CN104582259A - Golden finger plate with bevel edge chamfer and processing method for golden finger plate - Google Patents
Golden finger plate with bevel edge chamfer and processing method for golden finger plate Download PDFInfo
- Publication number
- CN104582259A CN104582259A CN201310503388.2A CN201310503388A CN104582259A CN 104582259 A CN104582259 A CN 104582259A CN 201310503388 A CN201310503388 A CN 201310503388A CN 104582259 A CN104582259 A CN 104582259A
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- Prior art keywords
- band
- golden finger
- finger plate
- plate
- strong point
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Abstract
The invention discloses a golden finger plate with a bevel edge chamfer and a processing method for the golden finger plate. The method comprises the following steps: milling a plate appearance on the golden finger plate by primary molding so as to form a golden finger band, and retaining a supporting point band on the golden finger plate, wherein the supporting point band and the golden finger band are positioned on the same plate edge of the golden finger plate, and the upper edge of the supporting point band is higher than or equal to that of the golden finger band; carrying out edge positioning by taking the supporting point band as a supporting point according to the requirement of the bevel edge depth specification, and carrying out bevel edge chamfer processing on the golden finger band; milling off the supporting point band by secondary molding. According to the golden finger plate and the processing method thereof, the problem of poor golden finger plate chamfering caused by a fact that edge positioning equipment cannot get close to the edge or the edge positioning precision is low as the plate edge of the golden finger plate is not flat in the prior art is solved; the positioning precision is effectively improved, and the product yield and the production efficiency are improved accordingly.
Description
Technical field
The present invention relates to printed circuit board and make field, particularly a kind of gold finger plate with hypotenuse chamfering and processing method thereof.
Background technology
Existing gold finger plate, normally on one-time formed basis, carry out hypotenuse chamfer machining, consult shown in Fig. 1, because golden finger band 1 is higher than other marginal portion of gold finger plate, make the edges of boards out-of-flatness of gold finger plate, result in gold finger plate carry out keeping to the side in the process of hypotenuse chamfer machining location time, cannot keep to the side because there is no the strong point, thus cause the bad and problem that scrappage is high of gold finger plate chamfering, and then limit the production of gold finger plate.
Summary of the invention
The embodiment of the present invention provides a kind of gold finger plate with hypotenuse chamfering and processing method thereof, in order to solve in prior art due to the edges of boards out-of-flatness of gold finger plate cause carrying out in the process of gold finger plate hypotenuse chamfer machining keeping to the side location time, there is no the strong point and the problem that cannot keep to the side.
The concrete technical scheme that the embodiment of the present invention provides is as follows:
First aspect, a kind of processing method of the gold finger plate with hypotenuse chamfering, comprising:
Through one-shot forming, gold finger plate mills out plate external form and forms golden finger band, and strong point band is retained on described gold finger plate, wherein, described strong point band and described golden finger band are in the same edges of boards of described gold finger plate, and the top edge of described strong point band higher than or equal the top edge of described golden finger band;
According to the specification requirement of the hypotenuse degree of depth, carry out for the strong point location of keeping to the side with described strong point band, hypotenuse chamfer machining is carried out to described golden finger band;
Through post forming, strong point band described in mill off.
Like this, by twice molding mode, retain after simultaneous manufacturing and be in same edges of boards with golden finger band and top edge is not less than the strong point band of golden finger band top edge, the strong point of locating as keeping to the side during hypotenuse chamfering, and final finished is obtained after post-forming process, solve the positioning equipment that keeps to the side caused due to the out-of-flatness of gold finger plate edges of boards in prior art and cannot to keep to the side or keep to the side the bad problem of the gold finger plate chamfering that causes of positioning precision difference.
In conjunction with first aspect, in the implementation that the first is possible, through one-shot forming, gold finger plate mills out plate external form and forms golden finger band, and retain strong point band on described gold finger plate, be specially:
Described gold finger plate is put on the table top of forming machine, by described forming machine, the top edge alignment of the edges of boards at Schilling described golden finger band place, then adopt default profile pattern or model, complete described one-shot forming.
Like this, in the process of follow-up gold finger plate hypotenuse chamfering, just there will not be the phenomenon that gold finger plate tilts.
In conjunction with first aspect, in the implementation that the second is possible, according to the specification requirement of the hypotenuse degree of depth, carry out for the strong point location of keeping to the side with described strong point band, hypotenuse chamfer machining carried out to described golden finger band, is specially:
By the positioning guide rail of described strong point band near bevelling machine;
Upper and lower belt is adopted to press described strong point band;
According to the specification requirement of the described hypotenuse degree of depth, described bevelling machine is adopted to carry out hypotenuse chamfer machining for the golden finger device in golden finger band.
Like this, with the strong point band retained after simultaneous manufacturing for the strong point, when bevelling machine carries out keeping to the side to locate automatic hypotenuse, the accuracy of location and chamfering is high.
In conjunction with the first possible implementation of first aspect and first aspect, in the implementation that the third is possible, the length of described golden finger band is less than or equal to the half of the edges of boards length of the described gold finger plate at its place.
The gold finger plate of the half of the whole edges of boards length of the curtailment due to this golden finger band, easily causes imbalance when chamfer machining, thus the method that the secondary milling being more suitable for adopting the present invention to propose is shaping.
In conjunction with the third possible implementation of first aspect, in the 4th kind of possible implementation, the length of described golden finger band is less than or equal to the length of the described gold finger plate edges of boards at its place
In this case, adopt technique of the present invention, the effect utilizing the mode guarantee fund finger plate of strong point band to balance is more obvious.
In conjunction with the first possible implementation of first aspect and first aspect, in the 5th kind of possible implementation, the length of described strong point band and the length sum of golden finger band, be greater than or equal to the half of the edges of boards length of described gold finger plate.
That is, the total length of strong point band and golden finger band, without the need to taking the whole edges of boards of place gold finger plate, only need retain the length of the half being no less than place edges of boards.
In conjunction with the 5th kind of possible implementation of first party, in the 6th kind of possible implementation, the length of described strong point band and the length sum of golden finger band, be greater than or equal to the edges of boards length of described gold finger plate
In this case, the total length of strong point band and golden finger band, retains and is no less than place edges of boards
length, be no less than the length of the half of place edges of boards, the better effects if when hypotenuse chamfer machining compared with only retaining.
In conjunction with first aspect, in the 7th kind of possible implementation, the material of described gold finger plate is resin material and Copper Foil, and golden finger surface adopts electrogilding.
Second aspect, a kind of gold finger plate, adopts any one possible implementation in first aspect to make.
Such gold finger plate, twice shaping processing mode is adopted to make, retain after simultaneous manufacturing and be in same edges of boards with golden finger band and top edge is not less than the strong point band of golden finger band top edge, the strong point of locating as keeping to the side during hypotenuse chamfering, and final finished is obtained after post-forming process, improve finished product rate and production efficiency.
Accompanying drawing explanation
Fig. 1 is the gold finger plate floor map after the one-shot forming under prior art;
Fig. 2 is the process chart of gold finger plate hypotenuse chamfer machining in the embodiment of the present invention;
Fig. 3 is the gold finger plate floor map in the embodiment of the present invention after one-shot forming;
Fig. 4 is the gold finger plate floor map in the embodiment of the present invention after hypotenuse chamfer machining;
Fig. 5 is the gold finger plate floor map in the embodiment of the present invention after post forming.
Embodiment
In the process of gold finger plate chamfer machining, in order to solve in prior art due to the out-of-flatness of gold finger plate edges of boards, cause keeping to the side positioning precision difference and the high problem of the scrappage that causes, in the embodiment of the present invention, provide a kind of gold finger plate hypotenuse chamfer processing method, efficiently solve the defect of above-mentioned prior art.
Below in conjunction with accompanying drawing, the preferred embodiment of the present invention is described in detail.
Consult shown in Fig. 2, in the embodiment of the present invention, idiographic flow gold finger plate being carried out to hypotenuse chamfer machining is as follows:
Step 200: through the simultaneous manufacturing of forming machine, gold finger plate mills out plate external form and forms golden finger band, and on gold finger plate, retain strong point band, wherein, this strong point band and this golden finger band are in the same edges of boards of gold finger plate, and the top edge of this strong point band higher than or equal the top edge of this golden finger band.
Particularly, gold finger plate is put on the table top of forming machine, pass through forming machine, the top edge alignment of the edges of boards at Schilling golden finger band place, adopt the profile pattern meeting Customer design preset or model again, complete one-shot forming, like this, in the process of follow-up gold finger plate hypotenuse chamfering, just there will not be the phenomenon that gold finger plate tilts.Gold finger plate after simultaneous manufacturing is concrete as shown in Figure 3, and position 1 is golden finger band, and position 2 is strong point band, and specific design is carried out according to concrete mechanism map in position 3.In the embodiment of the present invention, when the length of golden finger band 1 is less than or equal to a half of the edges of boards length of place gold finger plate, the imbalance of gold finger plate is easily caused when chamfer machining, so be more suitable for the method adopting this secondary milling shaping, especially when the length of golden finger band 1 is less than its place edges of boards
time, adopt the mode of this reservation strong point band to ensure to add the balance of gold finger plate in man-hour, effect is more obvious.The length sum of strong point band 2 and golden finger band 1 then needs the half of the edges of boards length being greater than or equal to place gold finger plate, is greater than or equal to the edges of boards length of place gold finger plate
shi Xiaoguo is more excellent, might not take the whole edges of boards of place gold finger plate.The material of gold finger plate is resin material and Copper Foil, and the surface of golden finger have employed electrogilding.
Step 210: bevelling machine, according to the specification requirement of the hypotenuse degree of depth, carries out for the strong point location of keeping to the side with strong point band, carries out hypotenuse chamfer machining to golden finger band.
Particularly, " the hypotenuse degree of depth " specification requirement of giving according to client, allow strong point band near the positioning guide rail of bevelling machine, strong point band is pressed by upper and lower belt, prevent from occurring the situation that gold finger plate rocks in the hypotenuse course of processing of gold finger plate, then, bevelling machine can be adopted to carry out hypotenuse chamfer machining to the golden finger device in golden finger band.Gold finger plate after hypotenuse chamfer machining is concrete as shown in Figure 4.
Step 220: forming machine carries out post-forming process to the above-mentioned gold finger plate completing hypotenuse chamfer machining, mill off strong point band.
Particularly, be put in by gold finger plate on forming machine table top, complete post forming by forming machine, the gold finger plate final finished obtained after post-forming process as shown in Figure 5.
In the embodiment of the present invention, after obtaining the final finished of gold finger plate, also to do further electric performance test to finished product, reject the bad gold finger plate of open circuit or short circuit.Also to do further visual examination again to qualified gold finger plate after electric performance test, avoid occurring that there is the bad phenomenon such as foreign matter or scratch in gold finger plate plate face.
In the embodiment of the present invention, a kind of gold finger plate, can adopt any one method above-mentioned to make.
In sum, adopt technical scheme described in the embodiment of the present invention, carry out in the course of processing of hypotenuse chamfering at gold finger plate, by twice molding mode, retain after simultaneous manufacturing and be in same edges of boards with golden finger band and top edge is not less than the strong point band of golden finger band top edge, the strong point of locating as keeping to the side during hypotenuse chamfering, and final finished is obtained after post-forming process, solve the positioning equipment that keeps to the side caused due to the out-of-flatness of gold finger plate edges of boards in prior art cannot to keep to the side or keep to the side the bad problem of the gold finger plate chamfering that causes of positioning precision difference, effectively improve the accuracy of location, and then improve finished product rate and production efficiency.
Obviously, those skilled in the art can carry out various change and modification to the embodiment of the present invention and not depart from the spirit and scope of the embodiment of the present invention.Like this, if these amendments of the embodiment of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (9)
1. a processing method for the gold finger plate with hypotenuse chamfering, is characterized in that, comprising:
Through one-shot forming, gold finger plate mills out plate external form and forms golden finger band, and strong point band is retained on described gold finger plate, wherein, described strong point band and described golden finger band are in the same edges of boards of described gold finger plate, and the top edge of described strong point band higher than or equal the top edge of described golden finger band;
According to the specification requirement of the hypotenuse degree of depth, carry out for the strong point location of keeping to the side with described strong point band, hypotenuse chamfer machining is carried out to described golden finger band;
Through post forming, strong point band described in mill off.
2. the method for claim 1, is characterized in that, through one-shot forming, gold finger plate mills out plate external form and forms golden finger band, and retain strong point band on described gold finger plate, be specially:
Described gold finger plate is put on the table top of forming machine, by described forming machine, the top edge alignment of the edges of boards at Schilling described golden finger band place, then adopt default profile pattern or model, complete described one-shot forming.
3. the method for claim 1, is characterized in that, according to the specification requirement of the hypotenuse degree of depth, carries out location of keeping to the side, carry out hypotenuse chamfer machining, be specially described golden finger band with described strong point band for the strong point:
By the positioning guide rail of described strong point band near bevelling machine;
Upper and lower belt is adopted to press described strong point band;
According to the specification requirement of the described hypotenuse degree of depth, described bevelling machine is adopted to carry out hypotenuse chamfer machining for the golden finger device in golden finger band.
4. method as claimed in claim 1 or 2, it is characterized in that, the length of described golden finger band is less than or equal to the half of the length of the described gold finger plate edges of boards at its place.
5. method as claimed in claim 4, is characterized in that, the length of described golden finger band is less than or equal to the length of the described gold finger plate edges of boards at its place
6. method as claimed in claim 1 or 2, it is characterized in that, the length of described strong point band and the length sum of golden finger band, be greater than or equal to the half of the edges of boards length of described gold finger plate.
7. method as claimed in claim 6, is characterized in that, the length of described strong point band and the length sum of golden finger band, is greater than or equal to the edges of boards length of described gold finger plate
8. the method for claim 1, is characterized in that, the material of described gold finger plate is resin material and Copper Foil, and golden finger surface adopts electrogilding.
9. a gold finger plate, is characterized in that, adopts the method as described in any one of claim 1-8 to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310503388.2A CN104582259B (en) | 2013-10-23 | 2013-10-23 | A kind of gold finger plate and its processing method with hypotenuse chamfering |
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| CN201310503388.2A CN104582259B (en) | 2013-10-23 | 2013-10-23 | A kind of gold finger plate and its processing method with hypotenuse chamfering |
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| CN104582259A true CN104582259A (en) | 2015-04-29 |
| CN104582259B CN104582259B (en) | 2018-01-12 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107231763A (en) * | 2017-06-29 | 2017-10-03 | 珠海杰赛科技有限公司 | A kind of golden finger wiring board preparation method and device |
| CN110579846A (en) * | 2019-09-26 | 2019-12-17 | 胜宏科技（惠州）股份有限公司 | Bevel edge processing method of high-speed optical module board |
| CN110579845A (en) * | 2019-09-20 | 2019-12-17 | 胜宏科技（惠州）股份有限公司 | forming method of optical module board |
| CN111642084A (en) * | 2020-06-29 | 2020-09-08 | 苏州浪潮智能科技有限公司 | Golden finger chamfering determination method, golden finger chamfering determination device, golden finger chamfering determination equipment and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110579846B (en) * | 2019-09-26 | 2021-07-06 | 胜宏科技（惠州）股份有限公司 | Bevel edge processing method of high-speed optical module board |
| CN111642084A (en) * | 2020-06-29 | 2020-09-08 | 苏州浪潮智能科技有限公司 | Golden finger chamfering determination method, golden finger chamfering determination device, golden finger chamfering determination equipment and storage medium |
| CN111642084B (en) * | 2020-06-29 | 2021-08-31 | 苏州浪潮智能科技有限公司 | Golden finger chamfering determination method, golden finger chamfering determination device, golden finger chamfering determination equipment and storage medium |
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| CN104582259B (en) | 2018-01-12 |
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Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220914 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |