CN109963414A - A kind of printed circuit board engrafting method for overcoming plate face to be stained with glue - Google Patents
A kind of printed circuit board engrafting method for overcoming plate face to be stained with glue Download PDFInfo
- Publication number
- CN109963414A CN109963414A CN201910248063.1A CN201910248063A CN109963414A CN 109963414 A CN109963414 A CN 109963414A CN 201910248063 A CN201910248063 A CN 201910248063A CN 109963414 A CN109963414 A CN 109963414A
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- China
- Prior art keywords
- circuit board
- printed circuit
- glue
- plate face
- stained
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a kind of printed circuit board engrafting methods for overcoming plate face to be stained with glue, belong to printed circuit board graft technology field.The following steps are included: classification: the multiple-unit typographical printing circuit board of electrical testing failure is classified with the bad element of same position；Milling plate: molding machine cuts the bad single plate on printed circuit board；Cleaning: mother matrix and sub- version plate face are cleaned；Dispensing: mother matrix clicks and enters binder in cut place with sub- version；Riveted: mother matrix and sub- version are in cut place riveted；Ultrasonic washes glue: setting Supersonic wave parameter carries out printed circuit board to wash glue after adhesive remover is added；Drying；Detection: accuracy tolerance detection is carried out to the printed circuit board after drying and electrical testing detects；Purged and packed.The application avoid grafting after the completion of generate it is secondary scrap, improve production yield and profit, reduce production cost.
Description
Technical field
The present invention relates to a kind of printed circuit board engrafting methods for overcoming plate face to be stained with glue, belong to printed circuit board graft technology
Field.
Background technique
At present in printed circuit board industry, factory is to improve productivity and stock utilization in process of production, it will usually
By the design of multiple separate units on same printed circuit board, forms big typesetting sheet printed circuit board and carry out subsequent production work again
Sequence.But often occur in which one or several separate unit functional damages, such as shipment to client, client was being assembled
The adjusted design that must be synchronized in journey, and it is excessive because scrapping unit permutation and combination, it is suitable to will cause client transactions process
Complexity, working efficiency is too low, causes client to select to reject, it is desirable that scrap processing, the separate unit containing partial quality qualification exists
Interior big typesetting sheet printed circuit board is also and then scrapped together, causes cost significant wastage.
Unit undesirable in sheet printed circuit board cutting can be scrapped in industry at present, while qualified unit being replaced
Enter to reach the printed circuit board of overall quality qualification, as grafting plate, this technique can effectively improve whole yield, keep away
Exempt to scrap.In grafting procedures, grafting plate face when riveted after dispensing will appear excessive glue phenomenon, and wiping is not clean, will cause secondary
It scraps.
Such as a kind of transplanting printed circuit board ohm ring that patent publication No. is CN205356831U, mention in this patent
Gluing process can be replaced by carrying out daughter board and mother matrix interference fit using ohm ring, and then avoid grafting plate face excessive glue problem, but should
It is interference fitted in patent using daughter board and motherboard, when assembly borrows external force primary and secondary interface and is easily broken off, and not can guarantee and assembled
At rear tolerance grade within 25 microns, while client leads to daughter board because high temperature generates thermal stress in high temperature assembling process
It is separated with motherboard, so patent is difficult to realize in assembling process below.
Summary of the invention
The technical problem to be solved by the present invention is to provide a kind of printing for overcoming plate face to be stained with glue for the above-mentioned prior art
Circuit board engrafting method, avoid grafting after the completion of generate it is secondary scrap, improve production yield, reduce production cost.
The present invention solves the above problems used technical solution are as follows: a kind of printed circuit board grafting for overcoming plate face to be stained with glue
Method the described method comprises the following steps:
Step 1: classification: electrical testing failure multiple-unit typographical printing circuit board, with the bad element of same position into
Row classification；
Step 2: milling plate: molding machine cuts the bad single plate on printed circuit board, to cut on printed circuit board
The few whole plate of bad single plate number is mother matrix, on the printed circuit board of another electrical testing failure identical with bad single plate position
Non-defective unit single plate be sub- version；
Step 3: cleaning: the dust on mother matrix and sub- version plate face is cleaned；
Step 4: dispensing: mother matrix clicks and enters binder in cut place with sub- version；
Step 5: riveted: mother matrix and sub- version are in cut place riveted；
Step 6: ultrasonic washes glue: during riveted, having binder spilling, setting ultrasonic ginseng transferring junction
Number carries out printed circuit board to wash glue after adhesive remover is added；
Step 7: baking: it is toasted to except the printing grafting circuit board after glue is clean,；
Step 8: detection: carrying out accuracy tolerance detection to the printed circuit board after drying and electrical testing detects；
Step 9: purged and packed: accuracy tolerance detection and electrical testing detect after detecting qualification respectively, carry out cleaning packet
Dress.
Specifically, the binder is high temperature bond glue, model LOCTTO LT-6307, the happy figure LT- of Singapore
The super adhesive agent of 6307 epoxy resins, dealer are SHENZHEN SAKAWA INDUSTIAL TACHNOLOGY CO.,
LTD, address NO.287LONGHUA NEW DISTRICT SHENZHEN CHINA, TEL:0755-29441523 FAX:0755-
27630429。
Specifically, the adhesive remover is the mixed solution of organic solvent, cosolvent, surfactant and water；
The adhesive remover is prepared from the following raw materials in parts by weight: 10~30% organic solvent, 3~10% hydrotropy
Agent, 0.1~1.5% surfactant and the water of surplus；
The organic solvent is methanol, ethyl alcohol, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, methyl acetate, ethyl acetate
Any one or more of with butyl glycol ether, organic solvent is used to accelerate the solution rate of high temperature bond glue；
The cosolvent is any or more in sodium chloride, metasilicate pentahydrate sodium, sodium carbonate, sodium bicarbonate and sodium formate
Kind, cosolvent is used to improve the meltage of high temperature bond glue；
The surfactant is ten alcohol polyethers of isomery, alkyl phenol polyoxyethylene ether, isooctanol polyethoxylate, allyl alcohol
Polyoxyalkyl ether and polyethylene glycol are any one or more of, and surfactant is for reducing adhesive remover in printed circuit board plate face
On surface tension.
Specifically, the ultrasonic removes glue parameter:
Supersonic wave frequency rate 20-30KHZ；
Electric current is set as 1A~3A；
Ultrasonic power: 250W~750W；
Temperature is set as 20 DEG C~30 DEG C.
Drying temperature in the step 7 is 110~130 DEG C, and drying time is 30~50min.
Compared with the prior art, the advantages of the present invention are as follows: a kind of printed circuit board engrafting method for overcoming plate face to be stained with glue,
Increase ultrasonic after riveted and wash glue process, can will be cleaned up because of the glue overflowed when riveted, after the completion of avoiding grafting
Generate it is secondary scrap, improve production yield and profit, reduce production cost.
Detailed description of the invention
Fig. 1 is a kind of grafting schematic diagram for the printed circuit board engrafting method for overcoming plate face to be stained with glue of the embodiment of the present invention；
1 mother matrix, 2 sub- versions in figure.
Specific embodiment
The present invention will be described in further detail below with reference to the embodiments of the drawings.
As shown in Figure 1, one of the present embodiment overcomes plate face to be stained with the printed circuit board engrafting method of glue, method include with
Lower step:
Step 1: classification: by the printed circuit board of the typesetting containing multiple-unit of electrical testing failure, with the bad of same position
Unit is classified；
Step 2: milling plate: molding machine cuts the bad single plate on printed circuit board, to cut on printed circuit board
The few whole plate of bad single plate number is mother matrix (1), with the printed circuit of another electrical testing failure identical with bad single plate position
Non-defective unit single plate on plate is sub- version (2)；
Step 3: cleaning: the dust on the mother matrix (1) and sub- version (2) plate face after cutting is cleaned
Step 4: dispensing: mother matrix (1) clicks and enters binder in cut place with sub- version (2)；
Step 5: riveted: mother matrix (1) and sub- version (2) are in cut place riveted；
Step 6: ultrasonic removes glue: binder spilling is had during riveted, at cut point, sets Supersonic wave parameter,
Printed circuit board is carried out to wash glue after adhesive remover is added；
Supersonic wave frequency rate: 20-30KHZ
Ultrasonic power: 250W~750W；
Time is set as 1min~2min；
Temperature is set as 20 DEG C~30 DEG C
Wherein adhesive remover is 20% organic solvent, 5% cosolvent, 0.5% surfactant and 74.5% water
Mixed solvent.
Comparative example 1: no ultrasonic cleaning
Embodiment 1: Supersonic wave frequency rate selects 20KHZ respectively, and the power corresponding selection 250W time is set as 1min, and temperature is set
It is set to 20 DEG C
Embodiment 2: Supersonic wave frequency rate selects 25KHZ, power corresponding selection 500W respectively, and the time is set as 1.5min, temperature
Degree is set as 25 DEG C,
Embodiment 3: Supersonic wave frequency rate selects 30KHZ, power corresponding selection 750W respectively, and the time is set as 2min, temperature
It is set as 30 DEG C
Step 7: baking: being toasted to the printed circuit grafting plate after being cleaned up except glue, 120 DEG C of parameter * 40 minutes
Step 8: detection: carrying out accuracy tolerance detection to the printed circuit board after drying and electrical testing detects；
Step 9: purged and packed: accuracy tolerance detection and electrical testing detect after detecting qualification respectively, carry out cleaning packet
Dress.
Step 9: purged and packed: accuracy tolerance detection and electrical testing detect after detecting qualification respectively, carry out cleaning packet
Dress.
Above-mentioned adhesive remover include 20% organic solvent, 5% cosolvent, 0.5% surfactant and 74.5%
The mixed solvent of water.
The combination 1 of the corresponding adhesive remover of embodiment 1: organic solvent is ethyl alcohol, methyl acetate, ethyl acetate arbitrary volume ratio
Mixture, cosolvent are metasilicate pentahydrate sodium, sodium chloride, and surfactant is ten alcohol polyethers of isomery, allyl alcohol polyoxyalkyl ether.
The combination 2 of the corresponding adhesive remover of embodiment 2: organic solvent is methanol, propylene glycol monomethyl ether, propylene glycol methyl ether acetate
Arbitrary volume compare mixture；Cosolvent is the equal proportion mixture of metasilicate pentahydrate sodium, sodium formate；Surfactant is isomery
Ten alcohol polyethers, allyl alcohol polyoxyalkyl ether, polyethylene glycol are mixed according to 4:3:3 ratio.
The combination 3 of the corresponding adhesive remover of embodiment 3: organic solvent be propylene glycol monomethyl ether, propylene glycol methyl ether acetate etc.
Scalemic thereof；Cosolvent is the arbitrary proportion mixture of sodium chloride, sodium bicarbonate and sodium formate；Surfactant is alkyl phenol
Polyoxyethylene ether, allyl alcohol polyoxyalkyl ether and polyethylene glycol are mixed according to 3:2:5 ratio.
In addition to the implementation, all to use equivalent transformation or equivalent replacement the invention also includes there is an other embodiments
The technical solution that mode is formed should all be fallen within the scope of the hereto appended claims.
Claims (5)
1. a kind of printed circuit board engrafting method for overcoming plate face to be stained with glue, it is characterised in that: the described method comprises the following steps:
Step 1: classification: the multiple-unit typographical printing circuit board of electrical testing failure is divided with the bad element of same position
Class；
Step 2: milling plate: molding machine cuts the bad single plate on printed circuit board, bad to cut on printed circuit board
The few whole plate of single plate number is mother matrix (1), on the printed circuit board of another electrical testing failure identical with bad single plate position
Non-defective unit single plate be sub- version (2)；
Step 3: cleaning: the dust on mother matrix (1) and sub- version (2) plate face is cleaned；
Step 4: dispensing: mother matrix (1) clicks and enters binder in cut place with sub- version (2)；
Step 5: riveted: mother matrix (1) and sub- version (2) are in cut place riveted；
Step 6: ultrasonic washes glue: during riveted, transferring junction and have binder spilling, set Supersonic wave parameter, be added
Printed circuit board is carried out after adhesive remover to wash glue；
Step 7: drying: being toasted to the printed circuit grafting plate after being cleaned up except glue；
Step 8: detection: carrying out accuracy tolerance detection to the printed circuit board after drying and electrical testing detects；
Step 9: purged and packed: accuracy tolerance detection and electrical testing detect after detecting qualification respectively, carry out purged and packed.
2. a kind of printed circuit board engrafting method for overcoming plate face to be stained with glue according to claim 1, it is characterised in that: described
Binder is high temperature bond glue, and model LOCTTO LT-6307, the binder is in step 7 completion thoroughly solidification.
3. a kind of printed circuit board engrafting method for overcoming plate face to be stained with glue according to claim 1, it is characterised in that: described
Adhesive remover is the mixed solution of organic solvent, cosolvent, surfactant and water；
The adhesive remover is prepared from the following raw materials in parts by weight: 10~30% organic solvent, 3~10% cosolvent,
0.1~1.5% surfactant and the water of surplus；
The organic solvent is methanol, ethyl alcohol, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, methyl acetate, ethyl acetate and second
Glycol butyl ether is any one or more of, and organic solvent is used to accelerate the solution rate of high temperature bond glue；
The cosolvent be sodium chloride, metasilicate pentahydrate sodium, sodium carbonate, sodium bicarbonate and sodium formate in it is any one or more, help
Solvent is used to improve the meltage of high temperature bond glue；
The surfactant is ten alcohol polyethers of isomery, alkyl phenol polyoxyethylene ether, isooctanol polyethoxylate, allyl alcohol polyoxy
Alkyl ether and polyethylene glycol are any one or more of, and surfactant is for reducing adhesive remover in printed circuit board plate face
Surface tension.
4. a kind of printed circuit board engrafting method for overcoming plate face to be stained with glue according to claim 1, it is characterised in that: described
Ultrasonic removes glue parameter:
Supersonic wave frequency rate: 20-30KHZ；
Ultrasonic power: 250W~750W；
Time is set as 1min~2min；
Temperature is set as 20 DEG C~30 DEG C.
5. a kind of printed circuit board engrafting method for overcoming plate face to be stained with glue according to claim 1, it is characterised in that: described
Drying temperature in step 7 is 110~130 DEG C, and drying time is 30~50min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910248063.1A CN109963414A (en) | 2019-03-29 | 2019-03-29 | A kind of printed circuit board engrafting method for overcoming plate face to be stained with glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910248063.1A CN109963414A (en) | 2019-03-29 | 2019-03-29 | A kind of printed circuit board engrafting method for overcoming plate face to be stained with glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109963414A true CN109963414A (en) | 2019-07-02 |
Family
ID=67025250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910248063.1A Pending CN109963414A (en) | 2019-03-29 | 2019-03-29 | A kind of printed circuit board engrafting method for overcoming plate face to be stained with glue |
Country Status (1)
| Country | Link |
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| CN (1) | CN109963414A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111660472A (en) * | 2020-06-08 | 2020-09-15 | 西安微电子技术研究所 | Method for cleaning residues in mold cavity of mold box in plastic package mold |
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|---|---|---|---|---|
| US20030029034A1 (en) * | 2001-08-08 | 2003-02-13 | Unitech Printed Circuit Board Corp. | Method of removing and replacing defective piece of printed circuit board formed on a panel |
| CN1956630A (en) * | 2005-10-28 | 2007-05-02 | 诠脑电子（深圳）有限公司 | Method of transplating and splicing single board of printed circuit board |
| CN101899365A (en) * | 2009-05-27 | 2010-12-01 | 宁波百仕高联合工业有限公司 | Adhesive remover and preparation method thereof |
| CN103002659A (en) * | 2011-09-08 | 2013-03-27 | 何其俊 | Flow line process method for automatic transplanting and repairing of printed circuit boards |
| CN103607852A (en) * | 2013-12-06 | 2014-02-26 | 柏承科技(昆山)股份有限公司 | Printed circuit board core transplanting method |
| CN107815353A (en) * | 2017-07-06 | 2018-03-20 | 上海新阳半导体材料股份有限公司 | A kind of glue-dispenser, its preparation method and application available for deburring |
-
2019
- 2019-03-29 CN CN201910248063.1A patent/CN109963414A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030029034A1 (en) * | 2001-08-08 | 2003-02-13 | Unitech Printed Circuit Board Corp. | Method of removing and replacing defective piece of printed circuit board formed on a panel |
| CN1956630A (en) * | 2005-10-28 | 2007-05-02 | 诠脑电子（深圳）有限公司 | Method of transplating and splicing single board of printed circuit board |
| CN101899365A (en) * | 2009-05-27 | 2010-12-01 | 宁波百仕高联合工业有限公司 | Adhesive remover and preparation method thereof |
| CN103002659A (en) * | 2011-09-08 | 2013-03-27 | 何其俊 | Flow line process method for automatic transplanting and repairing of printed circuit boards |
| CN103607852A (en) * | 2013-12-06 | 2014-02-26 | 柏承科技(昆山)股份有限公司 | Printed circuit board core transplanting method |
| CN107815353A (en) * | 2017-07-06 | 2018-03-20 | 上海新阳半导体材料股份有限公司 | A kind of glue-dispenser, its preparation method and application available for deburring |
Non-Patent Citations (2)
| Title |
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| 彭弘婧等: "《电子产品制造工艺》", 30 September 2015, 北京理工大学出版社 * |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111660472A (en) * | 2020-06-08 | 2020-09-15 | 西安微电子技术研究所 | Method for cleaning residues in mold cavity of mold box in plastic package mold |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190702 |