CN104582259B - A kind of gold finger plate and its processing method with hypotenuse chamfering - Google Patents
A kind of gold finger plate and its processing method with hypotenuse chamfering Download PDFInfo
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- CN104582259B CN104582259B CN201310503388.2A CN201310503388A CN104582259B CN 104582259 B CN104582259 B CN 104582259B CN 201310503388 A CN201310503388 A CN 201310503388A CN 104582259 B CN104582259 B CN 104582259B
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- band
- strong point
- gold finger
- finger plate
- plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Abstract
The invention discloses a kind of gold finger plate and its processing method with hypotenuse chamfering, this method is：By one-shot forming, plate external form is milled out on gold finger plate and forms golden finger band, and retain strong point band on the gold finger plate, wherein, the strong point band is in the same edges of boards of the gold finger plate with the golden finger band, and the top edge of the strong point band is greater than the top edge of the golden finger band；According to hypotenuse depth specification requirement, carry out keeping to the side to position as the strong point using the strong point band, hypotenuse chamfer machining is carried out to the golden finger band；By post forming, strong point band described in mill off.Solve the problems, such as in the prior art because location equipment of being kept to the side caused by the gold finger plate edges of boards out-of-flatness gold finger plate chamfering caused by positioning precision difference that can not keep to the side or keep to the side is bad, the accuracy of positioning is effectively increased, and then improves finished product rate and production efficiency.
Description
Technical field
The present invention relates to printed circuit board production field, more particularly to a kind of gold finger plate with hypotenuse chamfering and its processing
Method.
Background technology
Existing gold finger plate, hypotenuse chamfer machining is carried out typically on the basis of one-shot forming, as shown in fig.1,
Because golden finger band 1 is higher than other marginal portions of gold finger plate so that the edges of boards out-of-flatness of gold finger plate, result in golden hand
Fingerboard can not keep to the side, so as to cause gold when carrying out keeping to the side positioning during hypotenuse chamfer machining because of no strong point
Finger plate chamfering is bad and the problem of scrappage is high, and then limits the production of gold finger plate.
The content of the invention
The embodiment of the present invention provides a kind of gold finger plate and its processing method with hypotenuse chamfering, to solve prior art
In cause, when carrying out keeping to the side positioning during gold finger plate hypotenuse chamfer machining, not having due to the edges of boards out-of-flatness of gold finger plate
The problem of having the strong point and can not keeping to the side.
Concrete technical scheme provided in an embodiment of the present invention is as follows：
In a first aspect, a kind of processing method of the gold finger plate with hypotenuse chamfering, including：
By one-shot forming, plate external form is milled out on gold finger plate and forms golden finger band, and is protected on the gold finger plate
Strong point band is stayed, wherein, the strong point band is in the same edges of boards of the gold finger plate, and the branch with the golden finger band
The top edge of support point band is greater than the top edge of the golden finger band；
According to hypotenuse depth specification requirement, carry out keeping to the side to position as the strong point using the strong point band, to the golden finger
Band carries out hypotenuse chamfer machining；
By post forming, strong point band described in mill off.
So, by molding mode twice, retain after simultaneous manufacturing with golden finger band be in same edges of boards and on
Edge is not less than strong point band of the golden finger with top edge, the strong point for positioning of keeping to the side during as hypotenuse chamfering, and by secondary
Final finished is obtained after processing and forming, is solved in the prior art because positioning of being kept to the side caused by gold finger plate edges of boards out-of-flatness is set
Standby the problem of gold finger plate chamfering is bad caused by positioning precision difference that can not keep to the side or keep to the side.
With reference in a first aspect, in the first possible implementation, by one-shot forming, plate is milled out on gold finger plate
External form forms golden finger band, and retains strong point band on the gold finger plate, is specially：
The gold finger plate is put on the table top of forming machine, by the forming machine, where the Schilling golden finger band
Edges of boards top edge alignment, then using default profile pattern or model, complete the one-shot forming.
So, be just not in the inclined phenomenon of gold finger plate during follow-up gold finger plate hypotenuse chamfering.
With reference in a first aspect, in second of possible implementation, according to hypotenuse depth specification requirement, with the support
Point band carries out keeping to the side to position for the strong point, carries out hypotenuse chamfer machining to the golden finger band, is specially：
The strong point band is abutted to the positioning guide rail of bevelling machine；
The strong point band is pressed using upper lower belt；
According to the hypotenuse depth specification requirement, the golden finger device being directed to using the bevelling machine in golden finger band is carried out
Hypotenuse chamfer machining.
So, using the strong point band retained after simultaneous manufacturing as the strong point, bevelling machine carries out keeping to the side to position automatic inclined
The accuracy of Bian Shi, positioning and chamfering is high.
With reference to the possible implementation of the first of first aspect and first aspect, in the third possible implementation
In, the half of the edges of boards length for the gold finger plate that the length of the golden finger band is less than or equal to where it.
Due to the gold finger plate of the half of the whole edges of boards length of the curtailment of this golden finger band, hold in chamfer machining
Easily cause imbalance, so as to be more suitable for the method using secondary milling shaping proposed by the present invention.
With reference to the third possible implementation of first aspect, in the 4th kind of possible implementation, the golden hand
Refer to the length of band less than or equal to the length of the gold finger plate edges of boards where it
In this case, using the present invention technique, using the mode of strong point band ensure gold finger plate balance effect
Fruit becomes apparent.
With reference to the possible implementation of the first of first aspect and first aspect, in the 5th kind of possible implementation
In, the length of the strong point band and the length sum of golden finger band, more than or equal to the edges of boards length of the gold finger plate
Half.
That is, the total length of strong point band and golden finger band need not take the whole edges of boards of place gold finger plate, only
The length of the half no less than place edges of boards need to be retained.
With reference to the 5th kind of possible implementation of first party, in the 6th kind of possible implementation, the strong point
The length of band and the length sum of golden finger band, more than or equal to the edges of boards length of the gold finger plate
In this case, the total length of strong point band and golden finger band, retain no less than place edges of boardsLength,
Compared with the length for only retaining the half no less than place edges of boards, in hypotenuse chamfer machining, effect is more preferable.
With reference in a first aspect, in the 7th kind of possible implementation, the material of the gold finger plate for resin material and
Copper foil, golden finger surface is using plating gold.
Second aspect, a kind of gold finger plate, it is made of the possible implementation of any one in first aspect.
Such gold finger plate, it is made of the processing mode being molded twice, is retained and golden hand after simultaneous manufacturing
Refer to band and be not less than strong point band of the golden finger with top edge in same edges of boards and top edge, keep to the side to position during as hypotenuse chamfering
The strong point, and final finished is obtained after post-forming process, improves finished product rate and production efficiency.
Brief description of the drawings
Fig. 1 is the gold finger plate floor map after the one-shot forming under prior art；
Fig. 2 is the process chart of gold finger plate hypotenuse chamfer machining in the embodiment of the present invention；
Fig. 3 is the gold finger plate floor map after one-shot forming in the embodiment of the present invention；
Fig. 4 is the gold finger plate floor map after hypotenuse chamfer machining in the embodiment of the present invention；
Fig. 5 is the gold finger plate floor map after post forming in the embodiment of the present invention.
Embodiment
During gold finger plate chamfer machining, in order to solve in the prior art due to gold finger plate edges of boards out-of-flatness,
Cause to keep to the side positioning precision difference and caused by scrappage it is high the problem of, in the embodiment of the present invention, there is provided a kind of gold finger plate is oblique
Side chamfer processing method, the defects of efficiently solving above-mentioned prior art.
The preferred embodiment of the present invention is described in detail below in conjunction with the accompanying drawings.
As shown in fig.2, in the embodiment of the present invention, the idiographic flow that hypotenuse chamfer machining is carried out to gold finger plate is as follows：
Step 200：By the simultaneous manufacturing of forming machine, plate external form is milled out on gold finger plate and forms golden finger band,
And retain strong point band on gold finger plate, wherein, the strong point band is in the same edges of boards of gold finger plate with the golden finger band,
And the top edge of the strong point band is greater than the top edge of the golden finger band.
Specifically, gold finger plate is put on the table top of forming machine, by forming machine, the edges of boards where Schilling golden finger band
Top edge alignment, then use the default profile pattern or model for meeting Customer design, complete one-shot forming, so,
Just be not in the inclined phenomenon of gold finger plate during follow-up gold finger plate hypotenuse chamfering.By simultaneous manufacturing
Gold finger plate afterwards is specific as shown in figure 3, position 1 is golden finger band, and position 2 is strong point band, and position 3 is according to specific mechanism
Figure carries out specific design.In the embodiment of the present invention, when the length of golden finger band 1 is less than or equal to the edges of boards of place gold finger plate
During the half of length, the imbalance of gold finger plate is easily caused in chamfer machining, thus be more suitable for using this secondary milling into
The method of type, edges of boards especially where the length of golden finger band 1 is less than itWhen, using the side of this reservation strong point band
Formula ensures that the balance of gold finger plate, effect become apparent during processing.And the length sum of strong point band 2 and golden finger band 1 is then
The half of the edges of boards length of place gold finger plate need to be more than or equal to, more than or equal to the edges of boards length of place gold finger plate
'sShi Xiaoguo is more excellent, is not necessarily to the whole edges of boards of gold finger plate where taking.The material of gold finger plate is resin material
And copper foil, the surface of golden finger employ plating gold.
Step 210：Bevelling machine carries out keeping to the side to position according to hypotenuse depth specification requirement using strong point band as the strong point, right
Golden finger band carries out hypotenuse chamfer machining.
Specifically, " hypotenuse depth " specification requirement given according to client, strong point band is allowed to be led against the positioning of bevelling machine
Rail, strong point band is pressed by upper lower belt, prevent occurring what gold finger plate rocked in the hypotenuse process of gold finger plate
Situation, then, bevelling machine can be used to carry out hypotenuse chamfer machining to the golden finger device in golden finger band.By hypotenuse chamfering
Gold finger plate after processing is specifically as shown in Figure 4.
Step 220：Forming machine carries out post-forming process, mill off branch to the gold finger plate of above-mentioned completion hypotenuse chamfer machining
Support point band.
Specifically, gold finger plate is put on forming machine table top, post forming is completed by forming machine, by post forming
The gold finger plate final finished obtained after processing is as shown in Figure 5.
In the embodiment of the present invention, after obtaining the final finished of gold finger plate, further electrical property is also done to finished product and is surveyed
Examination, reject open circuit or the bad gold finger plate of short circuit.Also qualified gold finger plate is done again further after electric performance test
Visual examination, avoiding the occurrence of gold finger plate plate face has the bad phenomenons such as foreign matter or scratch.
In the embodiment of the present invention, a kind of gold finger plate, it can be made of any one above-mentioned method.
In summary, using technical scheme described in the embodiment of the present invention, hypotenuse chamfering is carried out in gold finger plate
In process, by molding mode twice, retain after simultaneous manufacturing and be in same edges of boards and top with golden finger band
Edge is not less than strong point band of the golden finger with top edge, the strong point for positioning of keeping to the side during as hypotenuse chamfering, and by it is secondary into
Final finished is obtained after type processing, is solved in the prior art due to location equipment of being kept to the side caused by gold finger plate edges of boards out-of-flatness
Can not keep to the side or keep to the side the problem of gold finger plate chamfering is bad caused by positioning precision difference, effectively increase the accurate of positioning
Degree, and then improve finished product rate and production efficiency.
Obviously, those skilled in the art can carry out various changes and modification without departing from this hair to the embodiment of the present invention
The spirit and scope of bright embodiment.So, if these modifications and variations of the embodiment of the present invention belong to the claims in the present invention
And its within the scope of equivalent technologies, then the present invention is also intended to comprising including these changes and modification.
Claims (8)
- A kind of 1. processing method of the gold finger plate with hypotenuse chamfering, it is characterised in that including：By one-shot forming, plate external form is milled out on gold finger plate and forms golden finger band, and retains branch on the gold finger plate Support point band, wherein, the strong point band is in the same edges of boards of the gold finger plate, and the strong point with the golden finger band The top edge of band is greater than the top edge of the golden finger band；According to hypotenuse depth specification requirement, carry out keeping to the side to position as the strong point using the strong point band, the golden finger is brought into Row hypotenuse chamfer machining；By post forming, strong point band described in mill off.
- 2. the method as described in claim 1, it is characterised in that by one-shot forming, plate external form shape is milled out on gold finger plate Into golden finger band, and retain strong point band on the gold finger plate, be specially：The gold finger plate is put on the table top of forming machine, by the forming machine, the plate where the Schilling golden finger band The top edge alignment on side, then using default profile pattern or model, complete the one-shot forming.
- 3. the method as described in claim 1, it is characterised in that according to hypotenuse depth specification requirement, using the strong point band as The strong point carries out keeping to the side to position, and carries out hypotenuse chamfer machining to the golden finger band, is specially：The strong point band is abutted to the positioning guide rail of bevelling machine；The strong point band is pressed using upper lower belt；According to the hypotenuse depth specification requirement, the golden finger device being directed to using the bevelling machine in golden finger band carries out hypotenuse Chamfer machining.
- 4. method as claimed in claim 1 or 2, it is characterised in that the length of the golden finger band is less than or equal to its institute The gold finger plate edges of boards length half.
- 5. method as claimed in claim 4, it is characterised in that the length of the golden finger band is less than or equal to where it The length of the gold finger plate edges of boards
- 6. method as claimed in claim 1 or 2, it is characterised in that the length of the strong point band and the length of golden finger band Sum, more than or equal to the half of the edges of boards length of the gold finger plate.
- 7. method as claimed in claim 6, it is characterised in that the length of the strong point band and the length of golden finger band it With more than or equal to the edges of boards length of the gold finger plate
- 8. the method as described in claim 1, it is characterised in that the material of the gold finger plate is resin material and copper foil, gold Finger surface is using plating gold.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310503388.2A CN104582259B (en) | 2013-10-23 | 2013-10-23 | A kind of gold finger plate and its processing method with hypotenuse chamfering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310503388.2A CN104582259B (en) | 2013-10-23 | 2013-10-23 | A kind of gold finger plate and its processing method with hypotenuse chamfering |
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| CN104582259A CN104582259A (en) | 2015-04-29 |
| CN104582259B true CN104582259B (en) | 2018-01-12 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107231763B (en) * | 2017-06-29 | 2019-06-18 | 珠海杰赛科技有限公司 | A kind of golden finger wiring board preparation method and device |
| CN110579845B (en) * | 2019-09-20 | 2021-07-06 | 胜宏科技（惠州）股份有限公司 | Forming method of optical module board |
| CN110579846B (en) * | 2019-09-26 | 2021-07-06 | 胜宏科技（惠州）股份有限公司 | Bevel edge processing method of high-speed optical module board |
| CN111642084B (en) * | 2020-06-29 | 2021-08-31 | 苏州浪潮智能科技有限公司 | Golden finger chamfering determination method, golden finger chamfering determination device, golden finger chamfering determination equipment and storage medium |
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| CN202617513U (en) * | 2012-04-17 | 2012-12-19 | 深圳市奔创电子有限公司 | PCB precise circuit board with connecting fingers |
| CN102933035A (en) * | 2012-11-06 | 2013-02-13 | 大连太平洋电子有限公司 | Processing method of printed wiring board golden finger plug chamfers |
| CN103096642A (en) * | 2011-10-27 | 2013-05-08 | 比亚迪股份有限公司 | Manufacture method of flexible circuit board |
| CN203015287U (en) * | 2012-12-25 | 2013-06-19 | 大连崇达电路有限公司 | Chamfered goldfinger printed wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7941916B1 (en) * | 2004-07-08 | 2011-05-17 | Super Talent Electronics, Inc. | Manufacturing method for memory card |
| TWI389604B (en) * | 2008-12-29 | 2013-03-11 | Au Optronics Corp | Circuit boards structure and manufacturing method thereof and liquid crystal display containing the same |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103096642A (en) * | 2011-10-27 | 2013-05-08 | 比亚迪股份有限公司 | Manufacture method of flexible circuit board |
| CN202617513U (en) * | 2012-04-17 | 2012-12-19 | 深圳市奔创电子有限公司 | PCB precise circuit board with connecting fingers |
| CN102933035A (en) * | 2012-11-06 | 2013-02-13 | 大连太平洋电子有限公司 | Processing method of printed wiring board golden finger plug chamfers |
| CN203015287U (en) * | 2012-12-25 | 2013-06-19 | 大连崇达电路有限公司 | Chamfered goldfinger printed wiring board |
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| CN104582259A (en) | 2015-04-29 |
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Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220914 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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