board starved caused in wiring board unit cavity and Copper Foil creasing problems, the M shell wiring board after pressing is caused to be scrapped, decrease the generation of defective products rate, save production cost, improve yields.
Description
Technical field
This utility model belongs to wiring board typesetting system field, is specifically related to the composing structure of a kind of wiring board.
Background technology
At present, wiring board manufacturing enterprise is when producing multilayer circuit board, after first being produced by the inner plating of multilayer circuit board, so
After again inner plating, PP and Copper Foil are carried out typesetting, put into after typesetting and press equipment carries out pressing make multilayer circuit board.By
In this multilayer circuit board, also have the biggest depletion region, and inner plating in manufacturing process due to the etching of etching solution, lead
Cause to there is difference of height between copper face and base material, although can be made up by PP layer and between copper face and base material, there is difference of height, but
Put into the multilayer circuit board of press equipment when carrying out pressing, during typesetting, the multilayer circuit board of multiple structure is carried out pressing, improve
Pressing efficiency.But existing multilayer circuit board is when pressing typesetting, due to direction always, therefore the level of typesetting how after,
The overlap in low-lying district easily occurs, increases difference of height, affect the overall quality of the wiring board after pressing.Therefore, how to overcome now
Some deficiencies, the quality changing wiring board becomes enterprise's problem demanding prompt solution.
Summary of the invention
In view of this, uniform force and scrappage low circuit when the technical problems to be solved in the utility model is a kind of pressing
The composing structure of plate.
In order to solve above-mentioned technical problem, this utility model uses following scheme to realize: the composing structure of a kind of wiring board,
Including carrier, kraft paper, wiring board typesetting district and steel plate, the top of carrier is sequentially provided with kraft paper, steel plate, wiring board
Typesetting district, steel plate, kraft paper and cover plate, described wiring board typesetting district is provided with ten sandwich circuit flaggies, pcb layer and line
Separated by steel plate between the flaggy of road；It is equipped with four pieces of wiring board units on described each sandwich circuit flaggy, and is arranged on not
Position with four pieces of wiring board units of pcb layer is identical；Wiring board unit between the different pcb layers of same position divides
Do not revolve turnback；Described wiring board unit is the M shell wiring board that depletion region is bigger.
Wherein, the length that M shell wiring board is depletion region that described depletion region is bigger is more than more than 200mm, width
The M shell wiring board of 20mm.
Wherein, described M is even number and M >=4.
Wherein, described M shell wiring board is made up of 2 blocks of Copper Foils and (M-1)/2 piece inner plating and M/2 block PP layer, (M-
1)/2 pieces of inner platings are arranged between Copper Foil, and are equipped with PP layer between copper coin and inner plating, between inner plating and inner plating.
Wherein, described carrier is square structure.
Compared with prior art, ten sandwich circuits can be set when composing structure of the present utility model can realize one step press
Flaggy, each sandwich circuit flaggy is provided with four wiring board units, can improve the production efficiency in bonding processes, same position
Different pcb layers between wiring board unit revolve turnback respectively, can stagger the line being arranged in different pcb layer
Depletion region in the Slab element of road so that the depletion region between the different pcb layers of same position is misaligned, it is to avoid row
After Ban in bonding processes stress and the be heated uneven M shell wiring board starved caused in wiring board unit cavity and Copper Foil fold
Problem, causes the M shell wiring board after pressing to be scrapped, and decreases the generation of defective products rate, saves production cost, improves non-defective unit
Rate.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of monolayer pcb layer of the present utility model.
Fig. 3 is the structural representation of wiring board unit of the present utility model.
Detailed description of the invention
In order to allow those skilled in the art be more fully understood that the technical solution of the utility model, below in conjunction with the accompanying drawings to this
Utility model is further elaborated.
As shown in figures 1 and 3, the composing structure of a kind of wiring board, including the circuit list to be laminated after placing typesetting
Unit carrier 1, kraft paper 2, wiring board typesetting district and steel plate 3, the top of carrier 1 be sequentially provided with kraft paper 2, steel plate 3,
Wiring board typesetting district, steel plate 3, kraft paper 2 and cover plate 4.Described carrier 1 is square structure.Wherein during typesetting, in carrying
Between dish and steel plate, between steel plate and cover plate, it is provided with kraft paper, the elasticity in bonding processes can be improved so that steel plate is more flat
Whole, improve the quality of pressing, improve the yields of product.
In order to improve production efficiency during pressing, shortening the production time, described wiring board typesetting district is provided with ten layer lines
Road flaggy 5 so that after typesetting once can pressing ten sandwich circuit flaggy, improve the efficiency of pressing.So that pcb layer
Between when pressing stress, be heated evenly, it is ensured that the smooth shape between pcb layer, between pcb layer 5 and pcb layer 5
It is provided with steel plate 3, and is separated by steel plate 3, it is achieved the separation between pcb layer.It is all provided with on described each sandwich circuit flaggy 5
There are four pieces of wiring board units 51, and the position being arranged on four pieces of wiring board units 51 of different pcb layer is identical, it is to avoid line
The position of the wiring board unit between road flaggy and pcb layer is different, stress when causing pressing, be heated uneven.
In order to avoid after typesetting in bonding processes stress and be heated uneven cause wiring board unit in there is starved
Cavity and Copper Foil creasing problems, the wiring board unit 51 between the different pcb layers 5 of same position revolves turnback respectively；
Described wiring board unit 51 is the M shell wiring board that depletion region is bigger.The M shell wiring board that described depletion region is bigger is empty
The length in spacious region is more than 200mm, the width M shell wiring board more than 20mm.Described M shell wiring board is by 2 blocks of Copper Foils and (M-
2)/2 pieces of inner platings and M/2 block PP layer composition, (M-2)/2 piece inner plating is arranged between Copper Foil, and at copper coin and inner plating
Between, be equipped with PP layer between inner plating and inner plating.Wherein, described M is even number and M >=4.
The composing structure of embodiment 1 six sandwich circuit board
The typographical sequences of six described sandwich circuit boards is followed successively by Copper Foil, PP layer, inner plating, PP layer, inner plating, Copper Foil.Will
Sandwich circuit board unit is organized after six sandwich circuit board typesettings.Then wiring board unit is carried out typesetting, facilitate next step pressing, improve
Yield rate after pressing.Composing structure during pressing sequentially consists of: carrier 1, kraft paper 2, steel plate 3, wiring board are arranged
Version district, steel plate 3, kraft paper 2 and cover plate 4.It is provided with ten sandwich circuit flaggies, each sandwich circuit board in described wiring board typesetting district
Layer is provided with four pieces of wiring board units, is separated by steel plate between pcb layer with pcb layer, it can be ensured that putting down during pressing
Whole property, uniform force and the effect being heated evenly.Due to wiring board unit inner plating etching time during, sheet material and copper
Certain difference in height can be formed between face, affect the smooth shape in plate face of wiring board unit in follow-up bonding processes.In order to avoid
After typesetting in bonding processes stress and be heated uneven cause wiring board unit in exist starved cavity and Copper Foil creasing problems,
Rotate respectively between wiring board unit and the wiring board unit of even level pcb layer of the odd number sandwich circuit flaggy of same position
180 degree so that the depletion region of six sandwich circuit boards completes dislocation and opens, reduce the overlap of depletion region, improve yields.Described
The size of depletion region of six sandwich circuit boards be a length of 200mm of depletion region, width be 20mm.
Above-described embodiment is only wherein specific implementation of the present utility model, and it describes more concrete and detailed, but also
Therefore the restriction to this utility model the scope of the claims can not be interpreted as.It should be pointed out that, for the ordinary skill of this area
For personnel, without departing from the concept of the premise utility, it is also possible to make some deformation and improvement, these are apparent
Alternative forms belong to protection domain of the present utility model.
Claims (4)
1. a composing structure for wiring board, including carrier (1), kraft paper (2), wiring board typesetting district and steel plate (3), its
Being characterised by, the top of carrier (1) is sequentially provided with kraft paper (2), steel plate (3), wiring board typesetting district, steel plate (3), kraft paper
(2) and cover plate (4), described wiring board typesetting district is provided with ten sandwich circuit flaggies (5), pcb layer (5) and pcb layer
(5) separated by steel plate (3) between；It is equipped with four pieces of wiring board units (51) on described each sandwich circuit flaggy (5), and sets
Put the position four pieces of wiring board units (51) of different pcb layers identical；Between the different pcb layers (5) of same position
Wiring board unit (51) revolve turnback respectively；Described wiring board unit (51) is the M shell wiring board that depletion region is bigger；
The length that M shell wiring board is depletion region that described depletion region is bigger is more than 200mm, the width M shell circuit more than 20mm
Plate.
The composing structure of wiring board the most according to claim 1, it is characterised in that described M is even number and M >=4.
The composing structure of wiring board the most according to claim 2, it is characterised in that described M shell wiring board is by 2 blocks of Copper Foils
(M-2)/2 pieces of inner platings and M/2 block PP layer composition, (M-2)/2 piece inner plating is arranged between Copper Foil, and at copper coin with interior
PP layer it is equipped with between laminate, between inner plating and inner plating.
The composing structure of wiring board the most according to claim 1, it is characterised in that described carrier (1) is square knot
Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620530051.XU CN205830133U (en) | 2016-06-03 | 2016-06-03 | A kind of composing structure of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620530051.XU CN205830133U (en) | 2016-06-03 | 2016-06-03 | A kind of composing structure of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205830133U true CN205830133U (en) | 2016-12-21 |
Family
ID=57567944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620530051.XU Active CN205830133U (en) | 2016-06-03 | 2016-06-03 | A kind of composing structure of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205830133U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573484A (en) * | 2021-09-23 | 2021-10-29 | 西安宏星电子浆料科技股份有限公司 | Small-batch rapid manufacturing method for LTCC (Low temperature Co-fired ceramic) substrates |
-
2016
- 2016-06-03 CN CN201620530051.XU patent/CN205830133U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573484A (en) * | 2021-09-23 | 2021-10-29 | 西安宏星电子浆料科技股份有限公司 | Small-batch rapid manufacturing method for LTCC (Low temperature Co-fired ceramic) substrates |
| CN113573484B (en) * | 2021-09-23 | 2022-03-25 | 西安宏星电子浆料科技股份有限公司 | Small-batch rapid manufacturing method for LTCC (Low temperature Co-fired ceramic) substrates |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210224 Address after: 226000 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province, No. 999 Guangzhou Road Patentee after: Nantong Shenghong Technology Co.,Ltd. Address before: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. |
|
| TR01 | Transfer of patent right |