CN206743657U - A kind of paving copper coin structure for improving pcb board internal layer pressing starved - Google Patents
A kind of paving copper coin structure for improving pcb board internal layer pressing starved Download PDFInfo
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- CN206743657U CN206743657U CN201720632364.0U CN201720632364U CN206743657U CN 206743657 U CN206743657 U CN 206743657U CN 201720632364 U CN201720632364 U CN 201720632364U CN 206743657 U CN206743657 U CN 206743657U
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- copper
- internal layer
- starved
- pcb board
- paving
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Abstract
The utility model discloses a kind of paving copper coin structure for improving pcb board internal layer pressing starved, including the copper sheet being laid on each edges of boards of PCB internal layer thin substrates, copper bar is provided between edges of boards copper sheet and form wire, spew groove is provided with the side of plate four for avoiding each tooling hole and contraposition module, layers of copper is equipped with the shaping gong dead zone of PCB internal layer thin substrates.The setting that the utility model passes through copper sheet, copper bar spew groove and layers of copper, gummosis amount of the prepreg in pressing can effectively be reduced, it can prevent that starved when pcb board presses, copper foil fold and interlayer are thin etc. bad or scrap generation, effectively improve the qualification rate of product, avoid because of gummosis and caused by product rejection, the first-time qualification rate of product improves, and reduces fraction defective, has saved the production cost of pcb board.The setting of spew groove, it can guarantee that the mobility of resin in bonding processes is uniform, the setting of layers of copper, can reduce filler amount, it is ensured that thickness of slab is integrally uniform on shaping gong dead zone.The utility model overall structure is simple, is easy to producing line volume production.
Description
Technical field
It the utility model is related to PCB technical fields, and in particular to a kind of paving copper coin knot for improving pcb board internal layer pressing starved
Structure.
Background technology
In PCB production processes, prepreg (Pp pieces) is the essential raw material of pressing working procedure, because internal layer designs original
Cause, prepreg (Pp pieces) often occur that resin stream glue is excessive in pressing, cause the interlayer of pcb board produced it is partially thin,
There is starved lamination in part, especially copper foil fold easily occurs in the golden finger position for having patchboard, causes product rejection, is
Effectively solve it is such scrap, improve the qualification rate of product, it is necessary to which a kind of can reduce presses gummosis, to improve because of starved
Caused by scrap, lifted quality yield, save manufacturing cost.
Utility model content
In order to solve the above-mentioned technical problem the utility model provides a kind of paving copper coin for improving pcb board internal layer pressing starved
Structure, this paving copper coin structure for improving pcb board internal layer pressing starved are solved caused by gummosis is excessive in existing bonding processes
The technical problems such as PCB interlayers are partially thin, local starved layering, the easy fold of copper foil.
It is a kind of to improve the paving copper coin structure of pcb board internal layer pressing starved, including be laid on each edges of boards of PCB internal layer thin substrates
Copper sheet, copper bar is provided between edges of boards copper sheet and form wire, is provided with the side of plate four for avoiding each tooling hole and contraposition module
Spew groove.
Wherein, it is equipped with layers of copper on the shaping gong dead zone of PCB internal layer thin substrates.
Preferably, distance of the described copper bar away from edges of boards is 0.5mm, and distance of the copper bar away from form wire is 0.5mm.
Preferably, described copper bar size is the wide 1.5mm of long 20mm*, and the spacing between copper bar and copper bar is 1mm.
Preferably, described spew groove totally 8,2 spew grooves are provided with every edges of boards.
Preferably, the width of described spew groove is 5mm.
Preferably, the spew groove close to plate angle is apart from 100 ~ 120mm of plate angle.
The utility model provides a kind of paving copper coin structure for improving pcb board internal layer pressing starved, passes through copper sheet, copper bar gummosis
The setting of groove and layers of copper, gummosis amount of the prepreg in pressing can be effectively reduced, starved when pcb board presses, copper can be prevented
It is bad or scrap generation that paper tinsel fold and interlayer are thin etc., effectively improves the qualification rate of product, avoid because of gummosis and caused by product report
Useless, the first-time qualification rate of product improves, and reduces fraction defective, has saved the production cost of pcb board.The setting of spew groove, it can protect
The mobility of resin is uniform in card bonding processes, and the setting of layers of copper, can reduce filler amount on shaping gong dead zone, it is ensured that thickness of slab is overall
Uniformly.Setting of the utility model to paving copper coin structure, overall structure is simple, is easy to producing line volume production.
Brief description of the drawings
Fig. 1 the utility model overall structure diagrams.
Fig. 2 the utility model copper bar partial structural diagrams.
Fig. 3 the utility model is molded gong dead zone upper berth layers of copper partial structural diagram.
Embodiment
In order to allow those skilled in the art to more fully understand the technical solution of the utility model, below to the utility model
It is further elaborated.
As illustrated in the accompanying drawings from 1 to 3, it is a kind of to improve the paving copper coin structure of pcb board internal layer pressing starved, including it is laid in PCB internal layers
Copper sheet 1 on each edges of boards of thin substrate, in the position for having plug gold finger plate, copper is additionally added between edges of boards copper sheet and form wire
Bar 2, spew groove 3 is provided with the side of plate four for avoiding each tooling hole and contraposition module, in the shaping gong dead zone of PCB internal layer thin substrates
On be equipped with layers of copper 4.
In the position for having plug gold finger plate, the distance of the copper bar away from edges of boards of the present embodiment is 0.5mm, and copper bar is away from form wire
Distance be 0.5mm, copper bar size is the wide 1.5mm of long 20mm*, and the spacing between copper bar and copper bar is 1mm.Avoiding each work
Have the spew groove totally 8 on the edges of boards of hole and contraposition module, 2 spew grooves are provided with every edges of boards, open the width of spew groove
Spend for 5mm, spacing of the spew groove between 100 ~ 120mm of plate angle, two spew grooves close to plate angle is true according to specific product
Fixed, the length of spew groove determines according to the edges of boards distance of specific product.
The cellular paving copper that the utility model is designed by changing raw sheet side（Gummosis amount is big）, edges of boards, which are pressed, spreads full copper design,
Reduce gummosis amount, each functional module of normal design edges of boards；Having at plug gold finger plate, need to be between edges of boards copper sheet and form wire
Extra addition copper bar, the length of copper bar can be according to the Design of length of golden finger；Each tooling hole and contraposition mould are avoided on four sides of plate
At block, spew groove is opened respectively, ensures Resin Flow in bonding processes, while increase paving copper in gong dead zone is molded in plate, is formed
Layers of copper, reduce filler amount, it is ensured that thickness of slab is integrally uniform.
The utility model provides a kind of paving copper coin structure for improving pcb board internal layer pressing starved, passes through copper sheet, copper bar gummosis
The setting of groove and layers of copper, gummosis amount of the prepreg in pressing can be effectively reduced, starved when pcb board presses, copper can be prevented
It is bad or scrap generation that paper tinsel fold and interlayer are thin etc., effectively improves the qualification rate of product, avoid because of gummosis and caused by product report
Useless, the first-time qualification rate of product improves, and reduces fraction defective, has saved the production cost of pcb board.The setting of spew groove, it can protect
The mobility of resin is uniform in card bonding processes, and the setting of layers of copper, can reduce filler amount on shaping gong dead zone, it is ensured that thickness of slab is overall
Uniformly.Setting of the utility model to paving copper coin structure, overall structure is simple, is easy to producing line volume production.
Above be the preferable implementation of the utility model, it is necessary to explanation, without departing substantially from the utility model spirit and
In the case of its essence, those skilled in the art, which work as, can make various corresponding changes and become according to the utility model
Shape, but these changes and deformation should all belong to the scope of the claims appended by the utility model.
Claims (7)
- A kind of 1. paving copper coin structure for improving pcb board internal layer pressing starved, it is characterised in that：Including being laid in the thin base of PCB internal layers Copper sheet on each edges of boards of plate, copper bar is provided between edges of boards copper sheet and form wire, is avoiding the plate of each tooling hole and contraposition module Four sides are provided with spew groove.
- 2. the paving copper coin structure according to claim 1 for improving pcb board internal layer pressing starved, it is characterised in that：In PCB Layers of copper is equipped with the shaping gong dead zone of layer thin substrate.
- 3. the paving copper coin structure according to claim 1 or 2 for improving pcb board internal layer pressing starved, it is characterised in that：It is described Distance of the copper bar away from edges of boards be 0.5mm, distance of the copper bar away from form wire is 0.5mm.
- 4. the paving copper coin structure according to claim 3 for improving pcb board internal layer pressing starved, it is characterised in that：Described Copper bar size is the wide 1.5mm of long 20mm*, and the spacing between copper bar and copper bar is 1mm.
- 5. the paving copper coin structure according to claim 1 or 2 for improving pcb board internal layer pressing starved, it is characterised in that：It is described Spew groove totally 8,2 spew grooves are provided with every edges of boards.
- 6. the paving copper coin structure according to claim 5 for improving pcb board internal layer pressing starved, it is characterised in that：Described The width of spew groove is 5mm.
- 7. the paving copper coin structure according to claim 6 for improving pcb board internal layer pressing starved, it is characterised in that：Close to plate The spew groove at angle is apart from 100 ~ 120mm of plate angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720632364.0U CN206743657U (en) | 2017-06-02 | 2017-06-02 | A kind of paving copper coin structure for improving pcb board internal layer pressing starved |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720632364.0U CN206743657U (en) | 2017-06-02 | 2017-06-02 | A kind of paving copper coin structure for improving pcb board internal layer pressing starved |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206743657U true CN206743657U (en) | 2017-12-12 |
Family
ID=60569179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720632364.0U Active CN206743657U (en) | 2017-06-02 | 2017-06-02 | A kind of paving copper coin structure for improving pcb board internal layer pressing starved |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206743657U (en) |
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2017
- 2017-06-02 CN CN201720632364.0U patent/CN206743657U/en active Active
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