CN103607852A - Printed circuit board core transplanting method - Google Patents
Printed circuit board core transplanting method Download PDFInfo
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- CN103607852A CN103607852A CN201310653340.XA CN201310653340A CN103607852A CN 103607852 A CN103607852 A CN 103607852A CN 201310653340 A CN201310653340 A CN 201310653340A CN 103607852 A CN103607852 A CN 103607852A
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Abstract
The invention discloses a printed circuit board core transplanting method. The method comprises the following steps: after any core is finished, detecting a whole working piece; marking defective semi-finished circuit boards, and transplanting the defective semi-finished printed circuit boards, wherein a qualified semi-finished circuit board is in butt-joint with a qualified semi-finished circuit board, and a defective semi-finished circuit board is in butt-joint with a defective semi-finished circuit board during transplanting, so that the working piece only contains the qualified semi-finished delivery piece and the wholly scrapped semi-finished delivery piece after transplanting; and continuously performing the following pressing process after transplanting. The printed circuit board core transplanting method is performed in the inner layer, the outer layer surface precision is not affected, and therefore, the finished product appearance has no transplanting trace. As a result, the method has a more excellent transplanting effect compared with that of a conventional finished product transplanting method, and a produced circuit board subjected to transplanting by the core transplanting method can be completely used as a normal board.
Description
Technical field
The invention belongs to printed circuit board manufacturing technology field, be specifically related to a kind of transplanting printed circuit board method.
Background technology
In the PCB of multi-disc connecting plate, there is unavoidably the bad situation of minority monolithic, general assembly plant does not wish to receive single report plate (single report plate: in many PCB in flakes, the bad plate that has monolithic to scrap, also be referred to as x-out plate) because so can have a strong impact on the efficiency of assembling, and then there are some international large factoriesies (as Samsung) to reject single report plate, or some factory can accept single report plate of minority (approximately 3%～10%), but all can require to sell at discount.The ratio of single report plate is higher, and the most directly impact is exactly: the evaluation of (1) production cost (2) production efficiency (3) client Dui Ban factory.
At the circuit board of high-order, the density of part is more and more higher, and wire is to do thinner and thinner, in defective products relative scale, also increases thereupon.Circuit board implantation can reduce the quantity of single report product, and because the surcharge of these circuit boards is higher, the situation Xia， circuit board factory that can accept implants client can significantly promote production capacity, reduces production costs.
To sum up analyze, transplanting is a technology that can allow rubbish flavescence gold.
Traditional transplanting is that production board is transplanted, and tradition transplanting flow process is as follows:
1. classification: classified in bad position;
2. moulding cutting: excision defective products, from another piece plank, obtain non-defective unit;
3. locate: adopt ccd localization machine, with high temperature resistant adhesive tape, fixed, and confirm positioning precision;
4. pressing plate: the transplanting board of just having located is flattened, and increase the adhesion of adhesive tape;
5. contraposition inspection for the first time: check that before injecting glue positioning precision is whether in tolerance;
6. injecting glue: inject high temperature resistant glue and sticked together transplanting interface;
7. baking: by drying adhesive;
8. for the second time to bit trial: check that production board positioning precision is whether in tolerance;
9. tensile test: degree of sticking together is answered force inspecting;
10. product inspection: check whether production board face is stained with glue, scratch, breakage etc.;
11. shipment.
But the problem that traditional production board implantation technique is faced is as follows:
1. the general precision of transplanting falls into three classes: the first order (lower accuracy: ± 3mil); The second level (general precision: ± 2mil); The third level (degree of precision: ± 1mil); Because transplanting board positioning precision cannot accomplish that 100% is accurate, generally all can have ± 1～2mil side-play amount;
2. the tack strength of transplanting board is not enough: tack strength can be along with, and the bonding area size of cut surface is difference to some extent, the thicker tack strength of transplanting board better, relatively thinner will be poorer;
3. the evenness of transplanting board not enough (error of Z-direction): the thick R value appointment of general pcb board drops on 2mil～4mil left and right, and the thicker gap of thickness of slab is larger, if pressing plate difference is 0 while transplanting, but the evenness drop of first 2mil～4mil in the sky still cannot overcome.
Above-mentioned condition may all can affect the yield of part on circuit board, so or some people transplants and has doubt finished product.
The problem that comprehensive production board is transplanted is all mainly the problem of circuit board surface (x, y, z) precision.
And then affect client's confidence problem, and when client also fails to come around to the correct way of thinking, how can break through because of finished product and transplant the problem causing, this is that dealer is urgently to be resolved hurrily.
Summary of the invention
In order to address the above problem, the invention provides a kind of printed circuit board (PCB) sandwich layer implantation method, this printed circuit board (PCB) sandwich layer implantation method is to transplant operation at internal layer, does not affect superficies (x, y, z) precision problem completely, and finished product outward appearance is not seen transplanting vestige completely.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of printed circuit board (PCB) sandwich layer implantation method, polylith printed circuit board (PCB) is unified into a shipment sheet, polylith shipment sheet is unified into an active gage, the active gage of take carries out printed circuit board (PCB) manufacture as unit, the superiors' line layer of printed circuit board (PCB) and orlop line layer are defined as to skin, the line layer adjacent with described skin is defined as to time skin, inferior skin and inferior skin are all referred to as sandwich layer with interior internal layer circuit layer, after any sandwich layer completes, whole active gage is detected, bad semi-finished product circuit plate is marked, then semi-finished product printed circuit board (PCB) is transplanted, during transplanting, qualified semi-finished product circuit plate is docked to qualified semi-finished product circuit plate, and bad semi-finished product circuit plate is docked to bad semi-finished product circuit plate, the semi-finished product shipment sheet that only has qualified semi-finished product shipment sheet and entirely scrap in active gage after transplanting.
The present invention for the further technical scheme that solves its technical problem and adopt is:
Say further, after any sandwich layer completes, whole active gage is carried out to AOI detection (Automatic Optic Inspection, automated optical detects), and mark bad semi-finished product circuit plate with AOI punctuate pen.
Say further, before transplanting, according to mark, indicate and adopt CAM(computer Aided Manufacturing, computer-aided manufacture) typesetting is die-cut, excise bad semi-finished product circuit plate, obtain qualified semi-finished product circuit plate, and cutting path will have concavo-convex.
Say further, before docking, need to, to transplanted qualified semi-finished product circuit plate is cleared up to remove dust and copper scale, then test to guarantee that transplanted qualified semi-finished product circuit plate is non-defective unit.
Say further, during docking, will guarantee with tool the aligning accuracy of semi-finished product circuit plate, determine after semi-finished product circuit plate location well and beat gently to guarantee that with rubber mallet the seam crossing of semi-finished product circuit plate is smooth smooth.
Say further, after docking, need to engage localization examination whether accurate to confirm transplanting location, if locate bad will again docking.
Say further, after semi-finished product circuit plate has docked, need to carry out a glue at interface and fix.
Say further, after transplanting, need to carry out semi-finished product circuit plate after three-D dimension measurement is transplanted with check whether in the margin of tolerance to the random sampling of semi-finished product shipment sheet.
Say further, after transplanting, need to answer force inspecting by degree of sticking together.
The invention has the beneficial effects as follows: printed circuit board (PCB) sandwich layer implantation method of the present invention is after any sandwich layer completes, whole active gage is detected, bad semi-finished product circuit plate is marked, then semi-finished product printed circuit board (PCB) is transplanted, during transplanting, qualified semi-finished product circuit plate is docked to qualified semi-finished product circuit plate, and bad semi-finished product circuit plate is docked to bad semi-finished product circuit plate, the semi-finished product shipment sheet that only has qualified semi-finished product shipment sheet and entirely scrap in active gage after transplanting, after completing, transplanting proceeds follow-up pressure programming, sandwich layer implantation method of the present invention is in internal layer operation, do not affect superficies (x completely, y, z) problem of precision, be that finished product outward appearance is not seen the vestige that has transplanting completely, thereby, it is quite remarkable that the more conventional finished product of effect of transplanting is transplanted, the circuit board that continues again to make after transplanting by sandwich layer implantation method can be considered as normal plank completely, and, the more processing procedure of the HDI of high-order and the more difficult plank of doing, the value that sandwich layer of the present invention is transplanted, all at internal layer, just more can be embodied in especially difficult place of doing, and sandwich layer transplanting amount is larger, and the cost of controlling instrument is just lower, transplants to be worth also more can present.
Embodiment
Embodiment: by specific instantiation explanation the specific embodiment of the present invention, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification below.The present invention also can other different mode be implemented, and, under not departing from disclosed category, can give different modifications and change that is.
A printed circuit board (PCB) sandwich layer implantation method, carries out in the steps below:
One, classification: after any sandwich layer completes, whole active gage is carried out to AOI detection (Automatic Optic Inspection, automated optical detects), and mark bad semi-finished product circuit plate with AOI punctuate pen;
Two, moulding cutting (punch die): indicate and adopt CAM(computer Aided Manufacturing according to mark, computer-aided manufacture) typesetting is die-cut, excise bad semi-finished product circuit plate, obtain qualified semi-finished product circuit plate, and cutting path will have concavo-convex;
Three, cleaning: the qualified semi-finished product circuit plate cutting down is cleared up to remove dust and copper scale;
Four, test: the qualified semi-finished product circuit plate after cleaning is tested to guarantee that transplanted qualified semi-finished product circuit plate is non-defective unit;
Five, transplant and engage: qualified semi-finished product circuit plate is docked to qualified semi-finished product circuit plate, and bad semi-finished product circuit plate is docked to bad semi-finished product circuit plate, during docking, to guarantee with tool the aligning accuracy of semi-finished product circuit plate, determine after semi-finished product circuit plate location well and beat gently to guarantee that with rubber mallet the seam crossing of semi-finished product circuit plate is smooth smooth, transplant the semi-finished product shipment sheet that only has qualified semi-finished product shipment sheet and entirely scrap in active gage after engaging;
Six, engage localization examination: confirm whether transplanting location is accurate, if locate bad will again docking;
Seven, injecting glue: transplanting interface is carried out to a glue and fix, what glue was used is industrial viscose agent, this glue viscosity and toughness are all relatively good, with needle tubing, glue spots is arrived and transplants interface, it is too thick too many that the glue amount a little paid special attention to wants that ultra-thin one deck can not put, also glue can not be dropped on the Copper Foil of edges of boards, if there is above situation, will carry out fine polishing with sandpaper, guarantee to exist without cull except transplanting interface other parts;
Eight, three-D dimension measurement: after having transplanted, random sampling is carried out plank after three-D dimension measurement is transplanted with check whether in the margin of tolerance to semi-finished product shipment sheet;
Nine, tensile test: after three-D dimensional measurement, degree of sticking together is answered force inspecting;
Ten, continue circuit board fabrication flow process: pressing.After pressing, without transplanting vestige, be as good as with general normal panel.
Sandwich layer implantation method of the present invention is in internal layer operation, does not affect the problem of superficies (x, y, z) precision completely, and finished product outward appearance is not seen the vestige that has transplanting completely.Thereby it is quite remarkable that the more conventional finished product of effect of transplanting is transplanted, the circuit board that continues again to make after transplanting by sandwich layer implantation method can be considered as normal plank completely.
Moreover, the HDI(high-density interconnected printed circuit board of high-order more) processing procedure and the more difficult plank of doing, the value that sandwich layer of the present invention is transplanted, all at internal layer, just more can be embodied in especially difficult place of doing.Sandwich layer transplanting amount is larger, and the cost of controlling instrument is just lower, transplants to be worth also more can present.
Be only the illustrative principle of the invention and effect thereof, but not for limiting the present invention.The scope of the present invention, should be as listed in claims.
Claims (10)
1. a printed circuit board (PCB) sandwich layer implantation method, it is characterized in that: polylith printed circuit board (PCB) is unified into a shipment sheet, polylith shipment sheet is unified into an active gage, the active gage of take carries out printed circuit board (PCB) manufacture as unit, the superiors' line layer of printed circuit board (PCB) and orlop line layer are defined as to skin, the line layer adjacent with described skin is defined as to time skin, inferior skin and inferior skin are all referred to as sandwich layer with interior internal layer circuit layer, after any sandwich layer completes, whole active gage is detected, bad semi-finished product circuit plate is marked, then semi-finished product printed circuit board (PCB) is transplanted, during transplanting, qualified semi-finished product circuit plate is docked to qualified semi-finished product circuit plate, and bad semi-finished product circuit plate is docked to bad semi-finished product circuit plate, the semi-finished product shipment sheet that only has qualified semi-finished product shipment sheet and entirely scrap in active gage after transplanting.
2. printed circuit board (PCB) sandwich layer implantation method as claimed in claim 1, is characterized in that: after any sandwich layer completes, whole active gage is carried out to AOI detection, and mark bad semi-finished product circuit plate with AOI punctuate pen.
3. printed circuit board (PCB) sandwich layer implantation method as claimed in claim 1, is characterized in that: before transplanting, according to mark, indicate and adopt CAM typesetting die-cut, excise bad semi-finished product circuit plate, obtain qualified semi-finished product circuit plate, and cutting path will have concavo-convex.
4. printed circuit board (PCB) sandwich layer implantation method as claimed in claim 1, it is characterized in that: before docking, need to, to transplanted qualified semi-finished product circuit plate is cleared up to remove dust and copper scale, then test to guarantee that transplanted qualified semi-finished product circuit plate is non-defective unit.
5. printed circuit board (PCB) sandwich layer implantation method as claimed in claim 1, it is characterized in that: during docking, will guarantee with tool the aligning accuracy of semi-finished product circuit plate, determine after semi-finished product circuit plate location well and beat gently to guarantee that with rubber mallet the seam crossing of semi-finished product circuit plate is smooth smooth.
6. printed circuit board (PCB) sandwich layer implantation method as claimed in claim 1, is characterized in that: after docking, need to engage localization examination whether accurate to confirm transplanting location, if locate bad will again docking.
7. printed circuit board (PCB) sandwich layer implantation method as claimed in claim 1, is characterized in that: after semi-finished product circuit plate has docked, need to carry out a glue at interface and fix.
8. printed circuit board (PCB) sandwich layer implantation method as claimed in claim 1, is characterized in that: after transplanting, carry out semi-finished product circuit plate after three-D dimension measurement is transplanted with check whether in the margin of tolerance to the random sampling of semi-finished product shipment sheet.
9. printed circuit board (PCB) sandwich layer implantation method as claimed in claim 1, is characterized in that: after transplanting, answer force inspecting by degree of sticking together.
10. printed circuit board (PCB) sandwich layer implantation method as claimed in any one of claims 1-9 wherein, is characterized in that: carry out in the steps below:
One, classification: after any sandwich layer completes, whole active gage is carried out to AOI detection, and mark bad semi-finished product circuit plate with AOI punctuate pen;
Two, moulding cutting: indicate and adopt CAM typesetting die-cut according to mark, excise bad semi-finished product circuit plate, obtain qualified semi-finished product circuit plate, and cutting path will have concavo-convex;
Three, cleaning: the qualified semi-finished product circuit plate cutting down is cleared up to remove dust and copper scale;
Four, test: the qualified semi-finished product circuit plate after cleaning is tested to guarantee that transplanted qualified semi-finished product circuit plate is non-defective unit;
Five, transplant and engage: qualified semi-finished product circuit plate is docked to qualified semi-finished product circuit plate, and bad semi-finished product circuit plate is docked to bad semi-finished product circuit plate, during docking, to guarantee with tool the aligning accuracy of semi-finished product circuit plate, determine after semi-finished product circuit plate location well and beat gently to guarantee that with rubber mallet the seam crossing of semi-finished product circuit plate is smooth smooth, transplant the semi-finished product shipment sheet that only has qualified semi-finished product shipment sheet and entirely scrap in active gage after engaging;
Six, engage localization examination: confirm whether transplanting location is accurate, if locate bad will again docking;
Seven, injecting glue: transplanting interface is carried out to a glue and fix;
Eight, three-D dimension measurement: after having transplanted, random sampling is carried out plank after three-D dimension measurement is transplanted with check whether in the margin of tolerance to semi-finished product shipment sheet;
Nine, tensile test: after three-D dimensional measurement, degree of sticking together is answered force inspecting;
Ten, continue printed circuit board (PCB) manufacturing process: pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310653340.XA CN103607852A (en) | 2013-12-06 | 2013-12-06 | Printed circuit board core transplanting method |
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| CN201310653340.XA CN103607852A (en) | 2013-12-06 | 2013-12-06 | Printed circuit board core transplanting method |
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| CN103607852A true CN103607852A (en) | 2014-02-26 |
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| CN201310653340.XA Pending CN103607852A (en) | 2013-12-06 | 2013-12-06 | Printed circuit board core transplanting method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104302108A (en) * | 2014-09-28 | 2015-01-21 | 江苏博敏电子有限公司 | Testing and forming method of printed circuit board |
| CN105430943A (en) * | 2015-11-06 | 2016-03-23 | 高德（江苏）电子科技有限公司 | Method for monitoring discarded inner layer of multilayer board of printed circuit board |
| CN107708330A (en) * | 2017-08-30 | 2018-02-16 | 奥士康精密电路（惠州）有限公司 | A kind of high-accuracy PCS plates implantation method |
| CN109963414A (en) * | 2019-03-29 | 2019-07-02 | 瀚宇博德科技（江阴）有限公司 | A kind of printed circuit board engrafting method for overcoming plate face to be stained with glue |
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| CN101299909A (en) * | 2007-04-30 | 2008-11-05 | 益庭股份有限公司 | Method for preparing multi-sheet printed circuit board |
| CN101843180A (en) * | 2008-10-27 | 2010-09-22 | 揖斐电株式会社 | Multi-piece substrate and method for manufacturing same |
| CN102365002A (en) * | 2011-10-25 | 2012-02-29 | 奈电软性科技电子(珠海)有限公司 | Transplanting grafting technology of FPC defective product |
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Patent Citations (5)
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| US20050235490A1 (en) * | 2004-04-27 | 2005-10-27 | Chih-Chung Chen | Printed circuit board defective area transplant repair method |
| CN101296582A (en) * | 2007-04-25 | 2008-10-29 | 燿华电子股份有限公司 | Method for replacing and mending bad circuit area on multi-layer printed circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302108A (en) * | 2014-09-28 | 2015-01-21 | 江苏博敏电子有限公司 | Testing and forming method of printed circuit board |
| CN104302108B (en) * | 2014-09-28 | 2017-12-01 | 江苏博敏电子有限公司 | A kind of printed wiring board test forming method |
| CN105430943A (en) * | 2015-11-06 | 2016-03-23 | 高德（江苏）电子科技有限公司 | Method for monitoring discarded inner layer of multilayer board of printed circuit board |
| CN105430943B (en) * | 2015-11-06 | 2018-06-19 | 高德（江苏）电子科技有限公司 | The method that monitoring printed circuit board multilayer inner cord is scrapped |
| CN107708330A (en) * | 2017-08-30 | 2018-02-16 | 奥士康精密电路（惠州）有限公司 | A kind of high-accuracy PCS plates implantation method |
| CN109963414A (en) * | 2019-03-29 | 2019-07-02 | 瀚宇博德科技（江阴）有限公司 | A kind of printed circuit board engrafting method for overcoming plate face to be stained with glue |
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Application publication date: 20140226 |